CN109905964A - A kind of production method of circuit board that realizing highly dense interconnection - Google Patents
A kind of production method of circuit board that realizing highly dense interconnection Download PDFInfo
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- CN109905964A CN109905964A CN201910181895.6A CN201910181895A CN109905964A CN 109905964 A CN109905964 A CN 109905964A CN 201910181895 A CN201910181895 A CN 201910181895A CN 109905964 A CN109905964 A CN 109905964A
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Abstract
The present invention relates to printed wiring board technical field, specially a kind of production method for the circuit board for realizing highly dense interconnection.The present invention is after graphic plating layers of copper and tin layers, tin and alkali etching are removed by laser part, it takes off tin and forms metallization point hole, layers of copper in hole wall is separated to form mutually independent part by substrate layer, the interlayer interconnection of heterogeneous networks can be achieved, the electric linkage function of multiple micropores is realized in the metallization point hole that a mechanical through hole is made, and then highly dense interconnection can be realized without micro-aperture technique.Therefore the present invention provides it is a kind of by metallization divide hole realize the highly dense interconnection of interlayer highly dense interconnection circuit plate and it is a kind of without application micro-aperture technique and the production method for forming highly dense interconnection circuit plate only can be made by mechanical through hole technology；And because using through-hole technology, without multiple laser drill, filling perforation plating and pressing, process flow is relatively easy very much, greatly reduces manufacture difficulty and manufacturing cost.
Description
Technical field
The present invention relates to printed wiring board technical field more particularly to a kind of production sides for the circuit board for realizing highly dense interconnection
Method.
Background technique
As the integrated level of electronic system is continuously improved, circuit board increasingly minimizes, is lightening and integrated, therefore electricity
The design density of road plate is higher and higher also just to become inevitable, and highly dense interconnection circuit plate application is also more and more, for example consumes
The mobile phone of electronics.Size due to battery of mobile phone is increasing, and circuit board of mobile phone increases space very little, but handset capability needs
It is promoted to meet the development of increasingly multifunction and high speed, therefore when designing circuit board using the increase number of plies, reduction line
The wide line realizes highly dense interconnection away from the mode with aperture.
Electric property between each layer of circuit board is to realize to connect by plated through-hole, and plated-through hole is a kind of most square
Just most direct connection type.But in the very high situation of the density in the hole of required setting, it is limited to plate thickness, radius-thickness ratio etc.
The problem of factor, mechanical through hole cannot be too small, otherwise will lead to drilling breaking of rod needle and electroplating hole are without quality problems such as copper.Solution at present
Certainly the scheme of the technical problem is to connect technology using random layer, by laser drilling Blind hole (general aperture 125 μm with
Under), in addition each layer Blind hole that filling perforation electroplating technology bores laser is superimposed and connects into a through-hole form.Existing work
Skill technology, the mentality of designing of existing high density case lower through-hole are that interlayer connection is realized by micro-aperture technique, and micropore
It is then to be formed by stacking by the Blind hole that laser is bored, design is complicated；And realize that through-hole is arranged in high density by micro-aperture technique
It needs to realize blind hole superposition by techniques such as multiple laser drill, filling perforation plating and pressings to realize interlayer connection,
This technology method is extremely complex, and manufacturing cost is very high.
Summary of the invention
The present invention realizes interlayer electrical connection using micro-aperture technique for existing highly dense interconnection circuit plate, need to repeatedly be swashed
The process flows such as drill finish hole, filling perforation plating and pressing, the problem that process is complicated, manufacturing cost is high provide one kind in a machinery
Circuit board of the electric linkage function of multiple micropores without highly dense interconnection can be realized using micro-aperture technique is realized in through-hole
Production method.
To achieve the above object, the present invention uses following technical scheme.
The present invention provides a kind of production method of circuit board for realizing highly dense interconnection, comprising the following steps:
S1, make internal layer circuit on core material by negative film technique, the internal layer circuit include for rear process
The internal layer of the plated-through hole connection of production divides hole pad；The internal layer divides hole pad circumferentially by the layers of copper of alternate intervals and base
Material layer is constituted.
S2, core material and outer copper foil high-temperature laminating are integrated by prepreg, form the production of multilayered structure
Plate.
S3, the holes drilled through on production plate, the through-hole divide hole perpendicular to the Kong Xinyu internal layer of internal layer point hole pad and through-hole
Pad center is overlapped；Then heavy copper, electric plating of whole board, the transfer of figure, pattern plating copper, graphic plating are successively carried out to production plate
The processing of tin process, and the figure includes preceding outer layer point hole land pattern；So far before being formed at the land pattern of preceding outer layer point hole
Outer layer divides hole pad, and the via metalization forms plated-through hole；The plated-through hole and preceding outer layer divide the outer of hole pad
Layer is tin layers, and secondary outer layer is layers of copper.
