CN205249636U

CN205249636U - To accuracy detection module between multilayer PCB layer

Info

Publication number: CN205249636U
Application number: CN201520874420.2U
Authority: CN
Inventors: 曾祥福; 张晃初; 李建红
Original assignee: Victory Giant Technology Huizhou Co Ltd
Current assignee: Victory Giant Technology Huizhou Co Ltd
Priority date: 2015-11-04
Filing date: 2015-11-04
Publication date: 2016-05-18
Anticipated expiration: 2025-11-04

Abstract

The utility model provides a to accuracy detection module between multilayer PCB layer, including a plurality of line groups, a plurality of line groups print in multilayer PCB board the same position on every layer of core respectively, overlap behind the core pressfitting, every line group includes 4 line modules, 4 individual line module prints respectively in the locating hole edge at PCB core technology four angles on the limit, and every line module includes that an adjacent horizontal line is organized and a vertical line group, horizontal line group is including the horizontal line of many parallels, vertical line group is including the vertical line of many parallels. The utility model discloses simple structure, easy to carry out after PCB accomplishes the pressfitting, carries out little section to detection module and takes a sample, can accurately read the alignment number of degrees value between each layer through the microscope.

Description

A kind of multi-layer PCB level to level alignment degree detection module

Technical field

The utility model relates to multi-layer PCB board detection field, is specifically related to a kind of multi-layer PCB level to level alignment detection module.

Background technology

Multi-layer PCB, is made up of multilayer line and dielectric layer, and the number of plies >=4L is multi-layer sheet, when the number of plies >=6L, be multiple central layers and PP combination, the Aligning degree General Requirements between each sandwich circuit, in 4mil, exceeds and there will be Nei Kai or interior short problem to cause PCB to scrap.

For the detection of level to level alignment degree, conventional detection method is exactly that front donut X-Ray measures and micro-section detection method, also has design conductivity detection module, and the problem of existence is as follows:

1.X-Ray detection method: the result inaccuracy that concentric circles tests out, easily causes erroneous judgement;

2. micro-section detection method: the result that micro-section detects is accurate, but in pcb board, be difficult to find the position that needs sampling;

3. conductivity detection module:

A. the number of plies is more, and the edges of boards space that need to take is larger;

B. can detect the inclined to one side layer of layer not, the data of measuring can only as a reference, still cannot know that actual layer is worth partially.

Utility model content

For addressing the above problem, the utility model provides a kind of multi-layer PCB level to level alignment degree detection module, comprises multiple sets of lines, and described multiple sets of lines are printed in respectively the same position on every layer of central layer in multi-layer PCB board, overlapping after central layer pressing; Each sets of lines comprises 4 line modules, described 4 line modules are printed in respectively on the locating hole limit at four angles of PCB central layer technique edges, each line module comprises adjacent a horizontal line group and a vertical line group, described horizontal line group comprises many parallel horizontal lines, and described vertical line group comprises many parallel vertical lines.

Preferably, the length of described horizontal line and vertical line is 8 to 12 millimeters.

Preferably, the width of described horizontal line and vertical line is 0.08 to 0.12 millimeter.

Preferably, described horizontal line group comprises 3 to 5 horizontal lines, and described vertical line group comprises 3 to 5 vertical lines.

The utility model is simple in structure, easy to implement, when PCB completes after pressing, detection module is carried out to micro-section sampling, can read exactly the Aligning degree numerical value of each interlayer by microscope.

Brief description of the drawings

Fig. 1 is multi-layer PCB level to level alignment degree detection module schematic diagram.

Fig. 2 is the sets of lines schematic diagram on individual layer central layer.

Detailed description of the invention

For the ease of it will be appreciated by those skilled in the art that below in conjunction with accompanying drawing and embodiment, the utility model is explained in further detail.

As shown in Figure 1, a kind of multi-layer PCB level to level alignment degree detection module that the utility model provides, comprises 4 sets of lines 2, and described 4 sets of lines 2 are printed in respectively the number of plies and are the same position on every layer of central layer 1 in 4 multi-layer PCB board, overlapping after central layer 1 pressing; As shown in Figure 2, on central layer 1, sets of lines 2 comprises 4 line modules 21, described 4 line modules 21 are printed in respectively on locating hole 13 limits at four angles of the technique edges 12 of central layer 1 shaping area 11 surroundings, each line module 21 comprises adjacent a horizontal line group 22 and a vertical line group 23, and described horizontal line group 22 comprises 3 parallel horizontal lines, and described vertical line group 23 comprises 3 parallel vertical lines, the length of described horizontal line and vertical line is 10 millimeters, and width is 0.1 millimeter.

Be more than specific implementation of the present utility model, it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims. It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these apparent replacement forms all belong to protection domain of the present utility model.

Claims

1. a multi-layer PCB level to level alignment degree detection module, is characterized in that: comprise multiple sets of lines, described multiple sets of lines are printed in respectively the same position on every layer of central layer in multi-layer PCB board, overlapping after central layer pressing; Each sets of lines comprises 4 line modules, described 4 line modules are printed in respectively on the locating hole limit at four angles of PCB central layer technique edges, each line module comprises adjacent a horizontal line group and a vertical line group, described horizontal line group comprises many parallel horizontal lines, and described vertical line group comprises many parallel vertical lines.

2. according to multi-layer PCB level to level alignment degree detection module described in claim 1, it is characterized in that: the length of described horizontal line and vertical line is 8 to 12 millimeters.

3. according to multi-layer PCB level to level alignment degree detection module described in claim 1, it is characterized in that: the width of described horizontal line and vertical line is 0.08 to 0.12 millimeter.

4. according to multi-layer PCB level to level alignment degree detection module described in claim 1, it is characterized in that: described horizontal line group comprises 3 to 5 horizontal lines, described vertical line group comprises 3 to 5 vertical lines.