CN102281726B - Multilayer circuit board method with high density interconnection and high reliability combination - Google Patents
Multilayer circuit board method with high density interconnection and high reliability combination Download PDFInfo
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- CN102281726B CN102281726B CN 201110199869 CN201110199869A CN102281726B CN 102281726 B CN102281726 B CN 102281726B CN 201110199869 CN201110199869 CN 201110199869 CN 201110199869 A CN201110199869 A CN 201110199869A CN 102281726 B CN102281726 B CN 102281726B
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Abstract
The invention discloses a multilayer circuit board manufacturing method with high density interconnection and high reliability combination. The method comprises the following steps of: rough shape cutting, sticking of dry film, transferring of inner layer patterns, etching of patterns, removing of a dry film, inspecting of patterns, brownification, stitching of a laminate, stitching, boring and burying, copper deposition, electrifying of the board, sticking of the dry film, transferring of patterns, electroplating of patterns, etching of patterns, brownification, stitching of laminated, stitching, copper deposition, electrifying of the board, sticking of the dry film, transferring of patterns, electroplating of patterns, etching of patterns, inspecting of patterns and molding. The invention aims to provide a multilayer circuit board method, after the cold and heat impulsion and the hot-oil high reliability testing, the resistance change rate is small, and the failure of the circuit board product is not easy to occur.
Description
[technical field]
The present invention relates to the manufacture method of the multilayer circuit board that a kind of high density interconnect is combined with high reliability.
[background technology]
Economic development along with society, product of the same race can be sold to all parts of the world, because the environment of various places, weather etc. are different, the available circuit panel products has not adapted to the impacts such as environment, weather, after the test of available circuit panel products thermal shock and the deep fat test, the resistance change rate of circuit board is very large, various faults appear in circuit board product easily, therefore, the high reliability test has been the difficult problem in the circuit board product industry, after high-end product (high density interconnect) adds strict reliability testing, fail especially a difficult point breaking through in the industry always.
[summary of the invention]
The present invention has overcome the deficiency of above-mentioned technology, provides a kind of resistance change rate through circuit board after thermal shock and the test of deep fat high reliability very little, the manufacture method of the multilayer circuit board that circuit board product is not easy to break down.
For achieving the above object, the present invention has adopted following technical proposal:
The manufacture method of the multilayer circuit board that a kind of high density interconnect is combined with high reliability comprises the steps:
Step 1: open material, leave and satisfy the circuit board plate face that meets the designing requirement size;
Step 2: paste dry film, dry film on each laminating of internal layer;
Step 3: inner figure shifts, and utilizes film exposure technique, and the figure of internal layer is transferred on the plate face;
Step 4: Etching, with the whole eating aways in unwanted position, the position that needs then keeps with etching solution.
Step 5: move back dry film, the dry film that sticks is all returned, copper face and circuit are exposed;
Step 6: the figure inspection, open the poor short circuit phenomenon with what scanner checked out circuit;
Step 7: brown, the copper face of each layer of alligatoring internal layer and line face, between layers good combination when making thereafter operation pressing;
Step 8: the pressing lamination, each layer of internal layer all stacked, skin wouldn't be made; Pressing: each is laminated together with internal layer, and skin wouldn't be made;
Step 9: bore buried via hole, get out buried via hole at a plurality of internal layers;
Step 10: heavy copper burying copper on the inner hole deposition, all is communicated with each internal layer;
Step 11: the plate electricity, the copper that reaches the plate face in the thickening buried via hole is thick;
Step 12: paste dry film, the whole face of skin is sticked dry film;
Step 13: figure shifts, and utilizes the technology of film exposure that the figure of internal layer is transferred on the plate face;
Step 14: graphic plating, electroplate the circuit of each internal layer;
Step 15: Etching, with the circuit etching of each internal layer out;
Step 10 six: brown, the copper face of each layer of alligatoring internal layer and line face, between layers good combination when making thereafter operation pressing;
Step 10 seven: the pressing lamination all stacks inside and outside layer;
Step 10 eight: pressing all forces together inside and outside layer;
Step 10 nine: the drilling blind hole through hole, run through outer field blind hole with radium-shine making, make the through hole that runs through inside and outside layer with machine drilling;
Step 2 ten: heavy copper, copper on blind hole, logical inner hole deposition all is communicated with inside and outside layer.
Step 2 11: the plate electricity, the copper that reaches the plate face in the thickening buried via hole is thick;
Step 2 12: paste dry film, the whole face of skin is sticked dry film;
Step 2 13: figure shifts, and utilizes the technology of film exposure that outer field figure is transferred on the plate face;
Step 2 14: graphic plating, copper is thick and figure copper is thick in thickening blind hole, the through hole;
Step 2 15: Etching, with the whole eating aways in unwanted position, the position that needs then keeps with etching solution;
Step 2 16: figure inspection: open the poor short circuit phenomenon with what scanner checked out circuit;
Step 2 17: moulding, gong go out the finished product profile.
