CN112312664A

CN112312664A - Circuit board and manufacturing method thereof

Info

Publication number: CN112312664A
Application number: CN202011177436.XA
Authority: CN
Inventors: 许校彬
Original assignee: Huizhou Glorysky Electronics Technology Co ltd
Current assignee: Huizhou Glorysky Electronics Technology Co ltd
Priority date: 2020-10-28
Filing date: 2020-10-28
Publication date: 2021-02-02
Anticipated expiration: 2040-10-28
Also published as: CN112312664B

Abstract

The application provides a circuit board and a manufacturing method thereof. The manufacturing method of the circuit board comprises the following steps: drilling a plate body to process a metal hole on the plate body; carrying out character processing on the plate body so as to print a character mark and a cutting alignment line on the plate body, wherein the cutting alignment line passes through the center of the metal hole; carrying out surface treatment on the plate body; carrying out large-board test on the board body; identifying a cutting alignment line of the plate body; according to the cutting alignment line, pre-drilling the periphery of the metal hole of the plate to form a pre-drilled hole in the plate, wherein the cutting alignment line also passes through the center of the pre-drilled hole; and V-cutting the tested plate along the cutting alignment line. The step of V-cutting the tested plate along the cutting alignment line is designed after the etching process, so that the problem of low production efficiency of the circuit board caused by a cross-process production process adopted by a traditional circuit board manufacturing method is solved.

Description

Circuit board and manufacturing method thereof

Technical Field

The invention relates to the technical field of circuit board production, in particular to a circuit board and a manufacturing method thereof.

Background

In recent years, with the rapid development of electronic products, high density, multifunction and miniaturization have become the development direction of circuit boards. The assembly of the printed circuit board is more and more complicated, the size of the circuit board is continuously reduced, and in addition, a plurality of carrier plates with smaller sizes are matched, and the unit edges of the carrier plates are provided with a whole row of metallized half holes. The daughter board is used as a daughter board of the mother board and is welded with the mother board and pins of the components through the metallized half holes.

Generally, because a main shaft of the numerical control milling machine always rotates clockwise, a cutting force is generated on the side surface of the daughter board in the milling process, and under the action of the cutting force, the milling cutter mills the redundant plate material to machine the metallized half hole of the daughter board. When the metallized half hole is processed, the forming processing quality of the metallized half hole is influenced by the binding force between the copper plating layer and the base material layer, the cutting performance of a milling cutter, the design characteristics of the semi-metallized unit graph, the milling mode and other factors. In the processing process of the metallized half hole, namely in the process of milling the metallized half hole at one time, if any auxiliary process is not added, burrs, copper wires and the like can be generated on the inner wall of the metallized half hole, so that the processing precision of the metallized half hole is low.

In addition, in the processing process, the powder mixture generated in the processing process is accumulated and even adhered to the edge of the metallized semi-hole, and the powder mixture cannot be completely removed under the protection of a dry film in the etching process, so that the circuit board has protruding residues, the appearance of the circuit board is influenced, and the qualification rate of the circuit board is poor.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provides the circuit board with higher processing precision of the metallized half hole and higher qualification rate of the circuit board and the manufacturing method thereof.

The purpose of the invention is realized by the following technical scheme:

a method of manufacturing a wiring board, comprising:

drilling a plate body to process a metal hole on the plate body;

performing character processing on the plate body to print a character mark and a cutting alignment line on the plate body, wherein the cutting alignment line passes through the center of the metal hole;

carrying out surface treatment on the plate body;

carrying out large-board test on the board body;

identifying a cutting alignment line of the plate body;

according to the cutting alignment line, pre-drilling the periphery of the metal hole of the plate to machine a pre-drilled hole in the plate, wherein the cutting alignment line also passes through the center of the pre-drilled hole;

and V-cutting the tested plate along the cutting alignment line.

In one embodiment, the number of the metal holes on the same cutting alignment line is multiple, and the metal holes are arranged side by side.

