CN109874232A - A kind of preparation method for the wiring board that high thickness to diameter ratio and route are unevenly distributed - Google Patents
A kind of preparation method for the wiring board that high thickness to diameter ratio and route are unevenly distributed Download PDFInfo
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- CN109874232A CN109874232A CN201910164406.6A CN201910164406A CN109874232A CN 109874232 A CN109874232 A CN 109874232A CN 201910164406 A CN201910164406 A CN 201910164406A CN 109874232 A CN109874232 A CN 109874232A
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Abstract
The present invention relates to printed wiring board technical field, the preparation method for the wiring board that specially a kind of high thickness to diameter ratio and route are unevenly distributed.The present invention is by first pasting conductive copper foil on production plate before carrying out graphic plating, increase the copper face area of plate face, the electric current of plate face when so as to disperse graphic plating, the thickness of plate face copper plate is relatively small when making to be electroplated with larger current and long period, and then when copper layer thickness reaches product design requirement in the Kong Qikong of realization high thickness to diameter ratio, the thickness of plate face route is unlikely to increase excessively, thus can reduce the depth of line gap, mitigates route and presss from both sides film problem.Dry film with thickness greater than 45 μm makes outer graphics, and route folder film problem can further be alleviated or avoided.It can reduce or avoid the problem that by the method for the invention route folder film in wiring board manufacturing process that high thickness to diameter ratio and route are unevenly distributed, to avoid occurring when outer layer alkali etching that etching is not clean to lead to line short, reduce line short scrappage.
Description
Technical field
The present invention relates to the routes that printed wiring board technical field more particularly to a kind of high thickness to diameter ratio and route are unevenly distributed
The preparation method of plate.
Background technique
In the manufacturing of assist side, it is sometimes desirable to manufacture some plate thickness reach 5.0mm or more than wiring board,
It is also devised with the lesser plated through-hole in aperture simultaneously, if aperture is 0.30mm, its radius-thickness ratio of such plated through-hole is up to 16:1,
And the plated through-hole of high thickness to diameter ratio is made, it is wanted to guarantee that the copper layer thickness of each point in hole is all satisfied the minimum value of product design
It asks, then needed in electro-coppering using bigger electric current and the longer time is electroplated, however high current is electroplated is increasing for a long time
While hole wall copper thickness, the copper thickness of outer-layer circuit can also increase therewith, but the line width line gap of wiring board outer-layer circuit is generally set
It is calculated as 4/4mil, it is relatively small that the copper thickness thickness partially of outer-layer circuit will lead to line gap, to carry out after completing outer graphics plating
It will appear when moving back film process and move back the problem of film is not clean, and line gap presss from both sides film, and then cause to occur etching not when subsequent outer layer alkali etching
Only so that route short circuit is occurred, wiring board short circuit is caused to scrap.For example, a plate thickness is 5.0mm, plated-through hole aperture is
0.35mm, radius-thickness ratio are the wiring board of 14:1, and route, which is distributed as shown in Figure 1, has serious uneven, the outer layer line of prior art production
The process on road is: heavy copper → electric plating of whole board → outer graphics → graphic plating → outer layer alkali etching, wherein electric plating of whole board process
In the general layers of copper for only plating 5-8 μ m-thick, main copper thickness mainly formed in graphic plating process.Before graphic plating, elder generation is needed
The region for covering the region for not needing to be formed outer-layer circuit with dry film and need to forming outer-layer circuit is exposed, then to not done
The region and hole of film covering are electroplated together, and parameters is made to be all satisfied the design requirement of product.It is raw with this production method
Such wiring board is produced, not clean because etching, the scrappage of wiring board short circuit is very high.
Summary of the invention
The present invention for prior art production high thickness to diameter ratio and the wiring board that is unevenly distributed of route easily occur line gap folder film,
Not clean, to cause wiring board short circuit scrappage high problem is etched, the wiring board that a kind of high thickness to diameter ratio and route are unevenly distributed is provided
Preparation method, while its hole wall copper thickness of the hole of high thickness to diameter ratio can be made to meet product design requirement, the layers of copper of outer-layer circuit is thick
Degree but increases less, line gap folder film occurs and to cause subsequent outer layer alkali etching etching occur not clean so as to be reduced or avoided
Problem.
To achieve the above object, the present invention uses following technical scheme.
