CN107770974A - A kind of design of level to level alignment degree detection module - Google Patents
A kind of design of level to level alignment degree detection module Download PDFInfo
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- CN107770974A CN107770974A CN201710851707.7A CN201710851707A CN107770974A CN 107770974 A CN107770974 A CN 107770974A CN 201710851707 A CN201710851707 A CN 201710851707A CN 107770974 A CN107770974 A CN 107770974A
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Abstract
The invention discloses a kind of design of level to level alignment degree detection module, comprise the following steps：S1, make detection copper billet：When inner plating makes internal layer circuit, a detection copper billet is produced in the lump on inner plating, the centre for detecting copper billet is empty；S2, pressing：Inner plating is pressed into multi-layer sheet by number of plies requirement；S3, drilling：When outer layer drills, detection hole is bored at corresponding detection copper billet center in the lump, the aperture of detection hole is less than the internal diameter of detection copper billet, and the periphery of detection hole does not contact with detection copper billet.S4, heavy copper, plate electricity：Heavy copper and electric plating of whole board processing is carried out to multi-layer sheet, makes the hole metallization on multi-layer sheet；S5, make copper dish：When making outer-layer circuit on multilayer boards, copper dish corresponding with internal layer detection copper billet are produced around detection hole.Detection module of the present invention is simply easily realized, is occupied little space, and can improve judging efficiency.
Description
Technical field
The present invention relates to printed wiring board manufacture technology field, and in particular to a kind of level to level alignment degree detection module is set
Meter.
Background technology
In printed circuit board manufacturing process, the detection method of level to level alignment degree is to set harmomegathus PAD in interlayer, in X-RAY
Bore target when by X-RAY target-shooting machines measure core material harmomegathus value, and by data provide outer layer drill drilling coefficient and
The reasonability of internal layer penalty coefficient is fed back, is confirmed whether that needs are adjusted.
Following defect be present in the detection method of above-mentioned level to level alignment degree：(1), because measurement is only to be directed to sampling measurement, differ
Fixed reflection produces the harmomegathus situation of plate by the gross；(2) it is harmomegathus compensation that (internal layer short circuit), short in production board feature, which is not easy to differentiation,
, it is necessary to look for point analysis by chasing after line, more cost, the efficiency such as consumption manual time is low for coefficient or the skew of interlayer slide plate.
The content of the invention
The present invention for the existing interlayer Aligning degree detection method of wiring board can not well short reason in arbitration functions, sentence
The problem of efficiency of breaking is low, there is provided a kind of design of level to level alignment degree detection module, this method, should by designing a kind of detection module
Detection module is simply easily realized, is occupied little space, and can improve judging efficiency.
In order to solve the above-mentioned technical problem, the invention provides a kind of design of level to level alignment degree detection module, including with
Lower step：
S1, make detection copper billet：When inner plating makes internal layer circuit, a detection copper is produced in the lump on inner plating
Block, the centre for detecting copper billet are empty.
Preferably, detection copper billet is made in the edges of boards of inner plating.
Preferably, the detection copper billet is copper ring or hollow square copper billet.
Preferably, the hem width of the detection copper billet is 0.15-0.25mm.
S2, pressing：Inner plating is pressed into multi-layer sheet by number of plies requirement.
S3, drilling：When outer layer drills, detection hole is bored at corresponding detection copper billet center in the lump, the aperture of detection hole is less than
The internal diameter of copper billet is detected, and the periphery of detection hole does not contact with detection copper billet.
Preferably, the distance of the detection hole periphery and the detection copper billet inner circumferential is equal to minimum aperture in multilayer Slab element and arrived
The distance of line.
S4, heavy copper, plate electricity：Heavy copper and electric plating of whole board processing is carried out to multi-layer sheet, makes the hole metallization on multi-layer sheet.
S5, make copper dish：When making outer-layer circuit on multilayer boards, produced around detection hole and detect copper billet with internal layer
Corresponding copper dish.