Also will carry out green oil and character silk printing step between figure inspection and forming step, green oil refers to play the liquid of insulation at silk-screen one deck on the plate face; Character silk printing refers to the literal identified when on plate face silk-screen goes out to be convenient to play element.
Also carry out the electrical measurement step after the character silk printing step, electrical measurement refers to carry out open-short circuit.Also carry out surface treatment step after the electrical measurement step, surface treatment refers to plate oxidation-resistant film at the circuit board face.
Also carry out the finished product inspection step after surface treatment step, finished product inspection is function and the outward appearance that checks product.
After the finished product inspection step, also carry out packaging step: with the circuit board packing of passed examination.
Be 0.1mm with the radium-shine aperture of running through outer blind hole of making, make with machine drilling that to run through inside and outside layer through-hole aperture be 0.3mm.
The invention has the beneficial effects as follows: the circuit board that 1, processes through this method, doing the CAF test, its condition is: 85 ℃, 85%RH DC100V 1000h, insulation resistance can guarantee more than 500M Ω.2, the circuit board that processes through this method in the condition of finishing is:
Afterwards thermal shock test, resistance change rate can be controlled in 10%.3, the circuit board that processes through this method, finishing condition:
Deep fat test after, resistance change rate can be controlled in 10%.-
[description of drawings]
Fig. 1 is flow chart of the present invention.
[embodiment]
The manufacture method of the multilayer circuit board that a kind of high density interconnect is combined with high reliability comprises the steps:
Step 1: open material, leave and satisfy the circuit board plate face that meets the designing requirement size;
Step 2: paste dry film, dry film on each laminating of internal layer;
Step 3: inner figure shifts, and utilizes film exposure technique, and the figure of internal layer is transferred on the plate face;
Step 4: Etching, with the whole eating aways in unwanted position, the position that needs then keeps with etching solution.
Step 5: move back dry film, the dry film that sticks is all returned, copper face and circuit are exposed;
Step 6: the figure inspection, open the poor short circuit phenomenon with what scanner checked out circuit;
Step 7: brown, the copper face of each layer of alligatoring internal layer and line face, between layers good combination when making thereafter operation pressing;
Step 8: the pressing lamination, each layer of internal layer all stacked, skin wouldn't be made; Pressing: each is laminated together with internal layer, and skin wouldn't be made;
Step 9: bore buried via hole, get out buried via hole at a plurality of internal layers;
Step 10: heavy copper burying copper on the inner hole deposition, all is communicated with each internal layer;
Step 11: the plate electricity, the copper that reaches the plate face in the thickening buried via hole is thick;
Step 12: paste dry film, the whole face of skin is sticked dry film;
Step 13: figure shifts, and utilizes the technology of film exposure that the figure of internal layer is transferred on the plate face;
Step 14: graphic plating, electroplate the circuit of each internal layer;
Step 15: Etching, with the circuit etching of each internal layer out;
Step 10 six: brown, the copper face of each layer of alligatoring internal layer and line face, between layers good combination when making thereafter operation pressing;
Step 10 seven: the pressing lamination all stacks inside and outside layer;
Step 10 eight: pressing all forces together inside and outside layer;
Step 10 nine: the drilling blind hole through hole, run through outer field blind hole with radium-shine making, make the through hole that runs through inside and outside layer with machine drilling;
Step 2 ten: heavy copper, copper on blind hole, logical inner hole deposition all is communicated with inside and outside layer.
Step 2 11: the plate electricity, the copper that reaches the plate face in the thickening buried via hole is thick;
Step 2 12: paste dry film, the whole face of skin is sticked dry film;
Step 2 13: figure shifts, and utilizes the technology of film exposure that outer field figure is transferred on the plate face;
Step 2 14: graphic plating, copper is thick and figure copper is thick in thickening blind hole, the through hole;
Step 2 15: Etching, with the whole eating aways in unwanted position, the position that needs then keeps with etching solution;
Step 2 16: figure inspection: open the poor short circuit phenomenon with what scanner checked out circuit.
Step 2 17: moulding, gong go out the finished product profile.
Also will carry out green oil and character silk printing step between figure inspection and forming step, green oil refers to play the liquid of insulation at silk-screen one deck on the plate face; Character silk printing refers to the literal identified when on plate face silk-screen goes out to be convenient to play element.
Also carry out the electrical measurement step after the character silk printing step, electrical measurement refers to carry out open-short circuit.