The present invention improves a kind of preparation method for the wiring board that high thickness to diameter ratio and route are unevenly distributed, comprising the following steps:
S1, production plate on make outer graphics, be used in be formed outer-layer circuit region windowing and other regions are done
Film covering.
Preferably, it is greater than or equal to 45 μm for making the thickness of the dry film of outer graphics.
Preferably, the multi-layer board that the production plate is press-fitted together as one by core material, prepreg, outer copper foil, and
Produce plate outer layer drilling, heavy copper and electric plating of whole board working process.
S2, the region copper-surfaced foil covered on production plate by dry film, increase the copper face area for producing plate surface.
Preferably, after sticking copper foil on production plate, improve the distributing homogeneity for producing the copper face of plate surface.Copper-surfaced foil
Make to produce region of the plate surface without large area without copper afterwards.
S3, graphic plating processing is carried out to production plate, makes the region for producing plate uplifting window and successively plates layers of copper on copper foil
And tin layers.
S4, the copper foil produced on plate is removed together together with the layers of copper and tin layers being electroplated on copper foil.
S5, production plate is successively carried out moving back film, outer layer alkali etching and moves back tin processing, production forms outer layer on production plate
Route.
S6, solder mask production, surface treatment and molding procedure are successively carried out to production plate, wiring board is made.
Compared with prior art, the beneficial effects of the present invention are:
The present invention makes the copper face area of plate face by first pasting conductive copper foil on production plate before carrying out graphic plating
Increase, the electric current of plate face when so as to disperse graphic plating, plate face copper plate when making to be electroplated with larger current and long period
Thickness is relatively small, and then realizes that copper layer thickness is when reaching product design requirement in the Kong Qikong of high thickness to diameter ratio, plate face route
Thickness is unlikely to increase excessively, thus can reduce the depth of line gap, mitigates route and presss from both sides film problem.It is greater than 45 μm of dry film with thickness
Outer graphics are made, route folder film problem can further be alleviated or avoided.It can reduce or avoid by the method for the invention high thick diameter
Than and the wiring board manufacturing process that is unevenly distributed of route in route folder film the problem of, to avoid losing when outer layer alkali etching
Carve it is not clean lead to line short, reduce line short scrappage.
Detailed description of the invention
Fig. 1 is the schematic diagram that wiring board its outer-layer circuit that route is unevenly distributed is unevenly distributed；
Fig. 2 is the schematic diagram of the copper-surfaced foil on the production plate for made outer graphics.
Specific embodiment
In order to more fully understand technology contents of the invention, combined with specific embodiments below to technical solution of the present invention
It is described further and illustrates.
Embodiment
The present embodiment provides a kind of high thickness to diameter ratio and the preparation method of wiring board that route is unevenly distributed, made route
The plate thickness of plate is 5.0mm, and the minimum-value aperture of plated through-hole is 0.35mm, and the line width line gap of radius-thickness ratio 14:1, outer-layer circuit are
4/4mil, route is unevenly distributed on wiring board, and there are large area for plate face without copper region, as shown in Figure 1.
Specific production step is as follows:
(1) sawing sheet: core material is outputed by the jigsaw size of design requirement.
(2) it makes internal layer circuit: internal layer circuit being made on core material using negative film technique, obtains internal layer circuit plate.
After internal layer circuit is made in etching on core material, routinely process successively carries out POE punching and internal layer AOI.
(3) it presses: core material, prepreg, housing copper foil is stacked in advance, and by way of fusion or riveted
It is pre-fixed, each layer is pre-fixed together, form pre- stack structure.Then select lamination appropriate will according to plate Tg
Pre- stack structure is press-fitted together as one, and forms production plate.
(4) outer layer drills: being drilled on production plate according to borehole data using the mode of machine drilling.
(5) it sinks copper and electric plating of whole board: along the groove milling of side wall slot position and carrying out milling oblique surface machining on production plate, form golden finger
Sidewall channels.Then one layer of copper is deposited on production plate with the method for chemistry, is electroplated with the current density of 18ASF to thicken copper
Layer produces the hole metallization on plate, forms plated through-hole to design requirement.
(6) outer-layer circuit is made:
Outer graphics are made on production plate using the dry film with a thickness of 45 μm, are used in form the region of outer-layer circuit and open
Window and other regions are covered by dry film.In other embodiments, also thicker dry film can be used to make outer graphics.