Compared with prior art, the present invention has the advantages that：
The present invention makes a hollow detection copper billet when inner plating makes internal layer circuit, and more being pressed into
After laminate, detection hole is bored when outer layer drills at corresponding detection copper billet center in the lump, the aperture of detection hole is less than detection copper billet
Internal diameter, then make detection hole metallization by heavy copper, plate electric treatment, tested and analyzed by universal meter, the copper seen in detection hole
Layer whether there is and connected with the detection copper billet on internal layer circuit, when by detect through hole and two different networks that detection hole forms it
Between short circuit, illustrate that layers of copper in detection hole is formed with the detection copper billet in internal layer circuit and connects, then can be determined that as interlayer pair
Accuracy fails；When being open circuit between two different networks by detecting through hole and detection hole composition, illustrate in detection hole
Layers of copper does not form connection with the detection copper billet in internal layer circuit, then can be determined that and do not failed for level to level alignment degree；And in order to
Finished product detection is more convenient, and copper dish shape is made around detection hole when making outer-layer circuit；By the result of determination of level to level alignment degree,
The feature internal layer short-circuit failure reason that can determine whether out production board is due to that harmomegathus penalty coefficient or the skew of interlayer slide plate cause
's；Detection module of the present invention is simply easily realized, is occupied little space, and can improve judging efficiency, and the detection module is applicable to institute
There is the wiring board of type, such as HDI plates, rigid-flex combined board, high multi-layer sheet.
Brief description of the drawings
Fig. 1 is overall interlayer Aligning degree detection module design diagram in embodiment 1；
Fig. 2 is each layer of spaced internal layer schematic diagram of individual layer Aligning degree detection module in embodiment 2；
Fig. 3 is the schematic diagram of blind hole alignment detection module design.
Embodiment
In order to more fully understand the technology contents of the present invention, below in conjunction with the drawings and specific embodiments to the present invention's
Technical scheme is described further and illustrated.
Embodiment 1
As shown in figure 1, a kind of preparation method of wiring board shown in the present embodiment, whole including a kind of multilayer circuit board
The design of body level to level alignment degree detection module, including following treatment process：
(1), sawing sheet：Core plate is outputed by jigsaw size 320mm × 420mm, and core plate thickness of slab is 0.5mm, the outer layer copper of core plate
Face thickness is 0.5OZ.
(2) internal layer circuit (negative film technique), is made：Inner figure is shifted, and light-sensitive surface, light-sensitive surface are coated with vertical application machine
8 μm of film thickness monitoring, using Full-automatic exposure machine, internal layer circuit and edges of boards copper are completed with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)
Ring (detection copper billet) exposes；Internal layer is etched, and the core plate after exposure imaging is etched into inner line figure 1 and copper ring, interior layer line
It is 3mil that width, which measures,；Then the defects of opening short circuit, circuit breach, circuit pin hole of internal layer circuit is checked, it is defective to scrap processing,
Flawless product goes out to downstream.
The position of above-mentioned copper ring can be distributed in SET technique edges, facilitate the later stage to be cut away when being molded；Also can also be arranged on
At edges of boards peripheral tools figure, as electroplated at FA section patterns, it can so be analyzed after plating together with electroplating hole table copper really
Recognize the situation of semi-finished product level to level alignment degree.
(3), press：Brown speed is according to bottom copper copper thickness brown, by outer copper foil, PP pieces, three core plates on request successively
After lamination, pressed according to the characteristic of plate from appropriate lamination, form eight layer multi-layer plates.
Relevant position in multiple-plate every layer of internal layer circuit is equipped with copper ring.
(4), outer layer drills:Holes drilled through is carried out using borehole data, and is corresponded in edges of boards and detection hole is bored at the center of copper ring
3, the aperture of detection hole 3 is less than the internal diameter of copper ring；The distance of the periphery of detection hole 3 and copper ring inner circumferential is according to minimum in multilayer Slab element
Hole is set to the distance of line, such as is arranged to 0.1mm, 0.125mm, 0.15mm or 0.175mm.
