CN102072716A - Method for detecting interlayer offset and drilling offset of multi-layer circuit board - Google Patents
Method for detecting interlayer offset and drilling offset of multi-layer circuit board Download PDFInfo
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- CN102072716A CN102072716A CN 201010596657 CN201010596657A CN102072716A CN 102072716 A CN102072716 A CN 102072716A CN 201010596657 CN201010596657 CN 201010596657 CN 201010596657 A CN201010596657 A CN 201010596657A CN 102072716 A CN102072716 A CN 102072716A
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Abstract
The present invention relates to a method for detecting an interlayer offset and a drilling offset of a multi-layer circuit board, which comprises arranging detection modules in the middle of each long edge and at board corners of each short edge outside a formation area of each layer of circuit board. The detection modules comprise an isolating frame, a plurality of hole offset measuring rings and a plurality of layer offset monitoring rings, wherein the isolating frame comprises two parallel copper bars and copper semicircular rings connected with the two ends of the two parallel copper bars, the hole offset measuring rings and the layer offset monitoring rings are arranged on the copper bars of the isolating frame with the same spacing, the centers of the hole offset measuring rings and the layer offset monitoring rings are arranged linearly, the hole offset measuring rings comprise 6-8 copper-free rings, the parts of each layer of circuit board for the copper-free rings are removed, the spacing of the copper-free rings on each layer of circuit board is 1.98mm, and the midpoint of the straight line for arrangement of the centers of the copper-free rings is 0.9mm away from the outer edges of the copper bars of the isolating frame and 6mm away from the ends of the copper semicircular rings. Since the detection modules are arranged in the middle of each long edge and at the board corners of each short edge outside the formation area of each layer of circuit board, the offset of all internal layers of the multi-layer circuit board can be detected comprehensively, the interlayer offset and the drilling offset can be detected simultaneously, and the offset can be read directly.
Description
Technical field
The present invention relates to the multilayer circuit board manufacture technology field, be specifically related to the detection method of a kind of multilayer circuit board interlayer and boring skew.
Background technology
Wiring board is divided into single face, two-sided and multilayer circuit board according to the number of plies, because the increase of integrated circuit packaging density causes the interconnection line high concentration, this makes multilayer circuit board be widely used gradually.Each of multilayer circuit board layer by upper and lower internal layer Copper Foil and the insulation course is between the two formed and each layer between mutually combine by cementing agent, be not communicating state between the Copper Foil of each layer.Therefore, for realizing being interconnected between each layer line road, need to pass through boring and form through hole, form electrodeposited coating through the outside surface that the electroplates in hole is made its inwall and multilayer circuit board again, thereby outer copper foil is communicated on the internal layer circuit with the elder sister's Copper Foil that is arranged in insulation course respectively.All need when each layer line road need interconnect to the position, top layer to extend to the through hole electrodeposited coating, extend to other layer or position, top layer up or down by through hole again, just extend laterally to the desired position then by this this other layer or top layer by landscape mode.Just because of this, the position accuracy demand between the overlap joint Copper Foil that each layer presets is higher, will derive open circuit/short circuit and cause the product electric property impaired in case bigger skew takes place.But be subjected to present production technology horizontal constraints, and make the wiring board material and certain contraction can take place in process of production, make factors such as aligning accuracy is not enough restriction in the process of multilayer circuit board, can not guarantee the contraposition of interlayer entirely accurate.
At present, Aligning degree between many employing longitudinal section method detection layers in the industry, but existing detection method needs to detect at the laggard X-RAY equipment that worked of shaping area boring, this has increased the risk of product rejection, but can't detect for the outer edges of boards of shaping area, adopts this detection method in addition if need obtain offset data, needing to beat section measures, this means that the PCS that bores must scrap processing, and the microsection manufacture timeliness is longer when measuring side-play amount by section, influences production capacity.At the problems referred to above, application number is that 200910036910.4 Chinese patent application proposes: by on the odd number of printed circuit board (PCB) or even level the circular alignment marks that some diameters become equal difference to increase progressively being set, adopt ohmmeter to measure in the internal layer minimum value footpath circular alignment marks respectively and short circuit between other circular alignment marks or open loop state again, judge the aligning accuracy of internal layer, to reach the purpose that detects printed circuit board interlayer drift condition.This method has solved the existing technical matters of longitudinal section method, but itself also exists a plurality of defectives, it can only judge the CORE skew by etched annulus is set at odd number or even level, but can not judge the skew of boring, more can not directly judge the skew of certain concrete layer, and its mode of measuring by ohmmeter detects directly side-play amount between reading layer.
