CN104936386A - Printed circuit board half metalized hole making method - Google Patents
Printed circuit board half metalized hole making method Download PDFInfo
- Publication number
- CN104936386A CN104936386A CN201510264030.8A CN201510264030A CN104936386A CN 104936386 A CN104936386 A CN 104936386A CN 201510264030 A CN201510264030 A CN 201510264030A CN 104936386 A CN104936386 A CN 104936386A
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- Prior art keywords
- hole
- pcb
- semi
- printed circuit
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a printed circuit board half metalized hole making method comprising the following steps: drilling a hole in a predetermined position in which a half metalized hole is to be formed on a PCB so as to form a to-be-cut hole position of the half metalized hole, and depositing copper in the to-be-cut hole position; performing pattern transfer, pattern electroplating, film stripping, alkaline etching, solder stripping and photosensitive resistance welding on the PCB; placing the PCB with the front side up, and using an end mill to drill a through hole respectively in the left and right ends of the to-be-cut hole position; and placing the PCB with the back side up, and using the end mill to remove blurs of the through holes. According to the printed circuit board half metalized hole making method, one through hole is drilled respectively in the left and right ends of the to-be-cut hole position of the half metalized hole by using the end mill, and then, the PCB is overturned, and the blurs of the through holes are removed by using the end mill. Therefore, the problem of copper wire and blur residue on the wall of the half metalized hole is solved effectively, and the quality of PCB products can be improved.
Description
Technical field
The present invention relates to wiring board manufacturing technology field, especially, relate to the manufacture method in a kind of printed circuit board (PCB) (Printed Circuit Board, PCB) semi-metal hole.
Background technology
So-called semi-metal hole, refer to the design only staying half plated-through hole on PCB object line, and second half is fallen by gong when processing and forming more.This design is used on power panel, individual consumer's goods or backboard.During welding processing, the side in semi-metal hole is as the mating surface crimped, and be in most cases a daughter board as motherboard, the pin of the semi-metal hole of daughter board and motherboard or components and parts is welded together to strengthen welding performance.Adopt traditional semi-metal hole manufacture method, often occur the phenomenons such as semi-metal hole hole wall generation copper wire, burr be residual, the copper wire remained, burr in semi-metal the hole in will cause leg loosely, rosin joint, even bridge joint short circuit problem.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of manufacture method in printed circuit board (PCB) semi-metal hole that effectively can solve semi-metal hole hole wall generation copper wire, burr residue problem.
The manufacture method in printed circuit board (PCB) semi-metal hole, comprises the following steps:
Intend the precalculated position boring in shaping semi-metal hole at pcb board part, form the position, hole to be cut in semi-metal hole, and in position, described hole to be cut heavy copper;
Graphic transitions, graphic plating carried out to described pcb board part, moves back film, alkali etching, move back tin, photosensitive solder resist;
Described pcb board part front is placed, uses gong cutter respectively to bore a through hole at the left and right two ends place of position, described hole to be cut;
Described pcb board part reverse side is placed, uses the burr of gong cutter to described through hole to place under repair.
As the further improvement of above-mentioned execution mode, described pcb board part is divided into graph area and garbage area by form wire, and described through hole is positioned at the garbage area of described pcb board part.
As the further improvement of above-mentioned execution mode, the diameter repairing the gong cutter that burr uses is less than the diameter of the gong cutter that holes drilled through uses.
As the further improvement of above-mentioned execution mode, placed by described pcb board part reverse side, the burr of gong cutter to described through hole that the step using the burr of gong cutter to described through hole to place under repair comprises use diameter 0.8mm and diameter 0.5mm respectively places under repair.
As the further improvement of above-mentioned execution mode, the feeding speed of the gong cutter of described diameter 0.80mm and diameter 0.50mm is 0.1-0.5m/min, and lamination sheet number is 1/gong.
As the further improvement of above-mentioned execution mode, described pcb board part reverse side is placed, also comprise after the step using the burr of gong cutter to described through hole to place under repair and surface treatment, character printing and gong profile are carried out to described pcb board part.
As the further improvement of above-mentioned execution mode, described semi-metal hole comprises half-round metal hole and U-shaped plated-through hole.
As the further improvement of above-mentioned execution mode, described Kong Weiwei circular hole to be cut.
Compared to prior art, the manufacture method in printed circuit board (PCB) semi-metal hole provided by the invention respectively adds brill one through hole by using gong cutter at the left and right two ends place of the position, hole to be cut in semi-metal hole, and then returning face plate face uses gong cutter to be placed under repair by the burr of described through hole, efficiently solve the problem that semi-metal hole hole wall generation copper wire, burr are residual, thus be conducive to improving PCB product quality.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the schematic flow sheet of the manufacture method in printed circuit board (PCB) semi-metal hole provided by the invention;
Fig. 2 is preferred embodiment of the present invention semi-metal hole forming schematic diagram.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Referring to Fig. 1, is the schematic flow sheet of the manufacture method in printed circuit board (PCB) semi-metal hole provided by the invention.The manufacture method in described printed circuit board (PCB) semi-metal hole comprises the following steps:
Step S1, intends the precalculated position boring in shaping semi-metal hole, forms the position, hole to be cut in semi-metal hole at pcb board part, and in position, described hole to be cut heavy copper;
As shown in Figure 2, described pcb board part is divided into graph area and garbage area by form wire, and position, a described hole to be cut part is positioned at graph area, and another part is positioned at garbage area.Position, described hole to be cut is generally circular hole.
Step S2, carries out Graphic transitions, graphic plating to described pcb board part, moves back film, alkali etching, moves back tin, photosensitive solder resist;
Comprise in graphic plating operation and copper facing and wicking are carried out to described pcb board part; and copper tin is deposited at described pcb board part uniform throughout; tin layers can protect the copper that need retain when alkali etching, tin layers is peeled off again, expose required line pattern after alkali etching.
Step S3, places described pcb board part front, uses gong cutter respectively to bore a through hole at the left and right two ends place of position, described hole to be cut;
In this step, described gong cutter carries out feed along the direction of form wire, the left and right ends A respectively in position, described hole to be cut, B place each brill one through hole, and described through hole is positioned at the garbage area of described pcb board part.Because gong cutter rotates usually all in the direction of the clock, when boring the through hole at left end A place, chip removal, in hole, can produce a small amount of burr, and when boring the through hole at right-hand member B place, chip removal is to outside hole, and the burr that can not produce burr or generation is few.In addition, the gong cutter diameter used in this step is less than the diameter of the cutting tools that the position, hole to be cut of boring semi-metal hole uses, and in other words, the diameter of described through hole is less than the diameter of position, described hole to be cut.
Step S4, places described pcb board part reverse side, uses the burr of gong cutter to described through hole to place under repair;
In this step, the burr of gong cutter to described through hole of different-diameter can be used repeatedly to repair, thoroughly to eliminate burr.Preferably, first use the burr of gong cutter to described through hole of diameter 0.8mm to place under repair, the burr of gong cutter to described through hole re-using diameter 0.5mm places under repair, the feeding speed of gong cutter is wanted slowly, usually control at 0.1-0.5m/min, in order to avoid breaking, lamination sheet number is 1/gong.And, do not need all to place under repair to the whole burrs in described through hole, only need repair the burr near graph area side in described through hole.In addition, the diameter repairing the gong cutter that burr uses is less than the diameter of the gong cutter that holes drilled through uses.
Step S5, carries out surface treatment, character printing and gong profile to described pcb board part.
Adopt the manufacture method in printed circuit board (PCB) semi-metal hole described above, both can make half-round metal hole, and also can make U-shaped plated-through hole.
Compared to prior art, the manufacture method in printed circuit board (PCB) semi-metal hole provided by the invention respectively adds brill one through hole by using gong cutter at the left and right two ends place of the position, hole to be cut in semi-metal hole, and then returning face plate face uses gong cutter to be placed under repair by the burr of described through hole, efficiently solve the problem that semi-metal hole hole wall generation copper wire, burr are residual, thus be conducive to improving PCB product quality.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (8)
1. the manufacture method in printed circuit board (PCB) semi-metal hole, is characterized in that, comprises the following steps:
Intend the precalculated position boring in shaping semi-metal hole at pcb board part, form the position, hole to be cut in semi-metal hole, and in position, described hole to be cut heavy copper;
Graphic transitions, graphic plating carried out to described pcb board part, moves back film, alkali etching, move back tin, photosensitive solder resist;
Described pcb board part front is placed, uses gong cutter respectively to bore a through hole at the left and right two ends place of position, described hole to be cut;
Described pcb board part reverse side is placed, uses the burr of gong cutter to described through hole to place under repair.
2. the manufacture method in printed circuit board (PCB) semi-metal hole according to claim 1, is characterized in that, described pcb board part is divided into graph area and garbage area by form wire, and described through hole is positioned at the garbage area of described pcb board part.
3. the manufacture method in printed circuit board (PCB) semi-metal hole according to claim 1, is characterized in that, the diameter repairing the gong cutter that burr uses is less than the diameter of the gong cutter that holes drilled through uses.
4. the manufacture method in printed circuit board (PCB) semi-metal hole according to claim 1, it is characterized in that, placed by described pcb board part reverse side, the burr of gong cutter to described through hole that the step using the burr of gong cutter to described through hole to place under repair comprises use diameter 0.8mm and diameter 0.5mm respectively places under repair.
5. the manufacture method in printed circuit board (PCB) semi-metal hole according to claim 4, is characterized in that, the feeding speed of the gong cutter of described diameter 0.80mm and diameter 0.50mm is 0.1-0.5m/min, and lamination sheet number is 1/gong.
