CN101442884A - Method for processing on-state hole of multilayer printed circuit board - Google Patents
Method for processing on-state hole of multilayer printed circuit board Download PDFInfo
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- CN101442884A CN101442884A CNA2007101880441A CN200710188044A CN101442884A CN 101442884 A CN101442884 A CN 101442884A CN A2007101880441 A CNA2007101880441 A CN A2007101880441A CN 200710188044 A CN200710188044 A CN 200710188044A CN 101442884 A CN101442884 A CN 101442884A
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Abstract
The invention provides a method for processing through hole on a multi-layer printed circuit board, where the a hole disc is disposed on each substrate of the multi-layer printed circuit board. The method comprises: arranging a plurality of detection discs on one or multiple layers; drilling out detection holes on the detection discs controlled by the drilling program; checking the deviation between the detection hole and he detection disc; compensating the drilling program if the deviation falls outside the allowed range, and drilling detection hole on another detection disc until the deviation falls in the allowed range; and drilling the hole disc if the deviation falls in the allowed range. Since a detection disc only for detecting the deviation between the detection hole and the detection disc is disposed, thus, the product can not be rejected even if the deviation between the detection hole and the detection disc falls outside the allowed range.
Description
Technical field
The present invention relates to the printed substrate field, more particularly, relate to a kind of processing method of via of multilayer printed circuit board.
Background technology
As everyone knows, the manufacture method of multilayer printed circuit board mainly comprise the steps: with internal layer base material (as the internal layer circuit plate) make finish after, with internal layer base material and the compound hot pressing of outer base material (as Copper Foil); Bore via; Make via metallization (as copper facing), realize the connection on each layer line road; According to the via after the copper facing, form outer field circuit then; Again the multilayer circuit board of finishing the circuit making is carried out remaining PROCESS FOR TREATMENT.
In the process of boring via, usually the porose disc that sets in advance at outermost layer base material (as outermost Copper Foil) is carried out drilling operation, so that the via that gets out all is positioned at the corresponding porose disc of each layer base material of multilayer printed circuit board exactly, thereby reliably and effectively realize the electrical connection between each layer line road.Yet; the distortion phenomenon of (as shrinking) appears owing to the employed material of flexibility printed circuit board often is subjected to Effect of Environmental easily; thereby; can not guarantee that the via that is got out all can be arranged in the corresponding porose disc of each layer exactly, the situation of deviation usually can the porose disc corresponding occur with each.If this deviation can not be controlled within the range of permission, then carry out hole metallization to be electrically connected the circuit between the different layers according to the through hole that has than large deviation, and make outer-layer circuit according to this hole, make the product open circuit or the short circuit of making easily, and make this product rejection.
In multilayer printed circuit board, the deviation of via is concerning the rate of finished products of production technology and the reliability of manufactured goods, thereby, in the making engineering of multilayer printed circuit board, very important to the control of via deviation.
In order to control the deviation of via, in the traditional diamond-making technique of via, generally include the step that the hole that is got out is checked, be specially: after finishing the lamination of multilayer printed circuit board, test drilling via on one or several porose disc of outer base material, the goods that will be drilled with the hole take off then, via that inspection is got out and the deviation between the porose disc, exceed the scope of permission if this deviation is big, the goods that then are drilled with the bigger hole of deviation are scrapped, by adjusting drilling program above-mentioned deviation is compensated then, on another goods, carry out the test boring operation more again, in described deviation is in the scope of permission, carry out large batch of via processing again; Be in the scope of permission if deviation is less, then produce in enormous quantities according to previous drilling program.
Obviously, in the existing via course of processing, need at first one or several porose disc to be carried out test boring, again test boring is checked with the deviation between the corresponding porose disc, carry out the processing of via then according to the result of deviation check more in large quantity.Yet owing to the test drilling via need be drilled within the porose disc, and the via that forms on this porose disc is the conducting that is used to realize each layer line road, thereby, surpass the scope that allows if the deviation of the via of test drilling and porose disc is big, then can't carry out revisal, thereby these goods are scrapped.Thereby the conventional method of via processing is easy to cause the problem of product rejection, and in production in enormous quantities, this can have a strong impact on the rate of finished products of production, causes bigger waste and loss simultaneously.
