CN104735910A - Circuit board manufacturing method and circuit board - Google Patents
Circuit board manufacturing method and circuit board Download PDFInfo
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- CN104735910A CN104735910A CN201310723003.3A CN201310723003A CN104735910A CN 104735910 A CN104735910 A CN 104735910A CN 201310723003 A CN201310723003 A CN 201310723003A CN 104735910 A CN104735910 A CN 104735910A
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- circuit board
- metal paste
- groove
- circuit substrate
- limit
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Abstract
The invention discloses a circuit board manufacturing method and a circuit board to overcome the defects that since an existing circuit board side face metallization process is adopted, burrs can be easily formed on the side face of a circuit board due to cutting, and the process can not be applied to circuit boards with resin plug holes. The method comprises the steps that side grooves are machined in a circuit substrate, wherein the circuit substrate comprises a circuit board unit, and the side grooves are located on boundary lines of the circuit board unit; the side grooves are filled with metal slurry, and the metal slurry is cured to form metal slurry solid blocks; the circuit substrate and the metal slurry solid blocks are cut along the boundary lines, and then the circuit board unit is obtained, wherein the metal slurry solid blocks are partially embedded in the side face of the circuit board unit.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of manufacture method and circuit board of circuit board.
Background technology
At present, occurred a kind of circuit board with side metal structure, diversified welding manner supported by this kind of circuit board, be applicable to encapsulate there is more pins electronic component as chip etc.
The manufacture method of this kind of circuit board is: first drill flute, then heavy copper, and plating thickeies, do graphic plating, the inwall of groove is metallized, will to metallize groove mill off half finally by milling profile technique, thus form sidewall metallization groove, the obtained circuit board with side metal structure.
Practice finds, said method has following defect:
1, when milling profile, because milling cutter is from metallization groove process, the metallization inwall of groove (hole copper) drawknot can be caused to become silk, form burr and remain on metallization groove, affect reliability and outward appearance.
If 2 circuit boards also have filling holes with resin structure, then said method is in the processing step of graphic plating and etching, there is the risk removed by etching in the inner wall hole copper of filling holes with resin, therefore said method can not be applied to the circuit board with filling holes with resin structure.
Summary of the invention
The embodiment of the present invention provides a kind of manufacture method and circuit board of circuit board, there is above-mentioned defect to solve existing circuit board side metallization process.
First aspect present invention provides a kind of manufacture method of circuit board, comprising:
Circuit substrate is processed limit groove, and described circuit substrate comprises circuit board unit, and slot, described limit is on the boundary line of described circuit board unit; In the groove of described limit, fill metal paste and solidify, forming metal paste solid block; Along described boundary line, described circuit substrate and described metal paste solid block are cut, the circuit board unit that side is inlaid with part metals slurry solids block must be arrived.
Second aspect present invention provides a kind of circuit board, and described circuit board has the limit groove being positioned at side, is inlaid with metal paste solid block in the groove of described limit, the part of surface as the side of described circuit board being revealed in described limit groove of described metal paste solid block.
Therefore, in the embodiment of the present invention, circuit substrate is processed limit groove, in the groove of limit, fill metal paste and solidify to form metal paste solid block, then carry out cutting circuit substrate and metal paste solid block, the circuit board unit that side is inlaid with part metals slurry solids block must be arrived, there is following technique effect:
Due to the mixture that metal paste solid block is metal dust or particle and electroconductive resin, instead of simple metal, therefore, when metal paste solid block is cut, can not burr be formed;
Due to metallization groove need not be made, thus do not walk graphic plating technique, be applicable to any product structure, such as, there is the circuit board of filling holes with resin structure;
The embodiment of the present invention is embedded in the metal paste solid block in circuit board sidewall, has better heat dispersion than existing metalized sidewall.
Accompanying drawing explanation
In order to be illustrated more clearly in embodiment of the present invention technical scheme, be briefly described to the accompanying drawing used required in embodiment and description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the flow chart of the manufacture method of a kind of circuit board that the embodiment of the present invention provides;
Fig. 2 a is the schematic diagram processing limit groove on circuit substrate;
Fig. 2 b is the schematic diagram of a pasting protective film at circuit substrate;
Fig. 2 c is the schematic diagram of filling metal paste in the groove of limit;
Fig. 2 d is the schematic diagram of circuit substrate after removal diaphragm;
Fig. 2 e is the schematic diagram forming outer-layer circuit on circuit substrate;
Fig. 2 f and 2g is vertical view and the end view of circuit board unit respectively.
Embodiment
The embodiment of the present invention provides a kind of manufacture method of circuit board, there is above-mentioned number of drawbacks to solve existing circuit board side metallization process.The embodiment of the present invention also provides corresponding circuit board.
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Below by specific embodiment, be described in detail respectively.
Embodiment one,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of manufacture method of circuit board, can comprise:
110, on circuit substrate, process limit groove, described circuit substrate comprises circuit board unit, and slot, described limit is on the boundary line of described circuit board unit.
In the embodiment of the present invention, said circuit substrate can be single-side coated copper plate or double face copper or the multi-layer sheet based on copper-clad plate lamination.The present embodiment take circuit substrate as multi-layer sheet is example, and this multilager base plate can comprise one or more internal layer circuit layer, and is positioned at two coating metal layers on multilager base plate two sides.Said circuit substrate can comprise more than one circuit board unit, and each circuit board unit can be cut out after following process becomes independently circuit board.
The operation of this step processing limit groove can perform in drilling operating after lamination.
As shown in Figure 2 a, this step processes limit groove 201 on circuit substrate 200.Wherein, circuit substrate 200 comprises at least one circuit board unit 210, and limit groove 201 is positioned on the boundary line 202 of circuit board unit 210.As can be seen from the figure, a part for limit groove 201 is positioned at circuit board unit 210 region, and another part of limit groove 201 is positioned at beyond circuit board unit 210 region.In the present embodiment, limit groove 201 is the grooves running through described circuit substrate 200.
General, in drilling operating, except processing limit groove 201, the blind hole required for other or through hole can also be processed simultaneously.Wherein, control dark milling processes limit groove 201 can be adopted, power auger processes blind hole or through hole can be adopted.
120, in the groove of described limit, fill metal paste and solidify, forming metal paste solid block.
The present embodiment, by filling metal paste in the groove of limit, replaces limit of the prior art groove metallization.The metal paste filled refers to puts into small metallic particles or powder the mixture formed in the carriers such as liquid electroconductive resin, can also include adhesive or diluent etc. to improve its performance such as adhesiveness or mobility in this mixture.Concrete, described metallic particles or powder can copper or copper alloy materials, so described liquid metal can be the liquid conductive substance of copper slurry or similar copper slurry and so on, and preferably its electric conductivity meets more than 80% of the electric conductivity of copper.
This step in the groove of limit, fill metal paste and the operation of solidification specifically can comprise:
1201, as shown in Figure 2 b, at a pasting protective film 203 of described circuit substrate 200; Described diaphragm 203 can be specifically high temperature without sulphur paper or other exotic material, for the one end open of limit groove 201 is blocked.
1202, as shown in Figure 2 c, silk-screen printing technique can be adopted to described limit groove 201, to fill metal paste 204 from the another side (opening of limit groove 201 on this surface be not by shutoff) of described circuit substrate 200.
1203, adopt progressively elevated cure technique that described metal paste 204 is solidified, form metal paste solid block (still using label 204 coding metal slurry solids block herein).Progressively elevated cure technique can by the bubble in metal paste or the expeling such as the adhesive that may exist or diluent.In a kind of execution mode, described progressively elevated cure technique refers to that according to the mode of 20 DEG C of heating up per half an hour, temperature being warmed up to 150 DEG C from 70 DEG C toasts, and makes the liquid electroconductive resin in metal paste solidify completely.
1204, as shown in Figure 2 d, described diaphragm 203 is removed.In embody rule, directly manual mode can tear high temperature without sulphur paper, then, can also carry out evening operation out, so as more than weeding residual without sulphur paper and unnecessary metal paste, ensure circuit board surface smooth.
So far, in the limit groove 201 of circuit substrate 200, metal paste solid block 204 is formed.Then, as shown in Figure 2 e, common process can also be adopted to make outer-layer circuit 205 on the surface of circuit substrate 200.
130, along described boundary line, described circuit substrate and described metal paste solid block are cut, the circuit board unit that side is inlaid with part metals slurry solids block must be arrived.
To circuit substrate milling profile in this step, by cutting, each circuit board unit is separated, becomes independently circuit board.During cutting, need cut along the boundary line of circuit board unit.As can be seen from Fig. 2 a, can find out, because limit groove 201 is positioned on the boundary line 202 of circuit board unit 210, then when cutting, limit groove 201 can be cut from centre, and the metal paste solid block 204 be formed in limit groove 201 is cut from centre.The circuit board unit 210 obtained after cutting is as shown in Fig. 2 f and 2g, visible, the sidewall 206 of part inlay at circuit board unit 210 being arranged in circuit board unit 210 region of metal paste solid block 204, the cut surface of this part metals slurry solids block 204 becomes a part for the sidewall 206 of circuit board unit 210.So the circuit board unit 210 cut down becomes the required circuit board with side metal structure.
To sum up, the embodiment of the invention discloses a kind of manufacture method of circuit board, the method embodiment processes limit groove on circuit substrate, in the groove of limit, fill metal paste and solidify to form metal paste solid block, then carry out cutting circuit substrate and metal paste solid block, the circuit board unit that side is inlaid with part metals slurry solids block must be arrived, there is following technique effect:
On the one hand, because metal paste solid block is the mixture of metal dust or particle and electroconductive resin, instead of simple metal, therefore, when metal paste solid block is cut, can not burr be formed, thus, can not outward appearance be affected, can not reliability be reduced;
On the other hand, owing to need not make metallization groove, thus do not need to walk graphic plating technique, therefore, the present embodiment method is applicable to any product structure, such as, have the circuit board of filling holes with resin structure;
Again on the one hand, the embodiment of the present invention is embedded in the metal paste solid block in circuit board sidewall, has better heat dispersion than existing metalized sidewall.
Embodiment two,
Please refer to figure Fig. 2 f and 2g, the embodiment of the present invention provides a kind of circuit board.This circuit board can adopt method disclosed in embodiment one to obtain.Described circuit board 210 has the limit groove 201 being positioned at side, is inlaid with metal paste solid block 204 in described limit groove 201, and the surface being revealed in described limit groove 201 of described metal paste solid block 204 is as a part for the sidewall 206 of described circuit board 210.
Optionally, described circuit board is double-sided wiring board or multilayer circuit board.
Above, be illustrated the circuit board of the embodiment of the present invention, more detailed description please refer to the record in embodiment one.
To sum up, the embodiment of the invention discloses a kind of circuit board, the sidewall of this circuit board is inlaid with metal paste solid block, and to form side metal structure, this circuit board has following technique effect:
On the one hand, due to the mixture that metal paste solid block is metal dust or particle and electroconductive resin, instead of simple metal, therefore, when metal paste solid block is cut, can not burr be formed, thus, circuit board of the present invention is relative to the circuit board of sidewall metallization, and manufacture method is more simple and reliable;
On the other hand, the embodiment of the present invention is embedded in the metal paste solid block in circuit board sidewall, has better heat dispersion than existing metalized sidewall.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiment.
It should be noted that, for aforesaid each embodiment of the method, in order to simple description, therefore it is all expressed as a series of combination of actions, but those skilled in the art should know, the present invention is not by the restriction of described sequence of movement, because according to the present invention, some step can adopt other order or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification all belongs to preferred embodiment, and involved action and module might not be that the present invention is necessary.
Above circuit board that the embodiment of the present invention provides and preparation method thereof is described in detail, but the explanation of above embodiment just understands method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.Those skilled in the art, according to thought of the present invention, in the technical scope that the present invention discloses, the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (8)
1. a manufacture method for circuit board, is characterized in that, comprising:
Circuit substrate is processed limit groove, and described circuit substrate comprises circuit board unit, and slot, described limit is on the boundary line of described circuit board unit;
In the groove of described limit, fill metal paste and solidify, forming metal paste solid block;
Along described boundary line, described circuit substrate and described metal paste solid block are cut, the circuit board unit that side is inlaid with part metals slurry solids block must be arrived.
