CN104039091A - Producing method of third-order buried blind hole of printed circuit board - Google Patents
Producing method of third-order buried blind hole of printed circuit board Download PDFInfo
- Publication number
- CN104039091A CN104039091A CN201410272091.4A CN201410272091A CN104039091A CN 104039091 A CN104039091 A CN 104039091A CN 201410272091 A CN201410272091 A CN 201410272091A CN 104039091 A CN104039091 A CN 104039091A
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- blind hole
- circuit board
- printed circuit
- blind
- blind holes
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- Laser Beam Processing (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a producing method of a third-order buried blind hole of a printed circuit board. The producing method comprises the following steps of: S1, determining sizes and a combination way of multiple basic blind holes which compose a target blind hole based on the size of the target blind hole of the printed circuit board; S2, adjusting alignment precision of multi-order blind holes by adopting a regional alignment way; S3, processing the printed circuit board by utilizing a laser drilling machine to obtain the target blind hole; S4, performing tap-hole plating on the blind holes with high ratio of thickness to radial dimension by adopting specific plating chemical liquid and parameters. The blind holes with relatively big apertures are processed through a laser drilling processing way, and the alignment precision of the multi-order blind holes is improved by adopting the regional alignment way, so that the processing precision of the blind holes can be guaranteed, and the product rejection rate is reduced.
Description
Technical field
The present invention relates to a kind of printed circuit board three rank buried blind via manufacture methods.
Background technology
For more space being provided to the cabling of multilayer printed circuit board, make it have best electric property, in the top layer of printed circuit board and bottom surface, be conventionally provided with blind hole, this blind hole can be used for the electric connection between top layer wiring and internal memory circuit.
According to actual needs, high density interconnect suppresses circuit board and sometimes also needs to design the larger blind hole in some apertures, the processing mode of the machine drilling that the processing and fabricating of these blind holes bores by controlling depth often completes, but, the working (machining) efficiency of machine drilling processing mode is lower, and a this work mode that adds is because machine drilling is difficult to control precision, and the product rejection rate that may cause the blind hole of printed circuit board to be processed is higher, thereby increase the cost of manufacturer.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide that a kind of accuracy is high, efficiency is higher, can effectively reduce the printed circuit board three rank buried blind via manufacture methods of product rejection rate.
The object of the invention is to be achieved through the following technical solutions: a kind of printed circuit board three rank buried blind via manufacture methods, it comprises the following steps:
S1: according to the target blind hole size of printed circuit board, determine size and the compound mode of multiple basic blind holes of the described target blind hole of composition;
S2: adopt subregion counter-point to adjust the aligning accuracy of multistage blind hole;
S3: utilize laser drilling machine to process printed circuit board, obtain target blind hole;
S4: adopt specific electroplating liquid medicine and parameter, high thickness to diameter ratio blind hole is carried out to consent plating;
Described blind hole aperture minimum is 55 μ m.
It also comprises: described target blind hole is carried out to metalized, form conducting blind hole.
In two adjacent basic orifice rings, the corresponding basic blind hole in position is connected or part covering.
The invention has the beneficial effects as follows: the processing mode by laser drill is processed the larger blind hole in aperture, adopt subregion counter-point to improve the aligning accuracy of multistage blind hole, ensure the accuracy of blind hole processing, reduce product rejection rate, improve the efficiency of producing, for producer has saved cost.
Brief description of the drawings
Fig. 1 is flow chart of the present invention.
Embodiment
Below in conjunction with accompanying drawing, technical scheme of the present invention is described in further detail:
As shown in Figure 1, a kind of printed circuit board three rank buried blind via manufacture methods, it comprises the following steps:
S1: according to the target blind hole size of printed circuit board, determine size and the compound mode of multiple basic blind holes of the described target blind hole of composition;
S2: adopt subregion counter-point to adjust the aligning accuracy of multistage blind hole;
S3: utilize laser drilling machine to process printed circuit board, obtain target blind hole;
S4: adopt specific electroplating liquid medicine and parameter, high thickness to diameter ratio blind hole is carried out to consent plating;
Described blind hole aperture minimum is 55 μ m.
It also comprises: described target blind hole is carried out to metalized, form conducting blind hole.
In two adjacent basic orifice rings, the corresponding basic blind hole in position is connected or part covering.
The above is only the preferred embodiment of the present invention, be to be understood that the present invention is not limited to disclosed form herein, should not regard the eliminating to other embodiment as, and can be used for various other combinations, amendment and environment, and can, in contemplated scope described herein, change by technology or the knowledge of above-mentioned instruction or association area.And the change that those skilled in the art carry out and variation do not depart from the spirit and scope of the present invention, all should be in the protection range of claims of the present invention.
