CN110225675A - A kind of production method of thin core plate wiring board - Google Patents
A kind of production method of thin core plate wiring board Download PDFInfo
- Publication number
- CN110225675A CN110225675A CN201910218515.1A CN201910218515A CN110225675A CN 110225675 A CN110225675 A CN 110225675A CN 201910218515 A CN201910218515 A CN 201910218515A CN 110225675 A CN110225675 A CN 110225675A
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- China
- Prior art keywords
- production
- core plate
- plate
- wiring board
- multilayer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to printed circuit board technology field, specially a kind of production method of thin core plate wiring board.Each core plate is first press-fitted together as one after constituting multilayer production plate drilling blind hole again, can avoid the problem of causing core plate to be broken off or formed folding line print in boring procedure due to core thickness is relatively thin by the present invention by the production method of blind hole on the thin core plate wiring board of change.And thin core plate wiring board is made by the method for the invention, process is shorter, and blind hole manufacturing process is more easy to operate, production difficulty and scrappage is reduced, to reduce production cost.
Description
Technical field
The present invention relates to printed circuit board technology field more particularly to a kind of production methods of thin core plate wiring board.
Background technique
The multilayered structure of wiring board can be made of two ways, and one is core materials and outer copper foil to pass through semi-solid preparation
Piece is press-fitted together as one, and another kind is that core plate is used only without the use of copper foil, is press-fitted together as one core plate by prepreg
It forms.The wiring board being only made of core plate, the production method of blind/buried vias is the first holes drilled through on core plate thereon, is then used again
Prepreg presses together core plate, and original through-hole becomes blind hole or buried via hole after pressing, and utilizes during the pressing process
The prepreg of melting fills this some holes.Specific process is generally as follows: sawing sheet → core plate drills → sink copper → electric plating of whole board →
Internal layer plating hole pattern → plated hole → abrasive belt grinding → inner figure → internal layer etching → internal layer AOI → lamination → outer layer drilling → outer
Heavy copper → outer layer electric plating of whole board → outer graphics → rear the process of layer.The thickness for the core plate that this kind of wiring board uses generally all compares
Thin, core thickness is generally within the scope of 0.05-0.3mm, and the aperture of blind/buried vias is then relatively large, and aperture is generally in 0.1-
Within the scope of 0.5mm, existing manufacture craft is for the core plate of this kind of thickness, and production difficulty is high, and the operation difficulty of each process is big, bores
Hole process easily causes core plate to fracture or formed folding line print, at high cost, quality very high so as to cause the scrappage of such wiring board
It is difficult to control.
Summary of the invention
The present invention fractures or is formed folding line for the wiring board only made by core plate, because easily there is core plate when production blind hole
It prints and causes scrappage high, and production process is long, at high cost, quality problem rambunctious, provide a kind of by changing blind hole
Production method is so as to shorten production procedure, the production method for reducing production difficulty, the thin core plate wiring board for reducing scrappage.
To achieve the above object, the present invention uses following technical scheme.
The present invention provides a kind of production method of thin core plate wiring board, comprising the following steps:
S1, the core plate for having made internal layer circuit is press-fitted together as one by prepreg, multilayer is made and produces plate；
S2, it drills, is drilled including blind hole on multilayer production plate；
S3, device to hole carry out metalized, make the hole metallization on multilayer production plate；
S4, filling perforation processing is carried out to multilayer production plate, fills and leads up hole by material；
S5, outer-layer circuit production, solder mask production, surface treatment and molding procedure are successively carried out to multi-layer board, or to more
Laminate successively carries out outer-layer circuit production, solder mask system after successively carrying out outer layer drilling, the heavy copper of outer layer and outer layer electric plating of whole board again
Work, surface treatment and molding procedure, are made thin core plate wiring board.
Preferably, the production method of the thin core plate wiring board, comprising the following steps:
S1, the core plate for having made internal layer circuit is press-fitted together as one by prepreg, multilayer is made and produces plate；
S2, it drills, is drilled including blind hole on multilayer production plate；And plate is produced in multilayer by the way of laser drill
The aperture of upper drilling blind hole, the blind hole is 0.075-0.175mm, and the ratio between hole depth and aperture are less than 1；
S3, copper-coating is carried out to multilayer production plate, makes the hole metallization on multilayer production plate；
S4, filling perforation electroplating processes are carried out to multilayer production plate, fills and leads up hole by copper；
S5, outer-layer circuit production, solder mask production, surface treatment and molding procedure are successively carried out to multi-layer board, obtain thin core
Plate wiring board.