Summary of the invention
In view of this, the technical problem to be solved in the present invention provide a kind of can ensure to all internal layers skews of multilayer circuit board carry out complete detection, and simultaneously between detection layers and boring skew and directly read the multilayer circuit board interlayer and the boring bias detecting method of side-play amount.
For solving the problems of the technologies described above, technical scheme provided by the invention is: a kind of multilayer circuit board interlayer and boring bias detecting method, be included in outside each sheet metal forming district, layer line road the middle part on each long limit and the place, plate angle of each minor face detection module is set, described detection module comprises the isolation frame is made up of two parallel copper bars and the copper semicircular ring that is connected two parallel copper bar two ends, equidistantly be arranged on the copper bar of isolating frame and the inclined to one side measurement ring in some holes that the center of circle is arranged in a linear and the skew of some levels are monitored and encircled.
Above-mentioned isolation frame is used for test pattern is kept apart, and prevents to connect with other figures, destroys other pattern integrity, especially for some SAMPLE that need locate, isolates frame and seems particularly important.Two parallel copper bar length of described isolation frame are preferably 23.2-25.8 MM, width is preferably 3.32-4.32 MM, the copper bar of this length, width range both can guarantee the needed space of graphic designs of the inside, be unlikely to the too big sheet material utilization factor that influences again, wherein length is preferably 23.5MM, width is preferably 3.48MM.Isolate the frame periphery and also be provided with no copper shielding wire, no copper shielding wire width is 0.5-0.8MM, and the no copper shielding wire of this width range both can have been assisted copper bar to be isolated from the outside figure and come, and was unlikely to take too greatly the plate space of planes again, and wherein preferable width is 0.7 MM.
Particularly, the inclined to one side measurement ring in above-mentioned some holes is a 6-8 no copper coin ring, is preferably 8, and not having minimum in the copper coin ring, not have the copper coin ring diameter be through-hole aperture+2MIL, and each diameter that does not have the copper coin ring increases progressively for tolerance equal difference with 2MIL.This is because the minimum-value aperture of common PCB product is 5MIL-8MIL, if exceeding the product of 8MIL, the boring side-play amount just need scrap, then lose the monitoring meaning, and general side-play amount is between 1-4MIL, in will the hole monitoring range setting bigger than normal relatively of side-play amount of this inventor spy, the side-play amount of monitoring is loosened to 8MIL, more help accurately monitoring boring side-play amount, the inclined to one side measurement ring in hole is used for intuitively reading the maximum offset of boring with respect to internal layer, reduces section and measures action, reduces and scraps risk.No copper coin ring position place on each layer wiring board hollows out, no copper coin ring spacing 1.96-2.00MM on each layer wiring board, also need during practical operation concrete spacing to be set according to isolating frame housing size, no copper coin ring number and size, the straight line mid point that arrange in the no copper coin ring center of circle is provided with concrete spacing according to isolating frame housing size, no copper coin ring number and size apart from isolation frame copper bar outside 0.8-1.0MM, apart from copper semicircular ring end points 5.8-6.2MM during practical operation equally.
Above-mentioned some levels skew monitoring ring for the no copper coin ring of internal layer number of plies equal number, each does not have the copper coin ring diameter is through-hole aperture+10MIL, no copper coin ring on every wiring board is layer by layer arranged in order, laterally from left to right, vertically represent wiring board level from small to large from top to bottom respectively, when a certain no copper coin ring is represented certain layer of wiring board, this layer wiring board keeps copper, all the other each layer wiring boards hollow out, and the straight line mid point that no copper coin ring spacing 1. 8MM on every wiring board layer by layer and not having arrange in the copper coin ring center of circle is apart from isolating frame copper bar outside 2.15MM, apart from copper semicircular ring end points 2.2MM.Whether level skew monitoring ring is used for the concrete every layer of wiring board of auxiliary judgment skew, and auxiliary be used for distinguishing skew for layer partially, expose to the sun partially or the hole inclined to one side, be convenient to the testing staff and search reason and make specific aim and improve, promote yield.