6. the manufacture method in printed circuit board (PCB) semi-metal hole according to claim 1, it is characterized in that, described pcb board part reverse side is placed, also comprises after the step using the burr of gong cutter to described through hole to place under repair and surface treatment, character printing and gong profile are carried out to described pcb board part.
7. the manufacture method in printed circuit board (PCB) semi-metal hole according to claim 1, is characterized in that, described semi-metal hole comprises half-round metal hole and U-shaped plated-through hole.
8. the manufacture method in printed circuit board (PCB) semi-metal hole according to claim 1, is characterized in that, described Kong Weiwei circular hole to be cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510264030.8A CN104936386B (en) | 2015-05-20 | 2015-05-20 | The production method in printed circuit board semi-metal hole |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510264030.8A CN104936386B (en) | 2015-05-20 | 2015-05-20 | The production method in printed circuit board semi-metal hole |
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| Publication Number | Publication Date |
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| CN104936386A true CN104936386A (en) | 2015-09-23 |
| CN104936386B CN104936386B (en) | 2018-07-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510264030.8A Active CN104936386B (en) | 2015-05-20 | 2015-05-20 | The production method in printed circuit board semi-metal hole |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106696475A (en) * | 2015-11-13 | 2017-05-24 | 富泰华工业（深圳）有限公司 | 3D (Three-dimensional) printer and method for utilizing 3D printer for printing printed circuit board |
| CN111712041A (en) * | 2020-06-02 | 2020-09-25 | 昆山飞繁电子有限公司 | Circuit board half-hole machining process |
| CN112312664A (en) * | 2020-10-28 | 2021-02-02 | 惠州市特创电子科技有限公司 | Circuit board and manufacturing method thereof |
| CN112752437A (en) * | 2020-12-11 | 2021-05-04 | 深圳市景旺电子股份有限公司 | Forming method of metallized half hole and PCB (printed circuit board) |
| CN112969312A (en) * | 2021-01-27 | 2021-06-15 | 红板（江西）有限公司 | PCB metallized half-hole processing technology |
Citations (5)
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| JPH07183658A (en) * | 1993-12-22 | 1995-07-21 | Toppan Printing Co Ltd | Forming method for side through hole of printed circuit board |
| CN101977481A (en) * | 2010-10-29 | 2011-02-16 | 东莞红板多层线路板有限公司 | Method for removing semi-metalized hole flash by back drilling |
| CN102244979A (en) * | 2010-05-12 | 2011-11-16 | 柏承科技(昆山)股份有限公司 | Half-hole processing mirror image manufacturing method of printed circuit board |
| CN102970834A (en) * | 2011-09-02 | 2013-03-13 | 悦虎电路(苏州)有限公司 | Method for fabricating circuit board metallized half hole |
| CN103179805A (en) * | 2011-12-21 | 2013-06-26 | 珠海方正科技多层电路板有限公司 | Metal half hole molding method and manufacture method of printed circuit board |
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2015
- 2015-05-20 CN CN201510264030.8A patent/CN104936386B/en active Active
Patent Citations (5)
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| JPH07183658A (en) * | 1993-12-22 | 1995-07-21 | Toppan Printing Co Ltd | Forming method for side through hole of printed circuit board |
| CN102244979A (en) * | 2010-05-12 | 2011-11-16 | 柏承科技(昆山)股份有限公司 | Half-hole processing mirror image manufacturing method of printed circuit board |
| CN101977481A (en) * | 2010-10-29 | 2011-02-16 | 东莞红板多层线路板有限公司 | Method for removing semi-metalized hole flash by back drilling |
| CN102970834A (en) * | 2011-09-02 | 2013-03-13 | 悦虎电路(苏州)有限公司 | Method for fabricating circuit board metallized half hole |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106696475A (en) * | 2015-11-13 | 2017-05-24 | 富泰华工业（深圳）有限公司 | 3D (Three-dimensional) printer and method for utilizing 3D printer for printing printed circuit board |
| US10342139B2 (en) | 2015-11-13 | 2019-07-02 | Fu Tai Hua Industry (Shenzhen) Co., Ltd. | Printer and printing method for printing of printed circuit boards |
| CN111712041A (en) * | 2020-06-02 | 2020-09-25 | 昆山飞繁电子有限公司 | Circuit board half-hole machining process |
| CN112312664A (en) * | 2020-10-28 | 2021-02-02 | 惠州市特创电子科技有限公司 | Circuit board and manufacturing method thereof |
| CN112752437A (en) * | 2020-12-11 | 2021-05-04 | 深圳市景旺电子股份有限公司 | Forming method of metallized half hole and PCB (printed circuit board) |
| CN112752437B (en) * | 2020-12-11 | 2022-07-12 | 深圳市景旺电子股份有限公司 | Forming method of metallized semi-hole and PCB |
| CN112969312A (en) * | 2021-01-27 | 2021-06-15 | 红板（江西）有限公司 | PCB metallized half-hole processing technology |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104936386B (en) | 2018-07-10 |
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