CN104080278A - Circuit board polymer conducting film hole processing process and matching pattern electroplating manufacturing process thereof - Google Patents
Circuit board polymer conducting film hole processing process and matching pattern electroplating manufacturing process thereof Download PDFInfo
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- CN104080278A CN104080278A CN201410286508.2A CN201410286508A CN104080278A CN 104080278 A CN104080278 A CN 104080278A CN 201410286508 A CN201410286508 A CN 201410286508A CN 104080278 A CN104080278 A CN 104080278A
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Abstract
The invention discloses a circuit board polymer conducting film hole processing process. The circuit board polymer conducting film hole processing process comprises the adjusting step, the promotion step, the polymerization step, the post-microetching step and other steps. According to the characteristic that modifiers do not adhere to a copper surface, a manganese dioxide layer is formed only on a nonmetal surface with the modifiers in the promotion process, and a high-molecular polymer conducting film is formed on a manganese dioxide surface under acid catalyzation. The process has the environmental protection benefits that procedures are simple, liquid medicine consumption is low, sewage output is low, water consumption is low, no harmful chemical substances are contained, chelates are fewer and sediment is little, also has the economic benefits that the process is not affected by palladium price, the occupied space is small, cost is low and the yield is high, and further has the technical advantages that the procedures are selective, no copper particles are generated, blind holes can be formed, horizontal processing and vertical processing can both be achieved, the inner-layer binding force is excellent, and blind hole windowing positions do not blister. The circuit board polymer conducting film hole process can be used directly in cooperation with a pattern electroplating process; besides, the line width and the size of a BGA are easy to control, the phenomena that lines are thinner and the BGA becomes smaller are avoided, a rear cooper plug is not needed, and the cost is reduced.
Description
Technical field
The invention belongs to field of printed circuit board fabrication, relate to a kind of processing method of printed circuit board (PCB) via and the production method of the method collocation graphic plating technique, the specifically production technology of direct graphic plating after a kind of conductive polymer fenestra metallization processes and this technique.
Background technology
In the prior art, the via of printed circuit board (PCB) is generally to realize metallization in hole by the method for chemical plating, before printed circuit board (PCB) carries out electric plating of whole board operation, after sensitization, activation, by chemical plating hole metallization method, in non metallic substrate, deposit after last layer metal, then carry out copper plating process, be referred to as the electroplates in hole (PTH) technique.Although, there is following drawback in this kind of PTH technique technology maturation: contain reducing agent formaldehyde and easily carcinogenic 1.; 2. contain chelating agent EDTA; 3. change copper groove and easily produce crystallization, be difficult for maintenance; 4. activation needs precious metals pd, and price is higher; 5. waste water contains a large amount of harmful substances, and processing cost is high.
In view of the above-mentioned many disadvantages of PTH, there is replacing with black hole metallization processes the way of PTH technique in industry.For example, Chinese patent application: 91100028.3, disclose a kind of non-chemical plating hole metallizing, its cardinal principle is to adopt the black hole liquid that contains graphite or carbon dust to form the black hole of one deck film at hole wall, then processes laggard electroplating through super-dry, striping.Chinese patent for example again: 200710196528.0, a kind of hole electricity conduction method of printed circuit board (PCB) is disclosed, be also a kind of black hole method.For another example Japan Patent: No.3284489 and Japan Patent: No.3261569 discloses and has made carbon deposit from the teeth outwards, process from copper surface, to go out carbon elimination and implement electric plating method in acid solution.And for example, Chinese patent: 200610061925.2 disclosed a kind of graphic plating methods for two-sided and multi-layer flexible printed circuit board, and Chinese patent: 201010219125.5 disclosed a kind of electro-plating methods for two-sided and multi-layer flexible printed circuit board, have wherein also all adopted black hole metallization processes.But these black hole metallization processes PCB scrappage in actual production is higher.
Except above-mentioned PTH technique and black hole metallization processes, also has tin palladium colloid technique and organic colloid palladium technique, for example: Japan Patent No.2660002, discloses and can implement electric plating method by changing Pd-Sn colloid catalyst into metal chalcogenides film by vulcanizing treatment; Japan Patent No.2799076, discloses after using the precious metal colloid shape acid solution processing of carrying out stabilisation through organic polymer, has carried out vulcanizing treatment to produce the method for metal coating under electro ultrafiltration; Chinese patent: 200680056449.3, a kind of direct coating method and solution for palladium conductor layer formation are disclosed, utilize the solution being formed by palladium conductor on insulated part, to form palladium conductor layer, then on palladium conductor layer, directly form electrolytic copper plated film.But the processing procedure cost of these techniques is all directly subject to the price of precious metal palladium very large.
