CN201860514U - PCB (printed circuit board) with PTH (plated through hole) semicircular hole - Google Patents

PCB (printed circuit board) with PTH (plated through hole) semicircular hole Download PDF

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Publication number
CN201860514U
CN201860514U CN2010205731458U CN201020573145U CN201860514U CN 201860514 U CN201860514 U CN 201860514U CN 2010205731458 U CN2010205731458 U CN 2010205731458U CN 201020573145 U CN201020573145 U CN 201020573145U CN 201860514 U CN201860514 U CN 201860514U
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China
Prior art keywords
hole
pth
pcb board
npth
pcb
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Expired - Fee Related
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CN2010205731458U
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Chinese (zh)
Inventor
徐健
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SUZHOU COMBO CIRCUIT TECHNOLOGY CO., LTD.
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Chun Yan Electronic Technology (suzhou) Co Ltd
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Priority to CN2010205731458U priority Critical patent/CN201860514U/en
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  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The utility model discloses a PCB (printed circuit board) with a PTH (plated through hole) semicircular hole, which comprises a PTH semicircular hole (1), an NPTH (non-plated through hole) (3) is arranged at the joint of the PTH semicircular hole (1) and a PCB outline (4), due to the NPTH (3), a mill is not contacted with a metallization layer, the shearing force of the mill cuts off the joint directly, and the problems that a copper sheet dose not turn up, excessive flash is not remained and the like are solved.

Description

Pcb board with PTH half hole
Technical field
The pcb board of problems such as the utility model designs a kind of pcb board with PTH half hole, and the copper sheet perk appears in limit, hole, particularly a kind of PTH of preventing half hole in the course of processing, burr is residual.
Background technology
Printed circuit board (PCB) (pcb board) is on the insulation board of certain size, is processed into the figure of some conductions, and cloth porose (as element jointing holes, fastener hole, plated-through hole etc.), with its chassis, can realize components and parts interconnective wiring plate before.
Have PTH hole, NPTH hole and PTH half hole on the pcb board, it is respectively:
The PTH hole, Platting Through Hole refers to electroplating hole (also claiming insert hole);
The NPTH hole, Non-Platting Through Hole refers to the electroless coating hole;
PTH half hole also claims stamp-like to electroplate semicircle orifice (as shown in Figure 1), and semicircle orifice goes between like pin, can directly with scolder the metallized semi circular hole be welded on the surface pads of another printed circuit board, thereby realize being electrically connected.
Pcb board adds man-hour, when the gong cutter at gong in the intersection point of PTH half hole and pcb board object line, the gong cutter gong of for example working as dextrorotation is subjected to a shearing force left to the intersection point on right side.Ideal state down cut power is cut off right side intersection point place.But be ductile and toughness attached to the copper on the hole wall, the gong cutter can be residual owing to following reason generation burr when switching to the metal layer of hole wall based on copper:
1. the gong cutter causes the cutting force deficiency of gong cutter because rotating speed is not enough and wearing and tearing;
2. hole copper and hole wall adhesion deficiency, under the effect of shearing force, hole copper breaks away near the fracture;
3. after the ductility of hole copper, particularly surface treatment such as hot air leveling or turmeric, increase metal layer thickness and ductility and toughness again, caused cutting constantly.
Cause the copper sheet perk for above-mentioned reasons in the PTH half hole forming process, the problem that burr is residual is difficult problem in the pcb board spare machining always.
As shown in Figure 2, remain in copper wire in PTH half hole and burr in the welding process of downstream SMT producer, it is not firm to occur solder joint easily, rosin joint, problems such as bridge joint short circuit.
The problems referred to above affect the quality of pcb board, need address these problems.At present technology is being improved PTH half hole, pcb board limit, mainly be during from the processing profile with little gong light maintenance with use new cutter to process, concrete grammar is as follows:
Method one: secondary gong.
When the processing profile,, and then use little gong cutter to repair limit, hole copper wire earlier with the normal gong profile in Double Bass Gong cutter gong limit.
Method two: filling perforation method.
The filling perforation method is after having plated hole copper, and the hole of adopting the resin filling perforation will be made into PTH half hole is filled up, and during gong PTH half hole, has resin to support like this, do not have the copper wire burr yet and produce, and then the removing resin.
From processing effect, the methods and results of secondary gong is gratifying, but the method working (machining) efficiency is too low.Same gong groove will walk twice, and little gong cutter scanning frequency is very slow, and little gong cutter price is 5 times of common gong cutter, has only 1/3 useful life.
The filling perforation method process flow of method two is many, and complex process, and the resin cost is higher, is not suitable for large-scale production.
The utility model content
The pcb board of problems such as technical problem to be solved in the utility model provides limit, hole, a kind of PTH of preventing half hole and the copper sheet perk occurs in the course of processing, and burr is residual.
In order to solve above-mentioned technical problem, the technical solution of the utility model is: a kind of pcb board with PTH half hole, comprise PTH half hole, and be provided with the NPTH hole at the intersection point place of described PTH half hole and pcb board object line.
Described NPTH hole is positioned at an intersection point place of PTH half hole and pcb board object line.The gong cutter of processing PCB plate is when anticlockwise, and described NPTH hole is positioned at the intersection point place, left side of PTH half hole and pcb board object line; The gong cutter of processing PCB plate is when right rotation, and described NPTH hole is positioned at the intersection point place, right side of PTH half hole and pcb board object line.
Described NPTH cuts in the hole into pcb board object line 2~4mil.
Pcb board adds man-hour, when the gong cutter at gong in the intersection point of PTH half hole and pcb board object line, problem such as because the existence in NPTH hole, the gong cutter does not reach metal layer, and directly with the cut-out of intersection point place, can there be the copper sheet perk in the shearing force of gong cutter, and burr is residual.
The utility model structure has effectively solved the copper wire burr that produces when the gong profile of edges of boards PTH hole, production efficiency height and cost are more superior than other scheme.It is not firm to avoid solder joint occurring in the welding process of downstream SMT producer, rosin joint, defectives such as bridge joint short circuit.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.
Fig. 1 is the structural representation with the pcb board in PTH half hole.
Fig. 2 is PTH half hole copper wire burr design sketch behind the gong limit.
Fig. 3 is a structural representation of the present utility model.
Fig. 4 is PTH half hole and the NPTH half hole structural representation on pcb board.
Embodiment
As shown in Figure 3, a kind of pcb board with PTH half hole comprises PTH half hole 1, is provided with NPTH hole 3 at the intersection point place of described PTH half hole 1 and pcb board object line 4.
As shown in Figure 4, intersection point is respectively A, B 2 points.
Described NPTH hole 3 is positioned at an intersection point place of PTH half hole 1 and pcb board object line 4.The gong cutter of processing PCB plate is when anticlockwise, and described NPTH hole 3 is positioned at the intersection point place, left side of PTH half hole 1 and pcb board object line 4.The gong cutter of processing PCB plate is when right rotation, and described NPTH hole 3 is positioned at the intersection point place, right side of PTH half hole 1 and pcb board object line 4.
With shown in Figure 4, PTH half hole 1 is provided with NPTH hole 3 with the B intersection point place of pcb board object line 4, the existence in NPTH hole 3, problem such as the gong cutter does not reach metal layer, and the shearing force of gong cutter is directly cut off the intersection point place, can not have the copper sheet perk, and burr is residual.
The copper sheet perk, burr is residual etc., and problem can not appear on two intersection points basically simultaneously.When the direction of rotation of gong cutter for to the right the time, with shown in Figure 4, if the B intersection point place of PTH half hole 1 and pcb board object line 4 is not provided with NPTH hole 3, burr only can not produce at the A point at the B point.This is because the gong cutter when cutting to the section that A orders, cuts to the hole wall metal layer that A is ordered earlier.The hole wall metal layer that A point metal layer is ordered with B is the same, and meeting is owing to the ductility generation deformation of metal, but A point section is leaning against substrate layer, has prevented the extension of metal level and the disengaging of metal level and hole wall effectively.As long as the gong cutter does not have heavy wear, cutting force is enough, and the section behind the A point gong can be very level and smooth, does not have burr to produce.
From principle analysis, we are easy to expect, earlier the copper wire gong at B point place is broken still with original gong plate direction as long as we are earlier inverted with plate, by normal condition gong plate, just can prevent the generation of burr again.But this kind method only is applicable to the single metal hole on object line, and the bigger situation in aperture.
The foregoing description limits the utility model never in any form, and every employing is equal to replaces or technical scheme that the mode of equivalent transformation obtains all drops in the protection range of the present utility model.

Claims (3)

1. the pcb board with PTH half hole comprises PTH half hole (1), it is characterized in that: the intersection point place at described PTH half hole (1) and pcb board object line (4) is provided with NPTH hole (3).
2. the pcb board with PTH half hole according to claim 1 is characterized in that: described NPTH hole (3) is positioned at an intersection point place of PTH half hole (1) and pcb board object line (4); The gong cutter of processing PCB plate is when anticlockwise, and described NPTH hole is positioned at the intersection point place, left side of PTH half hole (1) and pcb board object line (4); The gong cutter of processing PCB plate is when right rotation, and described NPTH hole (3) is positioned at the intersection point place, right side of PTH half hole (1) and pcb board object line (4).
3. the pcb board with PTH half hole according to claim 1 and 2 is characterized in that: cut into pcb board object line (4) 2~4mil in described NPTH hole (3).
CN2010205731458U 2010-10-22 2010-10-22 PCB (printed circuit board) with PTH (plated through hole) semicircular hole Expired - Fee Related CN201860514U (en)

Priority Applications (1)

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CN2010205731458U CN201860514U (en) 2010-10-22 2010-10-22 PCB (printed circuit board) with PTH (plated through hole) semicircular hole

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Application Number Priority Date Filing Date Title
CN2010205731458U CN201860514U (en) 2010-10-22 2010-10-22 PCB (printed circuit board) with PTH (plated through hole) semicircular hole

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CN201860514U true CN201860514U (en) 2011-06-08

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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102438411A (en) * 2011-09-30 2012-05-02 景旺电子(深圳)有限公司 Manufacturing method of metallized semi-hole
CN103179791A (en) * 2011-12-21 2013-06-26 北大方正集团有限公司 Metal half-hole forming method and printed circuit board manufacture method
CN103170664A (en) * 2011-12-23 2013-06-26 深南电路有限公司 Depth-control groove milling method and milling machine
CN104470213A (en) * 2014-10-16 2015-03-25 胜宏科技(惠州)股份有限公司 Half-copper-plated clamping groove manufacturing method
CN104582276A (en) * 2013-10-18 2015-04-29 北大方正集团有限公司 Method for manufacturing printed circuit board (PCB)
CN104717847A (en) * 2015-03-17 2015-06-17 深圳崇达多层线路板有限公司 Manufacturing method of metallized half hole in PCB
CN104735910A (en) * 2013-12-24 2015-06-24 深南电路有限公司 Circuit board manufacturing method and circuit board
CN104853544A (en) * 2015-06-03 2015-08-19 洛阳伟信电子科技有限公司 Method for making metalized half hole
CN105282975A (en) * 2014-05-28 2016-01-27 深圳崇达多层线路板有限公司 Threaded hole processing method for PCB (printed circuit board)
CN106270799A (en) * 2016-08-30 2017-01-04 江西景旺精密电路有限公司 A kind of prevent pcb board gong from breaking method that metal edges or metallic channel produce burr
CN107278027A (en) * 2017-07-12 2017-10-20 武汉华星光电技术有限公司 Circuit board and mobile terminal
CN109041432A (en) * 2018-09-07 2018-12-18 江门市奔力达电路有限公司 A kind of method and method for manufacturing circuit board improving wiring board gong plate burr
CN109152241A (en) * 2018-09-07 2019-01-04 江门市奔力达电路有限公司 A method of making edges of boards metal half bore
CN111432559A (en) * 2020-03-20 2020-07-17 江苏苏杭电子有限公司 Method for processing semicircular copper sinking hole
CN112040653A (en) * 2020-08-31 2020-12-04 欣强电子(清远)有限公司 PCB forming burr hole removing processing method
WO2020258446A1 (en) * 2019-06-26 2020-12-30 昆山首源电子科技有限公司 Circuit board punching structure capable of preventing copper sheet from warping
CN112512219A (en) * 2020-11-25 2021-03-16 益阳市明正宏电子有限公司 Copper-containing half groove machining method for PCB

