CN101211384A - Method for establishing electric impedance control line - Google Patents
Method for establishing electric impedance control line Download PDFInfo
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- CN101211384A CN101211384A CNA2007101651353A CN200710165135A CN101211384A CN 101211384 A CN101211384 A CN 101211384A CN A2007101651353 A CNA2007101651353 A CN A2007101651353A CN 200710165135 A CN200710165135 A CN 200710165135A CN 101211384 A CN101211384 A CN 101211384A
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- control line
- impedance control
- electric impedance
- setting
- perforation
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Abstract
The invention discloses a method for establishing impendence control wires; the method is used in a multi-layered PCB. First of all, connect with a database for impendence control wires; the impendence control wire database stores a plurality of impendence control wires and a group of defined parameter values corresponding to all impendence control wires. Then, input a group of the parameter values that respectively include a layer of values, a board thickness value, a wire width value as well as a space value. After that, perform comparison between the input group of the parameter values and the defined parameter values in the impendence control wire database, so as to gain a group of defined parameter values that are complied with and corresponding impendence control wires. Moreover, arrange the acquired impendence control wires into a layer of the multi-layered PCB.
Description
Technical field
The present invention relates to a kind of method of the wiring on multilayer board, particularly relate to a kind of electric impedance control line (Coupon Bar) and database (Coupon Bar Library) thereof set up, in order to the method for efficient circuit wiring.
Background technology
In recent years, because the fast development of electronics technology and semiconductor subassembly, circuit design and the function that is provided have had significant progress, industry constantly on the circuit design towards more developing on high-density wiring and the multi-functional wires design.And the coupled computer wiring software is to reach fast and the wiring technique that can simulate.
But in practise announcing line technology, relevant speciality personnel use that its individual skill is connected up and whether measuring circuit connects correctly, can expend great amount of manpower and a large amount of time and do and connect up and the step of debug.And because the wiring density of circuit design constantly increases now, it is relatively more difficult therefore to utilize people's power wiring usually can cause in human error and the debug.And above-mentioned human error, the not high problem of fabrication yield in the time of then can causing circuit to produce, and must repeat to wash the step of plate and wiring, this must increase manufacturing cost.
In addition, because in the known technology, wiring is usually because of the experience wiring of relevant speciality personnel according to the individual, therefore, relative, the personnel that newly advance usually lack experience, and make industry need spended time training and correction, or experienced relevant speciality personnel can't continue to take the post as, and then cause the influence on the technology easily.In addition, professional also Chang Yinwei individual uses and to design custom different, and the testing impedance circuit of the previous design of individual is brought use, and this kind be because everyone habit difference, and can't share with other people, will cause the dual waste of manpower and technical resource.
Summary of the invention
The objective of the invention is to set up standardized electric impedance control line, and compile and form an electric impedance control line database, utilize people's power wiring and debug in the known technology merely and expend a large amount of manpower time and increase the problem of processing procedure cost in order to solve.
To achieve these goals, the invention provides a kind of method of setting up electric impedance control line, be applied to a multilayer board, it includes following steps, at first be connected to an electric impedance control line database, and the electric impedance control line database storage has a large amount of electric impedance control lines and a large amount of setup parameter value, and each electric impedance control line is corresponding to one group of setup parameter value; Then import one group of parameter value, it is respectively a thickness of slab value of expression one deck numerical value that multilayer board had, each layer circuit board thickness of expression multilayer board, a line width values and the expression that expression is laid in the impedance line width on the multilayer board is distributed in the distance values between the impedance line on this multilayer board; Setup parameter value and the pairing electric impedance control line thereof that the group parameter value obtains being consistent with this group setup parameter value put in order in contrast again; And resulting electric impedance control line is laid in multilayer board wherein on the laminate.
The electric impedance control line database that provided is provided effect of the present invention, because its most electric impedance control lines with standardized format are formed, and centrally have most impedance lines that duplicate from circuit region, thereby, the function that electric impedance control line provided, not only make the relevant speciality personnel directly the impedance line in the self-impedance control line measure, and reduction causes human error because of the circuit region circuit is too complicated, also can be and make complicated wiring directly in database, to choose by compiling of database, and save time and the good technical succession is provided.Therefore, the present invention can effectively reduce manpower, waste of time, the artificial error of wiring and reduce the technology cost of manufacture.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Figure 1A is the decomposing schematic representation of multilayer board;
Figure 1B is the synoptic diagram with circuit board of electric impedance control line;
Fig. 2 is a method flow diagram of setting up electric impedance control line of the present invention;
Fig. 3 A is the synoptic diagram of electric impedance control line of the present invention;
Fig. 3 B is a thin portion method flow diagram of setting up electric impedance control line; And
Fig. 4 is for using the method flow diagram of electric impedance control line database of the present invention.
