CN109807477B - Composite processing method for PCB hole - Google Patents
Composite processing method for PCB hole Download PDFInfo
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- CN109807477B CN109807477B CN201711173692.XA CN201711173692A CN109807477B CN 109807477 B CN109807477 B CN 109807477B CN 201711173692 A CN201711173692 A CN 201711173692A CN 109807477 B CN109807477 B CN 109807477B
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Abstract
The invention relates to a PCB hole composite processing method, which comprises two or more PCB drilling processing technologies and is characterized in that: drilling a positioning hole, initially positioning, drilling a primary hole, carrying out process conversion, calibrating and positioning, and accurately processing. The invention fully combines the advantages of laser drilling and mechanical drilling, solves the problems of insufficient hole roundness, large hole heat affected zone, serious recasting layer and big-end-up taper hole when the laser drilling is adopted on one side, and breaks through the limitation of laser processing depth; the problems of processing burrs, in-hole drilling dirt, drill chip winding and cutter fracture when mechanical drilling is adopted on one side are solved, and the limitation of machining micropores is broken through.
Description
Technical Field
The invention relates to the field of PCB drilling processing, in particular to a PCB hole composite processing method.
Background
A printed electronic circuit (PCB) is a motherboard for fixing and assembling electronic components to realize circuit connection between the components. The development level of the PCB, which is a basic component in the advanced electronic information manufacturing industry, may reflect the development speed and technical level of the electronic industry of a country or region to some extent.
In recent years, the application and innovation of mobile internet, cloud computing, big data and internet of things are increasingly active, the high-end PCB with stronger performance and better efficiency is manufactured in a high-frequency high-speed, light, thin, small and high-density multi-layering trend, so that the PCB has the characteristics of complex structure, high hardness, large plate thickness, large inner-layer friction coefficient and the like, and the drilling of the PCB is more challenging.
Holes are an important component of PCBs, and the cost of drilling holes typically accounts for 30% to 40% of the cost of PCB fabrication. The holes of the PCB are divided into a via hole and a non-via hole, the via hole comprises a part hole for inserting pins and a via hole for connecting different layers, copper is arranged on the hole wall and used as a conducting medium for connecting a conducting pattern on the middle layer or the outer layer, the non-via hole comprises a mechanical hole for fixing a board card and the like, and the hole wall is free of copper. The via holes may be divided into through via holes, buried holes and blind holes, the through via holes passing directly from the top layer to the bottom layer, the blind holes extending only to one surface of the printed board and passing only from the top layer to an inner layer of a certain layer or from the inner layer to the bottom layer, and the buried holes connecting the inner two inner layers to each other without passing through the bottom layer or the top layer.
The most common methods for drilling holes in a PCB include a numerical control mechanical drilling method and a laser drilling method. The laser drilling speed is high, the efficiency is high, no cutter loss exists, ultra-high-efficiency processing of ultra-fine holes of the PCB can be carried out, but the thickness of the processed board is limited, the types of the board are also limited, and the laser drilling method is commonly used for processing through holes/blind holes of soft boards/hard boards. The mechanical drilling has small hole taper, high hole roundness, large one-time processing depth and no recast layer (black ring), but the processing aperture is limited, and the processing of micropores below 0.1mm is difficult. At present, mechanical numerical control drilling machines are used for drilling holes with the diameter larger than 0.1mm, and 80% of micro holes and blind holes with the diameter smaller than 0.1mm are drilled by lasers.
In the existing hole processing method, the generation of burrs and burrs during mechanical drilling is reduced by a method of covering a PCB (printed Circuit Board) or adding and improving other auxiliary cooling modes, and the processing precision and the problem of drill bit fracture are improved. In the aspect of laser drilling, two types of laser including CO2 laser and ultraviolet laser are mainly used, and the laser drilling quality is improved by changing the laser type, controlling the pulse number (single pulse/multiple pulses), processing paths (direct-impact type, surrounding type and spiral type) and processing technology. There is no laser and mechanical composite processing related technology involved.
At present, chip discharge difficulty still exists in mechanical drilling on a PCB, which causes processing burrs, in-hole drilling dirt and drill chip winding, and especially, problems of cutter fracture and difficult control of size and form and position precision in micro-hole (plate thickness and aperture ratio > 10). The laser drilling of blind holes has the problems of poor hole shape and hole roundness, large taper deviation of upper and lower holes, serious heat affected zone and recast layer, difficult processing of ultra-micro holes and the like.
Disclosure of Invention
In order to realize the purpose, the invention adopts the following technical scheme: a PCB hole composite processing method comprises the following steps:
s1: drilling a positioning hole, namely drilling the positioning hole on the PCB by selecting a mechanical drilling machine;
s2: initial processing, selecting one of a laser drilling machine or a mechanical drilling machine as an initial processing device;
s3: initially positioning, wherein a first CCD (charge coupled device) image sensor is installed on an initial processing device, and positioning hole position parameters are accurately acquired through automatic focusing and are transmitted back to a PC (personal computer) end to establish a coordinate system;
s4: drilling a primary hole, drilling the primary hole with the diameter smaller than the target aperture according to the machining parameters by using an initial machining device, and acquiring position coordinates (X1, Y1) of the primary hole relative to the positioning hole by using a first CCD image sensor;
s5: the process conversion is that the PCB drilled with the primary hole in the step S3 is disassembled and then is installed on a precise processing device, and the precise processing device is one of a laser drilling machine or a mechanical drilling machine different from the initial processing device;
s6: calibrating and positioning, wherein a second CCD image sensor is arranged on a main shaft of the accurate processing device, position parameters of a positioning hole on the PCB are obtained and are transmitted back to a PC end to obtain deviations (X2, Y2) between a target hole and a primary Kong Zuobiao, and the accurate processing coordinates (X1 + X2, Y1+ Y2) between the target hole and the primary hole are calculated;
s7: and (4) accurately machining, namely drilling a target hole on the basis of the primary hole according to machining parameters.
S8: and (5) circularly processing, and repeating the steps S5-S7 according to process requirements.
Further, the laser drilling machine adopts one or a combination of single-point pulse processing, winding continuous processing and spiral processing.
A PCB hole processing method with the aperture of 0.1mm and below comprises the following steps: the initial processing device is a laser drilling machine, the accurate processing device is a mechanical drilling machine, and the aperture of the primary hole is 50% -90% of the target aperture.
A PCB hole processing method with a hole diameter of more than 0.1mm comprises the following steps: the initial processing device is a mechanical drilling machine, the accurate processing device is a laser drilling machine, and the aperture of the primary hole is 60% -95% of the target aperture.
A PCB blind hole processing method comprises the following steps: the initial processing device is a mechanical drilling machine, the accurate processing device is a laser drilling machine, and the aperture of the primary hole is 60% -95% of the target aperture.
Further, the laser drilling machine adopts one or a combination of a femtosecond laser or a picosecond laser.
The working principle of the invention is as follows: the composite processing technology is used for positioning through four positioning holes of a plate and a first CCD image sensor and a second CCD image sensor, wherein the first CCD image sensor and the second CCD image sensor are respectively arranged on a main shaft or a laser head of an initial processing device and a main shaft or a laser head of an accurate processing device. Firstly, a primary hole is preliminarily machined at a designated position on a plate according to machining requirements, the first CCD image sensor moves along with the initial machining device, position parameters (X1 and Y1) of the machined hole relative to the positioning hole are accurately obtained through automatic focusing, and the position parameters are fed back to a PC end of a machine tool. And the initial processing device and the precise processing device realize data sharing through the PC terminal. After the drilling of the primary hole is finished, the plate is transferred to the accurate processing device, the second CCD moves to the position of the primary hole according to the position parameters (X1, Y1), the accurate position of the primary hole is grabbed through CCD automatic focusing to obtain position deviation (X2, Y2), the accurate position (X1 + X2, Y1+ Y2) of the primary hole is fed back to the PC end control system, the accurate processing device moves to the position, and secondary processing of the target hole is completed. The method can be used for multiple times of composite processing, and the hole site precision of the multiple times of processing is ensured.
When a PCB hole with the target aperture of 0.1mm or less is drilled, a primary hole with the diameter of 50% -90% of the target aperture is machined on a laser drilling machine by laser, a plate is transferred to a mechanical drilling machine, and a drill bit with the same size as the target aperture is used for reaming.
When a PCB hole with the target aperture of more than 0.1mm is drilled, firstly, a drill bit with the diameter of 60% -95% of the target aperture is adopted on a mechanical drilling machine to process a hole, a plate is transferred to a laser drilling machine, and then, the femtosecond/picosecond/nanosecond laser is utilized to remove redundant materials until the target aperture is reached.
When drilling blind holes or back drilling holes, firstly, a mechanical drilling machine is adopted to process the blind holes on a mechanical drilling machine, the processing aperture and the processing depth are 60% -95% of the target blind holes, the plate is transferred to a laser drilling machine, femtosecond or picosecond laser is used to precisely correct the blind hole depth to reach the target depth and aperture, the method can improve the processing dimensional precision of the blind holes, solve the problem that back drilling STUB exceeds the standard, and obtain the blind holes and the back drilling holes with high quality and high precision.