Summary of the invention
The conventional method that the objective of the invention is to overcome processing via in multilayer printed circuit board causes the defective of product rejection easily, and a kind of processing method that can as far as possible avoid causing owing to the processing of via product rejection is provided.
The invention provides a kind of processing method of via of multilayer printed circuit board, each of described multilayer printed circuit board layer base material is provided with corresponding porose disc, and this method comprises:
A., a plurality of inspection dishes are set in the non-functional area on one deck or multi-layer substrate;
B. under the control of drilling program, at least one inspection dish, get out inspection opening;
C. check the deviation between the inspection opening got out and the corresponding inspection dish;
If d. described deviation surpasses allowed band, then described drilling program is compensated, utilize the program after the compensation on other inspection dish, to get out inspection opening then, up to the deviation between this inspection opening and the corresponding inspection dish within allowed band; If described deviation within allowed band, is then holed to described porose disc, thereby form via on multilayer printed circuit board.
Processing method according to via provided by the present invention, each of multilayer printed circuit board layer base material is provided with the inspection dish, when boring via, at first on this inspection dish, bore inspection opening, check the inspection opening got out and the deviation between this inspection dish then, if this deviation check value in allowed limits, then utilize former drilling program to hole; If the scope that this deviation check value surpass to allow then compensates drilling program, utilize the drilling program after the compensation on other inspection dish, to get out inspection opening again, up to the deviation between this inspection opening and the corresponding inspection dish within allowed band.
Because in the method for the invention, be provided with the inspection dish, and the nonfunctional area that should the inspection dish be arranged on described base material (promptly, the set position of this inspection dish can not form circuit, can not influence the carrying out of any processing step after the boring) yet, only be used to check the inspection opening that bored and the deviation between this inspection dish, thereby, even if the deviation between the inspection opening that is got out on the inspection dish and this inspection dish is bigger, and above the scope that allows, these goods are scrapped, and after can being adjusted compensation to drilling program, on the inspection dish of these goods, continue the test drilling inspection opening again, position in deviation is in the scope of permission, utilize the drilling program after the compensation in other porose discs of these goods, to bore via then, and realize connection between each layer line road by the via that is bored on these porose discs.
Description of drawings
Fig. 1 is the partial schematic diagram that is illustrated in the interior via that is got out of porose disc on the multilayer printed circuit board;
Fig. 2 is the partial schematic diagram of the inspection opening that gets out in the expression inspection dish of the method according to this invention on multilayer printed circuit board;
Fig. 3 is provided with the schematic cross-section of inspection dish in three layers of printed substrate for expression the method according to this invention;
Fig. 4 is provided with the schematic cross-section of inspection dish in seven layers of printed substrate for expression the method according to this invention;
Fig. 5 is the plane graph of seven layers of printed substrate among Fig. 4.
Embodiment
Below with reference to accompanying drawing preferred implementation of the present invention is described in detail.
The invention provides a kind of processing method of via of multilayer printed circuit board, each of described multilayer printed circuit board layer base material is provided with corresponding porose disc, and this method comprises:
A., a plurality of inspection dishes are set in the non-functional area on one deck or multi-layer substrate;
B. under the control of drilling program, at least one inspection dish, get out inspection opening;
C. check the deviation between the inspection opening got out and the corresponding inspection dish;
If d. described deviation surpasses allowed band, then described drilling program is compensated, utilize the program after the compensation on other inspection dish, to get out inspection opening then, up to the deviation between this inspection opening and the corresponding inspection dish within allowed band; If described deviation within allowed band, is then holed to described porose disc, thereby form via on multilayer printed circuit board.
Described inspection dish has identical size with all the other porose discs of the layer at this inspection dish place.