Wherein, Reference numeral:
10 top layers
20 bottoms
30 ground planes
40 signals layers
41 circuit regions
42 test sections
50 bus planes
100 electric impedance control lines
110 frames
120 impedance lines
130 ground protection frames
140 circular perforations
150 square perforation
160 first font formats
170 second font formats
Embodiment
At first, please refer to Figure 1A and Figure 1B, Figure 1A is the decomposing schematic representation of multilayer board.Figure 1B is the synoptic diagram with circuit board of testing impedance line.Present embodiment is an example with eight layer printed circuit boards, wherein includes top layer 10, bottom 20, most ground planes 30, most individual signals layer 40 and bus planes 50.And each layer is provided with the wiring of meticulous connection.And shown in Figure 1B, in the present invention, with a signals layer 40 is example, signals layer 40 has circuit region 41 and test section 42,41 of circuit regions have the meticulous wiring that is connected to each layer, groundwork zone for signals layer 40 circuit boards, and test section 42 is provided with most electric impedance control lines 100, with circuit region 41 common grounds, but does not directly electrically connect, when circuit of circuit region 41 configurations, then can be replicated in simultaneously in the test section 42, therefore when detecting, the impedance that can directly measure the same line that duplicates from circuit region 41 in the test section 42 gets final product, and do not need to the circuit region 41 of complexity, to measure, to increase the accuracy of measuring.
Then, please refer to Fig. 2, be the method flow diagram of setting up electric impedance control line of the present invention.The method of setting up electric impedance control line of the present invention at first, one multilayer board that will use electric impedance control line 100 is connected in the electric impedance control line database of presetting, wherein stores a large amount of electric impedance control lines 100 and each electric impedance control line 100 corresponding one group of setup parameter value (step 100) in the electric impedance control line database.Then, the user can import one group of parameter value, and this group parameter value is respectively a thickness of slab value of expression one deck numerical value that multilayer board had, each layer circuit board thickness of expression multilayer board, a line width values and the expression that expression is laid in the impedance line width on the multilayer board is laid in the distance values (step 110) between the impedance line on the multilayer board.Contrast one group of parameter value being imported again, with setup parameter value stored in the electric impedance control line database, if meet the one group of pairing electric impedance control line 100 of setup parameter value (step 120) that then obtains meeting.Resulting electric impedance control line 100 is laid on the wherein laminate of multilayer board (step 130).
Please refer to Figure 1A, Fig. 3 A and Fig. 3 B, Fig. 3 A is the synoptic diagram of electric impedance control line of the present invention, and Fig. 3 B is a thin portion method flow diagram of setting up electric impedance control line.At first, as shown in Figure 3A, the present invention is applied on the circuit design of multilayer board of computing machine wiring software.Electric impedance control line 100 of the present invention includes frame 110, impedance line 120, ground protection frame 130, circular perforations 140, square perforation 150, first font format 160 and second font format 170.
And set up the method for electric impedance control line database; at first; set up the electric impedance control line 100 (step 200) of designated length at signals layer 40; and perforation is set respectively at the two ends of electric impedance control line 100; and make impedance line 120 be electrically connected to signals layer 40 and ground plane 30 (step 210) respectively by means of perforation; and at least one ground protection frame 130 is set; the ground protection frame have a specified width, which width and with impedance line 120 at a distance of a specific range (step 220); indicate the side of a resistance value again in electric impedance control line 100; it represents the impedance of impedance line 120; and the resistance value that indicates has one first font format 160 (step 230); and indicate one deck and be not worth in the particular orientation of perforation, the layer of sign not value has one second font format 170 (step 240).
Wherein, refer again to Fig. 3 A; the designated length of frame 110 is set at 3 inch; and the inner edge at frame 110 is provided with the ground protection frame 130 with a specified width, which width; impedance line 120 is surrounded, and the distance of 20 Mills (mil, per mille inch) is arranged apart from impedance line 120; the specified width, which width of itself is 20 Mills also, and ground protection frame 130 can unexpectedly not be electrically connected to circuit region 41 in order to guarantee circuit.And the two ends up and down at Fig. 3 A middle impedance control line 100 are respectively arranged with square perforation 150 and circular perforations 140, and are other in order to other layer that circuit is connected to multilayer circuit board.Wherein square perforation 150 is in order to being connected to ground plane 30, and has a square pad and be arranged at square perforation 150 and ground plane 30 places, and circular perforations 140 is in order to being connected to another signals layer 40, and has a circular pad in circular perforations 140 and another signals layer 40 places.