In addition, Japan Patent No.3117216, disclosing be adjusted to pH value with sulfonic acid etc. is in 0～6 potassium permanganate solution, to form after thin-oxide rete, form the conductive polymer coating of azole derivatives, then carry out electric plating method.
Summary of the invention
In order to solve the problems of the technologies described above, the invention provides the production technology of a kind of wiring board conductive polymer fenestra technique and collocation graphic plating thereof, it is simple and easy that this wiring board conductive polymer fenestra technique has operation, liquid medicine consumption is low, sewage generation is low, water consumption is low, not containing harmful chemical, the environmental benefits such as low chelate and few sediment generation, also have and be not subject to palladium price, take up room low, economization cost of investment, the economic benefit such as low production cost and high yield, have more selectivity operation, without shot copper, produce, blind hole ability, horizontal and vertical all can, outstanding internal layer adhesion, the technical advantages such as blind hole windowing position is non-foaming, the production technology of this wiring board conductive polymer fenestra technique collocation graphic plating has more live width and BGA system easy to control in size, can not cause the thin and BGA of the line problem that diminishes, and without filling in after a bronze medal, reduced cost.
The present invention for the technical scheme that solves its technical problem and adopt is:
The invention provides a kind of wiring board conductive polymer fenestra technique, comprise following processing step:
1) adjust → 2) promote → 3) high molecular polymerization → 4) rear microetch;
Wherein,
1) adjust: in adjusting agent, soak so that nonmetallic surface is cleaned and to be adjusted, in described adjusting agent, contain sodium carbonate and NaOH, and the concentration of sodium carbonate is 55～75ml/L, and the pH value of controlling adjusting agent is 10.5～12.5, working temperature is controlled at 60 ± 3 ℃, and the activity duration is controlled at 62 ± 5sec;
2) promotion: soak so that in step 1) on the nonmetallic surface after adjustment, form manganese dioxide cover layer in promoter, in described promoter, contain permanganate and boric acid, and MnO in promoter
4 -concentration is 80～120g/L, MnO
4 2-concentration is that 0～3g/L and boric acid concentration are 8～19g/L, and the pH value of controlling promoter is 5～7, and working temperature is controlled at 90 ± 3 ℃, and the activity duration is controlled at 70 ± 5sec;
3) on the tectal surface of manganese dioxide high molecular polymerization: soak so that in step 2) forming, form high molecular polymer conducting film in organic liquid, described organic liquid contains organic acid and can form the monomer of described high molecular polymer, and the concentration of described monomer is that 8.3～13.2ml/L and organic acid concentration are 11.5～25ml/L, and the pH value of controlling organic liquid is 1.8～2.5, working temperature is controlled at 16～22 ℃, and the activity duration is controlled at 75 ± 5sec;
4) microetch after: soak copper face is cleaned and to be stung erosion in rear microetch liquid medicine, contain hydrogen peroxide and sulfuric acid in described rear microetch liquid medicine, and concentration is H
2o
213～21ml/L and H
2sO
420～30ml/L, working temperature is controlled at 30 ± 3 ℃, and the activity duration is controlled at 18 ± 5sec.
Preferably, carry out step 1) before, need to carry out microetch step: in microetch liquid, soak copper surface is cleaned with micro-coarse, in described microetch liquid, contain sodium peroxydisulfate and sulfuric acid, and concentration is Na
2s
2o
830～70g/L and H
2sO
430～50ml/L, and control copper ion concentration < 20g/L in microetch liquid, working temperature is controlled at 30 ± 3 ℃, and the activity duration is controlled at 55 ± 5sec.
Preferably, in described microetch step and step 1) between, need to carry out acid pickling step: adopt sulfuric acid solution to carry out pickling, in described sulfuric acid solution, contain H
2sO
42～5% (percents by volume), working temperature is controlled at 30 ± 3 ℃, and the activity duration is controlled at 49 ± 5sec;
Preferably the permanganate, step 2) is sodium permanganate.
Preferably the described monomer, step 3) is thiophene.
Preferably the erosion amount of stinging, step 4) is controlled at 2～6 μ ".
Preferably, step 1) and step 2) in described nonmetallic surface refer to fiberglass surfacing and resin surface.
Preferably, step 1) to step 4), after each step, all need to carry out three road washings.
