CN102244979A - Half-hole processing mirror image manufacturing method of printed circuit board - Google Patents
Half-hole processing mirror image manufacturing method of printed circuit board Download PDFInfo
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- CN102244979A CN102244979A CN2010101724943A CN201010172494A CN102244979A CN 102244979 A CN102244979 A CN 102244979A CN 2010101724943 A CN2010101724943 A CN 2010101724943A CN 201010172494 A CN201010172494 A CN 201010172494A CN 102244979 A CN102244979 A CN 102244979A
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Abstract
The invention discloses a half-hole processing mirror image manufacturing method of a printed circuit board, which comprises the following steps: drilling a round plated through hole to be broken from at least one of the left and right ends of the plated through hole to form a broken hole; and molding the broken hole into a half hole during numerical control molding. Compared with the traditional processing technology that the round plated through hole is molded into the half hole in one step during molding, the processing technology that the round plated through hole is drilled to be broken at first and then the half hole is molded during numerical control molding can effectively reduce the burr phenomenon of the half hole, thereby ensuring the integrity of half hole performance, further improving the yield of the printed circuit board, and reducing the cost.
Description
Technical field
The present invention relates to the manufacture craft improvement of a kind of printed circuit board (PCB) (PCB), specifically relate to a kind of processing technology of half hole of printed circuit board (PCB).
Background technology
Half hole is to cut partly to form on the basis of plated-through-hole, be positioned at the edges of boards of printed circuit board (PCB), both kept the conducting function of original plated-through-hole, can utilize half hole hole wall to weld fixing again, realized the not only easy but also high-intensity fixing of plate and plate or part, used more extensive.
Half traditional orifice plate manufacture craft is: the moulding simultaneously of image transfer → graphic plating → move back film → etching → welding resistance → surface-coated → half hole and profile.This half hole is after circular plated-through-hole moulding, directly disposable the cutting partly of circular plated-through-hole formed, because the ductility of copper is preferable in the hole, add under the machine cut pullling of producing,, be easy to occur the phenomenon of the residual and copper sheet perk of half hole copper wire if properly do not handled, it is so-called half hole bur problem, influence half hole function, thereby cause properties of product and yield to descend, and then cost is increased.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of printed circuit board (PCB) half hole processing procedure mirror image way, this printed circuit board (PCB) half hole processing procedure mirror image way can effectively alleviate half hole bur, and then improves the yield of printed circuit board (PCB).
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of printed circuit board (PCB) half hole processing procedure mirror image way comprises the steps:
1., at least one end place brill of plated-through-hole in its left and right two ends with circle breaks formation disconnection hole;
2., when the numerical control moulding, described disconnection hole forming is become half hole.
This plated-through-hole subdrilling with circle is disconnected, when the numerical control moulding, mold the processing technology in half hole again, than traditional when the moulding disposable plated-through-hole with circle be shaped to the processing technology in half hole, this processing technology can effectively reduce by half hole bur phenomenon, thereby guarantee the complete of half permeability energy, and then the yield of raising printed circuit board (PCB), and cost is minimized.
Further technical scheme of the present invention is:
A kind of printed circuit board (PCB) half hole processing procedure mirror image way comprises the steps:
1., the plated-through-hole of circle is broken formation disconnection hole in its place, left and right two ends brill;
2., when the numerical control moulding, described disconnection hole forming is become half hole.
Because used cutting tools all is right handed when boring, when boring the plated-through-hole right-hand member, because chip removal is outside the hole, can not produce burr, when boring the plated-through-hole left end, because chip removal is in the hole, can produce a small amount of burr, but in accepting scope, than traditional when the moulding disposable plated-through-hole with circle be shaped to the processing technology in half hole, the burr of this processing technology will reduce a lot, thus guarantee half permeability can complete, and then the yield of raising printed circuit board (PCB), and cost is minimized.
Printed circuit board (PCB) can finish successively the scanning of outer-layer circuit etching, outer-layer circuit detect, anti-welding, carry out described step 1. after changing gold and literal, carry out described step 2. after 1. step is finished.
1. printed circuit board (PCB) carries out described step after also can finishing the outer-layer circuit etching, carry out successively after 1. step is finished outer-layer circuit scanning detect, anti-welding, change gold and literal, carry out described step 2. after literal is finished.Before anti-postwelding and the change gold, bore the debris removal hole less than described plated-through-hole aperture in described disconnection hole, aperture, described debris removal hole is than the little 4mil in described plated-through-hole aperture.Owing to being bored in the disconnection hole that forms of having no progeny, the plated-through-hole of circle may remain some substrate powder, if can't before anti-welding, thoroughly remove, carry out when anti-welding can with the anti-solder ink gluing together and amass and disconnect in the hole, the similar hole of situation inner product China ink, it is bad to occur gold like this when changing gold, therefore can in disconnecting the hole, bore the debris removal hole, be used for removing the adhesive bond of substrate powder and anti-solder ink, gold on the hole wall when being beneficial to follow-upization gold.
A kind of printed circuit board (PCB) half hole processing procedure mirror image way comprises the steps:
1., operate, it is disconnected to use the groove cutter that the plated-through-hole of circle is bored in its right-hand member place, forms to disconnect the hole at the printed circuit board (PCB) back side, because used cutting tools all is right handed when boring, therefore when the plated-through-hole right-hand member bored, chip removal can not produce burr outside the hole;
2., when the numerical control moulding, described disconnection hole forming is become half hole.
Thisly operate at the printed circuit board (PCB) back side, bore the plated-through-hole of circle disconnected in its right-hand member place overleaf, and then when the numerical control moulding, disconnect the processing mode that left end molds half hole, can not produce burr, thereby guarantee the complete of half permeability energy, and then the yield of raising printed circuit board (PCB), and cost is minimized.
Printed circuit board (PCB) can finish successively the scanning of outer-layer circuit etching, outer-layer circuit detect, anti-welding, carry out described step 1. after changing gold and literal, carry out described step 2. after 1. step is finished.
1. printed circuit board (PCB) carries out described step after also can finishing the outer-layer circuit etching, carry out successively after 1. step is finished outer-layer circuit scanning detect, anti-welding, change gold and literal, carry out described step 2. after literal is finished.Before anti-postwelding and the change gold, bore the debris removal hole less than described plated-through-hole aperture in described disconnection hole, aperture, described debris removal hole is than the little 4mil in described plated-through-hole aperture.Owing to being bored in the disconnection hole that forms of having no progeny, the plated-through-hole of circle may remain some substrate powder, if can't before anti-welding, thoroughly remove, carry out when anti-welding can with the anti-solder ink gluing together and amass and disconnect in the hole, the similar hole of situation inner product China ink, it is bad to occur gold like this when changing gold, therefore can in disconnecting the hole, bore the debris removal hole, be used for removing the adhesive bond of substrate powder and anti-solder ink, gold on the hole wall when being beneficial to follow-upization gold.
The invention has the beneficial effects as follows: printed circuit board (PCB) half hole processing procedure mirror image way of the present invention, be that the plated-through-hole subdrilling of circle is disconnected, when the numerical control moulding, mold the processing technology in half hole again, than traditional when the moulding disposable plated-through-hole with circle be shaped to the processing technology in half hole, processing technology of the present invention can effectively reduce by half hole bur phenomenon, thereby guarantee the complete of half permeability energy, and then improve the yield of printed circuit board (PCB), and cost is minimized.
Description of drawings
Fig. 1 is the embodiment of the invention 1 principle schematic;
Fig. 2 is the embodiment of the invention 2 principle schematic.
Embodiment
Embodiment 1: a kind of printed circuit board (PCB) half hole processing procedure mirror image way comprises the steps:
1., operate, the plated-through-hole 1 of circle is bored disconnected in its left and right ends A, B place, form and disconnect the hole in printed circuit board (PCB) front 2;
2., when the numerical control moulding, described disconnection hole forming is become half hole.
Because used cutting tools all is right handed when boring, when boring the plated-through-hole right-hand member, because chip removal is outside the hole, can not produce burr, when boring the plated-through-hole left end, because chip removal is in the hole, can produce a small amount of burr, but in accepting scope, than traditional when the moulding disposable plated-through-hole with circle be shaped to the processing technology in half hole, the burr of this processing technology will reduce a lot, thus guarantee half permeability can complete, and then the yield of raising printed circuit board (PCB), and cost is minimized.
Printed circuit board (PCB) can finish successively the scanning of outer-layer circuit etching, outer-layer circuit detect, anti-welding, carry out described step 1. after changing gold and literal, carry out described step 2. after 1. step is finished.
1. printed circuit board (PCB) carries out described step after also can finishing the outer-layer circuit etching, carry out successively after 1. step is finished outer-layer circuit scanning detect, anti-welding, change gold and literal, carry out described step 2. after literal is finished.Before anti-postwelding and the change gold, bore the debris removal hole less than described plated-through-hole aperture in described disconnection hole, aperture, described debris removal hole is than the little 4mil in described plated-through-hole aperture.Owing to being bored in the disconnection hole that forms of having no progeny, the plated-through-hole of circle may remain some substrate powder, if can't before anti-welding, thoroughly remove, carry out when anti-welding can with the anti-solder ink gluing together and amass and disconnect in the hole, the similar hole of situation inner product China ink, it is bad to occur gold like this when changing gold, therefore can in disconnecting the hole, bore the debris removal hole, be used for removing the adhesive bond of substrate powder and anti-solder ink, gold on the hole wall when being beneficial to follow-upization gold.
