CN101442901B - Method for composing multilayer printed circuit board - Google Patents
Method for composing multilayer printed circuit board Download PDFInfo
- Publication number
- CN101442901B CN101442901B CN2007101880437A CN200710188043A CN101442901B CN 101442901 B CN101442901 B CN 101442901B CN 2007101880437 A CN2007101880437 A CN 2007101880437A CN 200710188043 A CN200710188043 A CN 200710188043A CN 101442901 B CN101442901 B CN 101442901B
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- Prior art keywords
- inspection
- porose disc
- wiring board
- check
- copper foil
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- 238000000034 method Methods 0.000 title claims abstract description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000011889 copper foil Substances 0.000 claims abstract description 42
- 238000003825 pressing Methods 0.000 claims abstract description 9
- 238000007689 inspection Methods 0.000 claims description 117
- 238000000926 separation method Methods 0.000 claims description 3
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 claims 1
- 238000007731 hot pressing Methods 0.000 abstract description 5
- 238000001514 detection method Methods 0.000 abstract 8
- 238000013329 compounding Methods 0.000 abstract 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005215 recombination Methods 0.000 description 4
- 230000006798 recombination Effects 0.000 description 4
- 239000000047 product Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a compounding method for multi-layer circuit board, which comprise: providing a plurality of circuit boards with detection disc and detection pattern corresponding to each other formed on the copper foil thereof; jointing the circuit boards; detecting the jointing accuracy between all the detection discs and the detection patterns; separating all the circuit boards and re-jointing them if the jointing accuracy between the detection discs and the detection patterns falls outsides of the allowed range, until the jointing accuracy falls in the allowed range; and pressing the circuit boards if the jointing accuracy falls in the allowed range; optionally, applying copper foil on both the outer sides of the multi-layer circuit board; hot pressing it; and accomplishing the compounding of the multi-layer circuit board. In the method of the invention, the jointing accuracy is detected by the detection disc and the detection pattern, consequently, a higher resolution is achieved.
Description
Technical field
The present invention relates to the printed substrate field, more particularly, relate to a kind of complex method of multilayer printed circuit board.
Background technology
Along with the development of electronic technology, printed substrate develops to high density, multiple stratification gradually, thereby, in increasing workplace, all need the application of multilayer printed circuit board.
The manufacture method of multilayer printed circuit board mainly comprises: will be formed with the compound hot pressing of a plurality of wiring boards of circuit; Bore via; With the via metallization, realize the electrical connection on each layer line road; Form outer-layer circuit then; Again outer-layer circuit is carried out surface treatment; Carry out circuit test; Form processing at last, finally make the multilayer printed circuit board finished product of required size.
In the recombination process of multilayer printed circuit board, require porose disc corresponding on each sandwich circuit board must have higher registration accuracy: a plurality of wiring boards that will be formed with respectively circuit fit together by the hot pressure point with electric soldering iron or electric iron, check and confirm with fast press product to be carried out pressing after the no applying deviation, make fully combination of each layer.Bigger such as circuit applying deviation, in boring the via operation, bore via, and after making this via metallization, can not realize having reliable electrical connection between the circuit of each sandwich circuit board, short circuit occurs easily or open circuit, thereby cause these goods to scrap.Thereby in the manufacturing process of multilayer printed circuit board, the compound precision of each wiring board is very important.Directly affect the order of accuarcy of brill via subsequently.
In recombination process, has higher compound precision in order to ensure multilayer printed circuit board, in the recombination process of multilayer printed circuit board, mainly comprise the operation of fitting with pressing, be specially: preparation is as a plurality of wiring boards of internal layer circuit plate, wherein, all be formed with corresponding porose disc on the Copper Foil of each layer wiring board, on the Copper Foil of each layer wiring board, form circuit respectively; Each wiring board that will be formed with circuit is then fitted, to check the applying deviation between each wiring board; Then the registration accuracy of the corresponding porose disc of each layer wiring board after fitting is carried out the printing opacity inspection,, then each layer wiring board separated, fit again if corresponding porose disc registration accuracy is lower, higher up to registration accuracy; If corresponding porose disc registration accuracy reaches requirement, each layer circuit board pressing after then will fitting, and pass through insulating barrier (as prepreg) applying hot pressing together in both sides and outer copper foil respectively, wherein, do not form circuit on the outer copper foil, in these goods, on the Copper Foil of each internal layer circuit plate, be formed with internal layer circuit, and on outer copper foil, do not form outer-layer circuit.
The registration accuracy of the corresponding porose disc of each layer wiring board after fitting is being carried out printing opacity when checking, because the dielectric medium of each layer wiring board is rendered as translucent under printing opacity, corresponding porose disc then can shelter from light and be the shade state, thereby, can judge the registration accuracy of corresponding porose disc according to the shadow shapes of porose disc, if corresponding porose disc overlaps dislocation, then this shadow shapes is rendered as the shade of two circles of coincidence, as shown in Figure 1, and in fact, the relation of the dislocation between the porose disc as shown in Figure 2.
In existing inspection method, owing to need to judge the shadow shapes of porose disc, and corresponding porose disc is generally the identical circle of shape, thereby, only in the bigger situation of applying deviation, whether the registration accuracy that just can tell between the corresponding porose disc is too low.And porose disc is toward the connection of contact and formation, and whether deviation is made more greatly correct judgement to porose disc usually can to disturb the operating personnel.Thereby above-mentioned inspection method resolution is lower.
Summary of the invention
The objective of the invention is to overcome in the existing complex method of multilayer printed circuit board, to the lower defective of checking process resolution of the applying precision of each layer wiring board, and provide a kind of complex method that when the applying precision of each layer wiring board is checked, has high-resolution.
The invention provides a kind of applying method of multilayer printed circuit board, this method comprises the steps:
A., a plurality of wiring boards are provided, are formed with the inspection porose disc that corresponds to each other and check figure at the Copper Foil of two wiring boards of arbitrary neighborhood, can determine by this position relationship that checks porose disc and check figure thus the Anawgy accuracy of these adjacent two wiring boards;
B. described a plurality of wiring boards are fitted, make the described inspection porose disc that corresponds to each other and check that figure overlaps each other;
C. check the inspection porose disc of described coincidence and the Anawgy accuracy between the inspection figure;
If d. the Anawgy accuracy between described inspection porose disc and the inspection figure does not reach the scope of permission, then will again fit after described a plurality of wiring boards separation, until the Anawgy accuracy between described inspection porose disc and the inspection figure is in the range of permission;
If e. the Anawgy accuracy between described inspection porose disc and the inspection figure is in the range of permission, then with each sandwich circuit board pressing.
In traditional complex method, be to realize by the fortuitous arrangement of shadows that checks corresponding porose disc to the inspection as the Anawgy accuracy of each wiring board of internal layer circuit plate; And in the method for the invention, to the inspection of the Anawgy accuracy of each internal layer circuit plate, be by the inspection porose disc on the wiring board of arbitrary neighborhood and check that figure realizes.Owing to check figure and check between the porose disc to have relative stronger contrast, thereby, compare with traditional complex method, method of the present invention is when checking the applying precision of each layer wiring board, have higher relatively resolution, pick out deviation situation between each layer wiring board thereby help the operating personnel.
And, set inspection porose disc and check that figure generally only is used to check the applying precision between each layer wiring board in the method for the present invention, do not participate in forming circuit, be not connected with circuit yet, thereby, when the operation personnel observe described inspection opening dish and check fortuitous arrangement of shadows between the figure, can not be subjected to any interference.
Description of drawings
Fig. 1 is in traditional complex method, has the shade of corresponding porose disc between the wiring board of applying deviation;
Fig. 2 is the schematic diagram of the corresponding porose disc of the actual reflection of the shade among Fig. 1;
Fig. 3 is the method according to this invention, the schematic diagram of the inspection porose disc that forms at a sandwich circuit board;
Fig. 4 is the method according to this invention, the schematic diagram of the inspection figure that the inspection porose disc with among Fig. 3 that forms at another sandwich circuit board is corresponding;
Fig. 5 after each sandwich circuit board is fitted, has in the situation of higher Anawgy accuracy the shade that the inspection porose disc among Fig. 3 and the inspection figure among Fig. 4 present when printing opacity checks at wiring board;
Fig. 6 is after each sandwich circuit board is fitted, and has in the deviation situation shade that the inspection porose disc among Fig. 3 and the inspection figure among Fig. 4 present in the applying of wiring board when printing opacity checks;
Fig. 7 is the method according to this invention, the schematic diagram of the inspection porose disc that arranges in each sandwich circuit board of multilayer printed circuit board and inspection figure;
The schematic diagram of the wiring board of Fig. 8 after for the applying of the inspection porose disc that is provided with different numbers among Fig. 7.
Embodiment
Below with reference to accompanying drawing embodiments of the present invention are described in detail.
The invention provides a kind of complex method of multilayer printed circuit board, this method comprises the steps:
A., a plurality of wiring boards are provided, are formed with the inspection porose disc that corresponds to each other and check figure at the Copper Foil of two wiring boards of arbitrary neighborhood, can determine by this position relationship that checks porose disc and check figure thus the Anawgy accuracy of these adjacent two wiring boards;
B. described a plurality of wiring boards are fitted, make the described inspection porose disc that corresponds to each other and check that figure overlaps each other;
C. check the inspection porose disc of described coincidence and the Anawgy accuracy between the inspection figure;
If d. the Anawgy accuracy between described inspection porose disc and the inspection figure does not reach the scope of permission, then will again fit after described a plurality of wiring boards separation, until the Anawgy accuracy between described inspection porose disc and the inspection figure is in the range of permission;
If e. the Anawgy accuracy between described inspection porose disc and the inspection figure is in the range of permission, then with each sandwich circuit board pressing.
In the method for the invention, owing on the Copper Foil of adjacent arbitrarily wiring board, be formed with corresponding inspection porose disc and check figure, like this, after a plurality of wiring boards are fitted, can be to by to this inspection porose disc with check that the deviation between the figure checks, thus the applying precision between the wiring board estimated.Compare by checking the deviation between the corresponding porose disc with traditional method, check porose disc and check contrast between the figure obviously much larger than the contrast between the corresponding porose disc, thereby improved to a great extent the resolution ratio of the Anawgy accuracy of inspection wiring board.
What is called is adjacent to be that is to say for a plurality of wiring boards applyings are rear, and after a plurality of wiring boards were fitted, the inspection porose disc laid respectively on two adjacent wiring boards with the inspection figure, thereby is convenient to inspection porose disc and inspection figure are compared.
Recombination process to multilayer printed circuit board is described in detail below.
A plurality of wiring boards at first are provided, and these wiring boards as the internal layer circuit plate, wherein, have been finished the formation of circuit on described wiring board in the multilayer printed circuit board that completes, and leave corresponding porose disc to be holed simultaneously.In the method according to the invention, on the Copper Foil of adjacent arbitrarily wiring board, be formed with the inspection porose disc that corresponds to each other and check figure, so that subsequently by to checking porose disc and check that the applying deviation between the figure checks, thereby the applying precision of reflection wiring board.Wherein, each that forms at the Copper Foil of wiring board checks that porose disc can correspond to each other, and like this, behind each sandwich circuit board applying lamination, each checks porose disc and checks that figure all overlaps each other.
To be formed with the joint tool of a plurality of wiring boards of circuit with the band pin, corresponding location hole on the wiring board is enclosed within on the pin, with electric soldering iron or electric iron simple hot pressure is carried out in wiring board four leftover bits and pieces of material positions again, each layer line road is pasted together by the hot pressure point, after applying is finished, the applying precision of the multilayer circuit board after fitting is checked.Different from traditional method, method of the present invention is by to the inspection porose disc of correspondence with check the inspection of the applying deviation of figure, and the Anawgy accuracy of wiring board is estimated.
In the method for the invention, if the registration accuracy between corresponding inspection porose disc and the inspection figure does not reach the scope of permission, again fit after then described a plurality of wiring boards being separated, the registration accuracy between described inspection porose disc and inspection figure is within the scope of permission.
Describe below corresponding inspection porose disc and the setting that checks figure in detail, and how by checking porose disc and checking that figure checks the Anawgy accuracy of the wiring board of applying.
In the method according to this invention, form in the circuit board in the process of circuit, form in the circuit board simultaneously the inspection porose disc and inspection figure that correspond to each other.
When forming circuit in the circuit board, as shown in Figure 3, can carry out etching by Copper Foil and form the inspection porose disc a certain wiring board.Specifically, Copper Foil 3 etchings of this wiring board are removed around circular part, thereby the dielectric medium base material 2 that checks around the porose disc 1 is come out, and keep a circular Copper Foil, this circle Copper Foil is and checks porose disc 1.
Can carry out etching by the Copper Foil to another adjacent wiring board equally and form the inspection figure.Specifically, as shown in Figure 4, Copper Foil 5 etchings of this wiring board are removed to checking the part of graphics shape, thereby the dielectric medium base material of this wiring board is come out, form and check figure 4, this position of checking figure 4 is corresponding with the position of above-mentioned inspection porose disc 1, thereby is convenient to the two is compared.
Line electricity characteristic for fear of the inspection porose disc 1 that forms in the circuit board and 4 pairs of wiring boards of inspection figure has a negative impact, also prevent to check porose disc 1 simultaneously and check that the manufacture craft of 4 pairs of multilayer printed circuit boards of figure causes obstacle, in the preferred case, described inspection porose disc 1 and inspection figure 4 all are arranged on the nonfunctional area of wiring board, in this nonfunctional area, can not influence the electrical characteristics of circuit, can not have a negative impact to the later manufacture craft of wiring board yet, for example, can will check porose disc 1 and check figure 4 is arranged on does not need to form circuit near the wiring board edge position.
After a plurality of wiring boards are fitted, in the situation of accurately fitting, check porose disc 1 and check that figure 4 does not have deviation.Owing to lay respectively at the inspection porose disc 1 of different wiring boards and check that figure 4 is mutually corresponding, when carrying out printing opacity after the accurate applying when checking, check porose disc 1 and check figure 4 coincidence that also corresponds to each other.In the situation of accurately fitting, as shown in Figure 5, check porose disc 1 and check that figure 4 does not have deviation, accurately involutory, wherein, check porose disc 1 and check that figure 4 lays respectively at different wiring boards.And have in the situation of relatively large deviation when fitting, also can produce deviation between corresponding inspection porose disc 1 and the inspection figure 4, as shown in Figure 6.
For obtaining higher contrast when checking porose disc 1 and checking that figure 4 compares, in the preferred case, check that porose disc 1 be circle, and inspection porose disc 1 that should circle has identical size with other porose discs on the wiring board.Described inspection figure 4 is a regular polygon, when the wiring board of checking porose disc 1 place accurately overlaps with the wiring board of checking figure 4 places, checks that the circle of porose disc 1 is inscribed within the polygon of checking figure 4.Obviously, in the method for the present invention with contrast circular and regular polygon, greater than contrast circular with circular in traditional method.
Inspection figure 4 shown in Fig. 5 and Fig. 6 is square, but checks that the shape of figure 4 is not limited thereto, and checks that figure 4 can also be equilateral triangle, regular pentagon or regular hexagon etc.
Check the deviation of porose disc 1 and inspection figure 4, can be determined with the departure degree of the regular polygon that checks figure 4 by the circle of observation and inspection porose disc 1.
In traditional complex method, if the number of plies of multilayer printed circuit board is more, as be more than four layers or four layers, the applying at this moment traditional complex method checks step, can not confirm that the deviation of concrete that layer surpasses the scope that allows.Thereby, the wiring board of each layer can only be pulled down one by one the lamination of fitting again.If can determine it specifically is which laminating closes deviation above allowed band, then can directly this layer be pulled down, only this layer being fitted again gets final product.
In the method according to the invention, in step a, each that forms on described wiring board checks that porose disc is spaced apart from each other, rather than correspond to each other, on the Copper Foil of described a plurality of wiring boards, have a plurality of perforates, described perforate is checked porose disc with each respectively and is checked that the position of figure overlaps, and passes through to allow light.
Because the inspection porose disc that forms on each wiring board does not overlap each other, and is spaced apart from each other.That is to say that behind each wiring board applying lamination, each checks that porose disc can not overlap each other, but the space separately.
For the ease of when printing opacity checks, every pair of inspection porose disc and inspection figure being compared, on the Copper Foil of a plurality of wiring boards, also need to form a plurality of perforates, the position of this perforate is respectively corresponding with every pair of position that checks porose disc and inspection figure, passes through to allow light.
Below when making six layers of printed substrate, it is that example is illustrated that the wiring board goods after four sandwich circuit boards are fitted carry out the printing opacity inspection.As shown in Figure 7, these wiring board goods comprise: first wiring board of being made up of Copper Foil 11 and base material 10, second wiring board of forming by Copper Foil 21 and base material 20, the tertiary circuit plate of forming by Copper Foil 22 and base material 20, and the 4th wiring board of forming by Copper Foil 31 and base material 30.
For adjacent first wiring board and second wiring board, in Copper Foil 11, be formed with and check figure 41, in Copper Foil 21, be formed with and check porose disc 42, in Copper Foil 22 and 31, be formed with simultaneously perforate 43, the position of this perforate 43 is corresponding with the position of checking porose disc 42 and inspection figure 41, see through with permission light, thereby be convenient to the deviation of checking porose disc 42 and inspection figure 41 is checked.
For adjacent second wiring board and tertiary circuit plate, in Copper Foil 21, be formed with and check figure 51, in Copper Foil 22, be formed with and check porose disc 52, in Copper Foil 11 and 31, be formed with simultaneously perforate 53, the position of this perforate 53 is corresponding with the position of checking porose disc 52 and inspection figure 51, see through with permission light, thereby be convenient to the deviation of checking porose disc 52 and inspection figure 51 is checked.
For adjacent tertiary circuit plate and the 4th wiring board, in Copper Foil 31, be formed with and check porose disc 62, in Copper Foil 22, be formed with and check figure 61, in Copper Foil 11 and 21, be formed with simultaneously perforate 63, the position of this perforate 63 is corresponding with the position of checking porose disc 62 and inspection figure 61, see through with permission light, thereby be convenient to inspection porose disc 62 and inspection figure 61 are checked.
As shown in Figure 7, obviously, the inspection porose disc that forms on each wiring board does not overlap each other, and each other spaced apart.
By above-mentioned technical scheme, can estimate the applying deviation situation of every one deck.Thereby, if detect arbitrary to checking porose disc and checking that the deviation between the figure surpasses the scope that allows, and can determine at an easy rate that then specifically the applying of which sandwich circuit board goes wrong, thereby only this layer is separated, and re-starts applying.But also can in the applying lamination process, laminating layer be compressed into row adjustment proofread and correct according to detected applying deviation.
In order to differentiate each to adjacent wiring board inspection porose disc separately and to check figure, can carry out mark to it, perhaps the difference by number checks porose disc and checks that graphical demarcation comes each.
For example, as shown in Figure 8, the inspection porose disc that arranges on first wiring board and second wiring board and inspection figure are one, thereby first wiring board and second wiring board have a pair of inspection porose disc and check figure.The inspection porose disc that arranges on second wiring board and the tertiary circuit plate and inspection figure are two, thereby.Second wiring board and tertiary circuit plate have two pairs and check porose disc and check figure.The inspection porose disc that arranges on tertiary circuit plate and the 4th wiring board and inspection figure are three, thereby tertiary circuit plate and the 4th wiring board have three pairs and check porose discs and check figure.
In the wiring board goods Anawgy accuracy situation within the range of permission in confirming Fig. 7, then that each sandwich circuit board hot pressing is compound, form the printed wire slab products.
Outer copper foil can also be fitted in respectively on two sides of these wiring board goods, such as the semi-solid preparation layer by dielectric etc., finally after the hot pressing form six layers of printed substrate.In these six layers of printed substrates, formed internal layer circuit on four layers of inner Copper Foil, just also do not form outer-layer circuit on the outer copper foil on two sides, wait until in the operation subsequently forming.
Complex method according to the present invention is by improving the step of the inspection Anawgy accuracy in the bonding process, thereby is conducive to improve the compound precision between each sandwich circuit board.
In sum, in the method for the invention since by the inspection porose disc that arranges and check between the figure to determining recently whether the Anawgy accuracy between the wiring board is in the scope of permission, thereby, have higher resolution ratio.And by adjacent wiring board being arranged corresponding inspection porose disc and checks figure, and each checks that porose disc does not overlap mutually, and is spaced at each, thereby deviation appears in the Anawgy accuracy that can determine the wiring board of concrete which layer.
Claims (10)
1. the complex method of a multilayer printed circuit board, this method comprises the steps:
A., a plurality of wiring boards are provided, on the Copper Foil of any adjacent two wiring boards, be formed with the inspection porose disc that corresponds to each other and check figure, can check that the position of porose disc and inspection figure concerns to determine the applying precision of these adjacent two wiring boards by this thus, described inspection porose disc is circular, and described inspection figure is a regular polygon;
B. described a plurality of wiring boards are fitted, make the described inspection porose disc that corresponds to each other and check that figure overlaps each other;
C. check the inspection porose disc of described coincidence and the Anawgy accuracy between the inspection figure;
If d. the Anawgy accuracy between described inspection porose disc and the inspection figure does not reach the scope of permission, then will again fit after described a plurality of wiring boards separation, until the Anawgy accuracy between described inspection porose disc and the inspection figure is in the range of permission;
If e. the Anawgy accuracy between described inspection porose disc and the inspection figure is in the range of permission, then with each sandwich circuit board pressing.
2. method according to claim 1, wherein said inspection porose disc is made of the Copper Foil on the wiring board.
3. method according to claim 1 and 2, wherein said inspection figure forms by the Copper Foil on the wiring board is removed.
4. method according to claim 3, wherein said inspection porose disc and described inspection figure all are positioned at the nonfunctional area of wiring board.
5. method according to claim 3, wherein when the wiring board at described inspection porose disc place overlapped fully with the wiring board at described inspection figure place, described inspection porose disc was inscribed within described inspection figure.
6. method according to claim 5, wherein said regular polygon are equilateral triangle, square or regular pentagon.
7. according to claim 3 or 6 described methods, wherein in step a, each that forms on described each wiring board checks that porose disc does not overlap each other, on the Copper Foil of described a plurality of wiring boards, have a plurality of perforates, described perforate is checked porose disc with each respectively and is checked that the position of figure overlaps, and passes through to allow light.
8. method according to claim 7, wherein each has respectively the inspection porose disc of different numbers to adjacent wiring board.
9. method according to claim 7, wherein said perforate are a bit larger tham described inspection porose disc and are checked figure.
10. method according to claim 1, wherein said method also comprises: two lateral surfaces of the described a plurality of wiring boards after pressing also respectively pressing outer copper foil is arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101880437A CN101442901B (en) | 2007-11-22 | 2007-11-22 | Method for composing multilayer printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101880437A CN101442901B (en) | 2007-11-22 | 2007-11-22 | Method for composing multilayer printed circuit board |
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| Publication Number | Publication Date |
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| CN101442901A CN101442901A (en) | 2009-05-27 |
| CN101442901B true CN101442901B (en) | 2011-11-16 |
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| CN2007101880437A Expired - Fee Related CN101442901B (en) | 2007-11-22 | 2007-11-22 | Method for composing multilayer printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102065643B (en) * | 2009-11-17 | 2012-10-17 | 富葵精密组件(深圳)有限公司 | Method for making circuit board |
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2007
- 2007-11-22 CN CN2007101880437A patent/CN101442901B/en not_active Expired - Fee Related
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| JP平2-246194A 1990.10.01 |
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| CN101442901A (en) | 2009-05-27 |
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Assignee: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. Assignor: BYD Co.,Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: Method for composing multilayer printed circuit board License type: Exclusive license Record date: 20080504 |
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Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14; CHANGE OF CONTRACT Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
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