Preferably, after described microetch step, need to carry out three road washings, after described acid pickling step, need to carry out three road washings.
Preferably, before carrying out microetch step, carry out de-smear.
The present invention also provides after a kind of wiring board conductive polymer fenestra directly graphic plating production technology, comprises above-mentioned conductive polymer fenestra technique, and carries out in the steps below:
Plug → pressing after de-smear (Desmear) → conductive polymer fenestra technique → pad pasting → circuit exposure → development → vertical continuous plating (VCP) → fast-etching → automated optical detection (AOI) → brown.
The invention has the beneficial effects as follows: wiring board conductive polymer fenestra technique of the present invention comprises adjustment → promotion → high molecular polymerization → steps such as rear microetch, mainly utilize adjusting agent not adhere to the characteristic of copper face, in promotion process, only have on the nonmetallic surface of adjusting agent and forming manganese dioxide layer, and on manganese dioxide surface, form high molecular polymer conducting film under acidic catalyst, it is simple and easy that this wiring board conductive polymer fenestra technique has operation, liquid medicine consumption is low, sewage generation is low, water consumption is low, not containing harmful chemical, the environmental benefits such as low chelate and few sediment generation, also have and be not subject to palladium price, take up room low, economization cost of investment, the economic benefit such as low production cost and high yield, have more selectivity operation, without shot copper, produce, blind hole ability, horizontal and vertical all can, outstanding internal layer adhesion, the technical advantages such as blind hole windowing position is non-foaming.The flow process of the production technology of this wiring board conductive polymer fenestra technique collocation graphic plating is plug → pressing after de-smear → conductive polymer fenestra technique → pad pasting → circuit exposure → development → vertical continuous plating → fast-etching → automated optical detection → brown, this production technology has more live width and BGA system easy to control in size, can not cause the thin and BGA of the line problem that diminishes, and without filling in after a bronze medal, reduced cost.
Embodiment
Below, by specific instantiation explanation the specific embodiment of the present invention, those skilled in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can other different mode be implemented, and, under not departing from disclosed category, can give different modifications and change that is.
Embodiment: a kind of wiring board conductive polymer fenestra technique, comprises following processing step:
Microetch → pickling → adjustment → promotion → high molecular polymerization → rear microetch.
Specific as follows:
Wherein, the effect of microetch is that copper surface is cleaned with micro-coarse, removes copper dirt and ailhead, to guarantee the adhesion of best copper to copper, generally after de-smear, carries out this microetch step, if there is this microetch step of suitable front operation, is nonessential; The effect of pickling is further plate face to be cleaned, and removes surface oxidation; The effect of adjusting is that nonmetallic surface is cleaned and adjusted, and to reach the object of the follow-up manganese dioxide layer of best adhesion, adjusting agent does not stick to copper face; The effect promoting is to form manganese dioxide cover layer at nonmetallic surface, is beneficial to adhering to of follow-up high molecular polymer, because there is no adjusting agent on copper face, therefore can not form manganese dioxide cover layer on copper face; Polymerization is in manganese dioxide cover surface, to form high molecular polymer conducting film under acidic catalyst; The effect of rear microetch is the residual manganese dioxide of clean plate face and copper face carried out coarse, and rear microetch is for the selection of liquid medicine and to sting the control of erosion amount particularly important, considers the present invention and adopts by H
2o
2and H
2sO
4the liquid medicine performance forming is best, and easily clean plate face manganese dioxide is residual, joins that groove is simple, cost is low, by continuation, follow the trail of comparison, draw following situation: sting erosion amount and be less than 6 μ and " be the safest erosion amount of stinging, can not produce the broken risk in hole, and sting erosion amount lower than 2 μ, " will produce the residual MnO of plate face
2and cause dry film to attach the abnormal risk of the bad formation plating of power.
Nonmetallic surface described in above-mentioned steps refers to fiberglass surfacing and resin surface.
After completing, above-mentioned each step all needs three road washings.
Following table 1 is the operating conditions difference of conventional P TH technique and conductive polymer fenestra technique of the present invention.
Table 1:
Following table 2 is cost contrasts of conventional P TH technique and conductive polymer fenestra technique of the present invention.
Following table 3 is that conventional P TH monthly has more cost statistics than conductive polymer membrane process of the present invention.
Table 2 and 3 demonstrations, macromolecule conductive film line can reduce the use amount of water greatly, and greatly reduces cost for wastewater treatment.
