CN101865682A - Multilayer printed wiring board interlayer dislocation detection method - Google Patents
Multilayer printed wiring board interlayer dislocation detection method Download PDFInfo
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- CN101865682A CN101865682A CN 201010190021 CN201010190021A CN101865682A CN 101865682 A CN101865682 A CN 101865682A CN 201010190021 CN201010190021 CN 201010190021 CN 201010190021 A CN201010190021 A CN 201010190021A CN 101865682 A CN101865682 A CN 101865682A
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Abstract
The invention provides an efficient, accurate and nondestructive multilayer printed wiring board interlayer dislocation detection method. Special check patterns are added onto each layer of inner layers of a multilayer printed wiring board, wherein one layer is taken as a standard layer, and the maximal dislocation bias between other layers and the standard layer is taken as a precise numerical value between control layers. After the lamination process of the multilayer printed wiring board is completed, X-ray is used for checking equipment to carry out nondestructive interlayer dislocation detection and replace the traditional slicing checking method. The production efficiency can be improved, and the product yield can be improved by utilizing the novel interlayer dislocation checking method, and the purposes of ensuring the quality and reducing the cost are achieved.
Description
Technical field
The present invention relates to the making field of multilayer printed wiring board, particularly a kind of method that is used to check the control of multilayer printed wiring board interlayer alignment precision.
Background technology
The production procedure of multilayer printed wiring board lamination:
Preceding processing procedure → brown → pre-typesetting → riveted → inspection → lamination → inspection → next processing procedure.
Traditional multilayer printed wiring board interlayer dislocation control method is each internal layer design concentric circles, with one 8 laminate is example, at first design the concentric circles that diameter is the equal difference relation at each internal layer (2-7 layer), diameter difference is by control accuracy x2 design, respectively on the 2nd layer, the 3rd layer, the 4th layer, the 5th layer, the 6th layer, the 7th layer of correspondence.In addition again at the identical right angle line pattern of each internal layer same position design, the interlayer degree of misalignment is confirmed in section after being used for lamination, judge the interlayer degree of misalignment according to concentrically ringed deviation, the method of sampling of taking concrete dislocation numerical value to cut into slices detects, as it is crossing that concentric circles takes place, illustrate that then the interlayer dislocation surpasses the accuracy rating of control, concrete off-set value is confirmed according to the right angle line pattern.Fig. 1 is the theoretical effect figure of no interlayer dislocation behind the lamination.
The method accuracy that the design concentric circles detects is not high, and slice efficiency is low, therefore also can occur because of scrapping that the interlayer dislocation causes at the back processing procedure, and both cost of idleness influenced efficient again.When concentric circles towards same square, when promptly parallel misalignment taking place, omission will appear in the method that concentric circles detects, thus defective products will flow into down processing procedure or client.
Traditional concentric design multilayer printed wiring board interlayer dislocation detection method mainly contains following shortcoming:
1. inaccurate by the concentric circles detection, and the offset direction is difficult for judging;
2. low by the section detection efficiency, can't accomplish 100% inspection entirely;
3. cut sections for microscopic examination are destructive inspection, can not be corresponding one by one with plate after the section.
In interlayer dislocation context of detection, there is not ripe relevant patented technology at present yet.
Summary of the invention
For overcoming the deficiencies in the prior art, the invention provides a kind of efficient, accurate, nondestructive multilayer printed wiring board interlayer dislocation detection method.Add special inspection figure by each layer of internal layer at multilayer printed wiring board, with one deck wherein as key horizon, the maximum dislocation deviation of other each layer and key horizon is as accurate values between key-course, after the multilayer printed wiring board pressure programming is finished, carry out the dislocation of non-destructive interlayer and detect, be used for substituting traditional cut sections for microscopic examination method with the X-ray checkout facility.