(5), heavy copper:The through hole on multi-layer sheet and detection hole metallization, backlight is set to test 10 grades, the heavy copper thickness in hole is
0.5μm。
(6), electric plating of whole board:With 1.8ASD current density electric plating of whole board 20min.
(7) outer-layer circuit (positive blade technolgy), is made：Outer graphics shift, luxuriant and rich with fragrance using Full-automatic exposure machine and positive circuit
Woods, outer-layer circuit is completed with 5-7 lattice exposure guide rule (21 lattice exposure guide rule) and edges of boards copper dish expose, it is developed, formed on multilayer boards
Outer-layer circuit figure and the formation copper dish 4 around detection hole；Outer graphics are electroplated, then copper facing and the plating respectively on production plate
Tin, copper facing are the current density electric plating of whole board 60min with 1.8ASD, and tin plating is to electroplate 10min, tin with 1.2ASD current density
It is thick 3-5 μm, then move back film successively again, etch and move back tin, then check outer-layer circuit opens short circuit, circuit breach, circuit pin hole
The defects of, defective to scrap processing, flawless product goes out to downstream.
(8), welding resistance, silk-screen character：According to prior art and by design requirement solder mask and silk-screen are made on production plate
Character.
(9), it is surface-treated：It is surface-treated according to prior art and by design requirement on production plate.
(10), it is molded：According to prior art and design requirement gong profile is pressed, circuit board finished product is made.
(11), electric performance test：The electric property of wiring board is detected, qualified wiring board is detected and enters next processing
Link；
(12), inspection eventually：The outward appearance of finished product, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness etc. are taken a sample test respectively,
Qualified product can shipment.
By the method for above-described embodiment, in order to analyze the overall condition of multilayer circuit board, in multiple-plate internal layer circuit
Each layer of same position at be respectively provided with copper ring, then correspond to the detection hole that brill is smaller than copper ring internal diameter at copper ring center in outer layer,
And the heavy copper in detection hole, as long as there is the layers of copper in one layer of copper ring and detection hole to form connection by detection, then can be determined that
Failed for level to level alignment degree；And in order to which finished product detection is more convenient, copper dish shape is made around detection hole when making outer-layer circuit, it is real
The finished product interlayer Aligning degree analysis of existing multilayer circuit board；The detection module designed by the above method can also effectively monitor through hole pair
Accuracy and judgement through hole whether there is and bore inclined situation.
Embodiment 2
As shown in Fig. 2 a kind of preparation method of wiring board shown in the present embodiment, multilayer is monitored including one kind respectively
The design of each layer of Aligning degree detection module of wiring board, this method is essentially identical with embodiment 1, and difference is step
(2)-(4), it is specific as follows：
(2) internal layer circuit (negative film technique), is made：Inner figure is shifted, and light-sensitive surface, light-sensitive surface are coated with vertical application machine
8 μm of film thickness monitoring, using Full-automatic exposure machine, internal layer circuit and levels are completed with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)
Edges of boards copper ring (detection copper billet) exposure that mutual dislocation is set is spaced in circuit；Internal layer is etched, and the core plate after exposure imaging is lost
Line pattern and copper ring 2 are carved, it is 3mil that internal layer line width, which measures,；Then check internal layer circuit opens short circuit, circuit breach, circuit
The defects of pin hole, defective to scrap processing, flawless product goes out to downstream.
The position of above-mentioned copper ring can be distributed in SET technique edges, facilitate the later stage to be cut away when being molded；Also can also be arranged on
At edges of boards peripheral tools figure, as electroplated at FA section patterns, it can so be analyzed after plating together with electroplating hole table copper really
Recognize the situation of semi-finished product level to level alignment degree.