To sum up, above-mentioned wiring board conductive polymer fenestra technique has that operation is simple and easy, liquid medicine consumption is low, sewage generation is low, water consumption is low, containing environmental benefits such as harmful chemical, low chelate and few sediment generations, also have be not subject to palladium price, the economic benefit such as low, the economization cost of investment of taking up room, low production cost and high yield, have more selectivity operation, without shot copper production, blind hole ability, horizontal and vertical all can, the technical advantage such as outstanding internal layer adhesion, blind hole windowing position be non-foaming.
The technological process of production of above-mentioned wiring board conductive polymer fenestra technique collocation graphic plating (Pattern) is as follows: plug → pressing after de-smear (Desmear) → conductive polymer fenestra technique → pad pasting → circuit exposure → development → vertical continuous plating (VCP) → fast-etching → automated optical detection (AOI) → brown.This production technology has live width and BGA system easy to control in size, can not cause the thin and BGA of the line problem that diminishes, and without filling in after a bronze medal, reduce cost.
The above embodiment describes comparatively concrete and detailed, but can not therefore be interpreted as limiting the scope of the invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with claim.
Claims (11)
1. a wiring board conductive polymer fenestra technique, is characterized in that, comprises following processing step:
1) adjust → 2) promote → 3) high molecular polymerization → 4) rear microetch;
Wherein,
1) adjust: in adjusting agent, soak so that nonmetallic surface is cleaned and to be adjusted, in described adjusting agent, contain sodium carbonate and NaOH, and the concentration of sodium carbonate is 55～75ml/L, and the pH value of controlling adjusting agent is 10.5～12.5, working temperature is controlled at 60 ± 3 ℃, and the activity duration is controlled at 62 ± 5sec;
2) promotion: soak so that in step 1) on the nonmetallic surface after adjustment, form manganese dioxide cover layer in promoter, in described promoter, contain permanganate and boric acid, and MnO in promoter
4 -concentration is 80～120g/L, MnO
4 2-concentration is that 0～3g/L and boric acid concentration are 8～19g/L, and the pH value of controlling promoter is 5～7, and working temperature is controlled at 90 ± 3 ℃, and the activity duration is controlled at 70 ± 5sec;
3) on the tectal surface of manganese dioxide high molecular polymerization: soak so that in step 2) forming, form high molecular polymer conducting film in organic liquid, described organic liquid contains organic acid and can form the monomer of described high molecular polymer, and the concentration of described monomer is that 8.3～13.2ml/L and organic acid concentration are 11.5～25ml/L, and the pH value of controlling organic liquid is 1.8～2.5, working temperature is controlled at 16～22 ℃, and the activity duration is controlled at 75 ± 5sec;
4) microetch after: soak copper face is cleaned and to be stung erosion in rear microetch liquid medicine, contain hydrogen peroxide and sulfuric acid in described rear microetch liquid medicine, and concentration is H
2o
213～21ml/L and H
2sO
420～30ml/L, working temperature is controlled at 30 ± 3 ℃, and the activity duration is controlled at 18 ± 5sec.
2. wiring board conductive polymer fenestra technique as claimed in claim 1, it is characterized in that, carry out step 1) before, need to carry out microetch step: in microetch liquid, soak copper surface to be cleaned with micro-coarse, in described microetch liquid, contain sodium peroxydisulfate and sulfuric acid, and concentration is Na
2s
2o
830～70g/L and H
2sO
430～50ml/L, and control copper ion concentration < 20g/L in microetch liquid, working temperature is controlled at 30 ± 3 ℃, and the activity duration is controlled at 55 ± 5sec.
3. wiring board conductive polymer fenestra technique as claimed in claim 2, is characterized in that, in described microetch step and step 1) between, need to carry out acid pickling step: adopt sulfuric acid solution to carry out pickling, in described sulfuric acid solution, contain H
2sO
42～5% (percents by volume), working temperature is controlled at 30 ± 3 ℃, and the activity duration is controlled at 49 ± 5sec.
4. wiring board conductive polymer fenestra technique as claimed in claim 1, is characterized in that step 2) in permanganate be sodium permanganate.
5. wiring board conductive polymer fenestra technique as claimed in claim 1, is characterized in that step 3) in described monomer be thiophene.
6. wiring board conductive polymer fenestra technique as claimed in claim 1, is characterized in that step 4) in the erosion amount of stinging be controlled at 2～6 μ ".
7. wiring board conductive polymer fenestra technique as claimed in claim 1, is characterized in that step 1) and step 2) in described nonmetallic surface refer to fiberglass surfacing and resin surface.