A kind of multilayer printed wiring board interlayer dislocation detection method is characterized in that:
1, multilayer printed wiring board comprises the two-layer and some internal layers of outermost, chooses in the internal layer arbitrarily that one deck is a key horizon, and all the other are the equivalent beds; The equivalent beds surface is provided with square contrast patterns;
2, be provided with square check pattern with the corresponding position of each equivalent beds on the key horizon, square check pattern number equates with equivalent beds's number of plies; Among the equivalent beds on the position of the symcenter of square contrast patterns and the key horizon position of the symcenter of corresponding square check pattern identical;
3,, adopt the X-ray checkout facility to detect the interlayer misalignment of square contrast patterns of equivalent beds and the corresponding square check pattern of key horizon with behind equivalent beds and the key horizon lamination.
Preferably, when the wiring board number of plies was even number, described key horizon was middle two-layer any one deck, and when the wiring board number of plies was several for posting, described key horizon was the middle layer.
Use novel interlayer inspection method of position gap of the present invention, can promote production efficiency, improve product percent of pass, thus the purpose that reaches guaranteed quality, reduces cost.
Should be appreciated that above generality is described and the following detailed description is all enumerated and illustrative, purpose is for to the claimed further instruction that the invention provides.
Other features and advantages of the present invention provide in explanation subsequently, partly can be apparent from the description, and maybe can find out from enforcement of the present invention.Purpose of the present invention and other advantage can be understood, obtain from the structure that following written explanation, claim and accompanying drawing provide especially.
Description of drawings
The accompanying drawing of forming the part of this instructions helps further to understand the present invention, and these accompanying drawings illustrate embodiments of the invention, and can be used for illustrating principle of the present invention with instructions.In the accompanying drawing:
The theoretical effect figure that the concentric design multilayer printed wiring board interlayer dislocation detected when Fig. 1 misplaced for no interlayer;
Fig. 2 is the square check pattern of the key horizon of the specific embodiment of the invention;
Fig. 3 is the square contrast patterns of the second layer of the specific embodiment of the invention;
Fig. 4 is the design sketch of no interlayer dislocation behind the multilayer line printed board lamination of the specific embodiment of the invention;
Fig. 5 is the detection synoptic diagram of the specific embodiment of the invention;
Embodiment
In conjunction with the accompanying drawings, below by embodiment the present invention is specifically described.Same parts is represented with same label in the accompanying drawings.It is important to point out that present embodiment only is used for invention is further specified, but can not be interpreted as restriction the invention protection domain.The person skilled in art can make some nonessential improvement and adjustment to the present invention according to the above-mentioned technology contents that provides.
A kind of multilayer printed wiring board interlayer dislocation detection method:
1, multilayer printed wiring board comprises the two-layer and some internal layers of outermost, chooses in the internal layer arbitrarily that one deck is a key horizon, and all the other are the equivalent beds; The equivalent beds surface is provided with square contrast patterns;
2, be provided with square check pattern with the corresponding position of each equivalent beds on the key horizon, square check pattern number equates with equivalent beds's number of plies; Among the equivalent beds on the position of the symcenter of square contrast patterns and the key horizon position of the symcenter of corresponding square check pattern identical;
3,, adopt the X-ray checkout facility to detect the interlayer misalignment of square contrast patterns of equivalent beds and the corresponding square check pattern of key horizon with behind equivalent beds and the key horizon lamination.
When the wiring board number of plies was even number, described key horizon was middle two-layer any one deck, and when the wiring board number of plies was several for posting, described key horizon was the middle layer.
With seven layers of printed wiring board is example, at first selects the 4th layer for key horizon, in the square check pattern of key horizon design as Fig. 3, second and third, the square contrast patterns of five, six layers of design such as Fig. 4; Establishment detects numerical value around square check pattern, as shown in Figure 5, before lamination, use X-ray equipment to check each layer printed wiring board, determination methods according to Fig. 5 is judged, the expression product that interlayer dislocation numerical value is in the standard detection numerical range of setting is qualified, can carry out pressing, defective doing over again; Multilayer printed wiring board uses X-ray equipment to check after pressing, judges according to the determination methods of Fig. 5, and the expression product that interlayer dislocation numerical value is in the standard detection numerical range of setting is qualified, sends into next processing procedure, defectively scraps processing.
At last, it is also to be noted that what more than enumerate only is specific embodiments of the invention, obviously, the invention is not restricted to above examples of implementation, many distortion can also be arranged.All distortion that those of ordinary skill in the art can directly derive or associate from content disclosed by the invention all should be thought protection scope of the present invention.
Claims (2)
1. multilayer printed wiring board interlayer dislocation detection method is characterized in that:
One, multilayer printed wiring board comprises the two-layer and some internal layers of outermost, chooses in the internal layer arbitrarily that one deck is a key horizon, and all the other are the equivalent beds; The equivalent beds surface is provided with square contrast patterns;
Two, be provided with square check pattern with the corresponding position of each equivalent beds on the key horizon, square check pattern number equates with equivalent beds's number of plies; Among the equivalent beds on the position of the symcenter of square contrast patterns and the key horizon position of the symcenter of corresponding square check pattern identical;
Three,, adopt the X-ray checkout facility to detect the interlayer misalignment of square contrast patterns of equivalent beds and the corresponding square check pattern of key horizon with behind equivalent beds and the key horizon lamination.
2. multilayer printed wiring board interlayer dislocation detection method according to claim 1 is characterized in that: when the wiring board number of plies was even number, described key horizon was middle two-layer any one deck, and when the wiring board number of plies was several for posting, described key horizon was the middle layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101900216A CN101865682B (en) | 2010-06-02 | 2010-06-02 | Multilayer printed wiring board interlayer dislocation detection method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101900216A CN101865682B (en) | 2010-06-02 | 2010-06-02 | Multilayer printed wiring board interlayer dislocation detection method |
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| Publication Number | Publication Date |
|---|---|
| CN101865682A true CN101865682A (en) | 2010-10-20 |
| CN101865682B CN101865682B (en) | 2012-09-05 |
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| CN2010101900216A Expired - Fee Related CN101865682B (en) | 2010-06-02 | 2010-06-02 | Multilayer printed wiring board interlayer dislocation detection method |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102072716A (en) * | 2010-12-21 | 2011-05-25 | 胜宏科技（惠州）有限公司 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
| CN102607368A (en) * | 2012-03-20 | 2012-07-25 | 昆山鼎鑫电子有限公司 | Laser drilling deviation inspection method for HDI (High Density Interconnection) plate |
| CN103743361A (en) * | 2014-01-13 | 2014-04-23 | 宁德新能源科技有限公司 | Anode and cathode diaphragm malposition detection method for lamination cell |
| CN103874328A (en) * | 2014-02-21 | 2014-06-18 | 九江华祥科技股份有限公司 | Multilayer circuit board and inner layer core plate thereof |
| CN104880162A (en) * | 2015-05-15 | 2015-09-02 | 江门崇达电路技术有限公司 | Method for detecting drilling hole offset degree of PCB |
| CN104968142A (en) * | 2015-06-30 | 2015-10-07 | 开平依利安达电子第三有限公司 | Circuit board with interlayer alignment modules and detection method thereof |
| CN105357902A (en) * | 2015-11-23 | 2016-02-24 | 中山市惠亚线路版有限公司 | Multilayer circuit board alignment degree detection method |
| CN107241851A (en) * | 2016-03-29 | 2017-10-10 | 北大方正集团有限公司 | The detection method and multilayer circuit board of the level to level alignment degree of multilayer circuit board |
| CN108898590A (en) * | 2018-06-22 | 2018-11-27 | 浙江大学 | A kind of unique characteristics extracting method applied to product shape vision-based detection |
| CN108925066A (en) * | 2018-08-28 | 2018-11-30 | 深圳市景旺电子股份有限公司 | A kind of multi-layer board interlayer bias detecting method and detection system |