The processing technology of the via of printed substrate is undertaken by numerical control machining center or numerical control drilling machine usually, concrete step is: will wait that the multilayer printed circuit board goods that bore via are placed on the service position of process equipment, start process equipment, according to predefined digital control hole drilling program said products is drilled through hole operation, wherein, at first in one of the multilayer printed circuit board goods or a few porose disc 1, carry out test boring, and detect hole 2 that test drilling goes out and the deviation between this porose disc 1, by the above-mentioned drilling program of this offset correction, as shown in Figure 1.
Compare with the traditional diamond-making technique of via, in the method for the invention, being used to check the test boring of drilling program accuracy, is to carry out on the inspection dish 3 that is provided with on the base material of multilayer printed circuit board, rather than directly carries out on the porose disc that will form via.And this inspection dish is not used in the formation circuit, only is used for test boring to check the accuracy of drilling program.Thereby, even if the hole that is got out in the test boring 4 has bigger deviation with this inspection dish 3, this multilayer line slab products is scrapped, as shown in Figure 2.Can adjust drilling program, continuation is by holing to check the accuracy of adjusted drilling program on other inspection dishes of these goods, deviation between the hole that gets out on the inspection dish and this inspection dish is in the scope of permission, again the porose disc of these goods is holed, can also carry out large batch of boring processing same batch goods.
As mentioned above, the inspection dish is arranged in the nonfunctional area on each layer base material (as Copper Foil) of multilayer printed circuit board, described nonfunctional area is meant and is not used in the zone of not playing function that forms circuit and can not influence operation subsequently, for example, the inspection dish can be arranged on each layer base material of multilayer printed circuit board goods between the formed circuit, perhaps near on the marginal position of each layer base material.In the method for the invention, described inspection dish only is used for the test drilling via, checking in hole that this inspection dish is bored and the deviation between this inspection dish, thereby is convenient to according to check result drilling program be compensated or adjusts.
For the inspection dish on the internal layer base material, the inspection dish can form when forming each internal layer circuit, for the inspection dish on the outermost layer base material, the inspection dish can form after with internal layer base material (as carrying out the internal layer circuit plate of circuit) and the laminated hot pressing of outer base material (as outer copper foil).After lamination, inspection dish corresponding mutually in every layer is overlapped, and corresponding mutually porose disc is also overlapped in every layer.When these multilayer printed circuit board goods are carried out the test drilling inspection opening, if the deviation between the corresponding mutually inspection dish of the inspection opening that is bored and each layer all is in the scope of permission, then employed drilling program has accuracy preferably, can utilize this drilling program that porose disc is holed in enormous quantities; If deviation exceeds the scope of permission between any one the inspection dish in the inspection opening that the is bored inspection dish corresponding with each layer, then need this drilling program is adjusted, deviation between the inspection opening that is bored and each inspection dish all is in the scope of permission, just can use the drilling program after adjusting or compensating to carry out large quantities of boring processing.Described inspection dish can be by forming in the technology that forms circuit on pcb substrate, and specifically, described inspection dish can be formed by the etching solution etching in etching process.
Preferably, the inspection dish is arranged in the multilayer printed circuit board on the outermost layer base material (as Copper Foil), like this, is exposed to the outside owing to be positioned at the inspection dish of outermost layer base material, thereby is convenient to carry out drilling operation.
In the method for the invention, on the inspection dish, carry out the test drilling inspection opening, thereby judge whether and to adjust or to compensate drilling program.Passing through to adjust or compensate drilling program, this drilling program is had after enough accuracys, in porose disc, bore the operation of via again, the boring of being carried out in porose disc is the connection (after forming via, realizing electrical connection between each layer line road by hole metallization again) that is used to realize between each layer line road.Thereby in sum, the inspection dish is used to carry out the test drilling inspection opening, and porose disc is the via that is used for really forming the multilayer printed circuit board goods, so that realize the electrical connection between each layer line road in operation subsequently.
Therefore, can fully reflect porose disc and the deviation between the via that this porose disc bored in order to ensure inspection dish and the deviation between the inspection opening that this inspection dish is bored, in the preferred case, be positioned at the inspection dish on one deck base material and have identical size shape with porose disc.Further preferably, described inspection dish all has identical size shape with porose disc, facilitates the use compensation back or adjusted drilling program and carries out large batch of boring processing.
In the traditional diamond-making technique of via, for the individual layer printed substrate, the porose disc of this individual layer printed substrate is exposed to the outside, thereby, the hole of being bored is positioned within the corresponding porose disc.
And for multilayer printed circuit board (as the multilayer printed circuit board more than four layers), satisfying under the porose disc be positioned on the internal layer base material and the overlapped prerequisite of the corresponding porose disc on the outer base material, need make the via that is bored be positioned at the porose disc (comprising the porose disc on outer base material and the internal layer base material) of each layer base material.Yet, because the porose disc on each internal layer base material all overlaps, thereby, when the via that is bored in to porose disc and porose disc is checked, be difficult to understand the contraction distortion situation of each layer base material, thereby be difficult to understand the deviation situation of porose disc on the internal layer base material, and can only make whole evaluation to the effect of internal layer boring.
Thereby, for situation is shunk in the distortion that can understand any one deck base material in the multilayer printed circuit board, in the preferred case, the through hole of inspection dish by each layer base material outside the base material that runs through this inspection dish place that is positioned on each internal layer base material is exposed to the outside.
In the preferred case, for the ease of observing the inspection dish on the internal layer base material, the through hole that the described inspection dish on the internal layer base material is exposed is a bit larger tham described inspection dish.
As shown in Figure 3, be that example is illustrated with three layers of printed substrate 5, three layers of printed substrate 5 comprise two outer base materials 9 and 10, and the internal layer base material 6 between the outer base material 9,10.In embodiments of the present invention, described base material can be other conductive layers such as Copper Foil.In addition, between base material, also can have the other materials layer, as (not shown)s such as glue-line, epiphragma layers.
For the ease of checking the contraction or the distortion situation of internal layer base material 6, on internal layer base material 6, be formed with inspection dish 7, and the outer base material 9 that runs through outside the internal layer base material 6 is formed with through hole 8, thereby makes the inspection dish 7 on the internal layer base material 6 be exposed to outside (can certainly run through outer base material 10 and form the hole that can expose inspection dish 7 equally) by through hole 8.
Like this,, when above-mentioned three layers of printed substrate 5 being bored the via operation, can on the outer base material 9 and 10 of printed substrate 5, be formed with the inspection dish, on internal layer base material 6, also form inspection dish 7 simultaneously according to execution mode shown in Figure 3.In test drilling inspection opening process, simultaneously inspection dish on the outer base material and the inspection dish on the internal layer base material 67 are carried out the operation of test drilling inspection opening, thereby, can check the inspection dish of outer base material and the deviation between the inspection opening on this inspection dish, can also check the deviation between the inspection opening that is got out on the inspection dish 7 of internal layer base material 6 and this inspection dish, with distortion or the contraction situation of obtaining outer base material and internal layer base material, thereby help drilling program is made more accurate adjustment or compensation.
And for more multi-layered printed substrate, can on the internal layer base material inspection dish be set arbitrarily.As shown in Figure 4, be that example is illustrated with seven layers of printed substrate.Seven layers of printed substrate 11 comprise base material 101,102,103,104,105,106 and 107 successively, and wherein, outer base material is 101 and 107, and all the other base materials are the internal layer base material between outer base material 101 and 107.
