CN105764236B - A kind of processing method and PCB of PCB - Google Patents
A kind of processing method and PCB of PCB Download PDFInfo
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- CN105764236B CN105764236B CN201510214255.2A CN201510214255A CN105764236B CN 105764236 B CN105764236 B CN 105764236B CN 201510214255 A CN201510214255 A CN 201510214255A CN 105764236 B CN105764236 B CN 105764236B
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Abstract
The processing method that the present invention discloses a kind of PCB, comprising steps of one group of blind hole alignment target and multiple groups figure alignment target are arranged simultaneously in core material；Press outer layer daughter board；With block graphics alignment target positioning, the figure registration holes for graphic making contraposition are drilled out；Corresponding blind hole alignment target, loses blind hole registration holes out on outer straton plate；It is roughened outer layer daughter board, its thickness is made to be thinned to 5 microns -8 microns, and makes the micro-rough face of its outer surface formation organic Cu complex；Using blind hole alignment target as positioning, CO is used2The direct ablation outer layer daughter board of laser makes blind hole；New outer layer daughter board is pressed, with the positioning of another block graphics alignment target, corresponding figure registration holes is drilled out and is aligned for graphic making；Simultaneously using the blind hole alignment target contraposition production blind hole of first time, so circulation makes multistage blind hole and multiple figure, ensure that highly dense multistage HDI blind hole and figure aligning accuracy.One kind PCB made of the above method is also disclosed in this programme.
Description
Technical field
The present invention relates to PCB processing technique field, it is related to the processing method and PCB of a kind of PCB, more particularly to a kind of multistage
The processing method and PCB of PCB is further related to the processing method and PCB of a kind of multistage PCB of high density.
Background technique
With the development of electronic technology, consumer to electronic product propose function more comprehensively, shape it is lighter
It is required that therefore the design structure of electronic product become increasingly complex.Traditional design of electric through-hole excessively has been unable to satisfy highly dense, small-sized
Change and multi-functional technical need, traditional diameter for crossing electric through-hole are generally higher than equal to 10mil (i.e. 0.254 millimeter), occupy
Design space is larger, and is not able to satisfy the complicated circuit design of random layer interconnection.Therefore, multi-layered high density interconnected (High
Density Interconnect, abbreviation HDI) printed wiring board (Print Circuit Board, abbreviation PCB) becomes increasingly popular.
The structure of the multilayer printed wiring board (or multistage printed wiring board) of standard generally comprises core material and multiple
It is provided with route on outer layer daughter board, the core material and multiple outer layer daughter boards, passes through metal in drilling, hole between each sandwich circuit
The processing procedure for changing (plating or copper facing) forms through-hole, and by the through-hole between each layer, the inside of Lai Shixian interlayer is connected.With more
The continuous renewal of the packaged type of component, has in wiring density increase and wiring board between layer printed wiring board in order to allow
The surface of the wiring board of limit can place more high performance components, in addition to wiring route is wide in current multilayer printed wiring board
Degree develops towards thinner direction, through-hole aperture develops outer towards smaller direction, has also appeared the technology in interlayer setting blind hole, with into one
Step reduces the occupancy to pcb board surface area.The general 4mil-5mil of diameter of blind hole, and multistage blind hole folds hole and electricity can be replaced logical
Hole design, reduces occupied space, and be able to achieve random layer interconnection, meets the needs of complicated circuit design.
Currently, the development that HDI technology complies with the epoch also develops towards multi-functional, more dense and miniaturization direction, it is related to
The pcb board of HDI is also developed the high-end technology of supreme multistage HDI by common single order HDI.The blind hole contraposition of the pcb board of high multistage HDI
Difficulty is very big, and the traditional handicraft of single order HDI drilling blind hole recycles the production of laser ablation resin using film windowing etching copper sheet
Blind hole folds hole for multistage blind hole, and the method repeats windowing and film deformation etc. because the film is used for multiple times, be easy to cause multistage
Blind hole is folding hole contraposition not just, therefore this method has been unable to meet the folded hole requirement of blind hole of high multistage HDI.
In the prior art, the production of multi-layer H DI printed wiring board generally uses lamination method, i.e., first makes internal layer, then
The opposed outer layer for making the internal layer again becomes new internal layer after opposed outer layer production, can be further continued for new with this
Internal layer make opposed outer layer.In the lamination method, when each internal layer makes, it is both needed to be made according to the opposed outer layer of the internal layer
Line pattern and the contraposition reference of drilling, in order to the production and drilling of line pattern on the opposed outer layer of the internal layer.This
It is arranged under the alignment mode of alignment system according to adjacent layer, since each laminate is with the contraposition system in its adjacent inner layer line pattern
System is reference data, once the setting of the alignment system in printed wiring board on a certain layer slightly error, will cause entirely to print
It misplaces in wiring board processed, is even scrapped so that the aligning accuracy of printed wiring board reduces between layers, and multi-layer H DI prints
The aligning accuracy of wiring board processed requires high.Therefore, it has been difficult to further increase track using this existing alignment system
The aligning accuracy of road plate.