The region copper-surfaced foil covered on production plate by dry film increases the copper face area for producing plate surface, such as Fig. 2 institute
Show.After copper-surfaced foil, the distributing homogeneity for producing the copper face of plate surface is improved, produces region of the plate surface without large area without copper,
The exposed copper face overall scatter of the copper foil and windowing pasted is distributed in production plate plate face.
Graphic plating processing is carried out to production plate, makes the region for producing plate uplifting window and successively plates layers of copper and tin on copper foil
Layer.Copper layer thickness in hole is electroplated in graphic plating process when electro-coppering and reaches the minimum requirement of product design or more.
The copper foil produced on plate is removed together together with the layers of copper and tin layers being electroplated on copper foil.
Production plate is successively carried out moving back film, outer layer alkali etching and moves back tin processing, production forms outer layer line on production plate
Road.
(7) outer layer AOI: using automatic optical detecting system, by the comparison with CAM data, whether detects outer-layer circuit
There is the defects of open circuit, notch, not clean, short-circuit etching.
(8) welding resistance, silk-screen character: by making green oil layer and silk-screen character, green oil thickness are as follows: 10- in production plate outer layer
50 μm, so as to so that production plate can reduce influence of the environmental change to it in the subsequent use process.
(9) surface treatment (thering is lead to spray tin): plate will be produced and immerses the solder of molten condition, then pass through hot wind for surface and gold
Extra solder is blown off in categoryization hole, to obtain a smooth, uniform, bright solder layer.The thickness of surface tin layers
It is 1 μm, tin thickness is 10 μm in hole.
(10) it forms: according to the prior art and pressing design requirement gong shape, PCB is made in the +/- 0.05mm of external form tolerance.
(11) electrical testing: testing the electrically conducting performance of production board, this plate uses test method are as follows: flying probe.
(12) FQC: appearance, hole wall copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of production board etc. are checked whether
Meet the requirement of client.
(13) it packs: according to the manner of packing and packaging quantity of customer requirement, packaging being sealed to production board, and put
Desiccant and humidity card, then shipment.
The present embodiment makes the copper face face of plate face by first pasting conductive copper foil on production plate before carrying out graphic plating
Product increases, the electric current of plate face when so as to disperse graphic plating, plate face copper plate when making to be electroplated with larger current and long period
Thickness it is relatively small, and then realize that copper layer thickness is when reaching product design requirement in the Kong Qikong of high thickness to diameter ratio, plate face route
Thickness be unlikely to increase excessive, thus can reduce the depth of line gap, mitigate route and press from both sides film problem；It is dry greater than 45 μm with thickness
Film production outer graphics can ensure do not occur route folder film problem.Method can avoid high thickness to diameter ratio and route through this embodiment
The wiring board being unevenly distributed in the production process route folder film the problem of, thus when avoiding outer layer alkali etching occur etching it is not clean
Lead to line short.The wiring board that high thickness to diameter ratio and route are unevenly distributed is prepared using the present embodiment method, line short is scrapped
Rate is zero.
It is described above that technology contents of the invention are only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (4)
1. a kind of preparation method for the wiring board that high thickness to diameter ratio and route are unevenly distributed, which comprises the following steps:
S1, production plate on make outer graphics, be used in be formed outer-layer circuit region windowing and other regions are covered by dry film
Lid；
S2, the region copper-surfaced foil covered on production plate by dry film, increase the copper face area for producing plate surface；
S3, graphic plating processing is carried out to production plate, makes the region for producing plate uplifting window and successively plates layers of copper and tin on copper foil
Layer；
S4, the copper foil produced on plate is removed together together with the layers of copper and tin layers being electroplated on copper foil；
S5, production plate is successively carried out moving back film, outer layer alkali etching and moves back tin processing, production forms outer layer line on production plate
Road；
S6, solder mask production, surface treatment and molding procedure are successively carried out to production plate, wiring board is made.
2. the preparation method for the wiring board that high thickness to diameter ratio according to claim 1 and route are unevenly distributed, which is characterized in that
In step S1, it is greater than or equal to 45 μm for making the thickness of dry film of outer graphics.