Compared with prior art, the present invention has following beneficial effect:
1, the present invention is provided with detection module outside each sheet metal forming district, layer line road, avoid reducing and scrapping risk in shaping area boring monitoring, the present invention intuitively reads side-play amount by the inclined to one side measurement ring in hole, reduce original microsection manufacture and measure wasting time and energy of side-play amount, save and make timeliness.
2, each all is provided with detection module on the every limit of each layer wiring board in the present invention, and is distributed in position in corner and the limit, can more fully monitor the quality status of full wafer plate, and especially to big SIZE plate, advantage is more obvious.
3. by level skew monitoring ring is set, can not only monitor the hole drift rate, can also be offset situation by the intuitive judgment interlayer, point the direction, promote yield for opening in short in improving.
4, simplicity of design of the present invention, use cost are low, and processing ease, help the reviewer and skillfully operate.
Description of drawings
Fig. 1 is the described detection module structural representation of the embodiment of the invention.
Embodiment
For the ease of it will be appreciated by those skilled in the art that the present invention is explained in further detail below in conjunction with embodiment.
Present embodiment adopts the accurate detection of technical scheme realization of the present invention to being offset with boring between eight layer line road flaggies, may further comprise the steps: place, the plate angle of the middle part on each long limit and each minor face is provided with detection module outside each sheet metal forming district, layer line road, as shown in Figure 1, wherein detection module comprises the isolation frame 1 be made up of two parallel copper bars and the copper semicircular ring that is connected two parallel copper bar two ends, equidistantly is arranged on the copper bar of isolating frame and the inclined to one side measurement ring 2 in some holes and some levels skew monitoring ring 3 that the center of circle is arranged in a linear.
Above-mentioned isolation frame is used for test pattern is kept apart, prevent to connect other pattern integrity of destruction with other figures, isolate two parallel copper bars of frame long for 23.5MM, wide be 3.48MM, isolation frame periphery also is provided with no copper shielding wire, no copper shielding wire width is 0.7 MM.The inclined to one side measurement ring in hole is no copper coin ring, totally 8.It is through-hole aperture+2MIL that minimum in the no copper coin ring does not have the copper coin ring diameter, and the diameter that does not respectively have a copper coin ring increases progressively for tolerance equal difference with 2MIL.No copper coin ring is used for intuitively reading the maximum offset of boring with respect to internal layer, reduces section and measures action, reduces and scraps risk; No copper coin ring position place on each layer wiring board hollows out, the straight line mid point that the no copper coin ring spacing 1.98MM on each layer wiring board and not having arranges in the copper coin ring center of circle apart from isolate frame copper bar outside 0.9MM, apart from copper semicircular ring end points 6MM.Level skew monitoring ring for the no copper coin ring of internal layer number of plies equal number, the multilayer circuit board that present embodiment detects is eight layers of wiring board, the internal layer number of plies is six layers, therefore not having copper coin number of rings amount is six, each does not have the copper coin ring diameter is through-hole aperture+10MIL, no copper coin ring on every wiring board is layer by layer arranged in order, laterally from left to right, vertically represent wiring board level from small to large from top to bottom respectively, when a certain no copper coin ring is represented certain layer of wiring board, this layer wiring board keeps copper, all the other each layer wiring boards hollow out, and the straight line mid point that no copper coin ring spacing 1. 8MM on every wiring board layer by layer and not having arrange in the copper coin ring center of circle is apart from isolating frame copper bar outside 2.15MM, apart from copper semicircular ring end points 2.2MM.Whether level skew monitoring ring is used for the concrete every layer of wiring board of auxiliary judgment skew, and auxiliary be used for distinguishing skew for layer partially, expose to the sun partially or the hole inclined to one side, be convenient to the testing staff and search reason and make specific aim and improve, promote yield.
The principle of work of isolation frame of the present invention, level skew monitoring ring and the inclined to one side measurement ring in hole is as follows respectively:
Isolate frame: monitoring pattern and other figures of edges of boards are separated, and prevent to touch in the shaping area, influence other instrument figure work or elongation moulding district and cause short circuit to be scrapped, and attractive in appearancely be convenient to distinguish over other figures.