In summary, it is ensured that three ranks and its more than high-order HDI printed wiring board in the blind hole copper that is formed between each layer
The qualification of column is effectively, it is necessary to which the aligning accuracy that blind hole drills in each layer of strict guarantee, based on the above situation, it is necessary to mention for we
A kind of accurate high multistage PCB processing method of folded hole contraposition out.
Summary of the invention
It is an object of the present invention to: the processing method of PCB a kind of is provided, one group of blind hole alignment target is set, it is multistage
Blind hole production is positioned with the blind hole alignment target, and the aligning accuracy and consistency of multistage blind hole are effectively improved.
It is an object of the present invention to: the processing method of PCB a kind of is provided, blind hole alignment target and figure are aligned into target
Mark is arranged in same layer, effectively improves the aligning accuracy of multistage figure and blind hole.
It is an object of the present invention to: the processing method of PCB a kind of is provided, CO is used2The outer straton of the direct ablation of laser
The layers of copper and resin layer of plate, it is disposable to complete blind hole production, it effectively improves blind hole and folds hole precision.
It is an object of the present invention to: a kind of PCB is provided, the figure alignment target of each outer layer daughter board of the PCB is all provided with
It sets at same layer (multiple groups figure alignment target), the graphic making of different outer layer daughter boards aligns target with a corresponding block graphics respectively
Mark contraposition, effectively increases the aligning accuracy of the figure repeatedly made.
It is an object of the present invention to: a kind of PCB is provided, the folded hole precision of the multistage blind hole of the PCB is high, figure with it is blind
The aligning accuracy in hole is also high.
To achieve this purpose, the present invention adopts the following technical scheme:
On the one hand, the processing method of PCB a kind of is provided, comprising the following steps:
S10, blind hole alignment target and several figure alignment targets are set on core material；
S20, pressing outer layer daughter board；
S30, the outer layer daughter board newly pressed using the correspondence on core material the figure alignment target as positioning, use
X-RAY drills out one group of figure registration holes for running through outer layer daughter board and core material；
The blind hole alignment target on S40, corresponding core material, etches the layers of copper on outer layer daughter board, forms blind hole pair
Position hole, so that subsequent optical mirror is through the blind hole alignment target on outer layer daughter board capture core material；
S50, roughening outer layer daughter board, make the copper layer thickness of outer layer daughter board be thinned to 5 microns -8 microns, and make outer layer daughter board
The micro-rough face of outer surface formation organic Cu complex；
S60, using the blind hole alignment target on core material as positioning, use CO2The outer straton of the direct ablation of laser
Plate makes blind hole；
S70, judge whether the order of PCB is equal to the PCB order being pre-designed；
If it is not, return step S20；
If so, terminating PCB processing.
Multistage PCB includes several layers daughter board, only step S20 to S70 need to be repeated, until order reaches the specification of PCB product
It is required that.
Core material and outer layer daughter board are used only for facilitating differentiation, without other special meanings.
Preferably, the shape of the blind hole alignment target and the figure alignment target is round, rectangle or abnormity.
Preferably, in step S20, outer layer daughter board is bonded to one with core material under high-temperature and high-pressure conditions.
Preferably, in step S50, it is roughened the layers of copper of outer layer daughter board, microetch amount is controlled at 2 microns -3 microns.
Preferably, the method that copper is thinned in step S50 is that chemistry is carried out using sulfuric acid, hydrogen peroxide reagent and outer layer daughter board instead
It answers, the surface of the layers of copper of external straton plate carries out microetch, and the copper layer thickness of outer layer daughter board is thinned uniformly.
Main chemical reaction is as follows:
H2SO4+Cu+H2O2——CuSO4+2H2O
Specifically, in step S60, due to using CO2Laser drills, it is therefore desirable to the copper of strict control outer layer daughter board
Thickness degree guarantees that the copper layer thickness of outer layer daughter board is 5 microns -8 microns, otherwise CO2The energy of laser will be unable to burn outer straton
The layers of copper of plate.
Specifically, X-RAY in step S30 drilling of practicing shooting is exactly to penetrate energy using X-RAY is different in different media
Power receives the signal after layers of copper absorbs with CCD camera, then by signal and schemes through device for image forming and signal amplifying apparatus
Image relaying is to computer system and carries out the figure alignment target that image solution is clear, in discovery core material, is most centainly positioned afterwards
After program processing, the bore position of figure registration holes is determined.
A kind of preferred embodiment of processing method as PCB, the quantity of the blind hole alignment target are one group, the figure
The quantity of alignment target determines according to the number of plies of outer layer daughter board, make each outer layer daughter board it is one group corresponding described in figure alignment target.
Specifically, one group of blind hole alignment target is only set, multistage blind hole production is positioned with the blind hole alignment target,
Effectively improve the aligning accuracy and consistency of multistage blind hole.
A kind of preferred embodiment of processing method as PCB, the blind hole alignment target and the figure alignment target are set
It sets on same layer core plate.Keep the relative position of blind hole alignment target and figure alignment target more accurate, realizes blind hole and figure
The consistency of shape precision effectively improves the aligning accuracy of multistage figure and blind hole to guarantee the feasibility of fine and closely woven line space design.
A kind of preferred embodiment of processing method as PCB is additionally provided with step S65 between step S60 and step S70:
S65, using the corresponding figure alignment target of the outer layer daughter board in rear pressing as positioning, it is outer what is formerly pressed
Etched figure target relief hole on straton plate, to expose the corresponding figure alignment target of outer layer daughter board in rear pressing.
The figure target relief hole is opened up for the corresponding figure alignment target of the outer layer daughter board in rear pressing, is had
Conducive to the figure alignment target on the outer layer daughter board of rear pressing locking core material, and with figure alignment target work
For positioning, the figure registration holes through outer layer daughter board and core material are drilled out using X-RAY.
A kind of preferred embodiment of processing method as PCB is additionally provided with following steps between step S60 and step S65:
S63, the blind hole is filled and led up by electroless copper plating and whole plate electroplating processes, realizes the conducting of adjacent two layers daughter board；
S64, using figure registration holes as positioning, make figure on outer straton plate.
A kind of preferred embodiment of processing method as PCB is additionally provided with following steps between step S60 and step S63:
S61, buried via hole and edges of boards tooling hole are bored；
S62, the blind hole, buried via hole and copper scale and resin in edges of boards tooling hole are removed.
A kind of preferred embodiment of processing method as PCB is additionally provided with step S45 between step S40 and step S50:
S45, the copper layer thickness of outer layer daughter board is thinned to 8 microns -10 microns.
Preferably, following steps are additionally provided between step S45 and step S50:
S46, the oxide and foreign matter on outer layer daughter board surface are removed with acid reagent, then removes outer layer daughter board table with water
The remaining acid reagent in face；
S47, the grease and fingerprint on outer layer daughter board surface are removed with alkaline reagent, then removes outer layer daughter board surface with water
Remaining alkaline reagent；
S48, the surface roughness for increasing outer layer daughter board make outer layer daughter board surface active, and sufficiently remove step S46 and step
Remaining acid, base reagent in rapid S47.
Specifically, the foreign matters such as oxide, grease and the fingerprint on outer layer daughter board surface are removed by pickling, alkali cleaning, pass through work
Change the surface roughness for increasing outer layer daughter board, makes the surface active of outer layer daughter board, effectively improve roughening effect.
A kind of preferred embodiment of processing method as PCB, in step S40, the size of the blind hole registration holes is greater than institute
State the size of blind hole alignment target.
Specifically, the blind hole registration holes of larger size can guarantee that the blind hole alignment target on core material reveals completely
Out, the precision contraposition in blind hole manufacturing process is helped to improve.
A kind of preferred embodiment of processing method as PCB, in step S65, the size of the figure target relief hole is big
In the size of the figure alignment target.
Specifically, the figure target relief hole of larger size can guarantee that the figure alignment target on core material is complete
It is complete to expose.
On the other hand, a kind of PCB is provided, which is made of the processing method of the multistage PCB of above-specified high density, which includes
Edges of boards contraposition area and the unit figure area for making figure, the blind hole alignment target and the figure alignment target are respectively provided with
In edges of boards contraposition area.
Preferably, four angles in edges of boards contraposition area are arranged in the blind hole alignment target and the figure alignment target
On.
One group of blind hole alignment target is arranged in the PCB, and multiple groups figure alignment target is arranged for more on same layer core plate
The contraposition of secondary graphic making, multistage blind hole production are positioned with identical blind hole alignment target, and direct using CO2 laser
Ablation layers of copper and resin layer, disposable to complete blind hole production, multiple blind hole production is improved due to using same contraposition standard
Multistage blind hole folds hole precision；In addition, same layer is disposably arranged in blind hole alignment target and multiple groups figure alignment target, improve
The aligning accuracy of multiple figure and blind hole.
The invention has the benefit that
(1) one group of blind hole alignment target is set, multistage blind hole production is positioned with the blind hole alignment target, due to
Blind hole is positioned with the same blind hole alignment target, therefore effectively improves the aligning accuracy and consistency of multistage blind hole.In addition to phase
Same blind hole alignment target positioning is outer, also uses CO2The layers of copper and resin layer of the direct ablation outer layer daughter board of laser, it is disposable to complete
Blind hole production avoids film deformation and secondary contraposition deviation, effectively improves blind hole and fold hole without film windowing etching production blind hole
Precision.
(2) align blind hole alignment target and figure in same layer blind hole alignment target and the setting of figure alignment target
The relative position of target is more accurate, the consistency of blind hole and pattern precision is realized, to guarantee the feasible of fine and closely woven line space design
Property, effectively improve the aligning accuracy of multistage figure and blind hole.