8. wiring board conductive polymer fenestra technique as claimed in claim 1, is characterized in that step 1) to step 4), after each step, all need to carry out three road washings.
9. wiring board conductive polymer fenestra technique as claimed in claim 3, is characterized in that, needs to carry out three road washings after described microetch step, needs to carry out three road washings after described acid pickling step.
10. wiring board conductive polymer fenestra technique as claimed in claim 2, is characterized in that, carries out de-smear before carrying out microetch step.
After 11. 1 kinds of wiring board conductive polymer fenestras, direct graphic plating production technology, is characterized in that, comprises conductive polymer fenestra technique as claimed in claim 1, and carries out in the steps below:
Plug → pressing after de-smear → conductive polymer fenestra technique → pad pasting → circuit exposure → development → vertical continuous plating → fast-etching → automated optical detection → brown.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104582324A (en) * | 2015-01-07 | 2015-04-29 | 台山市精诚达电路有限公司 | Hole metallization method for flexible printed circuit board |
| CN106507613A (en) * | 2016-10-11 | 2017-03-15 | 江苏博敏电子有限公司 | A kind of HDI method for manufacturing circuit board of employing conductive polymer polymerization technique |
| CN107278056A (en) * | 2016-04-08 | 2017-10-20 | 东莞市斯坦得电子材料有限公司 | A kind of technique for printed circuit board Organic Conductive Films hole metallization |
| CN108221010A (en) * | 2018-01-29 | 2018-06-29 | 莆田市佳宜科技股份有限公司 | A kind of preparation process of pcb board macromolecule conductive film |
| CN109413894A (en) * | 2018-10-30 | 2019-03-01 | 生益电子股份有限公司 | A kind of production method and PCB of stepped groove slot bottom figure |
| CN110505768A (en) * | 2019-08-05 | 2019-11-26 | 江西志博信科技股份有限公司 | A kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1069387A (en) * | 1991-08-07 | 1993-02-24 | 科龙实业有限公司 | Puncture and eldctroplating method for circuit substrate |
| DE10124631C1 (en) * | 2001-05-18 | 2002-11-21 | Atotech Deutschland Gmbh | Direct electrolytic metallization of insulating substrate surface, used in circuit board production, e.g. for metallizing fine holes, uses pretreatment with water-soluble polymer and acid solutions of permanganate and thiophen compound |
| EP1897973A1 (en) * | 2006-09-07 | 2008-03-12 | Enthone, Inc. | Deposition of conductive polymer and metallization of non-conductive substrates |
| CN102364999A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Manufacturing method of mechanical conduction hole circuit board without holes on surface |
| CN102281726B (en) * | 2011-07-16 | 2013-04-03 | 中山市达进电子有限公司 | Multilayer circuit board method with high density interconnection and high reliability combination |
| CN103491728B (en) * | 2013-09-30 | 2016-06-08 | 电子科技大学 | The working method of a kind of printed electronic circuit board blind hole and fine-line |
-
2014
- 2014-06-24 CN CN201410286508.2A patent/CN104080278B/en active Active
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| CN104582324A (en) * | 2015-01-07 | 2015-04-29 | 台山市精诚达电路有限公司 | Hole metallization method for flexible printed circuit board |
| CN104582324B (en) * | 2015-01-07 | 2018-04-10 | 台山市精诚达电路有限公司 | Flexible PCB hole metallization method |
| CN107278056A (en) * | 2016-04-08 | 2017-10-20 | 东莞市斯坦得电子材料有限公司 | A kind of technique for printed circuit board Organic Conductive Films hole metallization |
| CN106507613A (en) * | 2016-10-11 | 2017-03-15 | 江苏博敏电子有限公司 | A kind of HDI method for manufacturing circuit board of employing conductive polymer polymerization technique |
| CN108221010A (en) * | 2018-01-29 | 2018-06-29 | 莆田市佳宜科技股份有限公司 | A kind of preparation process of pcb board macromolecule conductive film |
| CN109413894A (en) * | 2018-10-30 | 2019-03-01 | 生益电子股份有限公司 | A kind of production method and PCB of stepped groove slot bottom figure |
| CN109413894B (en) * | 2018-10-30 | 2022-02-08 | 生益电子股份有限公司 | Manufacturing method of bottom graph of stepped groove |
| CN110505768A (en) * | 2019-08-05 | 2019-11-26 | 江西志博信科技股份有限公司 | A kind of HDI method for manufacturing circuit board using conductive polymer polymerization technique |
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