For contraction or the distortion situation that can know each internal layer base material respectively, as shown in Figure 4, can on each internal layer base material, the inspection dish be set.Specifically, internal layer base material 102 is provided with inspection dish 102a; Internal layer base material 103 is provided with inspection dish 103a; Internal layer base material 104 is provided with inspection dish 104a; Internal layer base material 105 is provided with inspection dish 105a; And internal layer base material 106 is provided with inspection dish 106a.And the inspection dish 104a on the internal layer base material 104 is exposed to the outside by the through hole 104b (being that through hole 104b runs through base material 101 to 103) that runs through all base materials outside the internal layer base material 104; Inspection dish 105a on the internal layer base material 105 is exposed to the outside by the through hole 105b (being that through hole 105b runs through base material 106 and 107) that runs through all base materials outside the internal layer base material 105; Inspection dish 106a on the internal layer base material 106 is exposed to the outside by the through hole 106b (being that through hole 106b runs through base material 107) that runs through all base materials outside the internal layer base material 106; Inspection dish 103a on the internal layer base material 103 is exposed to the outside by the through hole 103b (being that through hole 103b runs through base material 102 and 101) that runs through all base materials outside the internal layer base material 103; Inspection dish 102a on the internal layer base material 102 is exposed to the outside by the through hole 102b (being that through hole 102b runs through base material 101) that runs through all base materials outside the internal layer base material 102.In addition, because internal layer base material 104 is the base material of innermost layer, thereby inspection dish 104a also can be exposed to the outside by the through hole 104c that runs through base material 105 to 107.
Thereby, according to execution mode shown in Figure 4, when above-mentioned seven layers of printed substrate 11 being bored the via operation, can be formed with the inspection dish on the outer base material 101 and 107 of printed substrate 11, the while also forms the inspection dish on each internal layer base material 102-106 of the diverse location of described printed substrate 11.In test drilling inspection opening process, simultaneously two inspection dishes on two outer base materials and the inspection dish on each internal layer base material are carried out the operation of test drilling inspection opening, thereby, can check the deviation between the inspection opening that institute's test drilling goes out on the inspection dish of outer base material and this inspection dish, can also check the deviation between the inspection opening that test drilling goes out on the inspection dish of each internal layer base material and this inspection dish, obtaining the distortion or the contraction situation of outer base material and each internal layer base material, thereby help drilling program is made more accurate adjustment or compensated.
The porose disc of each internal layer base material can be along the plane of printed substrate 11 and is arranged on each different position, like this, when carrying out the test drilling inspection opening, for example for seven layers of printed substrate, need bore inspection opening at the inspection dish on seven diverse locations of this wiring board, this is because these seven layers of printed substrates have seven layers of base material, and every layer of base material has own inspection dish, with inspection distortion or contraction situation separately.
In order further to improve the working (machining) efficiency that examination inspection is bored, in the preferred case, in multilayer printed circuit board, it is overlapping in twos to be positioned at two inspection dishes on the different internal layer base materials.As shown in Figure 4, it is 105 overlapping that the inspection that is positioned at the inspection dish 103a of internal layer base material 103 and is positioned at internal layer base material 105 is coiled, thereby through hole 103b and through hole 105b are overlapped each other; Be positioned at the inspection dish 102a of internal layer base material 102 and be positioned at the inspection dish 106a of internal layer base material 106 overlapping, thereby also make through hole 102b and through hole 106b overlapping.Like this, for example, when inspection dish 103a is carried out the test drilling inspection opening, can bore inspection dish 105a simultaneously, pass through hole 105b then, thereby can realize, simultaneously inspection opening that is bored in a side inspection and the deviation between the inspection dish 103a by a test drilling inspection opening, and in inspection opening that the opposite side inspection is bored and the deviation between the inspection dish 105a, thereby can obtain the distortion or the contraction situation of internal layer base material 103 and internal layer base material 105 simultaneously.As shown in Figure 4, also be same reason for the overlapping inspection dish 102a that is positioned at internal layer base material 102 with the inspection dish 106a that is positioned at internal layer base material 106.
In the method for the invention, the inspection dish separately of each internal layer base material of multilayer printed circuit board and outer base material can overlap each other in any a pair of mode, the hole that exposes this inspection dish is also overlapped each other, and be not limited to the mode shown in Fig. 4.
Be positioned at two inspection dishes on the different substrate materials in the multilayer printed circuit board and overlap each other mutually by making, can improve the efficient of test boring, thereby save processing cost.
As mentioned above, according to method provided by the present invention, at first on the inspection dish of multilayer printed circuit board to be holed, carry out the test drilling inspection opening, then according to this inspection dish and the deviation between the inspection opening that is got out on this inspection dish, employed drilling program is adjusted or compensated, carry out boring processing subsequently again.But, in some cases, still can not have enough precision through the drilling program after once adjusting or compensating, make the inspection opening and this inspection dish that in the inspection dish, get out have unallowed deviation, in this case, also need drilling program is adjusted and compensated, be positioned within the scope of permission up to the deviation between hole that gets out and the inspection dish till.
Thereby, might need drilling program is repeatedly adjusted and compensated.For this reason, in the preferred case, on every layer of base material of multilayer printed circuit board goods, be formed with a plurality of inspection dishes.
As shown in Figure 5, the seven layers of printed substrate 11 with Fig. 4 are that example is illustrated the situation that a plurality of inspection dishes are set on every laminar substrate.
In Fig. 5, seven layers of printed substrate 11 have 2 through hole 102b respectively, 2 through hole 104b, 3 through hole 103b and 2 inspection dish 101b, that is to say that internal layer base material 102 is provided with two inspection dish 102a, internal layer base material 104 is provided with two inspection dish 104a, internal layer base material 103 is provided with three inspection dish 103a, and outer base material 101 is provided with two inspection dish 101b.Further preferably, correspondingly, inner base material 106 is provided with respectively and two two inspection dish 106a that inspection dish 102a is overlapping, inner base material 105 is provided with respectively and three three inspection dish 105a that inspection dish 103a is overlapping, and another outside base material 107 is provided with respectively and two two inspection dish (not shown)s that inspection dish 101b is overlapping.
In addition, in two-layer printed substrate and in the multilayer printed circuit board of other numbers of plies, also can make each layer base material have a plurality of inspection dishes, and be not limited to execution mode shown in Figure 5.
According to method provided by the present invention, bore via at the multilayer printed circuit board for the treatment of boring and add man-hour, at first the inspection dish on the base material of multilayer printed circuit board is carried out the test drilling inspection opening, and according to the deviation between the inspection opening that is got out and this inspection dish, employed drilling program is adjusted or compensated, thereby overcome in traditional boring method, because after directly the porose disc that will form circuit being holed, owing to the big defective that goods are scrapped of deviation.
And, according to preferred implementation of the present invention, can also be to any one deck base material test drilling inspection opening in the multilayer printed circuit board, thereby or the distortion of every layer of base material or contraction situation, more accurately drilling program is adjusted or is compensated.
Claims (5)
1. the processing method of the via of a multilayer printed circuit board, each of described multilayer printed circuit board layer base material are provided with corresponding porose disc, and this method comprises the steps:
A., a plurality of inspection dishes are set in the non-functional area on one deck or multi-layer substrate;
B. under the control of drilling program, at least one inspection dish, get out inspection opening;
C. check the deviation between the inspection opening got out and the corresponding inspection dish;
If d. described deviation surpasses allowed band, then described drilling program is compensated, utilize the program after the compensation on other inspection dish, to get out inspection opening then, up to the deviation between this inspection opening and the corresponding inspection dish within allowed band; If described deviation within allowed band, is then holed to described porose disc, thereby form via on multilayer printed circuit board.
2. method according to claim 1, wherein said inspection dish has identical size shape with described porose disc.
3. method according to claim 1, the through hole of inspection dish by each layer base material outside the base material that runs through this inspection dish place that wherein is positioned on the internal layer base material is exposed to the outside.
4. method according to claim 3, wherein said through hole are a bit larger tham described inspection dish.
5. according to claim 3 or 4 described methods, wherein be positioned at two inspection dishes on the internal layer base material and overlap each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2007101880441A CN101442884B (en) | 2007-11-22 | 2007-11-22 | Method for processing on-state hole of multilayer printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101880441A CN101442884B (en) | 2007-11-22 | 2007-11-22 | Method for processing on-state hole of multilayer printed circuit board |
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| CN101442884A true CN101442884A (en) | 2009-05-27 |
| CN101442884B CN101442884B (en) | 2010-11-03 |
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| CN2007101880441A Active CN101442884B (en) | 2007-11-22 | 2007-11-22 | Method for processing on-state hole of multilayer printed circuit board |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103298251A (en) * | 2013-05-23 | 2013-09-11 | 华为技术有限公司 | Printed circuit board and production method thereof |
| CN105632941A (en) * | 2016-02-02 | 2016-06-01 | 广州兴森快捷电路科技有限公司 | Expansion and shrinkage process control-based production method for package substrate |
| CN110519910A (en) * | 2019-08-28 | 2019-11-29 | 生益电子股份有限公司 | The PCB detection method and PCB of heat eliminating medium are bonded by conducting medium |
| CN110876240A (en) * | 2018-09-04 | 2020-03-10 | 胜宏科技（惠州）股份有限公司 | Method for detecting drilling deviation of multilayer circuit board |
| CN111029067A (en) * | 2019-12-03 | 2020-04-17 | 欣强电子（清远）有限公司 | Preparation process of novel thermistor |
| CN112911791A (en) * | 2021-01-29 | 2021-06-04 | 深圳市强达电路有限公司 | Printed circuit board for detecting deviation of drilling hole |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3642926A1 (en) * | 1986-12-16 | 1988-06-30 | Siemens Ag | Arrangement and method for identifying displacement of the internal layers of multilayer printed circuit boards |
| GB2311618A (en) * | 1996-03-27 | 1997-10-01 | Motorola Ltd | Determining layer registration in multi-layer circuit boards |
| CN101094565A (en) * | 1997-12-11 | 2007-12-26 | 伊比登株式会社 | Method of manufacturing multilayer printed wiring board |
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2007
- 2007-11-22 CN CN2007101880441A patent/CN101442884B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103298251A (en) * | 2013-05-23 | 2013-09-11 | 华为技术有限公司 | Printed circuit board and production method thereof |
| CN103298251B (en) * | 2013-05-23 | 2016-05-25 | 华为技术有限公司 | A kind of printed circuit board (PCB) and preparation method thereof |
| CN105632941A (en) * | 2016-02-02 | 2016-06-01 | 广州兴森快捷电路科技有限公司 | Expansion and shrinkage process control-based production method for package substrate |
| CN105632941B (en) * | 2016-02-02 | 2018-06-22 | 广州兴森快捷电路科技有限公司 | A kind of production and processing method of the package substrate based on harmomegathus process control |
| CN110876240A (en) * | 2018-09-04 | 2020-03-10 | 胜宏科技（惠州）股份有限公司 | Method for detecting drilling deviation of multilayer circuit board |
| CN110876240B (en) * | 2018-09-04 | 2021-07-02 | 胜宏科技（惠州）股份有限公司 | Method for detecting drilling deviation of multilayer circuit board |
| CN110519910A (en) * | 2019-08-28 | 2019-11-29 | 生益电子股份有限公司 | The PCB detection method and PCB of heat eliminating medium are bonded by conducting medium |
| CN110519910B (en) * | 2019-08-28 | 2020-10-16 | 生益电子股份有限公司 | PCB detection method by bonding heat dissipation medium through conductive medium and PCB |
| CN111029067A (en) * | 2019-12-03 | 2020-04-17 | 欣强电子（清远）有限公司 | Preparation process of novel thermistor |
| CN112911791A (en) * | 2021-01-29 | 2021-06-04 | 深圳市强达电路有限公司 | Printed circuit board for detecting deviation of drilling hole |
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| CN101442884B (en) | 2010-11-03 |
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