2. method according to claim 1, is characterized in that, also comprises before described boundary line is cut described circuit substrate and described metal paste solid block:
Described circuit substrate makes outer-layer circuit figure.
3. method according to claim 1, is characterized in that,
Described circuit substrate is copper-clad plate or the multi-layer sheet based on copper-clad plate lamination.
4. method according to claim 1, is characterized in that,
Described limit groove is the groove running through described circuit substrate.
5. method according to claim 1, is characterized in that, fills metal paste and solidify to comprise in the groove of described limit:
At a pasting protective film of described circuit substrate;
Silk-screen printing technique is adopted to the groove of described limit, to fill metal paste from the another side of described circuit substrate;
Adopt progressively elevated cure technique that described metal paste is solidified;
Remove described diaphragm.
6. method according to claim 1, is characterized in that,
Described diaphragm is that high temperature is without sulphur paper.
7. a circuit board, is characterized in that, described circuit board has the limit groove being positioned at side, is inlaid with metal paste solid block in the groove of described limit, the part of surface as the side of described circuit board being revealed in described limit groove of described metal paste solid block.
8. circuit board according to claim 7, is characterized in that,
Described circuit board is double-sided wiring board or multilayer circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310723003.3A CN104735910B (en) | 2013-12-24 | 2013-12-24 | The preparation method and circuit board of a kind of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310723003.3A CN104735910B (en) | 2013-12-24 | 2013-12-24 | The preparation method and circuit board of a kind of circuit board |
Publications (2)
| Publication Number | Publication Date |
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| CN104735910A true CN104735910A (en) | 2015-06-24 |
| CN104735910B CN104735910B (en) | 2017-12-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310723003.3A Active CN104735910B (en) | 2013-12-24 | 2013-12-24 | The preparation method and circuit board of a kind of circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109118960A (en) * | 2018-05-30 | 2019-01-01 | 友达光电股份有限公司 | Display device and method for manufacturing the same |
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| JP2000349411A (en) * | 1999-06-07 | 2000-12-15 | Hodogaya Seisakusho:Kk | Method for forming split slit and press die therefor |
| JP2001168525A (en) * | 1999-12-14 | 2001-06-22 | Fuji Kiko Denshi Kk | Manufacturing method of printed wiring board with end- surface through hole |
| CN1305338A (en) * | 1999-10-25 | 2001-07-25 | 株式会社村田制作所 | Module substrate and its manufacturing method |
| CN1338890A (en) * | 2000-07-28 | 2002-03-06 | 松下电器产业株式会社 | Electronic elements and manufacture thereof |
| CN101626662A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process for removing flash of half PTH hole by dry film etching method |
| CN201860514U (en) * | 2010-10-22 | 2011-06-08 | 春焱电子科技（苏州）有限公司 | PCB (printed circuit board) with PTH (plated through hole) semicircular hole |
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Patent Citations (6)
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|---|---|---|---|---|
| JP2000349411A (en) * | 1999-06-07 | 2000-12-15 | Hodogaya Seisakusho:Kk | Method for forming split slit and press die therefor |
| CN1305338A (en) * | 1999-10-25 | 2001-07-25 | 株式会社村田制作所 | Module substrate and its manufacturing method |
| JP2001168525A (en) * | 1999-12-14 | 2001-06-22 | Fuji Kiko Denshi Kk | Manufacturing method of printed wiring board with end- surface through hole |
| CN1338890A (en) * | 2000-07-28 | 2002-03-06 | 松下电器产业株式会社 | Electronic elements and manufacture thereof |
| CN101626662A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process for removing flash of half PTH hole by dry film etching method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109118960A (en) * | 2018-05-30 | 2019-01-01 | 友达光电股份有限公司 | Display device and method for manufacturing the same |
| CN109118960B (en) * | 2018-05-30 | 2021-07-30 | 友达光电股份有限公司 | Display device and method for manufacturing the same |
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| Publication number | Publication date |
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| CN104735910B (en) | 2017-12-29 |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |