CN201860514U - PCB (printed circuit board) with PTH (plated through hole) semicircular hole - Google Patents
PCB (printed circuit board) with PTH (plated through hole) semicircular hole Download PDFInfo
- Publication number
- CN201860514U CN201860514U CN2010205731458U CN201020573145U CN201860514U CN 201860514 U CN201860514 U CN 201860514U CN 2010205731458 U CN2010205731458 U CN 2010205731458U CN 201020573145 U CN201020573145 U CN 201020573145U CN 201860514 U CN201860514 U CN 201860514U
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- hole
- pth
- pcb board
- npth
- pcb
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- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010205731458U CN201860514U (en) | 2010-10-22 | 2010-10-22 | PCB (printed circuit board) with PTH (plated through hole) semicircular hole |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010205731458U CN201860514U (en) | 2010-10-22 | 2010-10-22 | PCB (printed circuit board) with PTH (plated through hole) semicircular hole |
Publications (1)
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CN201860514U true CN201860514U (en) | 2011-06-08 |
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CN2010205731458U Expired - Fee Related CN201860514U (en) | 2010-10-22 | 2010-10-22 | PCB (printed circuit board) with PTH (plated through hole) semicircular hole |
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CN (1) | CN201860514U (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102438411A (en) * | 2011-09-30 | 2012-05-02 | 景旺电子(深圳)有限公司 | Manufacturing method of metallized semi-hole |
CN103179791A (en) * | 2011-12-21 | 2013-06-26 | 北大方正集团有限公司 | Metal half-hole forming method and printed circuit board manufacture method |
CN103170664A (en) * | 2011-12-23 | 2013-06-26 | 深南电路有限公司 | Depth-control groove milling method and milling machine |
CN104470213A (en) * | 2014-10-16 | 2015-03-25 | 胜宏科技(惠州)股份有限公司 | Half-copper-plated clamping groove manufacturing method |
CN104582276A (en) * | 2013-10-18 | 2015-04-29 | 北大方正集团有限公司 | Method for manufacturing printed circuit board (PCB) |
CN104717847A (en) * | 2015-03-17 | 2015-06-17 | 深圳崇达多层线路板有限公司 | Manufacturing method of metallized half hole in PCB |
CN104735910A (en) * | 2013-12-24 | 2015-06-24 | 深南电路有限公司 | Circuit board manufacturing method and circuit board |
CN104853544A (en) * | 2015-06-03 | 2015-08-19 | 洛阳伟信电子科技有限公司 | Method for making metalized half hole |
CN105282975A (en) * | 2014-05-28 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Threaded hole processing method for PCB (printed circuit board) |
CN106270799A (en) * | 2016-08-30 | 2017-01-04 | 江西景旺精密电路有限公司 | A kind of prevent pcb board gong from breaking method that metal edges or metallic channel produce burr |
CN107278027A (en) * | 2017-07-12 | 2017-10-20 | 武汉华星光电技术有限公司 | Circuit board and mobile terminal |
CN109041432A (en) * | 2018-09-07 | 2018-12-18 | 江门市奔力达电路有限公司 | A kind of method and method for manufacturing circuit board improving wiring board gong plate burr |
CN109152241A (en) * | 2018-09-07 | 2019-01-04 | 江门市奔力达电路有限公司 | A method of making edges of boards metal half bore |
CN111432559A (en) * | 2020-03-20 | 2020-07-17 | 江苏苏杭电子有限公司 | Method for processing semicircular copper sinking hole |
CN112040653A (en) * | 2020-08-31 | 2020-12-04 | 欣强电子(清远)有限公司 | PCB forming burr hole removing processing method |
WO2020258446A1 (en) * | 2019-06-26 | 2020-12-30 | 昆山首源电子科技有限公司 | Circuit board punching structure capable of preventing copper sheet from warping |
CN112512219A (en) * | 2020-11-25 | 2021-03-16 | 益阳市明正宏电子有限公司 | Copper-containing half groove machining method for PCB |
-
2010
- 2010-10-22 CN CN2010205731458U patent/CN201860514U/en not_active Expired - Fee Related