Preferably, the production method of the thin core plate wiring board, comprising the following steps:
S1, the core plate for having made internal layer circuit is press-fitted together as one by prepreg, multilayer is made and produces plate；
S2, it drills, is drilled including blind hole on multilayer production plate；And by the way of controlling deep drilling on multilayer production plate
Drilling blind hole, the aperture of the blind hole are greater than 0.175mm, and hole depth is greater than 0.15mm；
S3, heavy copper and electric plating of whole board processing are successively carried out to multilayer production plate, makes the hole metallization on multilayer production plate；
S4, filling holes with resin processing is carried out to multilayer production plate, fills and leads up hole by resin, carries out abrasive belt grinding then to remove
It overflows in the resin of multilayer production plate surface；
S5, outer layer drilling, the heavy copper of outer layer, outer layer electric plating of whole board, outer-layer circuit production, solder mask are successively carried out to multi-layer board
Production, surface treatment and molding procedure, are made thin core plate wiring board.
The production method of above each thin core plate wiring board, step S2, including between outermost layer and the layers of copper of secondary outer layer
Drilling blind hole.
Compared with prior art, the beneficial effects of the present invention are:
It is more to be first press-fitted together as one composition by the production method of blind hole on the thin core plate wiring board of change by the present invention for each core plate
Drilling blind hole again after layer production plate, can avoid causing core plate to be broken off or formed folding line in boring procedure due to core thickness is relatively thin
The problem of print.And thin core plate wiring board is made by the method for the invention, process is shorter, and blind hole manufacturing process is more easy to operate, drop
Low production difficulty and scrappage, to reduce production cost.
Specific embodiment
In order to more fully understand technology contents of the invention, combined with specific embodiments below to technical solution of the present invention
It is described further and illustrates.
Embodiment 1
The present embodiment provides a kind of production method of thin core plate wiring board, the layer structure of the thin core plate wiring board is by two
Core plate presses together composition by prepreg, core plate with a thickness of 0.15mm；Use need to be made on thin core plate wiring board
In the metalized blind vias of conducting first line layer and the second line layer, the aperture of blind hole is 0.175mm before not metallizing.Specifically
, the method that the present embodiment makes thin core plate wiring board is as follows:
(1) sawing sheet: core plate is outputed by the jigsaw size of design requirement.
(2) it makes internal layer circuit: internal layer circuit being made on core plate using negative film technique, obtains making internal layer circuit
Core plate.Routinely process successively carries out POE punching and internal layer AOI.
(3) press: a core plate, prepreg, another core plate are stacked in advance, and fusion or riveted by way of into
Row pre-fixes, and each layer is pre-fixed together, pre- stack structure is formed.Then select lamination appropriate will be pre- according to plate Tg
Stack structure is press-fitted together as one, and is formed multilayer and is produced plate.
(4) outer layer drills: drilling, is drilled including blind hole on multilayer production plate；And by the way of laser drill
Multilayer produces the blind hole that hole diameter between the outermost layer of plate and the layers of copper of secondary outer layer is 0.175mm, and the hole depth of blind hole is 0.15mm, hole
The ratio between deep and aperture is less than 1.
(5) heavy copper: one layer of copper is deposited on multilayer production plate with the method for chemistry, multilayer is made to produce the mesoporous metal on plate
Change.
(6) filling perforation is electroplated: filling perforation electroplating technology routinely carries out filling perforation electroplating processes to multilayer production plate, makes hole by copper
It fills and leads up.
(7) it makes outer-layer circuit: outer-layer circuit being made on multilayer production plate using positive blade technolgy, successively includes outer layer figure
Shape, graphic plating move back film, outer layer alkali etching, move back tin process.
(8) outer layer AOI: using automatic optical detecting system, by the comparison with CAM data, whether detects outer-layer circuit
There is the defects of open circuit, notch, not clean, short-circuit etching.
(9) green oil layer and silk-screen character, green oil thickness welding resistance, silk-screen character: are made by producing plate outer layer in multilayer are as follows:
10-50 μm, so as to so that multilayer production plate can reduce influence of the environmental change to it in the subsequent use process.
(10) surface treatment (having lead to spray tin): multilayer production plate is immersed into the solder of molten condition, then passes through hot wind for table
Extra solder is blown off in face and plated through-hole, to obtain a smooth, uniform, bright solder layer.Surface tin layers
With a thickness of 1 μm, in hole tin thickness be 10 μm.
(11) it forms: according to the prior art and pressing design requirement gong shape, thin core plate is made in the +/- 0.05mm of external form tolerance
Wiring board.
