CN106507613A - A kind of HDI method for manufacturing circuit board of employing conductive polymer polymerization technique - Google Patents
A kind of HDI method for manufacturing circuit board of employing conductive polymer polymerization technique Download PDFInfo
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- CN106507613A CN106507613A CN201610888904.1A CN201610888904A CN106507613A CN 106507613 A CN106507613 A CN 106507613A CN 201610888904 A CN201610888904 A CN 201610888904A CN 106507613 A CN106507613 A CN 106507613A
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- internal layer
- layer
- circuit board
- hdi
- conductive polymer
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of HDI method for manufacturing circuit board of employing conductive polymer polymerization technique, which comprises the steps：Internal layer sawing sheet>Internal layer circuit makes>Internal layer is pressed>Internal layer is radium-shine>Internal layer drills>Inner layer conductive film production>Internal layer filling perforation>Internal layer photoetching and etching>Outer layer is pressed>Outer layer is radium-shine>Outer layer drills>Outer conductive film makes>Outer layer photoetching and etching.The technique effect of the present invention is as follows：1st, formaldehydeless, cyanide-free, the content of the toxic compounds in waste water substantially reduce, and reduce the pollution to environment；2nd, the noble metals such as Metal Palladium are not consumed, reduces production cost；3rd, avoid layers of copper to separate and copper particle defect, improve the quality of production of product.
Description
Technical field
The present invention relates to wiring board makes field, and in particular to using the HDI wiring board systems of conductive polymer polymerization technique
Make method.
Background technology
HDI wiring boards are also referred to as high density interconnection board, and which is a kind of circuit distribution density ratio using micro- blind buried via hole technology
Higher circuit board.
In prior art, the method for the via of HDI circuit boards typically using electroless copper plating realizing metallizing in hole, i.e.,
Before HDI circuit boards carry out electroplating technology, through sensitization plays, activation after, deposit one in non metallic substrate by electroless copper plating
Layer copper, then carries out plating copper facing.There is following notable defect in electroless copper plating technique：1st, need to use formaldehyde as reducing agent,
Threat is produced to the health of process operator；2nd, operation is various, and needs to consume the noble metals such as Metal Palladium, extends product
Production cycle, improve production cost；2nd, environmental pollution is easily caused containing substantial amounts of harmful substance in waste water；3rd, chemistry is heavy
Copper density is larger with the copper-plated layers of copper density variation of plating, easily causes layers of copper separation.
In view of the drawbacks described above of electroless copper plating technique, industry to be occurred in that and replace electroless copper plating with conductive polymer polymerization technique
The way of technique.For example：Chinese patent application：201410286508.2, disclose a kind of wiring board conductive polymer fenestra work
The steps such as skill, which includes adjusting, promotes, high molecular polymerization, rear microetch, the characteristic for being not adhere to copper face using regulator are promoting
Manganese dioxide layer is formed during entering only on the nonmetallic surface with regulator, and in manganese dioxide table under acidic catalyst
Face forms high molecular polymer conducting film, carries out plating copper facing again after forming high molecular polymer conducting film.And for example：Japan Patent
No.3117216, disclose adjusted to pH value with sulfonic acid etc. be 0～6 potassium permanganate solution in formed thin-oxide film layer
Afterwards, form the conductive polymer coating of azole derivatives, then carry out plating copper coating.
Conductive polymer polymerization technique has that operation is simple, liquid medicine consumption is low, sewage yield is low, water consumption is low,
Without environmental benefits such as harmful chemical, low chelate and few sediments, more selective, without copper particle production, blind hole energy
The technical advantage such as power, horizontal and vertical, outstanding internal layer adhesion, blind hole windowing position be non-foaming, and figure of directly can arranging in pairs or groups
Electroplating technology, reduces cost.