Level skew monitoring ring: side-play amount is arranged by visual which level of analysis confirmation that carries out, find out the skew reason is to belong to which operation to cause, if whole C ORE is offset, proving the skew of pressing working procedure pressing plate causes, if a CORE has only wherein one deck skew, then,, then cause for drilling operating if all layers all are offset for the internal layer exposure causes.
The inclined to one side measurement ring in hole: measure the institute hole that drills through with respect to every layer of maximum offset, compare with standard, whether the final decision quality permits is received.
The foregoing description is a preferred implementation of the present invention, and in addition, the present invention can also have other implementations.That is to say that under the prerequisite that does not break away from the present invention's design, any conspicuous replacement also should fall within protection scope of the present invention.
Claims (6)
1. multilayer circuit board interlayer and boring bias detecting method, it is characterized in that: be included in outside each sheet metal forming district, layer line road the middle part on each long limit and the place, plate angle of each minor face detection module is set, described detection module comprises the isolation frame (1) is made up of two parallel copper bars and the copper semicircular ring that is connected two parallel copper bar two ends, equidistantly be arranged on the copper bar of isolating frame and inclined to one side measurement ring in some holes (2) that the center of circle is arranged in a linear and some levels are offset to monitor and encircle (3).
2. multilayer circuit board interlayer according to claim 1 and boring bias detecting method, it is characterized in that: the inclined to one side measurement ring in described some holes is a 6-8 no copper coin ring, no copper coin ring position place on each layer wiring board hollows out, the straight line mid point that the no copper coin ring spacing 1.98MM on each layer wiring board and not having arranges in the copper coin ring center of circle apart from isolate frame copper bar outside 0.9MM, apart from copper semicircular ring end points 6MM.
3. multilayer circuit board interlayer according to claim 2 and boring bias detecting method, it is characterized in that: it is through-hole aperture+2MIL that the minimum in the described no copper coin ring does not have the copper coin ring diameter, and the diameter that does not respectively have a copper coin ring increases progressively for tolerance equal difference with 2MIL.
4. according to claim 1 or 2 or 3 described multilayer circuit board interlayers and boring bias detecting method, it is characterized in that: described some levels skew monitoring ring for the no copper coin ring of internal layer number of plies equal number, each does not have the copper coin ring diameter is through-hole aperture+10MIL, no copper coin ring on every wiring board is layer by layer arranged in order, laterally from left to right, vertically represent wiring board level from small to large from top to bottom respectively, when a certain no copper coin ring is represented certain layer of wiring board, this layer wiring board keeps copper, all the other each layer wiring boards hollow out, and the straight line mid point that no copper coin ring spacing 1. 8MM on every wiring board layer by layer and not having arrange in the copper coin ring center of circle is apart from isolating frame copper bar outside 2.15MM, apart from copper semicircular ring end points 2.2MM.
5. multilayer circuit board interlayer according to claim 4 and boring bias detecting method, it is characterized in that: described isolation frame periphery also is provided with no copper shielding wire.