(12) electrical testing: testing the electrically conducting performance of production board, this plate uses test method are as follows: flying probe.
(13) FQC: appearance, hole wall copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of production board etc. are checked whether
Meet the requirement of client.
(14) it packs: according to the manner of packing and packaging quantity of customer requirement, packaging being sealed to production board, and put
Desiccant and humidity card, then shipment.
Embodiment 2
The present embodiment provides a kind of production method of thin core plate wiring board, the layer structure of the thin core plate wiring board is by two
Core plate presses together composition by prepreg, core plate with a thickness of 0.20mm；Use need to be made on thin core plate wiring board
In the metalized blind vias of conducting first line layer and the second line layer, the aperture of blind hole is 0.215mm before not metallizing.Specifically
, the method that the present embodiment makes thin core plate wiring board is as follows:
(1) sawing sheet: core plate is outputed by the jigsaw size of design requirement.
(2) it makes internal layer circuit: internal layer circuit being made on core plate using negative film technique, obtains making internal layer circuit
Core plate.Routinely process successively carries out POE punching and internal layer AOI.
(3) press: a core plate, prepreg, another core plate are stacked in advance, and fusion or riveted by way of into
Row pre-fixes, and each layer is pre-fixed together, pre- stack structure is formed.Then select lamination appropriate will be pre- according to plate Tg
Stack structure is press-fitted together as one, and is formed multilayer and is produced plate.
(4) it outer layer drilling 1: drills, is drilled including blind hole on multilayer production plate；And more by the way of controlling deep drilling
The blind hole that hole diameter is 0.215mm between the outermost layer of layer production plate and the layers of copper of secondary outer layer, the hole depth of blind hole are 0.20mm.
(5) heavy copper and electric plating of whole board: one layer of copper is deposited on multilayer production plate with the method for chemistry, with the electric current of 18ASF
Density is electroplated to thicken layers of copper to design requirement, and the hole metallization on multilayer production plate is made.
(6) filling holes with resin: filling holes with resin technique routinely carries out filling holes with resin processing to multilayer production plate, sets hole
Rouge is filled and led up；Then abrasive belt grinding is carried out to overflow to remove in the resin of multilayer production plate surface.
(7) it outer layer drilling 2: is drilled on multilayer production plate according to borehole data using the mode of machine drilling.
(8) the heavy copper of outer layer and outer layer electric plating of whole board: depositing one layer of copper on multilayer production plate with the method for chemistry, with
The current density of 18ASF is electroplated to thicken layers of copper to design requirement, and the hole metallization on multilayer production plate is made.
(9) it makes outer-layer circuit: outer-layer circuit being made on multilayer production plate using positive blade technolgy, successively includes outer layer figure
Shape, graphic plating move back film, outer layer alkali etching, move back tin process.
(10) outer layer AOI: using automatic optical detecting system, by the comparison with CAM data, whether detects outer-layer circuit
There is the defects of open circuit, notch, not clean, short-circuit etching.
(11) green oil layer and silk-screen character, green oil thickness welding resistance, silk-screen character: are made by producing plate outer layer in multilayer
Are as follows: 10-50 μm, so as to so that multilayer production plate can reduce influence of the environmental change to it in the subsequent use process.
(12) surface treatment (having lead to spray tin): multilayer production plate is immersed into the solder of molten condition, then passes through hot wind for table
Extra solder is blown off in face and plated through-hole, to obtain a smooth, uniform, bright solder layer.Surface tin layers
With a thickness of 1 μm, in hole tin thickness be 10 μm.
(13) it forms: according to the prior art and pressing design requirement gong shape, thin core plate is made in the +/- 0.05mm of external form tolerance
Wiring board.
(14) electrical testing: testing the electrically conducting performance of production board, this plate uses test method are as follows: flying probe.
(15) FQC: appearance, hole wall copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of production board etc. are checked whether
Meet the requirement of client.
(16) it packs: according to the manner of packing and packaging quantity of customer requirement, packaging being sealed to production board, and put
Desiccant and humidity card, then shipment.
It is described above that technology contents of the invention are only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (8)
1. a kind of production method of thin core plate wiring board, which comprises the following steps:
S1, the core plate for having made internal layer circuit is press-fitted together as one by prepreg, multilayer is made and produces plate；
S2, it drills, is drilled including blind hole on multilayer production plate；
S3, device to hole carry out metalized, make the hole metallization on multilayer production plate；
S4, filling perforation processing is carried out to multilayer production plate, fills and leads up hole by material；
S5, outer-layer circuit production, solder mask production, surface treatment and molding procedure are successively carried out to multi-layer board, or to multi-layer board
Outer-layer circuit production, solder mask production, table are successively carried out again after successively carrying out outer layer drilling, the heavy copper of outer layer and outer layer electric plating of whole board
Thin core plate wiring board is made in surface treatment and molding procedure.