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102438411A (en) * | 2011-09-30 | 2012-05-02 | 景旺电子(深圳)有限公司 | Manufacturing method of metallized semi-hole |
CN102438411B (en) * | 2011-09-30 | 2014-04-16 | 深圳市景旺电子股份有限公司 | Manufacturing method of metallized semi-hole |
CN103179791A (en) * | 2011-12-21 | 2013-06-26 | 北大方正集团有限公司 | Metal half-hole forming method and printed circuit board manufacture method |
CN103170664A (en) * | 2011-12-23 | 2013-06-26 | 深南电路有限公司 | Depth-control groove milling method and milling machine |
CN103170664B (en) * | 2011-12-23 | 2016-03-30 | 深南电路有限公司 | A kind of dark groove milling method of control and milling machine |
CN104582276A (en) * | 2013-10-18 | 2015-04-29 | 北大方正集团有限公司 | Method for manufacturing printed circuit board (PCB) |
CN104582276B (en) * | 2013-10-18 | 2017-08-29 | 北大方正集团有限公司 | A kind of processing method of printing board PCB |
CN104735910A (en) * | 2013-12-24 | 2015-06-24 | 深南电路有限公司 | Circuit board manufacturing method and circuit board |
CN104735910B (en) * | 2013-12-24 | 2017-12-29 | 深南电路有限公司 | The preparation method and circuit board of a kind of circuit board |
CN105282975B (en) * | 2014-05-28 | 2018-05-11 | 深圳崇达多层线路板有限公司 | A kind of hole processing method for pcb board |
CN105282975A (en) * | 2014-05-28 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Threaded hole processing method for PCB (printed circuit board) |
CN104470213A (en) * | 2014-10-16 | 2015-03-25 | 胜宏科技(惠州)股份有限公司 | Half-copper-plated clamping groove manufacturing method |
CN104470213B (en) * | 2014-10-16 | 2017-12-08 | 胜宏科技(惠州)股份有限公司 | A kind of preparation method of half copper facing neck |
CN104717847A (en) * | 2015-03-17 | 2015-06-17 | 深圳崇达多层线路板有限公司 | Manufacturing method of metallized half hole in PCB |
CN104853544B (en) * | 2015-06-03 | 2018-01-05 | 洛阳伟信电子科技有限公司 | A kind of preparation method of metallized semi-pore |
CN104853544A (en) * | 2015-06-03 | 2015-08-19 | 洛阳伟信电子科技有限公司 | Method for making metalized half hole |
CN106270799A (en) * | 2016-08-30 | 2017-01-04 | 江西景旺精密电路有限公司 | A kind of prevent pcb board gong from breaking method that metal edges or metallic channel produce burr |
CN107278027A (en) * | 2017-07-12 | 2017-10-20 | 武汉华星光电技术有限公司 | Circuit board and mobile terminal |
CN109041432A (en) * | 2018-09-07 | 2018-12-18 | 江门市奔力达电路有限公司 | A kind of method and method for manufacturing circuit board improving wiring board gong plate burr |
CN109152241A (en) * | 2018-09-07 | 2019-01-04 | 江门市奔力达电路有限公司 | A method of making edges of boards metal half bore |
WO2020258446A1 (en) * | 2019-06-26 | 2020-12-30 | 昆山首源电子科技有限公司 | Circuit board punching structure capable of preventing copper sheet from warping |
CN111432559A (en) * | 2020-03-20 | 2020-07-17 | 江苏苏杭电子有限公司 | Method for processing semicircular copper sinking hole |
CN112040653A (en) * | 2020-08-31 | 2020-12-04 | 欣强电子(清远)有限公司 | PCB forming burr hole removing processing method |
CN112512219A (en) * | 2020-11-25 | 2021-03-16 | 益阳市明正宏电子有限公司 | Copper-containing half groove machining method for PCB |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SUZHOU KANGBO CIRCUIT TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CHUNYAN ELECTRONIC TECHNOLOGY (SUZHOU) CO., LTD. Effective date: 20150520 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150520 Address after: 215533 No. 72 Huangpu Road, Changshu hi tech Industrial Development Zone, Jiangsu, Changshou City, China Patentee after: SUZHOU COMBO CIRCUIT TECHNOLOGY CO., LTD. Address before: 215533, Huangpu Road, Changshou City Southeast Economic Development Zone, Jiangsu, Suzhou 72, China Patentee before: Chun Yan Electronic Technology (Suzhou) Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110608 Termination date: 20151022 |
|
EXPY | Termination of patent right or utility model |