The invention has the beneficial effects that: the invention provides a laser and mechanical combined processing technology and a positioning method thereof aiming at the problems in the background technology, the combined technology can process a target hole by selecting the sequence and the combination sequence of mechanical drilling and laser drilling according to the actual processing condition, and the positioning of the target hole during two times or multiple times of processing can be realized by the positioning method in the invention.
The invention fully combines the advantages of laser drilling and mechanical drilling, solves the problems of insufficient hole roundness, large hole heat affected zone, serious recasting layer and big upper and lower taper holes when the laser drilling is adopted on one side, and breaks through the limitation of laser processing depth; the problems of processing burrs, in-hole drilling dirt, drill chip winding and cutter fracture when mechanical drilling is adopted on one side are solved, and the limitation of machining micropores is broken through.
Detailed Description
The PCB hole composite processing method provided by the embodiment of the invention comprises the following steps:
s1: drilling a positioning hole, namely drilling the positioning hole on the PCB by selecting a mechanical drilling machine;
s2: initial processing, selecting one of a laser drilling machine or a mechanical drilling machine as an initial processing device;
s3: initially positioning, wherein a first CCD image sensor is arranged on an initial processing device, and the position parameters of a positioning hole are accurately acquired through automatic focusing and are transmitted back to a PC end to establish a coordinate system;
s4: drilling a primary hole, drilling the primary hole with the diameter smaller than the target aperture according to the machining parameters by using an initial machining device, and acquiring position coordinates (X1, Y1) of the primary hole relative to the positioning hole by using a first CCD image sensor;
s5: the process conversion is that the PCB drilled with the primary hole in the step S3 is disassembled and then is installed on a precise processing device, and the precise processing device is one of a laser drilling machine or a mechanical drilling machine different from the initial processing device;
s6: calibrating and positioning, wherein a second CCD image sensor is arranged on a main shaft of the accurate processing device, position parameters of a positioning hole on the PCB are obtained and are transmitted back to a PC end to obtain the deviation (X2, Y2) between a target hole and a primary Kong Zuobiao, and the accurate processing coordinates of the target hole and the primary hole are calculated to be (X1 + X2, Y1+ Y2);
s7: and (4) accurately machining, namely drilling a target hole on the basis of the primary hole according to machining parameters.
S8: and (5) circularly processing, and repeating the steps S5-S7 according to process requirements.
Furthermore, the laser drilling machine adopts one or a combination of single-point pulse processing, winding continuous processing and spiral processing.
A PCB hole processing method with the aperture of 0.1mm and below comprises the following steps: the initial processing device is a laser drilling machine, the accurate processing device is a mechanical drilling machine, and the aperture of the primary hole is 50% -90% of the target aperture.
A method for processing a PCB hole with a hole diameter of more than 0.1mm comprises the following steps: the initial processing device is a mechanical drilling machine, the accurate processing device is a laser drilling machine, and the aperture of the primary hole is 60% -95% of the target aperture.
A PCB blind hole processing method comprises the following steps: the initial processing device is a mechanical drilling machine, the accurate processing device is a laser drilling machine, and the aperture of the primary hole is 60% -95% of the target aperture.
Further, the laser drilling machine adopts one or a combination of femtosecond laser or picosecond laser.
The working principle of the invention is as follows: the composite processing technology is used for positioning through four positioning holes of a plate and a first CCD image sensor and a second CCD image sensor, wherein the first CCD image sensor and the second CCD image sensor are respectively arranged on a main shaft or a laser head of an initial processing device and a main shaft or a laser head of an accurate processing device. Firstly, a primary hole is preliminarily machined at a designated position on a plate according to machining requirements, the first CCD image sensor moves along with the initial machining device, position parameters (X1 and Y1) of the machined hole relative to the positioning hole are accurately obtained through automatic focusing, and the position parameters are fed back to a PC end of a machine tool. And the initial processing device and the precise processing device realize data sharing through the PC terminal. After the drilling of the primary hole is finished, the plate is transferred to the accurate processing device, the second CCD moves to the position of the primary hole according to the position parameters (X1, Y1), the accurate position of the primary hole is grabbed through CCD automatic focusing to obtain position deviation (X2, Y2), the accurate position (X1 + X2, Y1+ Y2) of the primary hole is fed back to the PC end control system, the accurate processing device moves to the position, and secondary processing of the target hole is completed. The method can be used for multiple times of composite processing, and the hole site precision of the multiple times of processing is ensured.