S4, divide the part tin layers of hole pad so that layers of copper exposing, makes metal with laser burn-up plated-through hole and preceding outer layer
Change through-hole and preceding outer layer divides the outer layer of hole pad to be made of the tin layers of alternate intervals and layers of copper, and constitutes preceding outer layer and divide hole pad
Outer layer layers of copper corresponded with the layers of copper for the outer layer for constituting plated-through hole be connected and preceding outer layer point hole pad except layer
Layers of copper divides the set-up mode of substrate layer on the pad of hole identical with internal layer.
S5, the film for constituting figure on production plate is taken off, exposes the layers of copper of former envelope covering, it then will by alkali etching
Layers of copper exposed on plate is produced to remove so that substrate exposes；The plated-through hole and preceding outer layer divide the outer layer of hole pad equal at this time
It is made of the tin layers of alternate intervals and substrate layer.
S6, the tin layers produced on plate are taken off, exposes the former layers of copper covered by tin layers；The plated-through hole and preceding outer layer
Divide the outer layer of hole pad to be made of alternate layers of copper and substrate layer, metallization point hole is made respectively and outer layer divides hole pad.
Preferably, also hole can be divided to carry out filling holes with resin or the processing of welding resistance consent the metallization on production plate.
S7, silk-screen welding resistance, surface treatment and molding procedure are successively carried out to production plate, completes the production of circuit board.
Compared with prior art, the beneficial effects of the present invention are:
The method that the present invention uses graphic plating, after graphic plating layers of copper and tin layers, by laser by plated-through hole
The tin coating (tin thickness is generally 4-6 μm) of its hole wall is divided at least two mutually independent parts, and hole wall is cut off tin
Layers of copper is exposed in the region of layer, i.e., removes the tin protective layer in the region layers of copper by laser, then pass through the side of alkali etching
Method etches away exposed layers of copper, finally takes off tin and forms the metallization point hole that hole wall is layers of copper and substrate layer alternate intervals, hole wall
In layers of copper separated to form mutually independent part by substrate layer, referred to as metallization interconnecting piece, it can be achieved that heterogeneous networks interlayer
Multiple micropores (as shown in Figure 2) are realized in interconnection in the metallization point hole (as shown in Figure 1) that a mechanical through hole is made
Electric linkage function, and then highly dense interconnection can be realized without micro-aperture technique.Therefore the present invention provides one kind by metal
Change the highly dense interconnection circuit plate for dividing hole to realize the highly dense interconnection of interlayer, and a kind of without using micro-aperture technique and only by mechanical through hole
Technology can make the production method to form highly dense interconnection circuit plate.
Mentality of designing of the present invention is that through-hole is fabricated to at least two mutually independent metallization using through-hole technology
Interconnecting piece regards each metallization interconnecting piece as a micropore, to realize each circuit network interconnection；And because using through-hole
Technology, without multiple laser drill, filling perforation plating and pressing, process flow is relatively easy very much, and it is difficult to greatly reduce production
Degree and manufacturing cost.
Detailed description of the invention
The schematic diagram that Fig. 1 is metallization point hole, outer layer divides hole pad and outer-layer circuit to connect；
The highly dense interconnection circuit plate of Fig. 2 prior art realizes the schematic diagram of interlayer interconnection by micropore；
Fig. 3 is the schematic diagram that preceding outer layer divides hole pad and plated-through hole；
Fig. 4 is that the outer layer made by preceding outer layer point hole pad shown in Fig. 3 and plated-through hole divides hole pad and metallization
Divide the schematic diagram (there are three the interconnecting pieces that metallizes for tool) in hole；
It is in schematic diagram when sprawling state that Fig. 5, which is the metallize hole wall in point hole,.
Specific embodiment
In order to more fully understand technology contents of the invention, combined with specific embodiments below to technical solution of the present invention
It is described further and illustrates.
Embodiment
The present embodiment provides a kind of production method of circuit board for realizing highly dense interconnection, including making on circuit boards
Metallization divides the method in hole, comprising the following steps:
(1) sawing sheet: core material is outputed by the jigsaw size of design requirement.
(2) it makes internal layer circuit: internal layer circuit being made on core material using negative film technique, obtains internal layer circuit plate.
Internal layer circuit includes the internal layer point hole pad for connecting with the subsequent metallization point hole for forming production, and internal layer divides hole pad edge
Circumference is made of the layers of copper of alternate intervals and substrate layer, and internal layer divides the side of layers of copper and the setting of substrate layer alternate intervals on the pad of hole
The outer layer of production is divided the setting of hole pad identical by formula with subsequent, and internal layer divides layers of copper and the subsequent gold for forming production on the pad of hole
Categoryization divides the layers of copper of its outer layer of hole to correspond linking.
After internal layer circuit is made in etching on core material, routinely process successively carries out POE punching and internal layer AOI.
(3) it presses: core material, prepreg, housing copper foil is stacked in advance, and by way of fusion or riveted
It is pre-fixed, each layer is pre-fixed together, form pre- stack structure.Then select lamination appropriate will according to plate Tg
Pre- stack structure is press-fitted together as one, and forms production plate.
(4) outer layer drills: according to borehole data, using the mode of machine drilling, drill on production plate, bored these
Hole includes dividing hole pad, and Kong Xinyu internal layer perpendicular to internal layer with the one-to-one through-hole of internal layer point hole pad, i.e., the described through-hole
The center of hole pad is divided to be overlapped, it is subsequent to be first processed into plated-through hole, it is reprocessed into metallization point hole, for interlayer wire to be connected
Road.
(5) heavy copper and electric plating of whole board: one layer of copper is deposited on production plate with the method for chemistry, with the current density of 18ASF
It is electroplated to thicken layers of copper to design requirement, produces the hole metallization on plate, through-hole described in step (4) forms metallization
Through-hole.
(6) outer-layer circuit one is made: according to figure electricity on production plate in such a way that positive blade technolgy makes outer-layer circuit
Copper facing and electrotinning, including successively carry out pattern transfer, pattern plating copper, graphic plating tin, make the outer layer of plated-through hole
For tin layers, secondary outer layer is layers of copper.
The figure includes preceding outer layer point hole land pattern, and through pattern plating copper and graphic plating tin, preceding outer layer divides eyelet welding
Pan Tuxingchu forms the preceding outer layer point hole pad for connecting with the end of step (6) described plated-through hole, as shown in figure 3,
The outer layer of pad is tin layers, and secondary outer layer is layers of copper.
(7) laser part removes tin: burning up plated-through hole with laser and preceding outer layer divides the part tin layers of hole pad so that copper
Layer exposes, and constitutes plated-through hole and the outer layer of preceding outer layer point hole pad by the tin layers of alternate intervals and layers of copper, and constitutes
Preceding outer layer divides that the layers of copper of layer except the pad of hole be connected with the layers of copper for the outer layer for constituting plated-through hole one-to-one correspondence and preceding outer layer divides
The layers of copper of layer divides the set-up mode of substrate layer on the pad of hole identical with internal layer except the pad of hole.
(8) it makes outer-layer circuit two: continuing the process of positive blade technolgy, the production of outer-layer circuit is completed on production plate.It takes off
The film of composition figure is removed, layers of copper exposed on plate then will be produced by alkali etching and removed so that substrate exposes；Metal at this time
Change through-hole and preceding outer layer divides the outer layer of hole pad to be made of the tin layers of alternate intervals and substrate layer；Then, it takes off on production plate
Tin layers, expose the former layers of copper covered by tin layers；Plated-through hole and preceding outer layer divide the outer layer of hole pad by alternately at this time
Layers of copper and substrate layer constitute, obtained metallization point hole and outer layer divide hole pad, as shown in Figure 4.Fig. 5 is the hole that metallization divides hole
Wall is in schematic diagram when sprawling state.
(9) outer layer AOI: using automatic optical detecting system, by the comparison with CAM data, whether detects outer-layer circuit
There is the defects of open circuit, notch, not clean, short-circuit etching.
(10) consent: according on existing filling holes with resin or welding resistance jack process resin or solder mask filling production plate
Metallization divides hole.
(11) welding resistance, silk-screen character: by making green oil layer and silk-screen character, green oil thickness are as follows: 10- in production plate outer layer
50 μm, so as to so that production plate can reduce influence of the environmental change to it in the subsequent use process.
(12) surface treatment (have lead spray tin): will produce plate and immerse the solder of molten condition, then by hot wind by surface and
Extra solder is blown off in plated through-hole, to obtain a smooth, uniform, bright solder layer.The thickness of surface tin layers
Degree is 1 μm, and tin thickness is 10 μm in hole.
(13) it forms: according to the prior art and pressing design requirement gong shape, PCB is made in the +/- 0.05mm of external form tolerance.
(14) electrical testing: testing the electrically conducting performance of production board, this plate uses test method are as follows: flying probe.
(15) FQC: appearance, hole wall copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of production board etc. are checked whether
Meet the requirement of client.
(16) it packs: according to the manner of packing and packaging quantity of customer requirement, packaging being sealed to production board, and put
Desiccant and humidity card, then shipment.
It is described above that technology contents of the invention are only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (2)
1. a kind of production method for the circuit board for realizing highly dense interconnection, which comprises the following steps:
S1, internal layer circuit is made on core material by negative film technique, the internal layer circuit includes for making with rear process
Plated-through hole connection internal layer divide hole pad；The internal layer divides hole pad circumferentially by the layers of copper of alternate intervals and substrate layer
It constitutes；
S2, core material and outer copper foil high-temperature laminating are integrated by prepreg, form the production plate of multilayered structure；
S3, the holes drilled through on production plate, the through-hole divide hole pad perpendicular to the Kong Xinyu internal layer of internal layer point hole pad and through-hole
Center is overlapped；Then heavy copper, electric plating of whole board, the transfer of figure, pattern plating copper, graphic plating tin work are successively carried out to production plate
Sequence processing, and the figure includes preceding outer layer point hole land pattern；So far outer layer before being formed at the land pattern of preceding outer layer point hole
Divide hole pad, the via metalization forms plated-through hole；The plated-through hole and preceding outer layer divide the outer layer of hole pad equal
For tin layers, secondary outer layer is layers of copper；
S4, divide the part tin layers of hole pad with laser burn-up plated-through hole and preceding outer layer so that layers of copper exposing, keeps metallization logical
Hole and preceding outer layer divide the outer layer of hole pad to be made of the tin layers of alternate intervals and layers of copper, and constitute preceding outer layer and divide except the pad of hole
Layer layers of copper with constitute plated-through hole outer layer layers of copper one-to-one correspondence be connected and preceding outer layer point hole pad except layer layers of copper
Divide the set-up mode of substrate layer on the pad of hole identical with internal layer；
S5, the film for constituting figure on production plate is taken off, exposes the layers of copper of former envelope covering, then will be produced by alkali etching
Exposed layers of copper removes so that substrate exposes on plate；The plated-through hole and preceding outer layer divide the outer layer of hole pad by friendship at this time
It is constituted for the tin layers and substrate layer at interval；
S6, the tin layers produced on plate are taken off, exposes the former layers of copper covered by tin layers；The plated-through hole and preceding outer layer divide hole
The outer layer of pad is made of alternate layers of copper and substrate layer, and metallization point hole is made respectively and outer layer divides hole pad；
S7, silk-screen welding resistance, surface treatment and molding procedure are successively carried out to production plate, completes the production of circuit board.
2. the metallization of production in the circuit board according to claim 1 divides the method in hole, which is characterized in that before step S7 also
Including dividing the metallization on production plate, hole carries out filling holes with resin or welding resistance consent is processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910181895.6A CN109905964B (en) | 2019-03-11 | 2019-03-11 | Manufacturing method of circuit board for realizing high-density interconnection |
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| CN201910181895.6A CN109905964B (en) | 2019-03-11 | 2019-03-11 | Manufacturing method of circuit board for realizing high-density interconnection |
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| CN109905964B CN109905964B (en) | 2021-03-12 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113347798A (en) * | 2021-06-02 | 2021-09-03 | 珠海市汇一宏光电有限公司 | Method and system for manufacturing connected strip-shaped circuit board with multiple circuits |
| CN113923860A (en) * | 2021-10-11 | 2022-01-11 | 恒为科技（上海）股份有限公司 | SFI interface-based electrical signal testing device |
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| US20050196898A1 (en) * | 2004-03-02 | 2005-09-08 | Kwun-Yao Ho | Process of plating through hole |
| US20070125570A1 (en) * | 2005-12-07 | 2007-06-07 | High Tech Computer Corp. | Via Structure of a Printed Circuit Board |
| US20070151753A1 (en) * | 2005-12-29 | 2007-07-05 | Thor Soo F | Printed circuit board having plated through hole with multiple connections and method of fabricating same |
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| CN113347798A (en) * | 2021-06-02 | 2021-09-03 | 珠海市汇一宏光电有限公司 | Method and system for manufacturing connected strip-shaped circuit board with multiple circuits |
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| CN113923860B (en) * | 2021-10-11 | 2023-08-29 | 恒为科技（上海）股份有限公司 | Electric signal testing device based on SFI interface |
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