(3) a kind of PCB is provided, the folded hole precision of the multistage blind hole of the PCB is high, and the aligning accuracy of figure and blind hole is also high,
Be conducive to the accurate layout of PCB internal structure.
Detailed description of the invention
The present invention will be further described in detail below based on the drawings and embodiments.
Fig. 1 is the flow chart of the multistage PCB processing method of high density described in embodiment；
Fig. 2 is the schematic diagram of the pressing of L4/L7 daughter board described in embodiment；
Fig. 3 is the signal of L4/L7 daughter board figure alignment target, blind hole alignment target and graphic making described in embodiment
Figure；
Fig. 4 is the schematic diagram of the pressing of L3/L8 daughter board described in embodiment；
Fig. 5 is the schematic diagram that L3/L8 daughter board described in embodiment makes figure registration holes and blind hole registration holes；
Fig. 6 is the schematic diagram that L3/L8 daughter board described in embodiment opens up blind hole；
Fig. 7 is that L3/L8 daughter board blind hole described in embodiment fills and leads up the schematic diagram with graphic making；
Fig. 8 is the schematic diagram of the pressing of L2/L9 daughter board described in embodiment；
Fig. 9 is the schematic diagram that L2/L9 daughter board described in embodiment makes figure registration holes and blind hole registration holes；
Figure 10 is the schematic diagram that L2/L9 daughter board described in embodiment opens up blind hole；
Figure 11 is that L2/L9 daughter board blind hole described in embodiment fills and leads up the schematic diagram with graphic making；
Figure 12 is the schematic diagram of the pressing of L1/L10 daughter board described in embodiment；
Figure 13 is the schematic diagram that L1/L10 daughter board described in embodiment makes figure registration holes and blind hole registration holes；
Figure 14 is the schematic diagram that L1/L10 daughter board described in embodiment opens up blind hole；
Figure 15 is that L1/L10 daughter board blind hole described in embodiment fills and leads up the schematic diagram with graphic making.
Fig. 2 is into Figure 15:
1, core material；2, outer layer daughter board；3, unit figure area；31, blind hole；4, edges of boards align area；41, blind hole aligns target
Mark；42, blind hole registration holes；43, the first figure alignment target；44, second graph alignment target；45, third figure alignment target；
46, the first figure registration holes；47, second graph registration holes；48, third figure registration holes；49, figure target relief hole.
Specific embodiment
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
On the one hand, the processing method of PCB a kind of is provided, comprising the following steps:
S10, blind hole alignment target and several figure alignment targets are set on core material.
Core material and outer layer daughter board are used only for facilitating differentiation, without other special meanings.
The shape of the blind hole alignment target and the figure alignment target is round, rectangle or abnormity.
The quantity of the blind hole alignment target is one group, and the quantity of the figure alignment target is according to the number of plies of outer layer daughter board
Determine, make each outer layer daughter board it is one group corresponding described in figure alignment target.One group of blind hole alignment target is only arranged in this programme, multistage
Blind hole production is positioned with the blind hole alignment target, and the aligning accuracy and consistency of multistage blind hole are effectively improved.
The blind hole alignment target and the figure alignment target are arranged on same layer core plate.Make blind hole alignment target and
The relative position of figure alignment target is more accurate, the consistency of blind hole and pattern precision is realized, to guarantee that fine and closely woven spacing is set
The feasibility of meter effectively improves the aligning accuracy of multistage figure and blind hole.
In this present embodiment, step S10 is specifically: L4/L7 core material 1 edges of boards contraposition area 4 on be arranged one group it is blind
The shape of hole alignment target 41 and three block graphics alignment targets, blind hole alignment target 41 and the figure alignment target is round
Shape.In other embodiments, the shape of blind hole alignment target 41 and the figure alignment target can be rectangle or abnormity.It should
Three block graphics alignment targets are the first figure alignment target 43, second graph alignment target 44 and third figure alignment target respectively
45, the corresponding L3/L8 outer layer daughter board 2 of the first figure alignment target 43, the corresponding L2/L9 outer layer daughter board 2 of second graph alignment target 44,
Third figure alignment target 45 corresponds to L1/L10 outer layer daughter board 2.
S20, pressing outer layer daughter board.
In this present embodiment, step S20 is specifically: bonding outer layer daughter board 2 and core material 1 under high-temperature and high-pressure conditions
Integrally.
S30, using the figure alignment target on core material as positioning, drilled out using X-RAY through outer layer daughter board
With the figure registration holes of core material.
In this present embodiment, step S30 is specifically:
When processing L3/L8 outer layer daughter board 2, using the first figure alignment target 43 on core material 1 as positioning, use
X-RAY drills out the first figure registration holes 46 through outer layer daughter board 2 and core material 1.
When processing L2/L9 outer layer daughter board 2, using the second graph alignment target 44 on core material 1 as positioning, use
X-RAY drills out the second graph registration holes 47 through outer layer daughter board 2 and core material 1.
When processing L1/L10 outer layer daughter board 2, using the third figure alignment target 45 on core material 1 as positioning, make
The third figure registration holes 48 through outer layer daughter board 2 and core material 1 are drilled out with X-RAY.