| CN110691475A (en) * | 2018-07-06 | 2020-01-14 | 深南电路股份有限公司 | PCB (printed circuit board) layer deviation detection feedback system and detection device thereof |
| CN112165854A (en) * | 2020-10-21 | 2021-01-01 | 宜兴硅谷电子科技有限公司 | Interlayer alignment visual monitoring method |
| CN117979587A (en) * | 2024-04-02 | 2024-05-03 | 淄博芯材集成电路有限责任公司 | Alignment checking method for multilayer circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6151510A (en) * | 1984-08-22 | 1986-03-14 | Shimadzu Corp | Inspecting method for interlayer deviation of multilayer printed board |
| JP2007080915A (en) * | 2005-09-12 | 2007-03-29 | Seiko Epson Corp | Registration accuracy measuring mark |
-
2010
- 2010-06-02 CN CN2010101900216A patent/CN101865682B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6151510A (en) * | 1984-08-22 | 1986-03-14 | Shimadzu Corp | Inspecting method for interlayer deviation of multilayer printed board |
| JP2007080915A (en) * | 2005-09-12 | 2007-03-29 | Seiko Epson Corp | Registration accuracy measuring mark |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102072716B (en) * | 2010-12-21 | 2012-05-23 | 胜宏科技（惠州）有限公司 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
| CN102072716A (en) * | 2010-12-21 | 2011-05-25 | 胜宏科技（惠州）有限公司 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
| CN102607368A (en) * | 2012-03-20 | 2012-07-25 | 昆山鼎鑫电子有限公司 | Laser drilling deviation inspection method for HDI (High Density Interconnection) plate |
| CN103743361A (en) * | 2014-01-13 | 2014-04-23 | 宁德新能源科技有限公司 | Anode and cathode diaphragm malposition detection method for lamination cell |
| CN103874328A (en) * | 2014-02-21 | 2014-06-18 | 九江华祥科技股份有限公司 | Multilayer circuit board and inner layer core plate thereof |
| CN104880162A (en) * | 2015-05-15 | 2015-09-02 | 江门崇达电路技术有限公司 | Method for detecting drilling hole offset degree of PCB |
| CN104968142A (en) * | 2015-06-30 | 2015-10-07 | 开平依利安达电子第三有限公司 | Circuit board with interlayer alignment modules and detection method thereof |
| CN105357902B (en) * | 2015-11-23 | 2018-09-11 | 皆利士多层线路版(中山)有限公司 | Aligning degree of multi-layer circuit board detection method |
| CN105357902A (en) * | 2015-11-23 | 2016-02-24 | 中山市惠亚线路版有限公司 | Multilayer circuit board alignment degree detection method |
| CN107241851A (en) * | 2016-03-29 | 2017-10-10 | 北大方正集团有限公司 | The detection method and multilayer circuit board of the level to level alignment degree of multilayer circuit board |
| CN107241851B (en) * | 2016-03-29 | 2019-05-28 | 北大方正集团有限公司 | The detection method and multilayer circuit board of the level to level alignment degree of multilayer circuit board |
| CN108898590A (en) * | 2018-06-22 | 2018-11-27 | 浙江大学 | A kind of unique characteristics extracting method applied to product shape vision-based detection |
| CN108898590B (en) * | 2018-06-22 | 2022-03-29 | 浙江大学 | Self-feature extraction method applied to product appearance visual detection |
| CN110691475A (en) * | 2018-07-06 | 2020-01-14 | 深南电路股份有限公司 | PCB (printed circuit board) layer deviation detection feedback system and detection device thereof |
| CN110691475B (en) * | 2018-07-06 | 2021-01-08 | 深南电路股份有限公司 | PCB (printed circuit board) layer deviation detection feedback system and detection device thereof |
| CN108925066A (en) * | 2018-08-28 | 2018-11-30 | 深圳市景旺电子股份有限公司 | A kind of multi-layer board interlayer bias detecting method and detection system |
| CN112165854A (en) * | 2020-10-21 | 2021-01-01 | 宜兴硅谷电子科技有限公司 | Interlayer alignment visual monitoring method |
| CN117979587A (en) * | 2024-04-02 | 2024-05-03 | 淄博芯材集成电路有限责任公司 | Alignment checking method for multilayer circuit board |
| CN117979587B (en) * | 2024-04-02 | 2024-06-07 | 淄博芯材集成电路有限责任公司 | Alignment checking method for multilayer circuit board |
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|---|---|
| CN101865682B (en) | 2012-09-05 |
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