3. the preparation method for the wiring board that high thickness to diameter ratio according to claim 1 and route are unevenly distributed, which is characterized in that
In step S2, the region copper-surfaced foil covered on production plate by dry film improves the distributing homogeneity for producing the copper face of plate surface.
4. the preparation method for the wiring board that high thickness to diameter ratio according to claim 1-3 and route are unevenly distributed,
It is characterized in that, the multi-layer board that production plate described in step S1 is press-fitted together as one by core material, prepreg, outer copper foil,
And the outer layer drilling of production plate, heavy copper and electric plating of whole board working process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910164406.6A CN109874232A (en) | 2019-03-05 | 2019-03-05 | A kind of preparation method for the wiring board that high thickness to diameter ratio and route are unevenly distributed |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910164406.6A CN109874232A (en) | 2019-03-05 | 2019-03-05 | A kind of preparation method for the wiring board that high thickness to diameter ratio and route are unevenly distributed |
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| CN109874232A true CN109874232A (en) | 2019-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910164406.6A Pending CN109874232A (en) | 2019-03-05 | 2019-03-05 | A kind of preparation method for the wiring board that high thickness to diameter ratio and route are unevenly distributed |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110582167A (en) * | 2019-10-23 | 2019-12-17 | 四会富仕电子科技股份有限公司 | Method for manufacturing strippable mesh copper foil |
| CN111225517A (en) * | 2019-12-03 | 2020-06-02 | 厦门弘信电子科技集团股份有限公司 | Hole pattern electroplating method for FPC |
| CN111629531A (en) * | 2020-06-19 | 2020-09-04 | 西安微电子技术研究所 | Method for processing HDI plate with high thickness-diameter ratio |
| CN111867266A (en) * | 2020-07-14 | 2020-10-30 | 江门崇达电路技术有限公司 | Circuit design method for preventing short circuit of isolated circuit of PCB |
| CN112888186A (en) * | 2021-02-24 | 2021-06-01 | 铜陵安博电路板有限公司 | Production process of PCB for quick-charging pile of new energy automobile |
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| CN104780710A (en) * | 2014-01-15 | 2015-07-15 | 深圳崇达多层线路板有限公司 | PCB (Printed circuit board) and manufacturing method thereof |
| CN106028655A (en) * | 2016-06-23 | 2016-10-12 | 江西景旺精密电路有限公司 | Rapid board-grinding and film-pasting method for outer layer circuit board |
| CN106163096A (en) * | 2016-08-26 | 2016-11-23 | 奥士康精密电路（惠州）有限公司 | The impedance plate of a kind of high evenness and production method thereof |
| CN107835575A (en) * | 2017-10-18 | 2018-03-23 | 通元科技(惠州)有限公司 | A kind of PCB electro-plating methods for being directed to separate lines and pad |
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2019
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104780710A (en) * | 2014-01-15 | 2015-07-15 | 深圳崇达多层线路板有限公司 | PCB (Printed circuit board) and manufacturing method thereof |
| CN106028655A (en) * | 2016-06-23 | 2016-10-12 | 江西景旺精密电路有限公司 | Rapid board-grinding and film-pasting method for outer layer circuit board |
| CN106163096A (en) * | 2016-08-26 | 2016-11-23 | 奥士康精密电路（惠州）有限公司 | The impedance plate of a kind of high evenness and production method thereof |
| CN107835575A (en) * | 2017-10-18 | 2018-03-23 | 通元科技(惠州)有限公司 | A kind of PCB electro-plating methods for being directed to separate lines and pad |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110582167A (en) * | 2019-10-23 | 2019-12-17 | 四会富仕电子科技股份有限公司 | Method for manufacturing strippable mesh copper foil |
| CN111225517A (en) * | 2019-12-03 | 2020-06-02 | 厦门弘信电子科技集团股份有限公司 | Hole pattern electroplating method for FPC |
| CN111629531A (en) * | 2020-06-19 | 2020-09-04 | 西安微电子技术研究所 | Method for processing HDI plate with high thickness-diameter ratio |
| CN111867266A (en) * | 2020-07-14 | 2020-10-30 | 江门崇达电路技术有限公司 | Circuit design method for preventing short circuit of isolated circuit of PCB |
| CN112888186A (en) * | 2021-02-24 | 2021-06-01 | 铜陵安博电路板有限公司 | Production process of PCB for quick-charging pile of new energy automobile |
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Application publication date: 20190611 |