Claims (4)
1. printed circuit board three rank buried blind via manufacture methods, is characterized in that: it comprises the following steps:
S1: according to the target blind hole size of printed circuit board, determine size and the compound mode of multiple basic blind holes of the described target blind hole of composition;
S2: adopt subregion counter-point to adjust the aligning accuracy of multistage blind hole;
S3: utilize laser drilling machine to process printed circuit board, obtain target blind hole;
S4: adopt specific electroplating liquid medicine and parameter, high thickness to diameter ratio blind hole is carried out to consent plating.
2. printed circuit board three rank buried blind via manufacture methods according to claim 1, is characterized in that: described blind hole aperture minimum is 55 μ m.
3. printed circuit board three rank buried blind via manufacture methods according to claim 1, is characterized in that: it also comprises: described target blind hole is carried out to metalized, form conducting blind hole.
4. printed circuit board three rank buried blind via manufacture methods according to claim 1, is characterized in that: in two adjacent basic orifice rings, the corresponding basic blind hole in position is connected or part covering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410272091.4A CN104039091A (en) | 2014-06-18 | 2014-06-18 | Producing method of third-order buried blind hole of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410272091.4A CN104039091A (en) | 2014-06-18 | 2014-06-18 | Producing method of third-order buried blind hole of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104039091A true CN104039091A (en) | 2014-09-10 |
Family
ID=51469629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410272091.4A Pending CN104039091A (en) | 2014-06-18 | 2014-06-18 | Producing method of third-order buried blind hole of printed circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN104039091A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106425126A (en) * | 2016-11-11 | 2017-02-22 | 盐城工学院 | Femtosecond laser punching device and method for multi-layer printed circuit board |
| CN108055793A (en) * | 2017-11-09 | 2018-05-18 | 建业科技电子（惠州）有限公司 | A kind of blind hole processing method |
| CN110831326A (en) * | 2019-10-21 | 2020-02-21 | 鹤山市世安电子科技有限公司 | Method, device and equipment for controlling tolerance of crimping hole and storage medium |
| CN113369719A (en) * | 2021-05-14 | 2021-09-10 | 惠州中京电子科技有限公司 | Laser drilling method for LED carrier plate |
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| US5593606A (en) * | 1994-07-18 | 1997-01-14 | Electro Scientific Industries, Inc. | Ultraviolet laser system and method for forming vias in multi-layered targets |
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| CN103747625A (en) * | 2014-01-15 | 2014-04-23 | 上海斐讯数据通信技术有限公司 | GND (ground) hole distributing method and system of HDI (High Density Interconnection) circuit board |
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- 2014-06-18 CN CN201410272091.4A patent/CN104039091A/en active Pending
Patent Citations (6)
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| US5593606A (en) * | 1994-07-18 | 1997-01-14 | Electro Scientific Industries, Inc. | Ultraviolet laser system and method for forming vias in multi-layered targets |
| CN100534271C (en) * | 2006-05-19 | 2009-08-26 | 富葵精密组件(深圳)有限公司 | Method for producing printing-circuit board conducting hole |
| CN103217424A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Method for partition position-alignment correction of soft board |
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| CN103747625A (en) * | 2014-01-15 | 2014-04-23 | 上海斐讯数据通信技术有限公司 | GND (ground) hole distributing method and system of HDI (High Density Interconnection) circuit board |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106425126A (en) * | 2016-11-11 | 2017-02-22 | 盐城工学院 | Femtosecond laser punching device and method for multi-layer printed circuit board |
| CN106425126B (en) * | 2016-11-11 | 2017-12-29 | 盐城工学院 | A kind of multilayer board femtosecond laser perforating device and its drilling method |
| CN108055793A (en) * | 2017-11-09 | 2018-05-18 | 建业科技电子（惠州）有限公司 | A kind of blind hole processing method |
| CN110831326A (en) * | 2019-10-21 | 2020-02-21 | 鹤山市世安电子科技有限公司 | Method, device and equipment for controlling tolerance of crimping hole and storage medium |
| CN113369719A (en) * | 2021-05-14 | 2021-09-10 | 惠州中京电子科技有限公司 | Laser drilling method for LED carrier plate |
| CN113369719B (en) * | 2021-05-14 | 2023-01-31 | 惠州中京电子科技有限公司 | Laser drilling method for LED carrier plate |
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| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140910 |
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| RJ01 | Rejection of invention patent application after publication |