In one embodiment, the number of the pre-drilled holes formed in the periphery of the same metal hole is two.

In one embodiment, the diameter of the pre-drilled hole is equal to 0.2 of the diameter of the metal hole.

In one embodiment, before the step of V-cutting the board along the cutting alignment line, and after the step of performing the large board test on the board body, the manufacturing method further includes:

and carrying out secondary drilling processing on the metal hole of the plate body so as to mill and remove the chips in the metal hole.

In one embodiment, the step of performing V-sectioning on the tested plate along the cutting alignment line specifically includes:

and V-cutting the tested plate along the cutting alignment line by a V-cutting machine.

In one embodiment, before the step of performing the character processing on the plate body and after the step of performing the drilling processing on the plate body to machine the metal hole in the plate body, the manufacturing method further includes:

and (4) removing the film of the plate body so as to remove the dry film on the surface of the plate.

In one embodiment, before the step of performing the character processing on the board body, and after the step of performing the film removing processing on the board body, the manufacturing method further includes:

and etching the plate body after the film stripping treatment to remove the redundant copper foil on the plate body.

In one embodiment, before the step of performing the character processing on the board body, and after the step of performing the etching operation on the board body after the film removing processing, the manufacturing method further includes:

and stripping tin from the etched plate body to expose the circuit on the plate body.

A circuit board is processed by the manufacturing method of the circuit board in any embodiment.

Compared with the prior art, the invention has at least the following advantages:

1. firstly, drilling a plate body to process a metal hole on the plate body; then, performing character processing on the plate body to print a character mark and a cutting alignment line on the plate body, wherein the cutting alignment line passes through the center of the metal hole; then, carrying out surface treatment on the plate body, such as gold immersion, tin spraying or oxidation resistance treatment on the plate body; then, large board testing is carried out on the board body, namely the electrical performance of each sub-board is tested before board splitting, so that the production efficiency of a single circuit board is improved; then identifying the cutting alignment line of the plate body; then, pre-drilling the periphery of the metal hole of the plate according to the cutting alignment line so as to machine a pre-drilled hole in the plate body, wherein the cutting alignment line also passes through the center of the pre-drilled hole; finally, V-cutting the tested plate along the cutting alignment line to obtain at least two sub-plates, wherein pre-drilled holes are machined in the plate body before plate splitting, namely holes in contact with metal holes and a V-cutting path are drilled out before V-cutting, so that copper is prevented from being pulled out in the V-cutting process, the surfaces of the sub-plates obtained after V-cutting are smoother, and the production efficiency of the circuit board is improved;

2. the step of V-dividing the tested plate along the cutting alignment line is positioned after the step of processing the characters on the plate body, so that the step of V-dividing the tested plate along the cutting alignment line is designed after the etching process, and the problem of low production efficiency of the circuit board caused by a cross-process production process adopted by a traditional circuit board manufacturing method is solved;

3. the board splitting operation is added in the production process of the circuit board, the expansion and shrinkage problems in the subsequent transportation process do not need to be considered, the board is split according to the cutting alignment line, and the circuit board obtained by processing in the way is more accurate.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a flow chart of a method of manufacturing a circuit board according to an embodiment;

fig. 2 is a schematic view of a dicing alignment line printed on a large board in step S103 of the manufacturing method of the wiring board shown in fig. 1, in which a metal hole is not shown;

FIG. 3 is a schematic illustration of the locations of the pre-drilled holes and metal holes of the large panel of FIG. 2;

FIG. 4 is a partial schematic view of the V cutter;

fig. 5 is a schematic view of a daughter board cut by the V-cutter of fig. 4.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The present application provides a method of manufacturing a circuit board, including: drilling a plate body to process a metal hole on the plate body; performing character processing on the plate body to print a character mark and a cutting alignment line on the plate body, wherein the cutting alignment line passes through the center of the metal hole; carrying out surface treatment on the plate body; carrying out large-board test on the board body; identifying a cutting alignment line of the plate body; according to the cutting alignment line, pre-drilling the periphery of the metal hole of the plate to machine a pre-drilled hole in the plate, wherein the cutting alignment line also passes through the center of the pre-drilled hole; and V-cutting the tested plate along the cutting alignment line to obtain at least two sub-plates.

Firstly, drilling a plate body to process a metal hole on the plate body; then, performing character processing on the plate body to print a character mark and a cutting alignment line on the plate body, wherein the cutting alignment line passes through the center of the metal hole; then, carrying out surface treatment on the plate body, such as gold immersion, tin spraying or oxidation resistance treatment on the plate body; then, large board testing is carried out on the board body, namely the electrical performance of each sub-board is tested before board splitting, so that the production efficiency of a single circuit board is improved; then identifying the cutting alignment line of the plate body; then, pre-drilling the periphery of the metal hole of the plate according to the cutting alignment line so as to machine a pre-drilled hole in the plate body, wherein the cutting alignment line also passes through the center of the pre-drilled hole; finally, V-cutting the tested plate along the cutting alignment line to obtain at least two sub-plates, wherein pre-drilled holes are machined in the plate body before plate splitting, namely holes in contact with metal holes and a V-cutting path are drilled out before V-cutting, so that copper is prevented from being pulled out in the V-cutting process, the surfaces of the sub-plates obtained after V-cutting are smoother, and the production efficiency of the circuit board is improved; the step of V-dividing the tested plate along the cutting alignment line is positioned after the step of processing the characters on the plate body, so that the step of V-dividing the tested plate along the cutting alignment line is designed after the etching process, and the problem of low production efficiency of the circuit board caused by a cross-process production process adopted by a traditional circuit board manufacturing method is solved; the production process of the circuit board increases board splitting operation, the expansion and shrinkage problems in the subsequent transportation process do not need to be considered, the circuit board is split according to the cutting alignment line, and the circuit board obtained by processing in the way is more accurate.

Please refer to fig. 1, which is a flowchart illustrating a method for manufacturing a circuit board according to an embodiment of the invention. In one embodiment, the manufacturing method of the circuit board comprises part or all of the following steps.

S101, drilling the plate body to machine a metal hole in the plate body.

Referring to fig. 2 and 3, in the present embodiment, the board body 10 is a large board, and is a board that is not divided into sub-boards, that is, the sub-boards 12 that are not divided into circuit boards. The large board comprises a plurality of sub-boards arranged in an array. The plate body is drilled to form metal holes 14 in the plate body, i.e., between two adjacent daughter boards and within each daughter board. Specifically, between two adjacent daughter boards, the number of the metal holes is multiple, and the multiple metal holes are linearly arranged.

S103, performing character processing on the board body to print character marks and a cutting alignment line on the board body, wherein the cutting alignment line passes through the center of the metal hole.

As shown in fig. 2, in this embodiment, the character marks may be characters such as resistors, capacitors, or positive and negative electrodes. The number of the cutting alignment lines 16 is plural, and the plural cutting alignment lines are distributed in a grid shape. The plurality of cutting alignment lines comprise M transverse cutting alignment lines and N vertical cutting alignment lines, the M transverse cutting alignment lines are arranged side by side, the N vertical cutting alignment lines are arranged side by side, an intersection point exists between each transverse cutting alignment line and the N vertical cutting alignment lines respectively, and an intersection point exists between each vertical cutting alignment line and the M vertical cutting alignment lines respectively. Two adjacent daughter boards are demarcated by a cutting alignment line. The cutting alignment line passes through the center of the metal hole, namely the cutting alignment line between two adjacent daughter boards passes through the circle center of the metal hole between two adjacent daughter boards, namely the cutting alignment line between two adjacent daughter boards passes through the center of the metal hole between two adjacent daughter boards.

And S105, performing surface treatment on the plate body.

