CN101907454A - Method for measuring expansion and shrinkage of printed circuit board, and printed circuit board - Google Patents
Method for measuring expansion and shrinkage of printed circuit board, and printed circuit board Download PDFInfo
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- CN101907454A CN101907454A CN 201010220059 CN201010220059A CN101907454A CN 101907454 A CN101907454 A CN 101907454A CN 201010220059 CN201010220059 CN 201010220059 CN 201010220059 A CN201010220059 A CN 201010220059A CN 101907454 A CN101907454 A CN 101907454A
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- inner plating
- wiring board
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Abstract
The invention discloses a method for measuring expansion and shrinkage of a printed circuit board, and the printed circuit board. The printed circuit board comprises two outer layer boards and at least two inner layer boards arranged between the two outer layer boards, wherein each side of each inner layer board is provided with a test point, and test points on opposite sides of each inner layer board are positioned in the same horizontal line or vertical line. Each side of each inner layer board is provided with the test point, the test points on the opposite sides of each inner layer board are positioned in the same horizontal line or vertical line, after the inner layer boards are pressed, whether the two test points of two opposite sides of each inner layer board are expanded or shrunk is measured, the expansion and shrinkage data can be accurately measured, and data support is provided for the subsequent adjustment or modification of inner layer film compensation; therefore, the adverse effect of the circuit board caused by expansion and shrinkage can be effectively improved and the rejection rate of the circuit board is reduced.
Description
Technical field
The present invention relates to the wiring board manufacturing technology, particularly a kind of harmomegathus measuring method and printed-wiring board (PWB) thereof of printed-wiring board (PWB).
Background technology
Printed-wiring board (PWB) is generally formed by the pressing of polylith plank, and the two-layer plank of outermost generally plays insulation and protective effect, and middle multilayer plank is an inner plating, and it is provided with the physical circuit of wiring board.When producing wiring board, earlier the polylith inner plating is pressed into a plank by press equipment, then with the sub-pressing of outer field two boards.Yet when the inner plating pressing, harmomegathus can appear in one deck in the inner plating or multilayer, causes the wiring board produced bad, even scraps.
See also Fig. 1, the general employing of prior art is provided with a circular test point in four jiaos of relevant positions of each layer inner plating, behind circuit board pressing, these circular test points can form a donut, then, according to the ring of donut and the distance between the ring, check whether layer reaches harmomegathus to inner plating partially, can detect which layer inner plating like this and harmomegathus occur, but this method can not be measured the data of every layer of actual harmomegathus of other inner plating, therefore, this method can not provide the data support to follow-up change internal layer film compensation.
Thereby the harmomegathus measuring technique of existing line plate is still waiting to improve and improve.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art part, the object of the present invention is to provide a kind of harmomegathus measuring method and printed-wiring board (PWB) thereof of printed-wiring board (PWB), can accurately measure the data that harmomegathus appears in inner plating.
In order to achieve the above object, the present invention has taked following technical scheme:
A kind of harmomegathus measuring method of printed-wiring board (PWB), wherein, this method may further comprise the steps:
A, provide at least two inner platings;
B, on each bar limit of described inner plating, test point is set, and the test point on the relative edge of each layer inner plating is on same horizontal linear or vertical line;
C, with described inner plating pressing;
Whether D, the test point that adopts measuring equipment to detect on the relative edge of each inner plating harmomegathus occurs; If, execution in step E then, otherwise end operation;
E, measure the data of inner plating harmomegathus, and occur the inner plating of harmomegathus according to this data adjustment or replacing.
The harmomegathus measuring method of described printed-wiring board (PWB), wherein, described step B also comprises:
The layer of employing numeral or sign flag inner plating is not near each test point.
The harmomegathus measuring method of described printed-wiring board (PWB), wherein, described step C specifically comprises:
Cl, loci is set in the corresponding position of each inner plating;
C2, be reference point with this loci, and by press equipment with described inner plating pressing.
The harmomegathus measuring method of described printed-wiring board (PWB), wherein, described test point adopts Copper Foil to make.
The harmomegathus measuring method of described printed-wiring board (PWB), wherein, described measuring equipment is the XZ sheeting machine.
The harmomegathus measuring method of described printed-wiring board (PWB), wherein, described loci adopts Copper Foil to make.
A kind of printed-wiring board (PWB), it comprises two lamina rara externas and is arranged at least two inner platings between two lamina rara externas, wherein, each bar limit of each inner plating is provided with test point, and the test point on the relative edge of each inner plating is positioned on same horizontal linear or the vertical line.
Described printed-wiring board (PWB) wherein, is provided with expression internal layer other numeral of flaggy or symbol near each test point.
Described printed-wiring board (PWB), wherein, the relevant position on each inner plating is provided with loci.
Described printed-wiring board (PWB), wherein, described test point is circular.
The harmomegathus of printed-wiring board (PWB) provided by the invention is measured and printed-wiring board (PWB), owing to adopted on each the bar limit on each inner plating test point be set, test point on two relative edges on each inner plating is on same horizontal linear or vertical line, after the inner plating pressing, whether two test points measuring two relative edges of each inner plating have harmomegathus, and can accurately measure the data of its harmomegathus, for follow-up adjustment or the compensation of the change internal layer film provide the data support, thereby can improve the wiring board that causes because of harmomegathus is bad, reduce the scrappage of wiring board.
Description of drawings
Fig. 1 is the structural representation of prior art wiring board;
Fig. 2 is the sectional view of wiring board of the present invention;
Fig. 3 is the structural representation of the inner plating of wiring board of the present invention;
The method flow diagram that Fig. 4 measures for wiring board harmomegathus of the present invention.
Embodiment
The invention provides a kind of harmomegathus measuring method and printed-wiring board (PWB) thereof of printed-wiring board (PWB), clearer, clear and definite for making purpose of the present invention, technical scheme and effect, below develop simultaneously with reference to accompanying drawing that the present invention is described in more detail for embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
See also Fig. 2 and Fig. 3, printed-wiring board (PWB) provided by the invention comprises two lamina rara externas 110 and at least two inner platings 120.Described inner plating 120 is arranged between two lamina rara externas 110, has the physical circuit of printed-wiring board (PWB) on it.
In the present embodiment, described printed-wiring board (PWB) is a rectangular slab, and it comprises four inner platings 120.Each bar limit of each layer inner plating 120 is provided with a test point 121, and the test point on the relative edge of each layer inner plating 120 is positioned on same horizontal linear or the vertical line.
Also can be understood as: be provided with a test point 121 on the limit of each bar paralleled by X axis direction of inner plating 120, and the line between two test points is parallel with ordinate (being Y-axis), correspondingly, the limit of each bar equality Y direction of inner plating 120 is provided with a test point 121, and the line between these two test points is parallel with the Z axle.After the inner plating pressing, each other test point of layer is corresponding in twos in X-direction or Y direction, can detect the test point of X-direction and whether the test point of Y direction has deviation by measuring equipment like this, and measure the data of its deviation.
Please continue to consult Fig. 3, in order to discern the inner plating that harmomegathus occurs, the present invention adopts expression internal layer other numeral of flaggy or symbol is set near each test point.For example present embodiment adopts the next door reference numerals " 2 " in the test point of ground floor inner plating, next door reference numerals " 3 " in the test point of second layer inner plating, and the like, when harmomegathus appears in inner plating, can very fast picking out be that harmomegathus has appearred in which other inner plating of layer like this.
Certainly, in other embodiments, this test point can also adopt different color marks, as long as the staff can discern its layer not.
When the inner plating pressing, inner plating is located for convenience, and the present invention adopts in the corresponding position of each inner plating at least one pair of site 12 2 is set, and this loci can be used as the reference point of inner plating location.And also be provided with the pilot hole 123 that is used to locate on the printed-wiring board (PWB), when inner plating and lamina rara externa pressing, locate.
Based on above-mentioned printed-wiring board (PWB), the also corresponding harmomegathus measuring method that a kind of printed-wiring board (PWB) is provided of the embodiment of the invention sees also Fig. 4, and described method may further comprise the steps:
S401, provide at least two inner platings, present embodiment adopts four inner platings;
S402, on each bar limit of described inner plating, test point is set, and the test point on the relative edge of each layer inner plating is on same horizontal linear or vertical line;
On the limit of each inner plating directions X and Y direction test point is set, this test point is circular, and preferably is positioned at the centre position on each bar limit, and is connected to horizontal linear or vertical line between the test point on two relative edges of inner plating.
In the present embodiment, described test point adopts Copper Foil to make, and to each Copper Foil test point with the layer of numeral or this inner plating of sign flag not, distinguishes its layer not when being convenient to follow-up measurement harmomegathus value.
S403, with described inner plating pressing; Present embodiment specifically comprises:
A, loci is set, and this loci adopts Copper Foil in the corresponding position of each inner plating.
B, be reference point with this loci, and by press equipment with described inner plating pressing; After the inner plating pressing, the circular test point on each bar limit is arranged and is straight line, is convenient to follow-up measurement.