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102438411A (en) * 2011-09-30 2012-05-02 景旺电子(深圳)有限公司 Manufacturing method of metallized semi-hole
CN102438411B (en) * 2011-09-30 2014-04-16 深圳市景旺电子股份有限公司 Manufacturing method of metallized semi-hole
CN103179791A (en) * 2011-12-21 2013-06-26 北大方正集团有限公司 Metal half-hole forming method and printed circuit board manufacture method
CN103170664A (en) * 2011-12-23 2013-06-26 深南电路有限公司 Depth-control groove milling method and milling machine
CN103170664B (en) * 2011-12-23 2016-03-30 深南电路有限公司 A kind of dark groove milling method of control and milling machine
CN104582276A (en) * 2013-10-18 2015-04-29 北大方正集团有限公司 Method for manufacturing printed circuit board (PCB)
CN104582276B (en) * 2013-10-18 2017-08-29 北大方正集团有限公司 A kind of processing method of printing board PCB
CN104735910A (en) * 2013-12-24 2015-06-24 深南电路有限公司 Circuit board manufacturing method and circuit board
CN104735910B (en) * 2013-12-24 2017-12-29 深南电路有限公司 The preparation method and circuit board of a kind of circuit board
CN105282975B (en) * 2014-05-28 2018-05-11 深圳崇达多层线路板有限公司 A kind of hole processing method for pcb board
CN105282975A (en) * 2014-05-28 2016-01-27 深圳崇达多层线路板有限公司 Threaded hole processing method for PCB (printed circuit board)
CN104470213A (en) * 2014-10-16 2015-03-25 胜宏科技(惠州)股份有限公司 Half-copper-plated clamping groove manufacturing method
CN104470213B (en) * 2014-10-16 2017-12-08 胜宏科技(惠州)股份有限公司 A kind of preparation method of half copper facing neck
CN104717847A (en) * 2015-03-17 2015-06-17 深圳崇达多层线路板有限公司 Manufacturing method of metallized half hole in PCB
CN104853544B (en) * 2015-06-03 2018-01-05 洛阳伟信电子科技有限公司 A kind of preparation method of metallized semi-pore
CN104853544A (en) * 2015-06-03 2015-08-19 洛阳伟信电子科技有限公司 Method for making metalized half hole
CN106270799A (en) * 2016-08-30 2017-01-04 江西景旺精密电路有限公司 A kind of prevent pcb board gong from breaking method that metal edges or metallic channel produce burr
CN107278027A (en) * 2017-07-12 2017-10-20 武汉华星光电技术有限公司 Circuit board and mobile terminal
CN109041432A (en) * 2018-09-07 2018-12-18 江门市奔力达电路有限公司 A kind of method and method for manufacturing circuit board improving wiring board gong plate burr
CN109152241A (en) * 2018-09-07 2019-01-04 江门市奔力达电路有限公司 A method of making edges of boards metal half bore
WO2020258446A1 (en) * 2019-06-26 2020-12-30 昆山首源电子科技有限公司 Circuit board punching structure capable of preventing copper sheet from warping
CN111432559A (en) * 2020-03-20 2020-07-17 江苏苏杭电子有限公司 Method for processing semicircular copper sinking hole
CN112040653A (en) * 2020-08-31 2020-12-04 欣强电子(清远)有限公司 PCB forming burr hole removing processing method
CN112512219A (en) * 2020-11-25 2021-03-16 益阳市明正宏电子有限公司 Copper-containing half groove machining method for PCB

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SUZHOU KANGBO CIRCUIT TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: CHUNYAN ELECTRONIC TECHNOLOGY (SUZHOU) CO., LTD.

Effective date: 20150520

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20150520

Address after: 215533 No. 72 Huangpu Road, Changshu hi tech Industrial Development Zone, Jiangsu, Changshou City, China

Patentee after: SUZHOU COMBO CIRCUIT TECHNOLOGY CO., LTD.

Address before: 215533, Huangpu Road, Changshou City Southeast Economic Development Zone, Jiangsu, Suzhou 72, China

Patentee before: Chun Yan Electronic Technology (Suzhou) Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110608

Termination date: 20151022

EXPY Termination of patent right or utility model