The blind hole alignment target on S40, corresponding core material, etches the layers of copper on outer layer daughter board, forms blind hole pair
Position hole, so that subsequent optical mirror is through the blind hole alignment target on outer layer daughter board capture core material.
Specifically, the size of the blind hole registration holes is greater than the size of the blind hole alignment target.The blind hole of larger size
Registration holes can guarantee that the blind hole alignment target on core material is completely exposed, and help to improve in blind hole manufacturing process
Precision contraposition.
In this present embodiment, step S40 is specifically:
When processing L3/L8 outer layer daughter board 2, the blind hole alignment target 41 on core material 1, the straton outside L3/L8 are corresponded to
Blind hole registration holes 42 are etched on plate 2, to expose blind hole alignment target 41.
When processing L2/L9 outer layer daughter board 2, the blind hole alignment target 41 on core material 1, the straton outside L2/L9 are corresponded to
Blind hole registration holes 42 are etched on plate 2, to expose blind hole alignment target 41.
When processing L1/L10 outer layer daughter board 2, the blind hole alignment target 41 on core material 1 is corresponded to, in L1/L10 outer layer
Blind hole registration holes 42 are etched on daughter board 2, to expose blind hole alignment target 41.
S50, roughening outer layer daughter board, make the copper layer thickness of outer layer daughter board be thinned to 5 microns -8 microns, and make outer layer daughter board
The micro-rough face of outer surface formation organic Cu complex.
During being roughened the layers of copper of outer layer daughter board, microetch amount is controlled at 2 microns -3 microns.
In this present embodiment, step S50 is specifically: being carried out using sulfuric acid, hydrogen peroxide reagent and outer layer daughter board 2 chemical anti-
It answers, the surface of the layers of copper of external straton plate 2 carries out microetch, and microetch amount is controlled at 2 microns -3 microns, makes the layers of copper of outer layer daughter board 2
Thickness is uniformly thinned to 5 microns -8 microns, and makes the micro-rough face of the outer surface formation organic Cu complex of outer layer daughter board 2.
The main chemical reaction that copper is thinned is as follows:
H2SO4+Cu+H2O2——CuSO4+2H2O
S60, using the blind hole alignment target on core material as positioning, use CO2The outer straton of the direct ablation of laser
Plate makes blind hole.
Due to using CO2Laser drills, it is therefore desirable to which the copper layer thickness of strict control outer layer daughter board guarantees outer straton
The copper layer thickness of plate is 5 microns -8 microns, otherwise CO2The energy of laser will be unable to burn the layers of copper of outer layer daughter board.
In this present embodiment, step S60 is specifically:
When processing L3/L8 outer layer daughter board 2, using the blind hole alignment target 41 on core material 1 as positioning, CO is used2
The direct ablation L3/L8 outer layer daughter board 2 of laser makes blind hole 31.
When processing L2/L9 outer layer daughter board 2, using the blind hole alignment target 41 on core material 1 as positioning, CO is used2
The direct ablation L2/L9 outer layer daughter board 2 of laser makes blind hole 31.
When processing L1/L10 outer layer daughter board 2, using the blind hole alignment target 41 on core material 1 as positioning, CO is used2
The direct ablation L1/L10 outer layer daughter board 2 of laser makes blind hole 31.
S70, judge whether the order of PCB is equal to the PCB order being pre-designed；
If it is not, return step S20；
If so, terminating PCB processing.
Multistage PCB includes several layers daughter board, only step S20 to S70 need to be repeated, until order reaches the specification of PCB product
It is required that.
Further, step S65 is additionally provided between step S60 and step S70:
S65, using the corresponding figure alignment target of the outer layer daughter board in rear pressing as positioning, it is outer what is formerly pressed
Etched figure target relief hole on straton plate, to expose the corresponding figure alignment target of outer layer daughter board in rear pressing.
The figure target relief hole is opened up for the corresponding figure alignment target of the outer layer daughter board in rear pressing, is had
Conducive to the figure alignment target on the outer layer daughter board of rear pressing locking core material, and with figure alignment target work
For positioning, the figure registration holes through outer layer daughter board and core material are drilled out using X-RAY.
Specifically, the size of the figure target relief hole is greater than the size of the figure alignment target.Larger size
Figure target relief hole can guarantee that the figure alignment target on core material is completely exposed.
In this present embodiment, step S65 is specifically:
When processing L3/L8 outer layer daughter board 2, with the corresponding second graph alignment target 44 of L2/L9 outer layer daughter board 2 and L1/
The corresponding third figure alignment target 45 of L10 outer layer daughter board 2 distinguishes etched figure target as positioning on L3/L8 outer layer daughter board 2
Relief hole 49 is marked, to expose second graph alignment target 44 and third figure alignment target 45.
When processing L2/L9 outer layer daughter board 2, using the corresponding third figure alignment target 45 of L1/L10 outer layer daughter board 2 as
Positioning, the etched figure target relief hole 49 on L2/L9 outer layer daughter board 2, to expose third figure alignment target 45.
Further, following steps are additionally provided between step S60 and step S65:
S61, buried via hole and edges of boards tooling hole are bored.
S62, the blind hole, buried via hole and copper scale and resin in edges of boards tooling hole are removed.
S63, the blind hole is filled and led up by electroless copper plating and whole plate electroplating processes, realizes the conducting of adjacent two layers daughter board.
S64, using figure registration holes as positioning, make figure on outer straton plate.
In this present embodiment, step S64 is specifically:
When processing L3/L8 outer layer daughter board 2, using the first figure registration holes 46 as positioning, on L3/L8 outer layer daughter board 2
Make figure.
When processing L2/L9 outer layer daughter board 2, using second graph registration holes 47 as positioning, on L2/L9 outer layer daughter board 2
Make figure.
When processing L1/L10 outer layer daughter board 2, using third figure registration holes 48 as positioning, in L1/L10 outer layer daughter board 2
Upper production figure.
Further, following steps are additionally provided between step S40 and step S50:
S45, the copper layer thickness of outer layer daughter board is thinned to 8 microns -10 microns.
S46, the oxide and foreign matter on outer layer daughter board surface are removed with acid reagent, then removes outer layer daughter board table with water
The remaining acid reagent in face.
S47, the grease and fingerprint on outer layer daughter board surface are removed with alkaline reagent, then removes outer layer daughter board surface with water
Remaining alkaline reagent.
S48, the surface roughness for increasing outer layer daughter board make outer layer daughter board surface active, and sufficiently remove step S46 and step
Remaining acid, base reagent in rapid S47.
Specifically, the foreign matters such as oxide, grease and the fingerprint on outer layer daughter board surface are removed by pickling, alkali cleaning, pass through work
Change the surface roughness for increasing outer layer daughter board, makes the surface active of outer layer daughter board, effectively improve roughening effect.
For three rank PCB, as shown in attached drawing 2 to 15, specific procedure of processing is as follows:
As shown in figure 3, blind hole alignment target 41, the first figure is arranged in the edges of boards contraposition area 4 of L4/L7 core material 1
Alignment target 43, second graph alignment target 44 and third figure alignment target 45；
As shown in figure 4, L3/L8 outer layer daughter board 2 to be pressed together on to the two sides of L4/L7 core material 1；
As shown in figure 5, being bored using the first figure alignment target 43 on L4/L7 core material 1 as positioning using X-RAY
Run through the first figure registration holes 46 of outer layer daughter board 2 and core material 1 out；
As shown in figure 5, the blind hole alignment target 41 on corresponding L4/L7 core material 1, etches on L3/L8 outer layer daughter board 2
Blind hole registration holes 42, to expose blind hole alignment target 41；
The copper layer thickness of L3/L8 outer layer daughter board 2 is thinned to 8 microns -10 microns, removes L3/L8 outer layer with acid reagent
Then oxide and foreign matter on 2 surface of daughter board remove remaining acid reagent with water, remove L3/L8 outer layer with alkaline reagent
Then grease and fingerprint on 2 surface of daughter board remove remaining alkaline reagent with water, the surface for increasing L3/L8 outer layer daughter board 2 is thick
Rugosity makes 2 surface active of L3/L8 outer layer daughter board；
Microetch is carried out to the surface of the layers of copper of L3/L8 outer layer daughter board 2, microetch amount is controlled at 2-3 microns, makes L3/L8 outer layer
The copper layer thickness of daughter board 2 is uniformly thinned to 5-8 microns, and the outer surface of L3/L8 outer layer daughter board 2 is made to form the micro- of organic Cu complex
See rough surface；
As shown in fig. 6, using CO using the blind hole alignment target 41 on L4/L7 core material 1 as positioning2Laser is direct
Ablation L3/L8 outer layer daughter board 2 makes blind hole 31；
As shown in fig. 7, boring buried via hole and edges of boards tooling hole, blind hole 31, buried via hole and copper scale and tree in edges of boards tooling hole are removed
Rouge is filled and led up blind hole 31 by electroless copper plating and whole plate electroplating processes, realizes the conducting of adjacent two layers daughter board, and with the first figure
Registration holes 46 make figure on L3/L8 outer layer daughter board 2 as positioning；
As shown in fig. 7, right with the corresponding second graph alignment target 44 of L2/L9 outer layer daughter board 2 and L1/L10 outer layer daughter board 2
The third figure alignment target 45 answered distinguishes etched figure target relief hole 49 as positioning on L3/L8 outer layer daughter board 2, with
Expose second graph alignment target 44 and third figure alignment target 45；
As shown in figure 8, L2/L9 outer layer daughter board 2 to be pressed together on to the two sides of L3/L8 outer layer daughter board 2；
As shown in figure 9, being bored using the second graph alignment target 44 on L4/L7 core material 1 as positioning using X-RAY
Run through the second graph registration holes 47 of outer layer daughter board 2 and core material 1 out；