6. multilayer circuit board interlayer according to claim 5 and boring bias detecting method, it is characterized in that: described no copper shielding wire width is 0.5-0.8MM.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010105966570A CN102072716B (en) | 2010-12-21 | 2010-12-21 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
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| CN2010105966570A CN102072716B (en) | 2010-12-21 | 2010-12-21 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
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| CN102072716B CN102072716B (en) | 2012-05-23 |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102539996A (en) * | 2011-12-08 | 2012-07-04 | 东莞市五株电子科技有限公司 | Detection method and system for layers of multilayer circuit board |
| CN102607368A (en) * | 2012-03-20 | 2012-07-25 | 昆山鼎鑫电子有限公司 | Laser drilling deviation inspection method for HDI (High Density Interconnection) plate |
| CN102865838A (en) * | 2012-09-28 | 2013-01-09 | 长沙牧泰莱电路技术有限公司 | Printed circuit board (PCB) borehole test method |
| CN103900475A (en) * | 2013-11-22 | 2014-07-02 | 大连太平洋电子有限公司 | Laser blind hole and through hole alignment precision detection method |
| CN103913471A (en) * | 2012-12-31 | 2014-07-09 | 深南电路有限公司 | Method for examining position alignment of capacitor-embedding layer on capacitor-embedding plate |
| CN106017249A (en) * | 2016-06-12 | 2016-10-12 | 广州杰赛科技股份有限公司 | Layer offset detection method for printed circuit board |
| CN106525114A (en) * | 2016-11-08 | 2017-03-22 | 江门崇达电路技术有限公司 | Method for testing production line hole making capability in positive process |
| CN106556422A (en) * | 2016-11-08 | 2017-04-05 | 江门崇达电路技术有限公司 | The method of testing of production line drilling ability in a kind of negative film technique |
| CN109526156A (en) * | 2018-11-05 | 2019-03-26 | 深圳崇达多层线路板有限公司 | It is a kind of for detecting the detection module and detection method of deflection of borehole degree |
| CN110493977A (en) * | 2019-05-17 | 2019-11-22 | 惠州市特创电子科技有限公司 | A kind of inclined detection structure of layer and method of high frequency plate |
| CN112504183A (en) * | 2020-11-07 | 2021-03-16 | 奥士康科技股份有限公司 | Hole deviation detection method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102539996A (en) * | 2011-12-08 | 2012-07-04 | 东莞市五株电子科技有限公司 | Detection method and system for layers of multilayer circuit board |
| CN102607368A (en) * | 2012-03-20 | 2012-07-25 | 昆山鼎鑫电子有限公司 | Laser drilling deviation inspection method for HDI (High Density Interconnection) plate |
| CN102865838A (en) * | 2012-09-28 | 2013-01-09 | 长沙牧泰莱电路技术有限公司 | Printed circuit board (PCB) borehole test method |
| CN102865838B (en) * | 2012-09-28 | 2015-07-01 | 长沙牧泰莱电路技术有限公司 | Printed circuit board (PCB) borehole test method |
| CN103913471A (en) * | 2012-12-31 | 2014-07-09 | 深南电路有限公司 | Method for examining position alignment of capacitor-embedding layer on capacitor-embedding plate |
| CN103913471B (en) * | 2012-12-31 | 2016-04-13 | 深南电路有限公司 | The method held and plate buries and holds layer contraposition is buried in a kind of inspection |
| CN103900475A (en) * | 2013-11-22 | 2014-07-02 | 大连太平洋电子有限公司 | Laser blind hole and through hole alignment precision detection method |
| CN106017249A (en) * | 2016-06-12 | 2016-10-12 | 广州杰赛科技股份有限公司 | Layer offset detection method for printed circuit board |
| CN106525114A (en) * | 2016-11-08 | 2017-03-22 | 江门崇达电路技术有限公司 | Method for testing production line hole making capability in positive process |
| CN106556422A (en) * | 2016-11-08 | 2017-04-05 | 江门崇达电路技术有限公司 | The method of testing of production line drilling ability in a kind of negative film technique |
| CN106556422B (en) * | 2016-11-08 | 2018-12-07 | 江门崇达电路技术有限公司 | The test method of production line drilling ability in a kind of negative film technique |
| CN106525114B (en) * | 2016-11-08 | 2018-12-07 | 江门崇达电路技术有限公司 | The test method of production line drilling ability in a kind of positive blade technolgy |
| CN109526156A (en) * | 2018-11-05 | 2019-03-26 | 深圳崇达多层线路板有限公司 | It is a kind of for detecting the detection module and detection method of deflection of borehole degree |
| CN109526156B (en) * | 2018-11-05 | 2021-04-06 | 深圳崇达多层线路板有限公司 | Detection module and detection method for detecting deviation degree of drilling hole |
| CN110493977A (en) * | 2019-05-17 | 2019-11-22 | 惠州市特创电子科技有限公司 | A kind of inclined detection structure of layer and method of high frequency plate |
| CN112504183A (en) * | 2020-11-07 | 2021-03-16 | 奥士康科技股份有限公司 | Hole deviation detection method |
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Address after: Huizhou City, Guangdong province 516211 freshwater town Huiyang District Xinqiao village Cheng Technology Park Patentee after: Victory Giant Technology (Huizhou) Co., Ltd. Address before: Huizhou City, Guangdong province 516211 freshwater town Huiyang District Xinqiao village Cheng Technology Park Patentee before: Victory Giant Technology(HuiZhou)Co.,Ltd. |