Embodiment 2: a kind of printed circuit board (PCB) half hole processing procedure mirror image way comprises the steps:
1., operate, it is disconnected to use the groove cutter that the plated-through-hole 1 of circle is bored in its right-hand member C place, forms the disconnection hole at the printed circuit board (PCB) back side 3; Because used cutting tools all is right handed when boring, therefore when the plated-through-hole right-hand member bored, chip removal can not produce burr outside the hole.
2., when the numerical control moulding, described disconnection hole forming is become half hole.
Thisly operate at the printed circuit board (PCB) back side, bore the plated-through-hole of circle disconnected in its right-hand member place overleaf, and then when the numerical control moulding, disconnect the processing mode that left end molds half hole, can not produce burr, thereby guarantee the complete of half permeability energy, and then the yield of raising printed circuit board (PCB), and cost is minimized.
Printed circuit board (PCB) can finish successively the scanning of outer-layer circuit etching, outer-layer circuit detect, anti-welding, carry out described step 1. after changing gold and literal, carry out described step 2. after 1. step is finished.
1. printed circuit board (PCB) carries out described step after also can finishing the outer-layer circuit etching, carry out successively after 1. step is finished outer-layer circuit scanning detect, anti-welding, change gold and literal, carry out described step 2. after literal is finished.Before anti-postwelding and the change gold, bore the debris removal hole less than described plated-through-hole aperture in described disconnection hole, aperture, described debris removal hole is than the little 4mil in described plated-through-hole aperture.Owing to being bored in the disconnection hole that forms of having no progeny, the plated-through-hole of circle may remain some substrate powder, if can't before anti-welding, thoroughly remove, carry out when anti-welding can with the anti-solder ink gluing together and amass and disconnect in the hole, the similar hole of situation inner product China ink, it is bad to occur gold like this when changing gold, therefore can in disconnecting the hole, bore the debris removal hole, be used for removing the adhesive bond of substrate powder and anti-solder ink, gold on the hole wall when being beneficial to follow-upization gold.
Claims (8)
1. printed circuit board (PCB) half a hole processing procedure mirror image way is characterized in that, comprises the steps:
1., at least one end place brill of plated-through-hole in its left and right two ends with circle breaks formation disconnection hole;
2., when the numerical control moulding, described disconnection hole forming is become half hole.
2. printed circuit board (PCB) half hole processing procedure mirror image way according to claim 1 is characterized in that, comprises the steps:
1., the plated-through-hole of circle is broken formation disconnection hole in its place, left and right two ends brill;
2., when the numerical control moulding, described disconnection hole forming is become half hole.
3. printed circuit board (PCB) half hole processing procedure mirror image way according to claim 1 is characterized in that, comprises the steps:
1., operate, the plated-through-hole of circle is bored disconnected in its right-hand member place, form and disconnect the hole at the printed circuit board (PCB) back side;
2., when the numerical control moulding, described disconnection hole forming is become half hole.
4. printed circuit board (PCB) half hole processing procedure mirror image way according to claim 3 is characterized in that: the 1. middle groove cutter that uses of step bores the plated-through-hole of circle disconnected in its right-hand member place.
5. according to the described printed circuit board (PCB) half hole processing procedure mirror image way of one of claim 1 to 4, it is characterized in that: printed circuit board (PCB) finish successively the scanning of outer-layer circuit etching, outer-layer circuit detect, anti-welding, carry out described step 1. after changing gold and literal, carry out described step 2. after 1. step is finished.
6. according to the described printed circuit board (PCB) half hole processing procedure mirror image way of one of claim 1 to 4, it is characterized in that: 1. printed circuit board (PCB) carries out described step after finishing the outer-layer circuit etching, carry out successively after 1. step is finished outer-layer circuit scanning detect, anti-welding, change gold and literal, carry out described step 2. after literal is finished.
7. printed circuit board (PCB) half hole processing procedure mirror image way according to claim 6 is characterized in that: before anti-postwelding and the change gold, bore the debris removal hole less than described plated-through-hole aperture in described disconnection hole.