As shown in figure 9, the blind hole alignment target 41 on corresponding L4/L7 core material 1, etches on L2/L9 outer layer daughter board 2
Blind hole registration holes 42, to expose blind hole alignment target 41；
The copper layer thickness of L2/L9 outer layer daughter board 2 is thinned to 8 microns -10 microns, removes L2/L9 outer layer with acid reagent
Then oxide and foreign matter on 2 surface of daughter board remove remaining acid reagent with water, remove L2/L9 outer layer with alkaline reagent
Then grease and fingerprint on 2 surface of daughter board remove remaining alkaline reagent with water, the surface for increasing L2/L9 outer layer daughter board 2 is thick
Rugosity makes 2 surface active of L2/L9 outer layer daughter board；
Microetch is carried out to the surface of the layers of copper of L2/L9 outer layer daughter board 2, microetch amount is controlled at 2 microns -3 microns, makes L2/L9
The copper layer thickness of outer layer daughter board 2 is uniformly thinned to 5 microns -8 microns, and the outer surface of L2/L9 outer layer daughter board 2 is made to form organic network
Close the micro-rough face of copper；
As shown in Figure 10, using the blind hole alignment target 41 on L4/L7 core material 1 as positioning, CO is used2Laser is direct
Ablation L2/L9 outer layer daughter board 2 makes blind hole 31；
As shown in figure 11, buried via hole and edges of boards tooling hole are bored, blind hole 31, buried via hole and copper scale and tree in edges of boards tooling hole are removed
Rouge is filled and led up blind hole 31 by electroless copper plating and whole plate electroplating processes, realizes the conducting of adjacent two layers daughter board, and with second graph
Registration holes 47 make figure on L2/L9 outer layer daughter board 2 as positioning；
As shown in figure 11, using the corresponding third figure alignment target 45 of L1/L10 outer layer daughter board 2 as positioning, in L2/L9
Etched figure target relief hole 49 on outer layer daughter board 2, to expose third figure alignment target 45；
As shown in figure 12, L1/L10 outer layer daughter board 2 is pressed together on to the two sides of L2/L9 outer layer daughter board 2；
As shown in figure 13, it using the third figure alignment target 45 on L4/L7 core material 1 as positioning, is bored using X-RAY
Run through the third figure registration holes 48 of outer layer daughter board 2 and core material 1 out；
As shown in figure 13, the blind hole alignment target 41 on corresponding L4/L7 core material 1, loses on L1/L10 outer layer daughter board 2
Blind hole registration holes 42 are carved, to expose blind hole alignment target 41；
The copper layer thickness of L1/L10 outer layer daughter board 2 is thinned to 8 microns -10 microns, is removed outside L1/L10 with acid reagent
Then oxide and foreign matter on 2 surface of straton plate remove remaining acid reagent with water, removed outside L1/L10 with alkaline reagent
Then grease and fingerprint on 2 surface of straton plate remove remaining alkaline reagent with water, increase the table of L1/L10 outer layer daughter board 2
Surface roughness makes 2 surface active of L1/L10 outer layer daughter board；
Microetch is carried out to the surface of the layers of copper of L1/L10 outer layer daughter board 2, microetch amount is controlled at 2 microns -3 microns, makes L1/
The copper layer thickness of L10 outer layer daughter board 2 is uniformly thinned to 5 microns -8 microns, and is formed with the outer surface of L1/L10 outer layer daughter board 2
The micro-rough face of machine complex copper；
As shown in figure 14, using the blind hole alignment target 41 on L4/L7 core material 1 as positioning, CO is used2Laser is direct
Ablation L1/L10 outer layer daughter board 2 makes blind hole 31；
As shown in figure 15, buried via hole and edges of boards tooling hole are bored, blind hole 31, buried via hole and copper scale and tree in edges of boards tooling hole are removed
Rouge is filled and led up blind hole 31 by electroless copper plating and whole plate electroplating processes, realizes the conducting of adjacent two layers daughter board, and with third figure
Registration holes 48 make figure on L1/L10 outer layer daughter board 2 as positioning.
On the other hand, a kind of PCB is provided, which is made of the processing method of the multistage PCB of above-specified high density, which includes
Edges of boards align area 4 and the unit figure area 3 for making figure, and blind hole alignment target 41 and whole figure alignment targets are respectively provided with
In edges of boards contraposition area 4.
In this present embodiment, blind hole alignment target 41 and the first figure alignment target 43, second graph alignment target 44,
Three figure alignment targets 45 are arranged on four angles in edges of boards contraposition area 4.
" first " herein, " second ", " third " contain just for the sake of being distinguish in description special
Justice.
It is to be understood that above-mentioned specific embodiment is only that presently preferred embodiments of the present invention and institute's application technology are former
Reason, within the technical scope of the present disclosure, variation that anyone skilled in the art is readily apparent that or
Replacement, should be covered by the scope of protection of the present invention.