Then, indicate resistance value in the step of electric impedance control line 100, the resistance value that indicates has first font format 160, and wherein first font format 160 includes a word height (Height), a breadth length ratio (Aspectratio) and one thick (Stroke width).Setting the word height in the present embodiment is 0.045 inch, and breadth length ratio is 0.7 (being that word length is that then word is wide is 0.7 unit in 1 unit), and used pen slightly is 0.006 inch.Though the word height of present embodiment, breadth length ratio, pen are thick etc. sets as above-mentioned value, be not in order to limiting embodiments of the present invention, this setting value can be adjusted according to user's demand.
In addition, also be provided with not value of square and circular perforations 150,140 is connected the layer of representative at a side-lower square and circular perforations 150,140, and the layer not sign of value has second font format 170, and it is same, second font format 170 includes another word height (Height), another breadth length ratio (Aspect ratio) and another pen thick (Stroke width), yet second font format 170 is different from first font format 160.And the word height of setting second font format 170 in present embodiment is 0.04 inch, and breadth length ratio is 0.5 (being that word length is that then word is wide is 0.5 unit in 1 unit), and used pen slightly is 0.006 inch.
Yet the method for setting up impedance Control bar database of the present invention not only in order to increase the accuracy that measures, also has effectiveness as described below.
Please refer to Fig. 4, for using the method flow diagram of impedance Control bar database of the present invention.Set up in the manner described above and indicate when electric impedance control line 100, then can form the electric impedance control line database.Then, the user can be according to the design of needs and coupled computer software, can directly choose the wherein one group of electric impedance control line 100 in the electric impedance control line database and is distributed on the circuit board, and its step as shown in Figure 4.At first, open a board structure of circuit (step 300) earlier, read electric impedance control line tabulation (step 310) again in the self-impedance control line database, then choose one group of electric impedance control line 100 and recover its ASCII (ASC II) (step 320), open each layer (step 330) of multilayer circuit board again, and according to each layer must configuration add selected electric impedance control line 100 (step 340), therefore can reduce the problem that the relevant speciality personnel cause because of artificial carelessness greatly when wiring.
Electric impedance control line database provided by the present invention, owing to formed by most electric impedance control lines, and centrally have most impedance lines that duplicate from circuit region, thereby, the function that the impedance Control bar is provided, not only make the relevant speciality personnel directly the impedance line in the self-impedance control strip measure, reduction easily causes human error because of the circuit region circuit is too complicated, also can be and make complicated wiring directly in database, to choose by compiling of database, and save time and the good technical succession is provided.Therefore, the present invention can effectively reduce manpower, waste of time, the artificial error of wiring and reduce the technology cost of manufacture.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (10)
1. a method of setting up electric impedance control line is applied to a multilayer board, it is characterized in that, this method of setting up electric impedance control line includes following steps:
Be connected to an electric impedance control line database, and this electric impedance control line database storage has a large amount of electric impedance control lines and a large amount of setup parameter value, and respectively this electric impedance control line corresponding to one group of setup parameter value;
Import one group of parameter value, it is respectively expression one deck numerical value that this multilayer board had, represents a thickness of slab value of each layer circuit board thickness of this multilayer board, represents that the line width values and the expression that are laid in the impedance line width on this multilayer board are laid in the distance values between the impedance line on this multilayer board;
This group setup parameter value and pairing this electric impedance control line thereof of contrasting the setup parameter value in this group parameter value and this electric impedance control line database and obtaining being consistent; And
Resulting this electric impedance control line is laid in this multilayer board wherein on the laminate.
2. the method for setting up electric impedance control line according to claim 1 is characterized in that, this multilayer board comprises at least one ground plane and at least one signals layer.