Content of the invention
The present invention is directed to the problems referred to above, there is provided a kind of HDI wiring boards making side of employing conductive polymer polymerization technique
Method, the HDI method for manufacturing circuit board replace electroless copper plating technique with conductive polymer polymerization technique, and its concrete technical scheme is such as
Under：
A kind of HDI method for manufacturing circuit board of employing conductive polymer polymerization technique, which comprises the steps：
Step one, internal layer sawing sheet：If the substrate for selecting dried layer upper and lower surface to be covered with layers of copper carries out internal layer sawing sheet；Step 2,
Internal layer circuit makes：Substrate after to sawing sheet carries out internal layer circuit making, obtains some sandwich circuit boards, and carries out product to wiring board
Quality inspection is tested；Step 3, internal layer pressing：Overlap each sandwich circuit board and be laminated, obtain the internal layer for including some sandwich circuit boards
Wiring board；Step 4, internal layer are radium-shine：Using CO2The upper and lower surface of the internal sandwich circuit board of laser instrument carries out radium-shine, formation blind hole；
Step 5, internal layer drilling：Make wad cutter on internal layer circuit plate using X-RAY target-shooting machines, and using drilling machine at the wad cutter shape
Into through hole；Step 6, inner layer conductive film production：Prepared using upper and lower surface of the conductive polymer polymerization technique in internal layer circuit plate
Macromolecule conductive film；Step 7, internal layer filling perforation：Blind hole and through hole internally on sandwich circuit board carries out plating and fills out copper；Step 8, interior
Layer photoetching and etching：Internally the upper and lower surface of sandwich circuit board carries out photoetching and etching operation；Step 9, outer layer pressing：In internal layer
The upper and lower surface of wiring board overlaps copper foil layer respectively, is then laminated, and obtains HDI wiring boards；Step 10, outer layer are radium-shine：Right
The upper and lower surface of HDI wiring boards carries out radium-shine, formation blind hole；Step 11, outer layer drilling：Using X-RAY target-shooting machines in HDI lines
Wad cutter is made on the plate of road, and forms through hole using drilling machine at wad cutter；Step 12, outer conductive film make：Using high score
Electronic conduction polymerization technique prepares macromolecule conductive film in the upper and lower surface of HDI wiring boards；Step 13, outer layer photoetching and etching：
Photoetching and etching operation are carried out to the upper and lower surface of HDI wiring boards.
Further, in the step one, the thickness of the substrate is 0.6mm, and size is 540 × 615mm, upper following table
The copper layer thickness in face is 1/2OZ.
Further, there are following steps between the step 3 and the step 4：Internal layer brown：Internal sandwich circuit board
Upper and lower surface carry out brown process so that the upper and lower surface of internal layer circuit plate forms brown film；
Further, there are following steps between the step 9 and the step 10：Outer layer brown：To HDI wiring boards
Upper and lower surface carry out brown process so that the upper and lower surface of HDI wiring boards forms brown film.
Compared with prior art, the invention provides a kind of HDI wiring boards of employing conductive polymer polymerization technique make
Method, its replace electroless copper plating technique with conductive polymer polymerization technique.The technique effect of the present invention is as follows：1st, formaldehydeless, nothing
Cyanide, the content of the toxic compounds in waste water substantially reduce, and reduce the pollution to environment；2nd, it is expensive that Metal Palladium etc. is not consumed
Metal, reduces production cost；3rd, know clearly layers of copper separation and copper particle defect is avoided, the quality of production of product is improved.
Specific embodiment
For make the above objects, features and advantages of the present invention, can become apparent from understandable, with reference to specific embodiment
The present invention is further detailed explanation.
The present invention is to replace electroless copper plating technique with conductive polymer polymerization technique on the basis of existing technology in fact, from
And production cost is reduced, improve product quality.
Embodiment 1：Six layers of HDI wiring boards, six layers of HDI circuits are prepared with the HDI method for manufacturing circuit board of the present invention
Plate includes L1 layers, L2 layers, L3 layers, L4 layers, L5 layers, L6 layers successively, and wherein L1, L6 is outer layer, and L2 layers, L3 layers, L4 layers, L5 layers are
Internal layer.The HDI method for manufacturing circuit board using conductive polymer polymerization technique of the present invention comprises the steps：
(1), internal layer sawing sheet：The substrate that upper and lower surface is covered with layers of copper is selected to complete L2 layers, L3 layers, L4 layers, L5 layers respectively
Sawing sheet, the substrate thickness are 0.6mm, and size is 540 × 615mm, and the copper layer thickness of upper and lower surface is 1/2OZ；
(2), internal layer circuit makes：L2 layers, L3 layers after to sawing sheet, L4 layers, L5 layers enter row line and make and carry out quality
Inspection；
(3), internal layer pressing：Overlapping L2 layers, L3 layers, L4 layers, L5 layers are simultaneously laminated, and are obtained comprising L2 layers, L3 layers, L4
Layer, the internal layer circuit plate of L5 layers；
(4), internal layer brown：Internally the upper and lower surface of sandwich circuit board carries out brown process so that internal layer circuit plate upper and lower
Surface forms brown film；
(5), internal layer is radium-shine：Radium-shine, formation blind hole is carried out using the upper and lower surface of the internal sandwich circuit board of CO2 laser instruments；
(6), internal layer drilling：Wad cutter is made on internal layer circuit plate using X-RAY target-shooting machines, and using drilling machine in wad cutter
Place forms through hole；
(7), inner layer conductive film production：Height is prepared using upper and lower surface of the conductive polymer polymerization technique in internal layer circuit plate
Molecule conducting film；
(8), internal layer filling perforation：Blind hole and through hole internally on sandwich circuit board carries out plating and fills out copper；
(9), internal layer photoetching and etching：Internally the upper and lower surface of sandwich circuit board carries out photoetching and etching operation；
(10), outer layer pressing：Copper foil layer is overlapped to form L1 layers in the upper surface of internal layer circuit plate, in internal layer circuit plate
Lower surface overlaps copper foil layer to form L6 layers, is then laminated, obtains including L1 layers, L2 layers, L3 layers, L4 layers, L5 layers, L6
Six layers of HDI wiring boards of layer.
(11), outer layer brown：Brown process is carried out to the upper and lower surface of HDI wiring boards so that the upper following table of HDI wiring boards
Face forms brown film；
(12), outer layer is radium-shine：Radium-shine, formation blind hole is carried out to the upper and lower surface of HDI wiring boards；
(13), outer layer drilling：Wad cutter is made on HDI wiring boards using X-RAY target-shooting machines, and using drilling machine in wad cutter
Place forms through hole；
(14), outer layer conductive polymer film production：Using conductive polymer polymerization technique HDI wiring boards upper and lower surface
Prepare macromolecule conductive film；
(15), outer layer photoetching and etching：Photoetching and etching operation are carried out to the upper and lower surface of HDI wiring boards.
In the present embodiment, in internal layer macromolecule conductive film making step and outer layer macromolecule conductive film manufacture craft in adopted
The concrete technology step of conductive polymer polymerization technique is as follows：Bulk → removing glue → neutralization → roughening → pickling → whole hole →
Oxidation → catalysis → washing is dried, specific as follows：
Bulk：Wiring board is soaked in bulk liquid so that because of the drill point high temperature melting that at a high speed rotation is produced attached during drilling
PP glue on hole wall is bulk, soften.Operating temperature is 78-82 DEG C, and strong base solution of the bulk liquid for pH value 10-12, during reaction
Between be 155-165s.
Removing glue：Wiring board is soaked in the mixed solution of sodium permanganate and NaOH, will on hole wall residual after bulk
PP glue remove clean.Operating temperature is 78-82 DEG C, and the reaction time is 325-335s.
Neutralization：Wiring board is soaked in the mixed solution of sulfuric acid, hydrogen peroxide, nertralizer, will invest plate during removing glue
Face, 7 valencys of hole wall, 6 valencys, 4 valency manganese are cleaned up, it is ensured that hole wall copper and the good combination power of resin, adjust epoxy resin and glass
Glass fiber electrical, be that the good covering power of subsequent conductive film layer lays the first stone, the reaction time is 73-83s.
Roughening：Wiring board is soaked in the mixed solution of SPS and sulfuric acid, microetch, roughening copper surface, increases the coarse of copper face
Degree, is that follow-up press mold processing procedure dry film lays the first stone with the good combination power of copper face, and the concentration of SPS is 80-120g/L, the reaction time
For 43-53s.
Pickling：Using the sulfuric acid solution of 30-50ml/L, the cupric oxide residual produced in microetch, coarsening process, cleaning is cleaned
Plate face, reaction time are 30-40s.
Whole hole：Wiring board is soaked in conditioner, removes the residue resulted from during removing glue in hole, while making hole
Wall becomes a surface for possessing extremely strong adsorption capacity, in order in subsequent oxidation flow process, make to adhere on resin and glass
Even manganese dioxide layer, the attachment for conducting film provide a preferable hole wall treatment effect.Work liquid temp is 63-67 DEG C,
Conditioner is the strong base solution that pH value is 11-12, reaction time 90-100s.
Oxidation：Wiring board is soaked in oxidant, uniform manganese dioxide layer in deposition on hole wall resin and glass, with
It is easy to the complete polymerization of follow-up Organic Conductive Films, the reaction not to produce any impact to copper face.Work liquid temp is 88-92
DEG C, acid solution of the oxidant for pH value 5-7, reaction time 145-155s.
Catalysis：Wiring board is soaked in catalyst, and the thiophene monomer in catalyst is by anti-with the manganese dioxide on hole wall
Should, polymerization forms one layer of fine and close Organic Conductive Films, so that follow-up plating Copper treatment completes sky metallization process.Operating temperature
For 18-22 DEG C, catalyst is the strong acid solution of pH value 1.9-2.2, and the reaction time is 155-165s.
Washing is dried：After using board-washing water cleaning wiring board, wiring board is dried with dryer.