Also carry out surface treatment step after the electrical measurement step, surface treatment refers to plate oxidation-resistant film at the circuit board face.
Also carry out the finished product inspection step after surface treatment step, finished product inspection is function and the outward appearance that checks product.
After the finished product inspection step, also carry out packaging step: with the circuit board packing of passed examination.
Be 0.1mm with the radium-shine aperture of running through outer blind hole of making, make with machine drilling that to run through inside and outside layer through-hole aperture be 0.3mm.
Claims (7)
1. the manufacture method of the high density interconnect multilayer circuit board of being combined with high reliability is characterized in that comprising the steps:
Step 1: open material, leave and satisfy the circuit board plate face that meets the designing requirement size;
Step 2: paste dry film, dry film on each laminating of internal layer;
Step 3: inner figure shifts, and utilizes film exposure technique, and the figure of internal layer is transferred on the plate face;
Step 4: Etching, with the whole eating aways in unwanted position, the position that needs then keeps with etching solution;
Step 5: move back dry film, the dry film that sticks is all returned, copper face and circuit are exposed;
Step 6: the figure inspection, open the poor short circuit phenomenon with what scanner checked out circuit;
Step 7: brown, the copper face of each layer of alligatoring internal layer and line face, between layers good combination when making thereafter operation pressing;
Step 8: the pressing lamination, each layer of internal layer all stacked, skin wouldn't be made; Pressing: each is laminated together with internal layer, and skin wouldn't be made;
Step 9: bore buried via hole, get out buried via hole at a plurality of internal layers;
Step 10: heavy copper burying copper on the inner hole deposition, all is communicated with each internal layer;
Step 11: the plate electricity, the copper that reaches the plate face in the thickening buried via hole is thick;
Step 12: paste dry film, the whole face of skin is sticked dry film;
Step 13: figure shifts, and utilizes the technology of film exposure that the figure of internal layer is transferred on the plate face;
Step 14: graphic plating, electroplate the circuit of each internal layer;
Step 15: Etching, with the circuit etching of each internal layer out;
Step 10 six: brown, the copper face of each layer of alligatoring internal layer and line face, between layers good combination when making thereafter operation pressing;
Step 10 seven: the pressing lamination all stacks inside and outside layer;
Step 10 eight: pressing all forces together inside and outside layer;
Step 10 nine: the drilling blind hole through hole, run through outer field blind hole with radium-shine making, make the through hole that runs through inside and outside layer with machine drilling;
Step 2 ten: heavy copper, copper on blind hole, logical inner hole deposition all is communicated with inside and outside layer;
Step 2 11: the plate electricity, the copper that reaches the plate face in the thickening buried via hole is thick;
Step 2 12: paste dry film, the whole face of skin is sticked dry film;
Step 2 13: figure shifts, and utilizes the technology of film exposure that outer field figure is transferred on the plate face;
Step 2 14: graphic plating, copper is thick and figure copper is thick in thickening blind hole, the through hole;
Step 2 15: Etching, with the whole eating aways in unwanted position, the position that needs then keeps with etching solution;
Step 2 16: figure inspection: open the poor short circuit phenomenon with what scanner checked out circuit;
Step 2 17: moulding, gong go out the finished product profile.
2. the manufacture method of a kind of high density interconnect according to claim 1 multilayer circuit board of being combined with high reliability, it is characterized in that also will carrying out green oil and character silk printing step between figure inspection and forming step, green oil refers to play the liquid of insulation at silk-screen one deck on the plate face; Character silk printing refers to the literal identified when on plate face silk-screen goes out to be convenient to play element.
3. the manufacture method of a kind of high density interconnect according to claim 2 multilayer circuit board of being combined with high reliability is characterized in that also carry out the electrical measurement step after the character silk printing step, electrical measurement refers to carry out open-short circuit.
4. the manufacture method of a kind of high density interconnect according to claim 3 multilayer circuit board of being combined with high reliability is characterized in that also carry out surface treatment step after the electrical measurement step, surface treatment refers to plate oxidation-resistant film at the circuit board face.
5. the manufacture method of a kind of high density interconnect according to claim 4 multilayer circuit board of being combined with high reliability is characterized in that, also carries out the finished product inspection step after surface treatment step, and finished product inspection is function and the outward appearance that checks product.
6. the manufacture method of a kind of high density interconnect according to claim 5 multilayer circuit board of being combined with high reliability is characterized in that, also carries out packaging step after the finished product inspection step: with the circuit board packing of passed examination.
7. the manufacture method of a kind of high density interconnect according to claim 1 multilayer circuit board of being combined with high reliability, it is characterized in that, be 0.1mm with the radium-shine aperture of running through outer blind hole of making, make with machine drilling that to run through inside and outside layer through-hole aperture be 0.3mm.
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