CN101212859A - Method for detecting inter-layer displacement of multi-layer flexible printed circuit board - Google Patents
Method for detecting inter-layer displacement of multi-layer flexible printed circuit board Download PDFInfo
- Publication number
- CN101212859A CN101212859A CNA2006100637814A CN200610063781A CN101212859A CN 101212859 A CN101212859 A CN 101212859A CN A2006100637814 A CNA2006100637814 A CN A2006100637814A CN 200610063781 A CN200610063781 A CN 200610063781A CN 101212859 A CN101212859 A CN 101212859A
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000010410 layer Substances 0.000 title claims description 33
- 239000011229 interlayer Substances 0.000 title claims description 25
- 238000006073 displacement reaction Methods 0.000 title claims description 7
- 238000001514 detection method Methods 0.000 claims description 5
- 239000000047 product Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005755 formation reaction Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000013139 quantization Methods 0.000 description 2
- 238000003556 assay Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Abstract
The invention discloses a method for detecting positional deviation between multilayer flexible printed wiring boards, which includes the following steps: A) a pair of registration marks are respectively arranged at the same position of the layers that need paraposition on the multilayer flexible printed wiring boards; B) the registration marks of layers that need paraposition are compared to judge if the registration marks are at least partially overlapping; if so, the positional deviation among layers are considered to be within an acceptable range; otherwise, the positional deviation among layers are not considered to be within an acceptable range. The registration mark in the step A is a line mark which can detect the deviation amount between two axial locations mutually vertical on a surface; the line width of the line mark has the same size as that of the registration mark which need paraposition. The method can digitally quantify the detecting result; meet the detecting requirement of paraposition of arbitrary precision and improve the detecting efficiency.
Description
Technical field
The present invention relates to a kind of manufacture method of multi-layer flexible printed wiring board, be meant especially in multi-layer flexible printed wiring board manufacturing process and judge the determination methods whether the interlayer position is offset.
Background technology
Along with flexible printed wiring board develops towards high-density trend, the framework of multiple field wiring board is the kenel that the most generally adopts.Each layer of multiple field flexible printed wiring board comprises that upper and lower insulating barrier and therebetween internal layer Copper Foil constitute, and use semi-curing glue as binding agent, with the combination of pressing mode between the layers of material.Wherein, be the state that does not communicate between each layer Copper Foil.Therefore, when being communicated with for the part that makes each layer line road or privileged site, need form through hole by boring, and then through step to the electroplates in hole, make the outer surface of the internal face of through hole and flexible multi-layer circuit board form the electrodeposited coating of suitable thickness, by this electrodeposited coating can make outer copper foil respectively and the overlap joint Copper Foil that is arranged in insulating barrier be communicated on the internal layer circuit.Like this, when each layer line road need be interconnected to the position, top layer, all need to extend to the through hole electrodeposited coating, extend to other layer or position, top layer up or down by through hole again by landscape mode, then, just extend laterally to the desired position by this other layer or top layer.
Therefore, the position accuracy demand between the overlap joint Copper Foil that each layer presets is higher, causes the damage of product electric property in case take place bigger skew will derive open circuit.But be subjected to existing production technology level not high, and factor restrictions such as certain contraction can take place in material in process of production that make flexible printed wiring board, can not guarantee the interlayer alignment entirely accurate, the schematic diagram of skew takes place in Fig. 1 for existing multi-layer flexible printed wiring board interlayer.
The conventional practice of industry is that this offset is controlled in certain scope at present, and adopt as shown in Figure 2 method to judge that the interlayer position offset is whether in tolerance interval: to need at flexible printed wiring board to distinguish etching one circular alignment marks on each layer of contraposition, when contraposition is stacked, the criterion that could accept as the degrees of offset between the alignment mark of each interlayer is that irrelevance and label diameter size compare between mark, as 1st/3rd of irrelevance greater than flag size between mark, unacceptable, the mark irrelevance is smaller or equal to 1st/3rd of mark size, tolerance interval.In the production of reality, the criterion of this digital quantity method of no use needs quality inspection personnel naked eyes to judge, but owing to have certain otherness between different people, its assay also can be uneven, even can judge into defective products by accident non-defective unit.If but all adopted measurer to check irrelevance whether qualified to every flexible printed wiring board, production efficiency could be reduced greatly again.
Summary of the invention
Technical problem to be solved by this invention is to remedy the prior art deficiency, but proposes a kind of method of detection inter-layer displacement of multi-layer flexible printed circuit board of simple digital quantization.
Technical problem of the present invention solves by following scheme:
A kind of method that detects inter-layer displacement of multi-layer flexible printed circuit board comprises the steps:
A) the multi-layer flexible printed wiring board need contraposition the layer on the same position place one contraposition mark is set;
B) relatively need the alignment mark of the interlayer of contraposition whether to have at least and partially overlap,, then think the interlayer skew in tolerance interval,, think that then the interlayer skew is not in tolerance interval as not overlapping fully if any partially overlapping;
It is characterized in that: the alignment mark in the steps A be for detecting the line markings of orthogonal two axial location side-play amounts in the plane, the line thickness of this line markings and needed aligning accuracy measure-alike.
The described line markings that can detect orthogonal two axial location side-play amounts in the plane can be any one in the line markings of shapes such as cross, triangle, square, trapezoidal, rhombus.
But the circle of outer socket or the square housing of the line markings of shapes such as described cross, triangle, square, trapezoidal, rhombus.
The invention has the beneficial effects as follows: because the line thickness of alignment mark and needed aligning accuracy is measure-alike, but so digital quantization testing result, and can satisfy the detection of arbitrary accuracy contraposition requirement, and, its examination criteria whether have intersection just can judge that product is whether in acceptable deviation range between alignment mark because only need comparing, can reduce Capability Requirement greatly to the testing staff, unified examination criteria, and improve detection efficiency.
Description of drawings
The schematic diagram of skew takes place in Fig. 1 for existing multi-layer flexible printed wiring board interlayer;
Fig. 2 judges the whether method schematic diagram in tolerance interval of interlayer position offset for prior art;
Fig. 3 a kind of whether method schematic diagram in tolerance interval of interlayer position offset of judging of the present invention;
Fig. 4 another kind of the present invention is judged the whether method schematic diagram in tolerance interval of interlayer position offset.
Embodiment
Also the present invention is further detailed explanation in conjunction with the accompanying drawings below by specific embodiment.
The present invention needs on each layer of contraposition etching one circular alignment marks respectively at flexible printed wiring board, as shown in Figure 3, this alignment mark is the annular compound token of a socket cross, in this compound token between the line thickness of cross and gas producing formation the required precision of side-play amount identical, requirement at side-play amount between different gas producing formations can design different line thickness, therefore can satisfy the interlayer skew of all products and judge requirement.
For example the size when the pad of the multi-layer flexible printed wiring board of a certain model is 0.60mm, boring 0.20mm, the precision of contraposition is minimum so should be that 0.20mm could guarantee product quality, but some client can propose higher requirement to aligning accuracy, as to require aligning accuracy be 0.10mm, adopt conventional method just to need to use the width of 1/6 pad to judge, but judge with visual whether the skew of two alignment marks is extremely inaccurate in 1/6.But adopt alignment mark of the present invention, only need change the cross width in the alignment mark into 0.10mm from 0.20mm and get final product.
Adopt the alignment mark of Fig. 3, as long as being two cross alignment marks, its criterion to the interlayer offset have intersection can think qualified products, if two cross alignment marks complete from the time think substandard product, like this, quality inspection personnel only need be judged having marked whether from just determining whether interlayer alignment meets the demands between two-layer.Adopt above-mentioned design, the standard of judgement is just more direct, and different operators also can provide right judgement completely.Simultaneously, operator is because traditional criterion needs to estimate that new criterion is because more direct, thereby saved the time of estimating, the judgement speed of operator is greatly improved.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can make some simple deduction or replace, for example, remove the annulus of alignment mark of the present invention periphery, only keep the cross at center, or as shown in Figure 4, change the annulus of periphery into square frame, also can finish identical functions.In addition, adopt the line markings of triangle, square, trapezoidal, rhombus,, and can check the alignment mark of two axial location side-play amounts in the plane all can think simple transformation of the present invention as long as its line thickness is identical with aligning accuracy.
Claims (3)
1. a method that detects inter-layer displacement of multi-layer flexible printed circuit board comprises the steps:
A) the multi-layer flexible printed wiring board need contraposition the layer on the same position place one contraposition mark is set;
B) relatively need the alignment mark of the interlayer of contraposition whether to have at least and partially overlap,, then think the interlayer skew in tolerance interval,, think that then the interlayer skew is not in tolerance interval as not overlapping fully if any partially overlapping;
It is characterized in that: the alignment mark in the steps A be for detecting the line markings of orthogonal two axial location side-play amounts in the plane, the line thickness of this line markings and needed aligning accuracy measure-alike.
2. the method for detection inter-layer displacement of multi-layer flexible printed circuit board as claimed in claim 1 is characterized in that: the described line markings that can detect orthogonal two axial location side-play amounts in the plane can be wherein a kind of in the line markings of shapes such as cross, triangle, square, trapezoidal, rhombus.
3. the method for detection inter-layer displacement of multi-layer flexible printed circuit board as claimed in claim 2 is characterized in that: but the circle of periphery socket or the square housing of the line markings of shape such as described cross, triangle, square, trapezoidal, rhombus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610063781A CN100596253C (en) | 2006-12-31 | 2006-12-31 | Method for detecting inter-layer displacement of multi-layer flexible printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610063781A CN100596253C (en) | 2006-12-31 | 2006-12-31 | Method for detecting inter-layer displacement of multi-layer flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
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| CN101212859A true CN101212859A (en) | 2008-07-02 |
| CN100596253C CN100596253C (en) | 2010-03-24 |
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| CN200610063781A Expired - Fee Related CN100596253C (en) | 2006-12-31 | 2006-12-31 | Method for detecting inter-layer displacement of multi-layer flexible printed circuit board |
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Cited By (16)
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| CN101907454A (en) * | 2010-07-06 | 2010-12-08 | 竞华电子(深圳)有限公司 | Method for measuring expansion and shrinkage of printed circuit board, and printed circuit board |
| CN101646304B (en) * | 2008-08-05 | 2011-04-20 | 比亚迪股份有限公司 | Alignment method for printed circuit board |
| CN102032885A (en) * | 2010-08-31 | 2011-04-27 | 北大方正集团有限公司 | Printed circuit board, method and device for detecting layer-to-layer registration of circuit graphs at two surfaces thereof |
| CN102072716A (en) * | 2010-12-21 | 2011-05-25 | 胜宏科技（惠州）有限公司 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
| CN102607368A (en) * | 2012-03-20 | 2012-07-25 | 昆山鼎鑫电子有限公司 | Laser drilling deviation inspection method for HDI (High Density Interconnection) plate |
| CN103256905A (en) * | 2012-02-16 | 2013-08-21 | 华孚精密金属科技(常熟)有限公司 | Method and structure of detection of die casting code spraying position deviation |
| CN103900475A (en) * | 2013-11-22 | 2014-07-02 | 大连太平洋电子有限公司 | Laser blind hole and through hole alignment precision detection method |
| CN103913471A (en) * | 2012-12-31 | 2014-07-09 | 深南电路有限公司 | Method for examining position alignment of capacitor-embedding layer on capacitor-embedding plate |
| CN104244590A (en) * | 2014-08-28 | 2014-12-24 | 广州兴森快捷电路科技有限公司 | Control method of outer layer deviation of circuit boards |
| CN104677279A (en) * | 2015-03-06 | 2015-06-03 | 业成光电（深圳）有限公司 | Method for confirming outline dimension of base plate |
| CN105407637A (en) * | 2015-12-23 | 2016-03-16 | 珠海市联决电子有限公司 | Flexible printed circuit (FPC) jointed board and jointed board design method thereof |
| CN103175456B (en) * | 2011-12-21 | 2016-03-30 | 北大方正集团有限公司 | The method of detection contraposition skew and PCB are in making sheet |
| CN103256905B (en) * | 2012-02-16 | 2016-11-30 | 华孚精密金属科技(常熟)有限公司 | On die casting coding position skew detection method and structure |
| CN109737878A (en) * | 2018-12-29 | 2019-05-10 | 广州兴森快捷电路科技有限公司 | The measurement method and measuring system of interlayer offset |
| JP2020136351A (en) * | 2019-02-14 | 2020-08-31 | 大日本印刷株式会社 | Wiring board and manufacturing method thereof |
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2006
- 2006-12-31 CN CN200610063781A patent/CN100596253C/en not_active Expired - Fee Related
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| CN101646304B (en) * | 2008-08-05 | 2011-04-20 | 比亚迪股份有限公司 | Alignment method for printed circuit board |
| CN101907454A (en) * | 2010-07-06 | 2010-12-08 | 竞华电子(深圳)有限公司 | Method for measuring expansion and shrinkage of printed circuit board, and printed circuit board |
| CN102032885A (en) * | 2010-08-31 | 2011-04-27 | 北大方正集团有限公司 | Printed circuit board, method and device for detecting layer-to-layer registration of circuit graphs at two surfaces thereof |
| CN102032885B (en) * | 2010-08-31 | 2013-05-15 | 北大方正集团有限公司 | Printed circuit board, method and device for detecting layer-to-layer registration of circuit graphs at two surfaces thereof |
| CN102072716A (en) * | 2010-12-21 | 2011-05-25 | 胜宏科技（惠州）有限公司 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
| CN102072716B (en) * | 2010-12-21 | 2012-05-23 | 胜宏科技（惠州）有限公司 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
| CN103175456B (en) * | 2011-12-21 | 2016-03-30 | 北大方正集团有限公司 | The method of detection contraposition skew and PCB are in making sheet |
| CN103256905A (en) * | 2012-02-16 | 2013-08-21 | 华孚精密金属科技(常熟)有限公司 | Method and structure of detection of die casting code spraying position deviation |
| CN103256905B (en) * | 2012-02-16 | 2016-11-30 | 华孚精密金属科技(常熟)有限公司 | On die casting coding position skew detection method and structure |
| CN102607368A (en) * | 2012-03-20 | 2012-07-25 | 昆山鼎鑫电子有限公司 | Laser drilling deviation inspection method for HDI (High Density Interconnection) plate |
| CN103913471A (en) * | 2012-12-31 | 2014-07-09 | 深南电路有限公司 | Method for examining position alignment of capacitor-embedding layer on capacitor-embedding plate |
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| CN109737878A (en) * | 2018-12-29 | 2019-05-10 | 广州兴森快捷电路科技有限公司 | The measurement method and measuring system of interlayer offset |
| JP2020136351A (en) * | 2019-02-14 | 2020-08-31 | 大日本印刷株式会社 | Wiring board and manufacturing method thereof |
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| CN100596253C (en) | 2010-03-24 |
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Assignee: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. Assignor: BYD Co.,Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: Method for detecting inter-layer displacement of multi-layer flexible printed circuit board License type: Exclusive license Record date: 20080504 |
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Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen helitai photoelectric Co.,Ltd. Address before: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee before: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. |
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