(3), press：Brown speed is according to bottom copper copper thickness brown, by outer copper foil, PP pieces, core plate lamination successively on request
Afterwards, pressed according to the characteristic of plate from appropriate lamination, form multi-layer sheet.
Copper ring interval mutual dislocation in multi-layer sheet internal layer circuit on every sandwich circuit is set.
(4), outer layer drills:Drilling operation is carried out using borehole data, and corresponds in edges of boards and is bored at the center of every layer of copper ring
Detection hole 3, the aperture of detection hole are less than the internal diameter of copper ring；The distance of detection hole periphery and copper ring inner circumferential is according in multilayer Slab element
Minimum aperture is set to the distance of line, i.e. detection hole periphery and the distance of detection copper billet inner circumferential is equal to minimum aperture in multilayer Slab element
To the distance of line, such as it is arranged to 0.1mm, 0.125mm, 0.15mm or 0.175mm.
Set copper ring and outer layer to correspond to each copper ring and bore detection hole by the method for embodiment 2, each layer line can be analyzed
The level to level alignment degree situation on road.
In other embodiments, as shown in figure 3, the design of the inventive method level to level alignment degree detection module can be additionally used in
Blind hole alignment is detected, and copper ring is set on the internal layer circuit edges of boards of the bottom of blind hole 5, and by being corresponded in outer layer at copper ring center
Detection blind hole 6 is bored, then the heavy copper in blind hole 6 is detected, copper dish 4 are formed when making outer-layer circuit around detection blind hole 6.
In other embodiments, detection copper billet can also be hollow square, the detection hole surrounding that the later stage is bored and inspection
It is equal to survey the distance of copper billet, such as square；It can also be other various shapes that can realize above-mentioned effect.
The technical scheme provided above the embodiment of the present invention is described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are set forth, the explanation of above example is only applicable to help and understands this
The principle of inventive embodiments；Meanwhile for those of ordinary skill in the art, according to the embodiment of the present invention, in specific embodiment party
There will be changes in formula and application, in summary, this specification content should not be construed as limiting the invention.
Claims (5)
1. a kind of design of level to level alignment degree detection module, it is characterised in that comprise the following steps：
S1, make detection copper billet：When inner plating makes internal layer circuit, a detection copper billet is produced in the lump on inner plating,
It is empty to detect the centre of copper billet；
S2, pressing：Inner plating is pressed into multi-layer sheet by number of plies requirement；
S3, drilling：When outer layer drills, detection hole is bored at corresponding detection copper billet center in the lump, the aperture of detection hole is less than detection
The internal diameter of copper billet, and the periphery of detection hole does not contact with detection copper billet.
S4, heavy copper, plate electricity：Heavy copper and electric plating of whole board processing is carried out to multi-layer sheet, makes the hole metallization on multi-layer sheet；
S5, make copper dish：When making outer-layer circuit on multilayer boards, produced around detection hole corresponding with internal layer detection copper billet
Copper dish.
2. the design of level to level alignment degree detection module according to claim 1, it is characterised in that the detection hole periphery with
Distance of the distance of the detection copper billet inner circumferential equal to minimum aperture in multilayer Slab element to line.
3. the design of level to level alignment degree detection module according to claim 1, it is characterised in that the detection copper billet is copper
Ring or hollow square copper billet.
4. the design of level to level alignment degree detection module according to claim 1, it is characterised in that the side of the detection copper billet
A width of 0.15-0.25mm.
5. the design of level to level alignment degree detection module according to claim 1, it is characterised in that in step S1, in internal layer
The edges of boards of plate make detection copper billet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710851707.7A CN107770974B (en) | 2017-09-19 | 2017-09-19 | Manufacturing method of interlayer alignment detection module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710851707.7A CN107770974B (en) | 2017-09-19 | 2017-09-19 | Manufacturing method of interlayer alignment detection module |
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| Publication Number | Publication Date |
|---|---|
| CN107770974A true CN107770974A (en) | 2018-03-06 |
| CN107770974B CN107770974B (en) | 2020-01-14 |
Family
ID=61266110
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710851707.7A Active CN107770974B (en) | 2017-09-19 | 2017-09-19 | Manufacturing method of interlayer alignment detection module |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108401358A (en) * | 2018-01-24 | 2018-08-14 | 广州兴森快捷电路科技有限公司 | The production method of printed circuit board and printed circuit board |
| CN110412450A (en) * | 2019-08-28 | 2019-11-05 | 生益电子股份有限公司 | A kind of the connecting detection method and PCB of heat eliminating medium and conducting medium |
| CN110519910A (en) * | 2019-08-28 | 2019-11-29 | 生益电子股份有限公司 | The PCB detection method and PCB of heat eliminating medium are bonded by conducting medium |
| CN115988737A (en) * | 2023-03-21 | 2023-04-18 | 广州添利电子科技有限公司 | Verification board for testing detection capability of automatic optical detection machine and preparation method thereof |
| CN116489873A (en) * | 2023-06-25 | 2023-07-25 | 淄博芯材集成电路有限责任公司 | Structure and method for rapidly detecting dislocation of PCB laser perforation and lower disc |
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| JPH03179797A (en) * | 1989-12-07 | 1991-08-05 | Sekisui Chem Co Ltd | Manufacture of multilayer printed board provided with through-hole |
| CN103796415A (en) * | 2012-10-31 | 2014-05-14 | 宏启胜精密电子(秦皇岛)有限公司 | Multilayer circuit board and method for manufacturing same |
| CN205946395U (en) * | 2016-07-01 | 2017-02-08 | 深圳中富电路有限公司 | Printed circuit board |
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| JPH03179797A (en) * | 1989-12-07 | 1991-08-05 | Sekisui Chem Co Ltd | Manufacture of multilayer printed board provided with through-hole |
| CN103796415A (en) * | 2012-10-31 | 2014-05-14 | 宏启胜精密电子(秦皇岛)有限公司 | Multilayer circuit board and method for manufacturing same |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108401358A (en) * | 2018-01-24 | 2018-08-14 | 广州兴森快捷电路科技有限公司 | The production method of printed circuit board and printed circuit board |
| CN108401358B (en) * | 2018-01-24 | 2020-06-23 | 广州兴森快捷电路科技有限公司 | Printed circuit board and manufacturing method thereof |
| CN110412450A (en) * | 2019-08-28 | 2019-11-05 | 生益电子股份有限公司 | A kind of the connecting detection method and PCB of heat eliminating medium and conducting medium |
| CN110519910A (en) * | 2019-08-28 | 2019-11-29 | 生益电子股份有限公司 | The PCB detection method and PCB of heat eliminating medium are bonded by conducting medium |
| CN110519910B (en) * | 2019-08-28 | 2020-10-16 | 生益电子股份有限公司 | PCB detection method by bonding heat dissipation medium through conductive medium and PCB |
| CN110412450B (en) * | 2019-08-28 | 2021-06-25 | 生益电子股份有限公司 | Connection detection method for heat dissipation medium and conductive medium and PCB |
| CN115988737A (en) * | 2023-03-21 | 2023-04-18 | 广州添利电子科技有限公司 | Verification board for testing detection capability of automatic optical detection machine and preparation method thereof |
| CN115988737B (en) * | 2023-03-21 | 2023-08-25 | 广州添利电子科技有限公司 | Verification board for verifying detection capability of automatic optical detector and preparation method thereof |
| CN116489873A (en) * | 2023-06-25 | 2023-07-25 | 淄博芯材集成电路有限责任公司 | Structure and method for rapidly detecting dislocation of PCB laser perforation and lower disc |
| CN116489873B (en) * | 2023-06-25 | 2023-10-20 | 淄博芯材集成电路有限责任公司 | Structure and method for rapidly detecting dislocation of PCB laser perforation and lower disc |
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| CN107770974B (en) | 2020-01-14 |
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