When a PCB hole with the target aperture of 0.1mm or less is drilled, a primary hole with the diameter of 50% -90% of the target aperture is machined on a laser drilling machine by laser, a plate is transferred to a mechanical drilling machine, and a drill bit with the same size as the target aperture is used for reaming.
When a PCB hole with the target aperture of more than 0.1mm is drilled, firstly, a drill bit with the diameter of 60% -95% of the target aperture is adopted on a mechanical drilling machine to process a hole, a plate is transferred to a laser drilling machine, and then, the femtosecond/picosecond/nanosecond laser is utilized to remove redundant materials until the target aperture is reached.
When drilling blind holes or back drilling holes, firstly, a mechanical drilling machine is adopted to process the blind holes on a mechanical drilling machine, the processing aperture and the processing depth are 60% -95% of the target blind holes, the plate is transferred to a laser drilling machine, femtosecond or picosecond laser is used to precisely correct the blind hole depth to reach the target depth and aperture, the method can improve the processing dimensional precision of the blind holes, solve the problem that back drilling STUB exceeds the standard, and obtain the blind holes and the back drilling holes with high quality and high precision.
The invention has the beneficial effects that: the invention provides a laser and mechanical combined processing technology and a positioning method thereof aiming at the problems in the background technology, the combined technology can process a target hole by selecting the sequence and the combination sequence of mechanical drilling and laser drilling according to the actual processing condition, and the positioning of the target hole during two times or multiple times of processing can be realized by the positioning method in the invention.
The invention fully combines the advantages of laser drilling and mechanical drilling, solves the problems of insufficient hole roundness, large hole heat affected zone, serious recasting layer and big-end-up taper hole when the laser drilling is adopted on one side, and breaks through the limitation of laser processing depth; the problems of processing burrs, in-hole drilling dirt, drilling cutting winding and cutter fracture when mechanical drilling is adopted on one side are solved, and the limitation of mechanical processing micropores is broken through.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (1)
1. A PCB hole composite processing method comprises two or more PCB drilling processing technologies, and is characterized in that:
s1: drilling a positioning hole, namely drilling the positioning hole on the PCB by selecting a mechanical drilling machine;
s2: initial processing, selecting one of a laser drilling machine or a mechanical drilling machine as an initial processing device;
s3: initially positioning, wherein a first CCD (charge coupled device) image sensor is installed on an initial processing device, and positioning hole position parameters are accurately acquired through automatic focusing and are transmitted back to a PC (personal computer) end to establish a coordinate system;
s4: drilling a primary hole, drilling the primary hole with the diameter smaller than the target aperture according to the machining parameters by using an initial machining device, and acquiring position coordinates (X1, Y1) of the primary hole relative to the positioning hole by using a first CCD image sensor;
s5: the process conversion is that the PCB drilled with the primary hole in the step S3 is disassembled and then is installed on a precise processing device, and the precise processing device is one of a laser drilling machine or a mechanical drilling machine different from the initial processing device;
s6: calibrating and positioning, wherein a second CCD image sensor is arranged on a main shaft of the accurate processing device, position parameters of a positioning hole on the PCB are obtained and are transmitted back to a PC end to obtain deviations (X2, Y2) between a target hole and a primary Kong Zuobiao, and the accurate processing coordinates (X1 + X2, Y1+ Y2) between the target hole and the primary hole are calculated;
s7: accurately machining, namely drilling a target hole on the basis of the primary hole according to machining parameters; under the condition that the aperture is 0.1mm or less, when the initial processing device is a laser drilling machine, the precise processing device is a mechanical drilling machine, and the aperture of the primary hole is 50% -90% of the target aperture; under the condition that the aperture is more than 0.1mm, when the initial processing device is a mechanical drilling machine, the precise processing device is a laser drilling machine, and the aperture of the primary hole is 60% -95% of the target aperture; under the condition of blind hole machining, the initial machining device is a mechanical drilling machine, the precise machining device is a laser drilling machine, and the aperture of the primary hole is 60% -95% of the target aperture;
s8: circularly processing, and repeating the steps S5-S7 according to the process requirement; the laser drilling machine adopts one or a combination of single-point pulse processing, winding continuous processing and spiral processing;
in the case of blind hole machining, the laser drilling machine adopts one or a combination of femtosecond laser or picosecond laser.
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| CN113873758A (en) * | 2021-08-27 | 2021-12-31 | 珠海杰赛科技有限公司 | Processing method for improving interconnection and separation of through holes of PTFE circuit board |
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