8. printed circuit board (PCB) half hole processing procedure mirror image way according to claim 7, it is characterized in that: aperture, described debris removal hole is than the little 4mil in described plated-through-hole aperture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101724943A CN102244979A (en) | 2010-05-12 | 2010-05-12 | Half-hole processing mirror image manufacturing method of printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010101724943A CN102244979A (en) | 2010-05-12 | 2010-05-12 | Half-hole processing mirror image manufacturing method of printed circuit board |
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| CN102244979A true CN102244979A (en) | 2011-11-16 |
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| CN2010101724943A Pending CN102244979A (en) | 2010-05-12 | 2010-05-12 | Half-hole processing mirror image manufacturing method of printed circuit board |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103945658A (en) * | 2013-01-22 | 2014-07-23 | 深圳市万泰电路有限公司 | Method of manufacturing metallized semi-hole plate |
| CN104289737A (en) * | 2013-07-18 | 2015-01-21 | 深圳市大族激光科技股份有限公司 | Stacked slotted hole drilling machining method |
| CN104717847A (en) * | 2015-03-17 | 2015-06-17 | 深圳崇达多层线路板有限公司 | Manufacturing method of metallized half hole in PCB |
| CN104936386A (en) * | 2015-05-20 | 2015-09-23 | 东莞市五株电子科技有限公司 | Printed circuit board half metalized hole making method |
| CN105704947A (en) * | 2016-03-25 | 2016-06-22 | 柏承科技(昆山)股份有限公司 | Forming process of burr-free printed circuit board (PCB) |
| CN105722324A (en) * | 2016-03-15 | 2016-06-29 | 建业科技电子（惠州）有限公司 | Manufacturing method of circuit board counterbore |
| CN111432559A (en) * | 2020-03-20 | 2020-07-17 | 江苏苏杭电子有限公司 | Method for processing semicircular copper sinking hole |
| CN112235960A (en) * | 2020-10-28 | 2021-01-15 | 惠州市特创电子科技有限公司 | Gold immersion circuit board and preparation method thereof |
| CN112312664A (en) * | 2020-10-28 | 2021-02-02 | 惠州市特创电子科技有限公司 | Circuit board and manufacturing method thereof |
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| JPH06291459A (en) * | 1993-04-01 | 1994-10-18 | Nec Corp | Manufacture of printed wiring board |
| CN101152674A (en) * | 2006-09-28 | 2008-04-02 | 日立比亚机械股份有限公司 | Figuration processing method |
| CN101547569A (en) * | 2009-04-24 | 2009-09-30 | 深圳市博敏电子有限公司 | Technology for processing semi-hole of PCB board |
| CN101695218A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for manufacturing printed circuit board with half-edge hole |
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2010
- 2010-05-12 CN CN2010101724943A patent/CN102244979A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06291459A (en) * | 1993-04-01 | 1994-10-18 | Nec Corp | Manufacture of printed wiring board |
| CN101152674A (en) * | 2006-09-28 | 2008-04-02 | 日立比亚机械股份有限公司 | Figuration processing method |
| CN101547569A (en) * | 2009-04-24 | 2009-09-30 | 深圳市博敏电子有限公司 | Technology for processing semi-hole of PCB board |
| CN101695218A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for manufacturing printed circuit board with half-edge hole |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103945658A (en) * | 2013-01-22 | 2014-07-23 | 深圳市万泰电路有限公司 | Method of manufacturing metallized semi-hole plate |
| CN104289737A (en) * | 2013-07-18 | 2015-01-21 | 深圳市大族激光科技股份有限公司 | Stacked slotted hole drilling machining method |
| CN104289737B (en) * | 2013-07-18 | 2016-12-28 | 大族激光科技产业集团股份有限公司 | A kind of drilling method of superposition slotted eye |
| CN104717847A (en) * | 2015-03-17 | 2015-06-17 | 深圳崇达多层线路板有限公司 | Manufacturing method of metallized half hole in PCB |
| CN104936386A (en) * | 2015-05-20 | 2015-09-23 | 东莞市五株电子科技有限公司 | Printed circuit board half metalized hole making method |
| CN104936386B (en) * | 2015-05-20 | 2018-07-10 | 东莞市五株电子科技有限公司 | The production method in printed circuit board semi-metal hole |
| CN105722324A (en) * | 2016-03-15 | 2016-06-29 | 建业科技电子（惠州）有限公司 | Manufacturing method of circuit board counterbore |
| CN105704947A (en) * | 2016-03-25 | 2016-06-22 | 柏承科技(昆山)股份有限公司 | Forming process of burr-free printed circuit board (PCB) |
| CN111432559A (en) * | 2020-03-20 | 2020-07-17 | 江苏苏杭电子有限公司 | Method for processing semicircular copper sinking hole |
| CN112235960A (en) * | 2020-10-28 | 2021-01-15 | 惠州市特创电子科技有限公司 | Gold immersion circuit board and preparation method thereof |
| CN112312664A (en) * | 2020-10-28 | 2021-02-02 | 惠州市特创电子科技有限公司 | Circuit board and manufacturing method thereof |
| CN112235960B (en) * | 2020-10-28 | 2022-05-17 | 惠州市特创电子科技股份有限公司 | Gold immersion circuit board and preparation method thereof |
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Application publication date: 20111116 |