Enough detailed description with certain particularity has been carried out to the present invention above.Ordinary skill in art
Personnel it should be understood that what the description in embodiment was merely exemplary, before without departing from true spirit and scope of the present invention
Put make all change should all belong to protection scope of the present invention.Scope of the present invention is by described power
Sharp claim is defined, rather than by embodiment in foregoing description limiting.
Claims (4)
1. a kind of HDI method for manufacturing circuit board of employing conductive polymer polymerization technique, it is characterised in that：Which includes following step
Suddenly：
Step one, internal layer sawing sheet：If the substrate for selecting dried layer upper and lower surface to be covered with layers of copper carries out internal layer sawing sheet；
Step 2, internal layer circuit make：Substrate after to sawing sheet carries out internal layer circuit making, obtains some sandwich circuit boards, and right
Wiring board carries out quality restriction；
Step 3, internal layer pressing：Overlap each sandwich circuit board and be laminated, obtain the internal layer circuit for including some sandwich circuit boards
Plate；
Step 4, internal layer are radium-shine：Using CO2The upper and lower surface of the internal sandwich circuit board of laser instrument carries out radium-shine, formation blind hole；
Step 5, internal layer drilling：Wad cutter is made on internal layer circuit plate using X-RAY target-shooting machines, and using drilling machine in wad cutter
Place forms through hole；
Step 6, inner layer conductive film production：Height is prepared using upper and lower surface of the conductive polymer polymerization technique in internal layer circuit plate
Molecule conducting film；
Step 7, internal layer filling perforation：Blind hole and through hole internally on sandwich circuit board carries out plating and fills out copper；
Step 8, internal layer photoetching and etching：Internally the upper and lower surface of sandwich circuit board carries out photoetching and etching operation；
Step 9, outer layer pressing：Copper foil layer is overlapped respectively in the upper and lower surface of internal layer circuit plate, is then laminated, is obtained HDI
Wiring board；
Step 10, outer layer are radium-shine：Radium-shine, formation blind hole is carried out to the upper and lower surface of HDI wiring boards；
Step 11, outer layer drilling：Wad cutter is made on HDI wiring boards using X-RAY target-shooting machines, and using drilling machine in wad cutter
Place forms through hole；
Step 12, outer conductive film make：Height is prepared using upper and lower surface of the conductive polymer polymerization technique in HDI wiring boards
Molecule conducting film；
Step 13, outer layer photoetching and etching：Photoetching and etching operation are carried out to the upper and lower surface of HDI wiring boards.
2. the HDI method for manufacturing circuit board of employing conductive polymer polymerization technique as claimed in claim 1, it is characterised in that：
In the step one, the thickness of the substrate is 0.6mm, and size is 540 × 615mm, and the copper layer thickness of upper and lower surface is 1/
2OZ.
3. the HDI method for manufacturing circuit board of employing conductive polymer polymerization technique as claimed in claim 1, it is characterised in that：
There are following steps between the step 3 and the step 4：
Internal layer brown：Internally the upper and lower surface of sandwich circuit board carries out brown process so that the upper and lower surface of internal layer circuit plate is formed
Brown film.
4. the HDI method for manufacturing circuit board of employing conductive polymer polymerization technique as claimed in claim 1, it is characterised in that：
There are following steps between the step 9 and the step 10：
Outer layer brown：Brown process is carried out to the upper and lower surface of HDI wiring boards so that the upper and lower surface of HDI wiring boards forms palm fibre
Change film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610888904.1A CN106507613A (en) | 2016-10-11 | 2016-10-11 | A kind of HDI method for manufacturing circuit board of employing conductive polymer polymerization technique |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610888904.1A CN106507613A (en) | 2016-10-11 | 2016-10-11 | A kind of HDI method for manufacturing circuit board of employing conductive polymer polymerization technique |
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Family
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| CN201610888904.1A Pending CN106507613A (en) | 2016-10-11 | 2016-10-11 | A kind of HDI method for manufacturing circuit board of employing conductive polymer polymerization technique |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446372A (en) * | 2019-08-29 | 2019-11-12 | 江苏上达电子有限公司 | A kind of production method of improved multilayer fine-line plate |
| CN110505768A (en) * | 2019-08-05 | 2019-11-26 | 江西志博信科技股份有限公司 | A kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110505768A (en) * | 2019-08-05 | 2019-11-26 | 江西志博信科技股份有限公司 | A kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique |
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Address after: 224100 No. 9, Yong Sheng Road, Dafeng Development Zone, Yancheng City, Jiangsu. Applicant after: JIANGSU BOMIN ELECTRONICS CO., LTD. Address before: 224100 Electronic Information Industry Park, Yancheng City, Jiangsu. Applicant before: JIANGSU BOMIN ELECTRONICS CO., LTD. |
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Application publication date: 20170315 |
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