In this embodiment, the plate body is subjected to a surface treatment, i.e., a gold immersion treatment, a tin spray treatment, an oxidation resistance treatment, or the like.

And S107, carrying out large-board test on the board body.

In this embodiment, the board body is subjected to a large board test, that is, batch electrical performance tests are performed on a plurality of daughter boards of the board body, so that the production efficiency of a single daughter board is improved.

And S109, identifying the cutting alignment line of the plate body.

In this embodiment, the cutting alignment line of the board body is identified, that is, the process of aligning the cutting alignment line of the board body is found. It is understood that the cutting alignment line of the plate body can be identified by the naked eye, or by a machine, such as a CCD camera or a CMOS camera.

And S111, pre-drilling the periphery of the metal hole of the plate according to the cutting alignment line so as to machine a pre-drilled hole in the plate, wherein the cutting alignment line also passes through the center of the pre-drilled hole.

As shown in fig. 3, in this embodiment, according to the cutting alignment line, the periphery of the metal hole of the plate is pre-drilled, that is, the intersection point between the cutting alignment line and the periphery of the metal hole is pre-drilled, that is, two symmetrical pre-drilled holes are respectively machined at two end points of the metal hole passing through the center of the cutting alignment line and intersecting the periphery of the metal hole, so that two symmetrical pre-drilled holes are machined at the periphery of each metal hole.

And S113, carrying out V-shaped plate division on the tested plate along the cutting alignment line.

In this embodiment, the board after the test is subjected to V-splitting along the cutting alignment line to obtain at least two sub-boards.

In one embodiment, the number of the metal holes on the same cutting alignment line is multiple, and the metal holes are arranged side by side. In this embodiment, the number of the metal holes located on the same cutting alignment line is multiple, that is, a plurality of metal holes are formed on the boundary line between two adjacent daughter boards.

In one embodiment, the number of the pre-drilled holes formed in the periphery of the same metal hole is two, that is, the two ends of the metal hole passing through the center of the cutting alignment line and intersecting the periphery of the metal hole are respectively formed with the pre-drilled holes, so that two symmetrical pre-drilled holes are formed in the periphery of each metal hole, and the pre-drilled holes are formed in the points where the metal hole and the cutting alignment line intersect, thereby avoiding the copper sheet from rolling up during the process of performing V-shaped division along the cutting alignment line and avoiding the situation of the metal burrs existing on the division lines between the daughter boards.

As shown in fig. 3, in order to improve the flatness of the plate body divided into the daughter boards, in one embodiment, the diameter of the pre-drilled hole is equal to 0.2 of the diameter of the metal hole, so that the metal hole and the pre-drilled hole are drilled out of the plate body before V-cutting, thereby effectively avoiding the situation that the copper layer is pulled during V-cutting of the plate body, and improving the flatness of the plate body divided into the daughter boards.

the metal hole of the plate body is subjected to secondary drilling processing to remove chips in the metal hole in a milling mode, the inner wall of the metal hole is provided with the chips such as copper chips after the metal hole is machined and formed, and if the chips are not cleaned in advance, burrs exist on the surface of the metal half hole obtained after V cutting, the appearance of the metal half hole is influenced, and the qualification rate of the daughter board of the circuit board is low.

as shown in fig. 4, the tested plate is V-cut along the cutting alignment line by a V-cutter 20. In this embodiment, the board after the test is subjected to the V-splitting along the cutting alignment line by the V-splitter to split the board into at least two sub-boards, i.e., sub-boards of at least two circuit boards. Fig. 5 is a schematic sectional view of the daughter board cut by the V cutter 20.

As shown in fig. 4, in one embodiment, the V-cutter 20 includes a main frame 100, a first movable frame 200, a second movable frame 300, a first cutting assembly 400 and a second cutting assembly 500, wherein the first movable frame and the second movable frame are movably disposed on the main frame, the first cutting assembly is disposed on the first movable frame, the second cutting assembly is disposed on the second movable frame, and the first cutting assembly and the second cutting assembly are disposed opposite to each other. The first movable frame and the second movable frame move relatively, namely the first movable frame and the second movable frame are close to or far away from each other, so that the first cutting assembly and the second cutting assembly are close to or far away from each other, and further the first cutting assembly and the second cutting assembly cut the sub-board of the circuit board along the cutting alignment line together, and the V-shaped cutting board of the board body is realized. In this embodiment, the first cutting assembly and the second cutting assembly respectively cut the large board from two sides of the large board along the cutting alignment line, so that the sub board and the sub board are effectively separated along the cutting alignment line, and the cutting surface of the large board by the first cutting assembly and the cutting surface of the large board by the second cutting assembly are on the same cutting surface, so that the splitting surface between the sub board and the sub board is relatively flat.

As shown in fig. 4, further, the V-cutter further includes a driving assembly 600, the driving assembly is disposed on the main frame, and a power output end of the driving assembly is connected to the first movable frame and the second movable frame respectively, so that the driving assembly drives the first movable frame and the second movable frame to approach or separate from each other, so as to adjust a distance between the first cutting assembly and the second cutting assembly, and meet different processing requirements of the daughter board of the circuit board. In this embodiment, first cutting assembly and second cutting assembly all carry out disposable cutting and realize dividing the board, make the first adjustable shelf of drive assembly drive and second adjustable shelf be close to each other, and the distance on the machined surface is zero until between first cutting assembly and the second cutting assembly. The drive assembly is double-cylinder drive assembly, and drive assembly's power take off end includes first end and second end, and the power take off direction of first end and the power take off direction of second end are close to each other or keep away from, and first adjustable shelf is connected with first end, and the second adjustable shelf is held with the second and is connected.

As shown in fig. 4, the main frame is further provided with a first sliding chute 110 and a second sliding chute 120, and an extending direction of the first sliding chute is collinear with an extending direction of the second sliding chute. The first movable frame comprises a first frame body 210 and a first sliding block 220 which are connected, the first frame body is connected with the power output end of the driving assembly, and the first frame body is located in the first sliding groove and is in sliding connection with the main frame. The first cutting assembly is fixedly arranged on the first frame body, so that the first cutting assembly is arranged on the first movable frame. The second movable frame comprises a second frame body 310 and a second sliding block 320 which are connected, the second frame body is connected with the power output end of the driving assembly, and the second frame body is located in the second sliding groove and is in sliding connection with the main frame. The second cutting assembly is fixedly arranged on the second frame body, so that the second cutting assembly is arranged on the second movable frame.

Furthermore, the first cutting assembly comprises a first tool rest, a first rotary tool body, a first transmission assembly and a first power source, the first tool rest is rotatably arranged on the first frame body, the first rotary tool body is fixed on the first tool rest, the first power source is arranged on the first frame body, and the first power source drives the first tool rest to rotate relative to the first frame body through the first transmission assembly. In this embodiment, the first tool post is sleeved on the first frame body through the bearing, so that the rotation of the first tool post and the first frame body is more stable and the wear resistance is smaller. The first transmission assembly comprises a first gear and a second gear, the first gear is sleeved on the output shaft of the first power source, the second gear is sleeved on the first tool rest, and the second gear is in meshing transmission with the first gear. The first power source is a motor or a rotary cylinder. The first rotary cutter body and the first cutter frame are coaxially arranged.

Furthermore, the first rotary cutter body comprises a first cutter disc and a plurality of first cutting edges, the first cutter disc is fixed on the first cutter frame, the first cutting edges are distributed at intervals along the circumferential direction of the first cutter disc, and the outline of each first cutting edge is in a V-shaped shape, so that the first rotary cutter body can perform V-cut processing on a large board of a circuit board. In this embodiment, the first cutter head is fixed to the first cutter frame, and the first cutter head and the plurality of first cutting edges are integrally formed. In other embodiments, the first cutter disc and the plurality of first cutting edges may also be formed separately and fixedly attached by welding.

Furthermore, the second cutting assembly comprises a second tool rest, a second rotary tool body, a second transmission assembly and a second power source, the second tool rest is rotatably arranged on the second frame body, the second rotary tool body is fixed on the second tool rest, the second power source is arranged on the second frame body, and the second power source drives the second tool rest to rotate relative to the second frame body through the second transmission assembly. In this embodiment, the second tool rest is sleeved on the second frame body through the bearing, so that the second tool rest and the second frame body rotate more stably and have smaller wear resistance. The second transmission assembly comprises a third gear and a fourth gear, the third gear is sleeved on the output shaft of the second power source, the fourth gear is sleeved on the second tool rest, and the fourth gear and the third gear are in meshing transmission. The second power source is a motor or a rotary cylinder. The second rotating cutter body and the second cutter frame are coaxially arranged.

Furthermore, the second rotary cutter body comprises a second cutter disc and a plurality of second cutting edges, the second cutter disc is fixed on the second cutter frame, the second cutting edges are distributed at intervals along the circumferential direction of the second cutter disc, and the outline of each second first cutting edge is V-shaped, so that the second rotary cutter body can perform V-cut processing on the large board of the circuit board. In this embodiment, the second cutter head is fixed to the second cutter frame, and the second cutter head and the plurality of second cutting edges are integrally formed. In other embodiments, the second cutter head and the plurality of second cutting edges may also be formed separately and fixedly attached by welding.

In one embodiment, the V-cutter further comprises a receiving lift mechanism, which is disposed on the main frame. The supporting lifting mechanism comprises a lifting assembly, a supporting main board and a plurality of supporting adsorption pieces, the lifting assembly is arranged on the main frame, the supporting main board is connected with the power output end of the lifting assembly, and the lifting assembly drives the supporting main board to move up and down relative to the main frame. A plurality of support adsorption parts are connected to one side of the power output end of the bearing main board, which is far away from the lifting assembly. A plurality of supports adsorb the piece interval setting, and each supports adsorbs the piece and includes back shaft and sucking disc, and the one end of back shaft is connected with accepting the mainboard, and the other end of back shaft is located to the sucking disc. The suckers for supporting the adsorption pieces are adsorbed on the corresponding sub-plates, so that each supporting adsorption piece supports and fixes the corresponding sub-plate. Before the V cuts the board, the mainboard is accepted in the lifting unit drive for main frame elevating movement, makes the sucking disc butt that supports the adsorption element and adsorb in the daughter board, makes each daughter board relative positioning before cutting apart, is unlikely to the problem that partial daughter board dropped like this after the V cuts the board. Further, the supporting main board is connected to the main frame in a sliding mode. The lifting assembly comprises a lifting motor, a screw rod and a nut, the lifting motor is fixedly installed on the main frame, one end of the screw rod is connected with a power shaft of the lifting motor, the other end of the screw rod is rotatably connected onto the main frame, the nut is connected onto the bearing main board, and when the lifting motor drives the screw rod to rotate relative to the main frame, the screw rod drives the nut to perform threaded transmission, so that the bearing main board is slidably connected onto the main frame. It can be understood that when the sub-board is supported and fixed, the suction cup is attracted to the surface of the sub-board. When the daughter board needs to be loosened, the suction cup blows air to loosen the surface of the daughter board.

In a specific embodiment, two V knives of the V cutting machine are in a front-back direction, namely the distance between a first cutting edge and a second cutting edge of the V cutting machine is smaller, the residual thickness of the daughter board is set to be 0, the separation between the daughter boards can be realized by the first cutting edge and the second cutting edge through one-time cutting, the V cutting is not provided with a chamfer, because the teeth of the V cutting knife completely penetrate into the board, the two sides of the V cutting are flush, when the residual thickness is 0, the board is V-penetrated, the board and the board are directly separated to obtain the corresponding daughter board, the daughter board is directly welded with the mother board, the board separation through a board separation device is not needed, unnecessary processes are reduced, the production efficiency of a factory is improved, meanwhile, the utilization rate of the designed daughter board is greatly improved by dividing the holes into two half holes instead of the two half holes, the number of designed drilled holes is reduced, the production efficiency is improved by reducing the number of drilled holes, the cost is reduced.

and carrying out film removing treatment on the plate body to remove the dry film on the surface of the plate body so as to expose the copper layer of the plate body.