2. the production method of thin core plate wiring board according to claim 1, which is characterized in that step S2, using laser drilling
The mode in hole drilling blind hole on multilayer production plate, the aperture of the blind hole is 0.075-0.175mm, and the ratio between hole depth and aperture are less than
1。
3. the production method of thin core plate wiring board according to claim 2, which is characterized in that step S3 produces multilayer
Plate carries out copper-coating, makes the hole metallization on multilayer production plate；
Step S4 carries out filling perforation electroplating processes to multilayer production plate, fills and leads up hole by copper.
4. the production method of thin core plate wiring board according to claim 3, which is characterized in that step S5, to multi-layer board according to
Secondary progress outer-layer circuit production, solder mask production, surface treatment and molding procedure, obtain thin core plate wiring board.
5. the production method of thin core plate wiring board according to claim 1, which is characterized in that step S2, using control deep drilling
Mode be greater than 0.175mm in drilling blind hole, the aperture of the blind hole on multilayer production plate, hole depth is greater than 0.15mm.
6. the production method of thin core plate wiring board according to claim 5, which is characterized in that step S3 produces multilayer
Plate successively carries out heavy copper and electric plating of whole board processing, makes the hole metallization on multilayer production plate；
Step S4 carries out filling holes with resin processing to multilayer production plate, fills and leads up hole by resin, carry out abrasive belt grinding then to remove
It overflows in the resin of multilayer production plate surface.
7. the production method of thin core plate wiring board according to claim 6, which is characterized in that step S5, to multi-layer board according to
Secondary progress outer layer drilling, the heavy copper of outer layer, outer layer electric plating of whole board, outer-layer circuit production, solder mask production, surface treatment and molding work
Thin core plate wiring board is made in sequence.
8. the production method of thin core plate wiring board according to claim 1-7, which is characterized in that step S2, packet
Include the drilling blind hole between outermost layer and the layers of copper of secondary outer layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910218515.1A CN110225675A (en) | 2019-03-21 | 2019-03-21 | A kind of production method of thin core plate wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910218515.1A CN110225675A (en) | 2019-03-21 | 2019-03-21 | A kind of production method of thin core plate wiring board |
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| Publication Number | Publication Date |
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| CN110225675A true CN110225675A (en) | 2019-09-10 |
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ID=67822332
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910218515.1A Pending CN110225675A (en) | 2019-03-21 | 2019-03-21 | A kind of production method of thin core plate wiring board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111182743A (en) * | 2020-01-06 | 2020-05-19 | 江门崇达电路技术有限公司 | Manufacturing method of ceramic-based circuit board |
| CN111757602A (en) * | 2020-06-02 | 2020-10-09 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of blind hole |
| CN114173477A (en) * | 2020-09-10 | 2022-03-11 | 深南电路股份有限公司 | Circuit board drilling method and device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596597A (en) * | 1982-06-28 | 1984-01-13 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | Method of perforating blind through hole at printed circuit board |
| CN104427786A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Processing method of printed circuit board |
| CN106061119A (en) * | 2016-07-06 | 2016-10-26 | 四川海英电子科技有限公司 | Method for manufacturing multi-stage random-layer blind holes |
-
2019
- 2019-03-21 CN CN201910218515.1A patent/CN110225675A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596597A (en) * | 1982-06-28 | 1984-01-13 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | Method of perforating blind through hole at printed circuit board |
| CN104427786A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Processing method of printed circuit board |
| CN106061119A (en) * | 2016-07-06 | 2016-10-26 | 四川海英电子科技有限公司 | Method for manufacturing multi-stage random-layer blind holes |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111182743A (en) * | 2020-01-06 | 2020-05-19 | 江门崇达电路技术有限公司 | Manufacturing method of ceramic-based circuit board |
| CN111182743B (en) * | 2020-01-06 | 2021-06-04 | 江门崇达电路技术有限公司 | Manufacturing method of ceramic-based circuit board |
| CN111757602A (en) * | 2020-06-02 | 2020-10-09 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of blind hole |
| CN114173477A (en) * | 2020-09-10 | 2022-03-11 | 深南电路股份有限公司 | Circuit board drilling method and device |
| CN114173477B (en) * | 2020-09-10 | 2024-05-17 | 深南电路股份有限公司 | Circuit board drilling method and equipment |
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