Claims (9)
1. a kind of processing method of PCB, which comprises the following steps:
S10, blind hole alignment target and several figure alignment targets are set on core material；
S20, pressing outer layer daughter board；
S30, the outer layer daughter board newly pressed using the correspondence on core material the figure alignment target as positioning, use X-
RAY drills out one group of figure registration holes for running through outer layer daughter board and core material；
The blind hole alignment target on S40, corresponding core material, etches the layers of copper on outer layer daughter board, forms blind hole registration holes,
So that subsequent optical mirror is through the blind hole alignment target on outer layer daughter board capture core material；
S50, roughening outer layer daughter board, make the copper layer thickness of outer layer daughter board be thinned to 5 microns -8 microns, and make the appearance of outer layer daughter board
The micro-rough face of face formation organic Cu complex；
S60, using the blind hole alignment target on core material as positioning, use CO2The direct ablation outer layer daughter board production of laser
Blind hole；
S70, judge whether the order of PCB is equal to the PCB order being pre-designed；
If it is not, return step S20；
If so, terminating PCB processing.
2. the processing method of PCB according to claim 1 a kind of, which is characterized in that the quantity of the blind hole alignment target
It is one group, the quantity of the figure alignment target is determined according to the number of plies of outer layer daughter board, makes the corresponding one group of institute of each outer layer daughter board
State figure alignment target.
3. the processing method of PCB according to claim 2 a kind of, which is characterized in that between step S60 and step S70 also
It is provided with step S65:
S65, using the corresponding figure alignment target of the outer layer daughter board in rear pressing as positioning, in the outer straton formerly pressed
Etched figure target relief hole on plate, to expose the corresponding figure alignment target of outer layer daughter board in rear pressing.
4. the processing method of PCB according to claim 3 a kind of, which is characterized in that between step S60 and step S65 also
It is provided with step S63:
S63, the blind hole is filled and led up by electroless copper plating and whole plate electroplating processes, realizes the conducting of adjacent two layers daughter board.
5. the processing method of PCB according to claim 4 a kind of, which is characterized in that between step S60 and step S63 also
It is provided with following steps:
S61, buried via hole and edges of boards tooling hole are bored；
S62, the blind hole, buried via hole and copper scale and resin in edges of boards tooling hole are removed.
6. the processing method of PCB according to claim 1 a kind of, which is characterized in that between step S40 and step S50 also
It is provided with step S45:
S45, the copper layer thickness of outer layer daughter board is thinned to 8 microns -10 microns.
7. the processing method of PCB according to claim 1 a kind of, which is characterized in that in step S40, the blind hole contraposition
The size in hole is greater than the size of the blind hole alignment target.
8. the processing method of PCB according to claim 3 a kind of, which is characterized in that in step S65, the figure target
The size of relief hole is greater than the size of the figure alignment target.
9. a kind of PCB, which is characterized in that be made of the processing method of the described in any item PCB of claim 1 to 8, the PCB packet
Rubbing board side contraposition area and unit figure area for making figure, the blind hole alignment target and the figure alignment target are all provided with
It sets in edges of boards contraposition area.
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106170181B (en) * | 2016-08-31 | 2018-12-21 | 博敏电子股份有限公司 | A kind of wiring board production folded hole interconnection method in high-precision laser hole |
| CN109922602B (en) * | 2019-04-02 | 2021-09-14 | 博敏电子股份有限公司 | Multi-functional target error-proofing design method for Analyyer plate |
| CN112087887B (en) * | 2019-06-12 | 2023-06-09 | 奥特斯科技(重庆)有限公司 | Alignment of component carrier structures by combining evaluation pad and hole type alignment marks |
| CN111372382B (en) * | 2020-04-15 | 2021-05-25 | 黄石广合精密电路有限公司 | Primary and secondary board pressing alignment design process method of PCB |
| CN112312683A (en) * | 2020-09-22 | 2021-02-02 | 胜宏科技（惠州）股份有限公司 | High-order HDI board layer alignment method and circuit board |
| CN112165779B (en) * | 2020-10-20 | 2021-08-31 | 江西强达电路科技有限公司 | High-precision inner layer laminating method for multilayer PCB |
| CN114727486B (en) * | 2021-01-04 | 2024-03-15 | 鹏鼎控股(深圳)股份有限公司 | Circuit board preparation method |
| CN113163580B (en) * | 2021-04-25 | 2023-12-19 | 东莞市五株电子科技有限公司 | Novel graphic composite alignment target and HDI board |
| CN114340225B (en) * | 2021-12-23 | 2024-02-23 | 江苏普诺威电子股份有限公司 | Multilayer packaging substrate alignment method suitable for laser blind holes |
| CN114845484A (en) * | 2022-05-05 | 2022-08-02 | 博敏电子股份有限公司 | Cross-layer blind hole alignment method of multilayer board |
| CN115397117A (en) * | 2022-08-10 | 2022-11-25 | 中山芯承半导体有限公司 | Circuit board manufacturing method for improving interlayer and layer alignment |
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