In one embodiment, before the step of performing the character processing on the plate body, and after the step of performing the tin stripping operation on the etched plate body, the manufacturing method further includes:

and carrying out solder mask operation on the plate body to remove redundant ink on the plate body.

According to the manufacturing method of the circuit board, the daughter board to SMT flow is optimized through the scheme of manufacturing the daughter board by V-cutting the half holes, the large board is subjected to the delivery mode of V-cutting the board to deliver the daughter board, the size consistency of the half holes can be guaranteed on the quality problem, burrs of the half holes are reduced, the flow of a client side is reduced, the utilization rate of processed plates of the daughter board of the circuit board can be improved, the number of drilled holes is reduced, and the production efficiency of the circuit board is improved.

Further, after the step S113 of V-dividing the tested plate along the cutting alignment line, the manufacturing method further includes the steps of: and detecting the cut daughter board. In this embodiment, detect the daughter board after the cutting and can be examined by artifical vision, also can gather and analysis and detection through the CCD camera, improve the detection efficiency of daughter board.

Further, after the step of inspecting the cut sub-board, the manufacturing method further includes the steps of: and delivering the detected daughter board.

In one embodiment, the process of the method for manufacturing a wiring board includes: inner layer → pressing → drilling → copper deposition → whole board electroplating → pattern transfer → pattern electroplating → film removal → etching → tin removal → solder mask → character → surface treatment → large board test → two drills → V cut and separate board molding → visual inspection → shipment.

The application also provides a circuit board which is processed by adopting the manufacturing method of the circuit board in any embodiment.

3. the production process of the circuit board increases board splitting operation, the expansion and shrinkage problems in the subsequent transportation process do not need to be considered, the circuit board is split according to the cutting alignment line, and the circuit board obtained by processing in the way is more accurate.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A method of manufacturing a wiring board, comprising:

drilling a plate body to process a metal hole on the plate body;

carrying out surface treatment on the plate body;

carrying out large-board test on the board body;

identifying a cutting alignment line of the plate body;

and V-cutting the tested plate along the cutting alignment line.

2. The method of manufacturing a wiring board according to claim 1, wherein the number of the metal holes on the same dicing alignment line is plural, and the plural metal holes are arranged side by side.

3. The method of manufacturing a wiring board according to claim 2, wherein the number of the pre-drilled holes opened at the periphery of the same metal hole is two.

4. The method of manufacturing a wiring board according to claim 1, wherein the diameter of the pre-drilled hole is equal to 0.2 of the diameter of the metal hole.

5. The method of manufacturing a wiring board according to claim 1, wherein before the step of V-dividing the board after the test along the dicing alignment lines, and after the step of performing a large board test on the board body, the method further comprises:

6. The method for manufacturing a circuit board according to claim 1, wherein the step of performing V-dicing on the board after the test along the dicing alignment line is specifically:

7. The method for manufacturing a wiring board according to claim 1, wherein before the step of performing character processing on the board body and after the step of performing drilling processing on the board body to machine a metal hole in the board body, the method further comprises:

8. The method for manufacturing a wiring board according to claim 7, wherein before the step of performing character processing on the board body and after the step of performing film removal processing on the board body, the method further comprises:

9. The method of manufacturing a wiring board according to claim 8, wherein before the step of performing character processing on the board body, and after the step of performing etching operation on the board body after the film removal processing, the method further comprises:

10. A wiring board characterized by being processed by the method for manufacturing a wiring board according to any one of claims 1 to 9.