CN102638947B - Production technology of silver paste over-line printed circuit board - Google Patents
Production technology of silver paste over-line printed circuit board Download PDFInfo
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- CN102638947B CN102638947B CN201210120728.9A CN201210120728A CN102638947B CN 102638947 B CN102638947 B CN 102638947B CN 201210120728 A CN201210120728 A CN 201210120728A CN 102638947 B CN102638947 B CN 102638947B
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Abstract
The invention relates to a production technology of a silver paste over-line printed circuit board. The technology comprises the steps of: cutting, edging, NC (numerical control) drilling, deburring, printing pretreatment, and printing of reverse-side solder mask ink; UV (ultraviolet) curing, and printing of graphics ink; UV curing and etching; ink removing, solder mask printing pretreatment and printing of front-side solder mask ink; UV curing and printing of front-side text; UV curing and printing of reverse-side text; UV curing, printing pretreatment and printing of insulating layer 1 ink; UV curing and printing of insulating layer 2 ink; UV curing, silver paste over-line printing pretreatment and printing of silver paste over-line, silver paste hot-wind curing, printing pretreatment, and printing of silver paste protection layer 1 ink; UV curing and printing of silver paste protection layer 2 ink; and hot-wind curing, lead hot-wind leveling, punching, on/off detection, low-resistance detection, finished product inspection, and packaging and shipment.
Description
Technical field:
The present invention relates to a kind of silver slurry cross-line production process of printed circuit board.
Background technology
Traditional plated-through hole double sided board is by double face copper, by boring and chemical become the production technology of copper, electro-coppering the copper wire of substrate not coplanar is connected into a loop, it needs by double face copper, and toxic waste liquid and contaminated environment can be produced at chemistry and plating production process, production cost comparatively high yield in addition, production cycle is longer, and production efficiency is lower.
Summary of the invention
In order to overcome above-mentioned defect, the object of this invention is to provide a kind of silver slurry cross-line production process of printed circuit board, adopt this technique can make bilayer conductive circuit on single-side coated copper plate, namely be printed as cross-line with silver slurry and non-conterminous multiple loop is unified into the loop that is almost same potential, and, silver slurry cross-line and beneath copper conductor have quite high insulation impedance, can the intrinsic instructions for use of adaptive circuit.
To achieve these goals, the present invention adopts following technical scheme: silver slurry cross-line production process of printed circuit board, it is: sawing sheet-edging-NC boring-deburring-printing pre-treatment-printing reverse side solder mask, UV solidification-printed pattern ink, UV solidification-etching, removal ink-welding resistance printing pre-treatment-printing front solder mask, UV solidifies-prints front word, UV solidifies-prints reverse side word, UV solidifies-prints pre-treatment-printing insulating barrier 1 ink, UV solidifies-prints insulating barrier 2 ink, UV solidification-silver slurry cross-line printing pre-treatment-printing silver slurry cross-line-silver slurry hot blast solidifies-prints pre-treatment-printing silver slurry protective layer 1 ink, UV solidification-printing silver slurry protective layer 2 ink, hot blast solidifies-has plumbous hot air leveling-die-cut-break-make road detection-low resistance detection-product inspection-packaging, shipment.
In order to surface of insulating layer stress can be made to reduce, light energy working control when ground floor dielectric ink is solidified is at 650 ~ 750mj/cm
2, make ink be in semi-cured state, make its pencil hardness between HB ~ 1H, improve the adherence of silver slurry cross-line and insulating barrier, eliminate silver slurry and insulating barrier segregation phenomenon.
The UV light energy of second layer insulating barrier ink solidification controls at 700 ~ 800mj/cm
2semi-cured state, reinforced insulation layer starches the adhesion of cross-line with silver.
Silver slurry cross-line: adopt one side PCB silk-screen printing technique, printing screen plate made by the 170 order silk screens selecting the resistance that can meet silver slurry cross-line to require and 40 μm of thickness films, the silver slurry cross-line thickness of each printing is made to keep relatively consistent, to keep product silver slurry cross-line resistance stability.
The UV light energy of ground floor silver slurry cross-line protective layer ink controls at 700 ~ 800mj/cm
2semi-cured state, reinforced insulation layer starches the adhesion of cross-line with silver.
One. select U.S. ACHESON 976-SSHV (or Korea S sun NS-FSP04) the silver slurry of low-resistivity as cross-line printing material, to ensure that the circuit that cross-line connects has relatively low potential difference;
Two. the Shanghai Xiang Letian village USR-11G-11 ultraviolet curing type solder mask selecting pencil hardness lower is as the insulating barrier ink between two conductive layers and silver slurry protective layer, and control the light energy technological parameter of ink solidification, can insulating properties be ensured, accomplish insulating barrier and the silver-colored adherence of starching cross-line and having had again;
Three. select that there is degreasing and cleaning fluid and the washing combination conduct silver slurry cross-line printing pre-treating technology of removing Copper Foil oxidation, ensure that silver-colored slurry has stronger adherence with copper dish, reduce silver and starch the contact resistance with copper dish.
Four. select hot curing solder mask as the last slurry of silver together cross-line protective layer ink; better to protect silver slurry cross-line; improve the resistance to sudden heating of product, product is after having the high temperature impact of plumbous hot air leveling, Reflow Soldering and wave-soldering, and silver slurry cross-line resistance has less rate of change.
Silver slurry cross-line printed wiring board of the present invention compares with plated-through hole double sided board: it is pass through silk-screen printing technique that silver starches cross-line production process of printed circuit board technology, cover on copper sheet at one side and form double-layered circuit board, it is shorter than the life cycle of the product of plated-through hole double sided board explained hereafter, efficiency is high, more adapts to product and produces in enormous quantities; Most importantly electroless plating is not used
Technique, does not just have the waste liquid of welding to produce yet, and has saved the copper raw material of 50% than plated-through hole double sided board, greatly reduces product boring cost yet, meets the theory of cleaner production, have positive meaning to environmental protection.
Embodiment
Further illustrate below:
In one, real electrical equipment N300 printed wire panel products is used for automobile instrument panel, and this wiring board adopts silver slurry cross-line single side printed wiring board production technology process to produce.
Silver slurry cross-line production process of printed circuit board: it is: sawing sheet-edging-NC boring-deburring-printing pre-treatment-printing reverse side solder mask, UV solidification-printed pattern ink, UV solidification-etching, removal ink-welding resistance printing pre-treatment-printing front solder mask, UV solidifies-prints front word, UV solidifies-prints reverse side word, UV solidifies-prints pre-treatment-printing insulating barrier 1 ink, UV solidifies-prints insulating barrier 2 ink, UV solidification-silver slurry cross-line printing pre-treatment-printing silver slurry cross-line-silver slurry hot blast solidifies-prints pre-treatment-printing silver slurry protective layer 1 ink, UV solidification-printing silver slurry protective layer 2 ink, hot blast solidifies-has plumbous hot air leveling-die-cut-break-make road detection-low resistance detection-product inspection-packaging, shipment.
In order to surface of insulating layer stress can be made to reduce, light energy working control when ground floor dielectric ink is solidified is at 650 ~ 750mj/cm
2, make ink be in semi-cured state, make its pencil hardness between HB ~ 1H, improve the adherence of silver slurry cross-line and insulating barrier, eliminate silver slurry and insulating barrier segregation phenomenon, solve a key issue.
The UV light energy of second layer insulating barrier ink solidification controls at 700 ~ 800mj/cm
2semi-cured state, reinforced insulation layer starches the adhesion of cross-line with silver.
Silver slurry cross-line: adopt one side PCB silk-screen printing technique, printing screen plate made by the 170 order silk screens selecting the resistance that can meet silver slurry cross-line to require and 40 μm of thickness films, the silver slurry cross-line thickness of each printing is made to keep relatively consistent, to keep product silver slurry cross-line resistance stability.
The UV light energy of ground floor silver slurry cross-line protective layer ink controls at 700 ~ 800mj/cm
2semi-cured state, reinforced insulation layer starches the adhesion of cross-line with silver.
One. we are in the insulating barrier ink printing, curing process of production process, select Shanghai Xiang Letian village USR-11G-11 solder mask, and pass through the special control of ink solidification light energy, improve the adherence of silver slurry cross-line and insulating barrier, eliminate silver slurry and insulating barrier segregation phenomenon, solve a key issue.
Two. the 2nd key issue to ensure that silver slurry has good adhesion with copper dish, make silver starch the contact resistance≤20m Ω with copper dish, and product is after having plumbous hot air leveling, and silver slurry cross-line loop resistance value rate of change wants≤30%, and this is the most key.For this reason, we have employed at silver slurry cross-line printing pretreatment procedure has degreasing and removes cleaning fluid and the washing optimum organization that Copper Foil is oxidized effect, makes product before printing silver slurry cross-line, has clean copper face.Through detecting, the actual contact resistance < 15m Ω of silver slurry and copper dish.Product is after having plumbous hot air leveling, and silver starches actual rate of change≤20% of cross-line loop resistance value.
Three. we have relative " zero " current potential to make the loop connected together by silver slurry cross-line in product, select U.S. ACHESON 976-SSHV (or Korea S sun NS-FSP04) conductive silver paste, and adopt suitable half tone to carry out printing silver slurry, to ensure that printed silver slurry cross-line has certain thickness, finally reach low resistance requirement.After testing, on our product, silver starches the actual sheet resistance < 20m Ω (product sheet resistance standard≤40m Ω) of cross-line.
Four. we are in order to make product after having plumbous hot air leveling; silver slurry cross-line loop resistance value keeps relative stability; have selected hot curing solder mask as last silver slurry cross-line protective layer; improve the resistance to sudden heating of product; after testing; product is after having plumbous hot air leveling, and silver starches the resistance varying-ratio < 20% in cross-line loop.
Claims (3)
1. single side printed wiring board production technology: it is: sawing sheet-edging-NC boring-deburring-printing pre-treatment-printing reverse side solder mask, UV solidification-printed pattern ink, UV solidification-etching, removal ink-welding resistance printing pre-treatment-printing front solder mask, UV solidifies-prints front word, UV solidifies-prints reverse side word, UV solidifies-prints pre-treatment-printing ground floor dielectric ink, UV solidifies-prints second layer dielectric ink, UV solidification-Yin starches cross-line printing pre-treatment-printing silver slurry cross-line-Yin slurry hot blast and solidifies-print pre-treatment-printing ground floor silver slurry protective layer ink, UV solidifies-prints second layer silver slurry protective layer ink, hot blast solidifies-has plumbous hot air leveling-die-cut-break-make road detection-low resistance detection-product inspection-packaging, shipment, light energy working control when ground floor dielectric ink is solidified is at 650 ~ 750mj/cm
2, make ink be in semi-cured state, make its pencil hardness between HB ~ 1H, improve the adherence of silver slurry cross-line and insulating barrier, eliminate silver slurry and insulating barrier segregation phenomenon, the UV light energy of second layer dielectric ink solidification controls at 700 ~ 800mj/cm
2, make ink be in semi-cured state, reinforced insulation layer starches the adhesion of cross-line with silver.
2. single side printed wiring board production technology according to claim 1, it is characterized in that: silver slurry cross-line: adopt one side PCB silk-screen printing technique, printing screen plate made by the 170 order silk screens selecting the resistance that can meet silver slurry cross-line to require and 40 μm of thickness films, the silver slurry cross-line thickness of each printing is made to keep relatively consistent, to keep product silver slurry cross-line resistance stability.
3. single side printed wiring board production technology according to claim 1, is characterized in that: the UV light energy of ground floor silver slurry protective layer ink controls at 700 ~ 800mj/cm
2, make ink be in semi-cured state, reinforced insulation layer starches the adhesion of cross-line with silver.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210120728.9A CN102638947B (en) | 2012-04-24 | 2012-04-24 | Production technology of silver paste over-line printed circuit board |
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| CN201210120728.9A CN102638947B (en) | 2012-04-24 | 2012-04-24 | Production technology of silver paste over-line printed circuit board |
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| CN102638947A CN102638947A (en) | 2012-08-15 |
| CN102638947B true CN102638947B (en) | 2014-12-31 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103152989B (en) * | 2013-03-01 | 2015-12-02 | 杭州新三联电子有限公司 | Silk screen printing wiring board production technology |
| JP5939640B2 (en) * | 2013-03-08 | 2016-06-22 | 富士フイルム株式会社 | MULTILAYER COMPOSITION AND METHOD FOR PRODUCING MULTILAYER COMPOSITION |
| CN103367011B (en) * | 2013-07-17 | 2016-02-17 | 深圳市则成电子工业有限公司 | Anti-method and a kind of anti-thin film switch of divulging a secret of divulging a secret of a kind of thin film switch |
| CN104202907B (en) * | 2014-07-21 | 2017-11-07 | 本立遠東有限公司 | A kind of UV print processes make the technique that heavy copper electroplates via hole double-sided wiring board |
| CN109673111B (en) * | 2017-10-13 | 2021-08-20 | 宏启胜精密电子(秦皇岛)有限公司 | Method for manufacturing circuit board |
| CN109275264A (en) * | 2018-09-18 | 2019-01-25 | 镇江华印电路板有限公司 | A kind of preparation process of film key carbon film printed circuit board |
| CN113733723A (en) * | 2021-08-23 | 2021-12-03 | 连城县中触电子有限公司 | Automatic line body of touch-sensitive screen anterior segment printing |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0071375A2 (en) * | 1981-07-25 | 1983-02-09 | Kazuo Kay | Method for manufacturing a circuit board with a through hole |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2010140214A (en) * | 2008-12-11 | 2010-06-24 | Brother Ind Ltd | Wireless tag communication device and printed matter creation system |
| JPWO2010140214A1 (en) * | 2009-06-02 | 2012-11-15 | ソニーケミカル＆インフォメーションデバイス株式会社 | Manufacturing method of multilayer printed wiring board |
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- 2012-04-24 CN CN201210120728.9A patent/CN102638947B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0071375A2 (en) * | 1981-07-25 | 1983-02-09 | Kazuo Kay | Method for manufacturing a circuit board with a through hole |
Non-Patent Citations (2)
| Title |
|---|
| 单面双层印制板制造技术;朱民;《电子工艺技术》;19931231(第6期);正文第35页右边栏倒数第2段至第36页左边栏第3段 * |
| 银/铜导电浆料的特性及其在印制板方面的应用;李昌国;《印制电路信息》;20050303(第2期);正文第42页右边栏第1段至第43页右边栏第2段、图1b * |
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