Whether S404, two test points that adopt measuring equipment to detect on the relative edge of each inner plating harmomegathus occurs; If, execution in step S405 then, otherwise end operation;
When measuring, whether two points that adopt XZ sheeting machine (XZ represents the model of sheeting machine) to measure respectively on each inner plating directions X and the Y direction deviation occurs, if there is not deviation, show that then harmomegathus does not appear in wiring board, finish measuring operation this moment, if deviation is arranged then execution in step S405.
S405, measure the data of inner plating harmomegathus, and the inner plating of harmomegathus occurs according to this data adjustment or replacing, execution in step S401 again is not till inner plating has harmomegathus.
In sum, the harmomegathus of printed-wiring board (PWB) provided by the invention is measured and is printed its wiring board, owing to adopted on each the bar limit on each inner plating test point be set, and the test point on two relative edges is on same horizontal linear or vertical line, after the inner plating pressing, whether two test points measuring two relative edges of each inner plating have harmomegathus, and can accurately measure the data of its harmomegathus, for follow-up adjustment or the compensation of the change internal layer film provide the data support, thereby can improve the wiring board that causes because of harmomegathus is bad, reduce the scrappage of wiring board.
Be understandable that, for those of ordinary skills, can be equal to replacement or change according to technical scheme of the present invention and inventive concept thereof, and all these changes or replacement all should belong to the protection domain of the appended claim of the present invention.
Claims (10)
1. the harmomegathus measuring method of a printed-wiring board (PWB) is characterized in that, this method may further comprise the steps:
A, provide at least two inner platings;
B, on each bar limit of described inner plating, test point is set, and the test point on the relative edge of each layer inner plating is on same horizontal linear or vertical line;
C, with described inner plating pressing;
Whether D, the test point that adopts measuring equipment to detect on the relative edge of each inner plating harmomegathus occurs; If, execution in step E then, otherwise end operation;
E, measure the data of inner plating harmomegathus, and occur the inner plating of harmomegathus according to this data adjustment or replacing.
2. the harmomegathus measuring method of printed-wiring board (PWB) according to claim 1 is characterized in that, described step B also comprises:
The layer of employing numeral or sign flag inner plating is not near each test point.
3. the harmomegathus measuring method of printed-wiring board (PWB) according to claim 1 is characterized in that, described step C specifically comprises:
Cl, loci is set in the corresponding position of each inner plating;
C2, be reference point with this loci, and by press equipment with described inner plating pressing.
4. the harmomegathus measuring method of printed-wiring board (PWB) according to claim 1 is characterized in that, described test point adopts Copper Foil to make.
5. the harmomegathus measuring method of printed-wiring board (PWB) according to claim 1 is characterized in that, described measuring equipment is the XZ sheeting machine.
6. the harmomegathus measuring method of printed-wiring board (PWB) according to claim 3 is characterized in that, described loci adopts Copper Foil to make.
7. printed-wiring board (PWB), it comprises two lamina rara externas and is arranged at least two inner platings between two lamina rara externas, it is characterized in that each bar limit of each inner plating is provided with test point, and the test point on the relative edge of each inner plating is positioned on same horizontal linear or the vertical line.
8. printed-wiring board (PWB) according to claim 7 is characterized in that, is provided with expression internal layer other numeral of flaggy or symbol near each test point.
9. printed-wiring board (PWB) according to claim 7 is characterized in that the relevant position on each inner plating is provided with loci.
10. printed-wiring board (PWB) according to claim 7 is characterized in that, described test point is circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010220059 CN101907454A (en) | 2010-07-06 | 2010-07-06 | Method for measuring expansion and shrinkage of printed circuit board, and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010220059 CN101907454A (en) | 2010-07-06 | 2010-07-06 | Method for measuring expansion and shrinkage of printed circuit board, and printed circuit board |
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| CN101907454A true CN101907454A (en) | 2010-12-08 |
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| CN 201010220059 Pending CN101907454A (en) | 2010-07-06 | 2010-07-06 | Method for measuring expansion and shrinkage of printed circuit board, and printed circuit board |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102072716A (en) * | 2010-12-21 | 2011-05-25 | 胜宏科技（惠州）有限公司 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
| CN106061106A (en) * | 2016-08-04 | 2016-10-26 | 高德（江苏）电子科技有限公司 | Method for monitoring expansion-contraction matching degree of different internal-layer core plates |
| CN106852030A (en) * | 2017-03-14 | 2017-06-13 | 奥士康精密电路（惠州）有限公司 | A kind of method of determination PCB internal layer film penalty coefficients |
| CN107105579A (en) * | 2017-05-26 | 2017-08-29 | 东莞翔国光电科技有限公司 | A kind of lamp bar Special circuit board runs the solution of net |
| CN107148170A (en) * | 2017-06-27 | 2017-09-08 | 奥士康精密电路（惠州）有限公司 | A kind of core material riveting bad method partially in reduction PCB multilayer board |
| CN111629510A (en) * | 2020-05-29 | 2020-09-04 | 珠海新业电子科技有限公司 | Method for controlling expansion and contraction of panel |
| CN112895691A (en) * | 2021-01-18 | 2021-06-04 | 景旺电子科技(珠海)有限公司 | Printing screen and manufacturing method thereof |
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| US4510446A (en) * | 1982-11-03 | 1985-04-09 | Burroughs Corporation | Test coupons for determining the registration of subsurface layers in a multilayer printed circuit board |
| US5093183A (en) * | 1990-09-13 | 1992-03-03 | Sundstrand Corporation | Printed circuit board with layer and order of assembly identification |
| CN2587131Y (en) * | 2002-10-25 | 2003-11-19 | 楠梓电子股份有限公司 | Aligning degree and expansion-contraction degree measuring construction for multiple-layer printed circuit board |
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| CN101022700A (en) * | 2007-03-19 | 2007-08-22 | 友达光电股份有限公司 | Printing circuit board and method for testing anisotropic conducting membrance |
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| CN101212859A (en) * | 2006-12-31 | 2008-07-02 | 比亚迪股份有限公司 | Method for detecting inter-layer displacement of multi-layer flexible printed circuit board |
| CN101662895A (en) * | 2008-08-25 | 2010-03-03 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board, manufacturing method thereof and method for detecting alignment of circuit board |
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| US4510446A (en) * | 1982-11-03 | 1985-04-09 | Burroughs Corporation | Test coupons for determining the registration of subsurface layers in a multilayer printed circuit board |
| US5093183A (en) * | 1990-09-13 | 1992-03-03 | Sundstrand Corporation | Printed circuit board with layer and order of assembly identification |
| CN2587131Y (en) * | 2002-10-25 | 2003-11-19 | 楠梓电子股份有限公司 | Aligning degree and expansion-contraction degree measuring construction for multiple-layer printed circuit board |
| CN2742447Y (en) * | 2004-10-22 | 2005-11-23 | 自然兴电通科技股份有限公司 | Printed circuit board test tool with telescopic regulating mechanism |
| CN101025398A (en) * | 2006-02-20 | 2007-08-29 | 牧德科技股份有限公司 | Hollow-bulge analyzing method for micro-pore after filled by copper |
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| CN101022700A (en) * | 2007-03-19 | 2007-08-22 | 友达光电股份有限公司 | Printing circuit board and method for testing anisotropic conducting membrance |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102072716A (en) * | 2010-12-21 | 2011-05-25 | 胜宏科技（惠州）有限公司 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
| CN102072716B (en) * | 2010-12-21 | 2012-05-23 | 胜宏科技（惠州）有限公司 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
| CN106061106A (en) * | 2016-08-04 | 2016-10-26 | 高德（江苏）电子科技有限公司 | Method for monitoring expansion-contraction matching degree of different internal-layer core plates |
| CN106061106B (en) * | 2016-08-04 | 2018-10-12 | 高德（江苏）电子科技有限公司 | A method of each level core material harmomegathus matching degree of monitoring |
| CN106852030A (en) * | 2017-03-14 | 2017-06-13 | 奥士康精密电路（惠州）有限公司 | A kind of method of determination PCB internal layer film penalty coefficients |
| CN106852030B (en) * | 2017-03-14 | 2019-04-12 | 奥士康精密电路（惠州）有限公司 | A kind of method of determining PCB internal layer film penalty coefficient |
| CN107105579A (en) * | 2017-05-26 | 2017-08-29 | 东莞翔国光电科技有限公司 | A kind of lamp bar Special circuit board runs the solution of net |
| CN107148170A (en) * | 2017-06-27 | 2017-09-08 | 奥士康精密电路（惠州）有限公司 | A kind of core material riveting bad method partially in reduction PCB multilayer board |
| CN107148170B (en) * | 2017-06-27 | 2019-05-24 | 奥士康精密电路（惠州）有限公司 | A kind of partially undesirable method of core material riveting in reduction PCB multilayer board |
| CN111629510A (en) * | 2020-05-29 | 2020-09-04 | 珠海新业电子科技有限公司 | Method for controlling expansion and contraction of panel |
| CN112895691A (en) * | 2021-01-18 | 2021-06-04 | 景旺电子科技(珠海)有限公司 | Printing screen and manufacturing method thereof |
| CN112895691B (en) * | 2021-01-18 | 2022-08-23 | 景旺电子科技(珠海)有限公司 | Printing screen and manufacturing method thereof |
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Application publication date: 20101208 |