3. the method for setting up electric impedance control line according to claim 2, it is characterized in that, also include the method for setting up this electric impedance control line database, and in this electric impedance control line database the method for building up of this stored electric impedance control line, it may further comprise the steps:
Set up this electric impedance control line of designated length at this signals layer;
Two ends at this electric impedance control line are provided with a perforation respectively, and make this impedance line be electrically connected to this signals layer and this ground plane respectively by means of this perforation;
At least one ground protection frame is set, this ground protection frame have a specified width, which width and with this impedance line at a distance of a specific range;
Indicate a resistance value in this electric impedance control line, this resistance value is represented the impedance of this impedance line, and the resistance value of this sign has one first font format; And
Sign one deck is not worth the particular orientation in this perforation, and the layer of this sign not value has one second font format.
4. the method for setting up electric impedance control line according to claim 3; it is characterized in that; the designated length of this electric impedance control line is 3 inch, and this specific range that is provided with in the step of at least one ground protection frame is 20 Mills, and the specified width, which width of this ground protection frame is 20 Mills.
5. the method for setting up electric impedance control line according to claim 3 is characterized in that, the step that a perforation should be set respectively at the two ends of this electric impedance control line also comprises one square a pad in this perforation and this ground plane place is set.
6. the method for setting up electric impedance control line according to claim 3 is characterized in that, the step that a perforation should be set respectively at the two ends of this electric impedance control line also comprises one and a circular pad is set in this perforation and this signals layer place.
7. the method for setting up electric impedance control line according to claim 3 is characterized in that, this first font format is different from this second font format.
8. the method for setting up electric impedance control line according to claim 3 is characterized in that, this of this resistance value first font format comprises that a word height, a breadth length ratio and one are thick, and this word height is 0.045 inch, and this breadth length ratio is 0.7, and this pen slightly is 0.006 inch.
9. the method for setting up electric impedance control line according to claim 3 is characterized in that, this layer not value is positioned at the below of this particular orientation of this perforation for this perforation.
10. the method for setting up electric impedance control line according to claim 3 is characterized in that, this of this resistance value second font format comprises that a word height, a breadth length ratio and one are thick, and this word height is 0.04 inch, and this breadth length ratio is 0.5, and this pen slightly is 0.006 inch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101651353A CN101211384A (en) | 2006-12-29 | 2007-10-29 | Method for establishing electric impedance control line |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610156376.7 | 2006-12-29 | ||
| CN200610156376 | 2006-12-29 | ||
| CN200710163591.4 | 2007-10-12 | ||
| CNA2007101651353A CN101211384A (en) | 2006-12-29 | 2007-10-29 | Method for establishing electric impedance control line |
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| Publication Number | Publication Date |
|---|---|
| CN101211384A true CN101211384A (en) | 2008-07-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2007101651353A Pending CN101211384A (en) | 2006-12-29 | 2007-10-29 | Method for establishing electric impedance control line |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103019491A (en) * | 2012-12-19 | 2013-04-03 | 深圳市子元技术有限公司 | Method for manufacturing ITO (Indium Tin Oxide) capacitive touch screen |
| CN107908828A (en) * | 2017-10-26 | 2018-04-13 | 惠州市金百泽电路科技有限公司 | A kind of automatic method for making pcb board testing impedance bar |
| CN108388760A (en) * | 2018-05-31 | 2018-08-10 | 郑州云海信息技术有限公司 | A kind of printed circuit board wiring method, apparatus and electronic equipment |
| CN114025481A (en) * | 2021-11-12 | 2022-02-08 | 深圳市一晤未来科技有限公司 | Method and system for identifying and managing impedance line |
-
2007
- 2007-10-29 CN CNA2007101651353A patent/CN101211384A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103019491A (en) * | 2012-12-19 | 2013-04-03 | 深圳市子元技术有限公司 | Method for manufacturing ITO (Indium Tin Oxide) capacitive touch screen |
| CN103019491B (en) * | 2012-12-19 | 2016-03-30 | 深圳市三创客科技有限公司 | A kind of method for making of ITO capacitive touch screen |
| CN107908828A (en) * | 2017-10-26 | 2018-04-13 | 惠州市金百泽电路科技有限公司 | A kind of automatic method for making pcb board testing impedance bar |
| CN108388760A (en) * | 2018-05-31 | 2018-08-10 | 郑州云海信息技术有限公司 | A kind of printed circuit board wiring method, apparatus and electronic equipment |
| CN114025481A (en) * | 2021-11-12 | 2022-02-08 | 深圳市一晤未来科技有限公司 | Method and system for identifying and managing impedance line |
| CN114025481B (en) * | 2021-11-12 | 2023-06-30 | 深圳市一晤未来科技有限公司 | Method and system for identifying and managing impedance line |
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Open date: 20080702 |