CN103913471A - Method for examining position alignment of capacitor-embedding layer on capacitor-embedding plate - Google Patents
Method for examining position alignment of capacitor-embedding layer on capacitor-embedding plate Download PDFInfo
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- CN103913471A CN103913471A CN201210593685.6A CN201210593685A CN103913471A CN 103913471 A CN103913471 A CN 103913471A CN 201210593685 A CN201210593685 A CN 201210593685A CN 103913471 A CN103913471 A CN 103913471A
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Abstract
The invention belongs to the field of manufacturing of printed circuit boards, and especially relates to a method for examining position alignment of a capacitor-embedding layer on a capacitor-embedding plate. The method comprises the following steps: finding the dimension of a smallest isolation pad or a welding pad of each capacitor-embedding layer, and respectively making the smallest isolation pads or the welding pads of the layer at blank positions of four corners of each capacitor-embedding layer; enabling the prepared smallest isolation pads or the welding pads on each capacitor-embedding layer to be successively stagger with a set distance in the horizontal direction; after the capacitor-embedding layers and an inner-layer core plate are subjected to pressing and form a multilayer circuit board, according to the set distance to drill holes, so as to form multiple through holes penetrating the smallest isolation pad or the welding pad; and examining the figures of the smallest isolation pad or the welding pads on each capacitor-embedding layer and the inner-layer core plate of the circuit board subjected to hole drilling by employing an X-ray machine, and determining that the layer has no destroyed pads if the figures of the smallest isolation pads or the welding pads have no destroyed pad phenomena. Therefore, the method helps to directly determine whether the pad destroying phenomenon exists and which layer a destroyed pad specially exists at.
Description
Technical field
The invention belongs to field of printed circuit board fabrication, relate in particular to a kind of inspection and bury the method for burying the contraposition of appearance layer on appearance plate.
Background technology
At present, conventional PCB is provided for confirming the square copper point of dislocation on frame, because the square copper spot size size of every layer is the same, even if while there is dislocation, can not confirm specifically broken dish has occurred which layer, need to sign useless plate and go to confirm in plate, increase scrapping of pcb board.
Especially burying capacity materials when very thin,, there is every stacked pattern displacement shade that adds in easily dislocation in PCB process, after boring, cannot intuitive judgment whether break dish when X-ray machine checks, need to examine under a microscope by getting section, need about one hour consuming time.
In sum, existing burying held layer alignment detecting method, be difficult for observing and judge broken dish situation, and scrappage is high.
Summary of the invention
The object of the present invention is to provide a kind of inspection to bury appearance plate and bury the method for holding layer contraposition, be intended to solve the broken dish situation that is difficult for observation and judgement multilayer circuit board in prior art, and multilayer circuit board detects the high problem of scrappage.
The present invention be achieved in that a kind of inspection bury hold plate bury hold layer contraposition method, comprise the following steps:
Find out every layer and bury the minimum trap-out tray or the pad size that hold layer;
Bury the blank position that holds layer four corner in every layer, make respectively minimum trap-out tray or the pad of this layer;
Described in each, bury and hold the upper minimum trap-out tray of making of layer or the figure of pad, the interval distance of a setting that staggers successively in horizontal direction;
Hold layer and form after multilayer circuit board with core material pressing when described respectively burying, according to the distance of described setting, hole, form multiple through holes, described through hole runs through respectively the described minimum trap-out tray or the pad that hold on the upper and described core material of layer of respectively burying;
By the described wiring board completing after boring, under X-ray machine device, check and bury the minimum trap-out tray that holds on layer and described core material or the figure of pad described in each, if the broken dish of the figure of described minimum trap-out tray or pad, this layer breaks and coils.
Further, the figure of described minimum trap-out tray or pad is a square, described foursquare four jiaos of place's roundings, and be provided with a circle in described foursquare center, described diameter of a circle is as the diameter of minimum trap-out tray or pad.
Further, the described foursquare length of side is 5mm, described foursquare four jiaos of fillets that place's reciprocal radius is 1mm.
Further, the distance of described setting is greater than 2mm.
Further, hold layer above in described burying, in the figure of described minimum trap-out tray or pad, only circular portion is not coated with copper metal; On described core material, in the figure of described minimum trap-out tray or pad, only circular portion is coated with copper metal.
Compared with prior art, four jiaos of blank positions that burying described in each in the present invention held layer arrange minimum pad or trap-out tray figure, described minimum pad or the trap-out tray space distance of a setting that staggers held on layer of respectively burying, so, hold layer after described core material pressing formation multilayer circuit board described respectively burying, be drilled with multiple described through holes that hold layer and described core material that respectively bury that run through according to predefined distance, again the multilayer circuit board that is drilled with through hole is checked under X-ray machine device and bury the minimum trap-out tray that holds on layer and described core material or whether broken the coiling of figure of pad described in each, if broken dish, represent described broken dish figure place bury hold layer or core material there is skew.In whole process, can very intuitively judge efficiently the whether broken dish of multilayer circuit board after pressing, and there is broken dish in which layer specifically, and do not needed useless multilayer circuit board label plate to confirm, avoid detected the scrapping of multilayer circuit board of high-quality, greatly improved detection efficiency.
Brief description of the drawings
Fig. 1 buries in the embodiment of the present invention to hold the upper minimum pad of layer or trap-out tray graphical distribution in the schematic diagram of four jiaos of blank positions;
Fig. 2 buries in the embodiment of the present invention to hold the upper minimum pad of layer or trap-out tray graphical distribution in the schematic side view of four jiaos of blank positions;
Fig. 3 is multiple schematic diagram that hold after layer boring that bury in the embodiment of the present invention;
Fig. 4 is the pictorial diagram of minimum pad or trap-out tray in the embodiment of the present invention.
Description of symbols:
1 first buries first surface 11 first pads that hold layer
2 first bury second 21 second pad that holds layer
3 second bury first surface 31 the 3rd pad that holds layer
4 second bury second 41 the 4th pad that holds layer
5 core materials 51 the 5th pad
6 through hole 71 circles
Distributive province 72 squares of 8 minimum pads or trap-out tray
The 9 active graphical district D1 length of sides
10 blank position R radiuss of corner
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Below in conjunction with concrete accompanying drawing, realization of the present invention is described in detail.
As shown in Fig. 1 ~ 4, it is a preferred embodiment provided by the invention.
Inspection in the present invention is buried and is held plate and bury the method for holding layer contraposition, described in bury that to hold the center section of floor be active graphical district 9, its periphery is blank position 10, comprises the following steps:
Find out every layer and bury the minimum trap-out tray or the pad size that hold layer;
Bury the blank position 10 that holds layer four corner in every layer, make respectively minimum trap-out tray or the pad of this layer; As shown in Figure 1, the distributive province 8 of described minimum trap-out tray or pad is positioned at four corners of described blank position 10.
Shown in Figure 2, bury described in each and hold upper minimum trap-out tray or the pad of making of layer, the distance of a setting staggers successively in horizontal direction;
Shown in Figure 3, hold after layer and core material 5 pressings formation multilayer circuit boards when described respectively burying, according to the distance of described setting, hole, form multiple through holes 6, described through hole 6 runs through respectively described respectively burying and holds minimum trap-out tray or the pad of layer above and on described core material 5;
By the described wiring board completing after boring, under X-ray machine device, check and bury the minimum trap-out tray that holds on layer and described core material 5 or the figure of pad described in each, if the broken dish of the figure of described minimum trap-out tray or pad, this layer breaks and coils.
Compared with prior art, four jiaos of blank positions 10 that burying described in each in the present invention held layer arrange minimum shading ring or land pattern, described minimum shading ring or the pad space distance of a setting that staggers held on layer of respectively burying, so, hold after layer and described core material 5 pressings formation multilayer circuit boards described respectively burying, be drilled with multiple described through holes 6 that hold layer and described core material 5 that respectively bury that run through according to predefined distance, again the multilayer circuit board that is drilled with through hole 6 is checked under X-ray machine device and bury the minimum trap-out tray that holds on layer and described core material 5 or whether broken the coiling of figure of pad described in each, if broken dish, represent described broken dish figure place bury hold layer or core material 5 there is skew.In whole process, can very intuitively judge efficiently the whether broken dish of multilayer circuit board after pressing, and there is broken dish in which layer specifically, and do not needed useless multilayer circuit board label plate to confirm, detected the scrapping of multilayer circuit board of having avoided high-quality, provides detection efficiency greatly.
Particularly, in the present embodiment, be provided with two-layer burying and hold layer, every layer is buried appearance layer and has two sides.As shown in Figure 2, from top to bottom, be followed successively by first and bury the first surface 1, first that holds layer and bury and hold second 2, second of layer and bury the first surface 3 and second that holds layer and bury and hold second 4 of layer, and core material 5.Described first bury hold layer first surface 1, first bury hold layer second 2, second bury hold layer first surface 3 and second bury hold layer second 4 and core material 5 on be respectively equipped with the first pad, the second pad, the 3rd pad, the 4th pad and the 5th pad.
Further, the figure of described minimum trap-out tray or pad is a square 72, described foursquare four jiaos of place's roundings, and be provided with a circle in described square 72 center, described diameter of a circle is as the diameter of minimum pad or trap-out tray.By the setting of this structure, in the time there is broken dish, be beneficial to observation, can judge intuitively that broken dish has occurred concrete which layer.
Preferably, shown in Figure 4, described square 72 length of side D1 is 5mm, four jiaos of fillets that the reciprocal radius R of place is 1mm of described square 72.So, tiny design, the production and processing of being more convenient for.Certainly,, according to concrete multiple-plate accuracy requirement, this size can be rationally set.Certainly, the more different needs that hold layer that bury, can rationally arrange described diameter of a circle, and the size of minimum trap-out tray or pad is set.
Further, the distance of described setting is greater than 2mm.So, can avoid the detection between minimum shading ring or the pad between each layer to interfere.Dish is detected and become more directly perceived, reliable.
Further, hold layer above in described burying, in the figure of described minimum trap-out tray or pad, only circular 71 parts are not coated with copper metal and do negativity; On described core material 5, in the figure of described minimum trap-out tray or pad, only circular 71 parts are coated with copper metal.So, described in can distinguishing fast, bury and hold layer and the non-appearance layer that buries, be convenient to judge brokenly and coil in specifically betiding which layer.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (5)
1. inspection is buried appearance plate and is buried a method of holding layer contraposition, it is characterized in that, comprises the following steps:
Find out every layer and bury the minimum trap-out tray or the pad size that hold layer;
Bury the blank position that holds layer four corner in every layer, make respectively minimum trap-out tray or the pad of this layer;
Described in each, bury and hold upper minimum trap-out tray or the pad of making of layer, the interval distance of a setting that staggers successively in horizontal direction;
Hold layer and form after multilayer circuit board with core material pressing when described respectively burying, according to the distance of described setting, hole, form multiple through holes, described through hole runs through respectively the described minimum trap-out tray or the pad that hold on the upper and described core material of layer of respectively burying;
By the described wiring board completing after boring, under X-ray machine device, check and bury the minimum trap-out tray that holds on layer and described core material or the figure of pad described in each, if the broken dish of the figure of described minimum trap-out tray or pad, this layer breaks and coils.
2. a kind of inspection according to claim 1 is buried appearance plate and is buried the method for holding layer contraposition, it is characterized in that: the figure of described minimum trap-out tray or pad is a square, described foursquare four jiaos of place's roundings, and being provided with a circle in described foursquare center, described diameter of a circle is as minimum trap-out tray or pad diameter.
3. a kind of inspection according to claim 2 is buried appearance plate and is buried the method for holding layer contraposition, it is characterized in that: the described foursquare length of side is 5mm described foursquare four jiaos of fillets that place's reciprocal radius is 1mm.
4. a kind of inspection according to claim 3 is buried appearance plate and is buried the method for holding layer contraposition, it is characterized in that: the distance of described setting is greater than 2mm.
5. a kind of inspection according to claim 3 is buried appearance plate and is buried the method for holding layer contraposition, it is characterized in that: hold layer above in described burying, in the figure of described minimum trap-out tray or pad, only circular portion is not coated with copper metal; On described other core material, in the figure of described minimum trap-out tray or pad, only circular portion is coated with copper metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210593685.6A CN103913471B (en) | 2012-12-31 | 2012-12-31 | The method held and plate buries and holds layer contraposition is buried in a kind of inspection |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210593685.6A CN103913471B (en) | 2012-12-31 | 2012-12-31 | The method held and plate buries and holds layer contraposition is buried in a kind of inspection |
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| CN103913471A true CN103913471A (en) | 2014-07-09 |
| CN103913471B CN103913471B (en) | 2016-04-13 |
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| CN201210593685.6A Active CN103913471B (en) | 2012-12-31 | 2012-12-31 | The method held and plate buries and holds layer contraposition is buried in a kind of inspection |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112654141A (en) * | 2020-12-25 | 2021-04-13 | 天津普林电路股份有限公司 | Method for checking alignment between mechanical hole and inner layer pattern |
| CN114614231A (en) * | 2020-12-09 | 2022-06-10 | 深南电路股份有限公司 | Coupler and electronic equipment |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN103913471B (en) | 2016-04-13 |
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Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |