CN103793544B - System and method for analyzing of defect position - Google Patents
System and method for analyzing of defect position Download PDFInfo
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- CN103793544B CN103793544B CN201310162917.7A CN201310162917A CN103793544B CN 103793544 B CN103793544 B CN 103793544B CN 201310162917 A CN201310162917 A CN 201310162917A CN 103793544 B CN103793544 B CN 103793544B
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- bad
- coordinate
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- piece
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/30—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The invention provides a system and method for analyzing of defect positions. The method of the invention includes a step of storing design data and product information; a step of collecting panel reference defect coordinates from multiple detection devices each time when a panel for manufacturing a printed circuit board substrate is detected; and a step of converting the panel reference defect coordinates into defect coordinates of all objects by utilizing the design data and coordinate conversion reference.
Description
Technical field
The present invention relates to bad position analysis system and method.
Background technology
Currently, various bad check including what is including patent documentation 1, produced in the manufacture to tellite
Various interim inspection operation in, spatiality pattern analysis and the particular problem of manufacturing process or equipment have close related
Relation, it can be said that promptly solving the problems, such as that manufacturing process is the part of core.
Further, since the design difficulty of product is improved and the service life of product shortens, therefore practical situation is, with product
The design of product is associated, and the importance for grasping and improving the technology of process capability gets most of the attention.
Prior art literature
Patent documentation
Patent documentation 1：US publication 2011-0140105A.
The content of the invention
Problems to be solved by the invention
The present invention proposes to solve aforesaid problem of the prior art, the side of the present invention with regard to：It is logical
Cross and reflect flame in design data, so that in the manufacturing process of tellite more system can be carried out not
The bad position analysis system of good Information application and method.
For solution to problem
The bad position analysis system of the embodiment of the present invention includes：To including including design data and product information with not
The data base that the associated information of good position analyses system is stored；Collector panels（Panel）The data of the bad coordinate of benchmark
Collection portion；And the panel benchmark that will be collected from the data collection unit using the design data and coordinate transform benchmark
Bad coordinate is transformed to the bad coordinate of each object and storage coordinate converting section in the database, and the object can be with institute
State the block including tellite（Piece）, including multiple described piece of piece（Sheet）.
The design data of the bad position analysis system of other embodiments of the present invention can include panel（Panel）Interior piece
Block arrangement information, block profile coordinate, block internal symbol and feature in arrangement information, piece profile coordinate, panel（Feature）
Information.
The bad coordinate of panel benchmark of the bad position analysis system of other embodiments of the present invention includes identification number, described
Coordinate converting section can be based on the product information and grasp the type matched with the identification number of the bad coordinate of the panel benchmark
Number information, extracts the design data of grasped type information, utilizes extracted design data and the panel benchmark bad
The bad coordinate of the panel benchmark is transformed to the bad coordinate of each object by coordinate and coordinate transform benchmark.
The data base of the bad position analysis system of other embodiments of the present invention can store the design data of coordinate form,
The coordinate converting section can utilize design data to grasp the origin of the reference plate in panel, the row based on the piece in the panel
Column information grasps the origin of each, and the profile that the piece in panel is calculated using the arrangement anglec of rotation of piece and the profile coordinate of piece is sat
Mark, and store in the database.
The bad position analysis system of other embodiments of the present invention, piece benchmark is being transformed to not by the bad coordinate of panel benchmark
In the case of good coordinate, the coordinate converting section can grasp bad matched with the bad coordinate of the panel benchmark, root
The origin of described bad is grasped according to the origin of described each, bad for being grasped is deducted from the bad coordinate of the panel benchmark
Origin, calculate the bad coordinate of piece benchmark in panel.
The block profile coordinate of the bad position analysis system of other embodiments of the present invention can include starting point, via point with
And end point, the coordinate converting section can be based on the outer contour of the block profile coordinate of design data identification block, grasp
The bad coordinate of block unit grasped is located in block or outside block on the basis of described piece of outer contour, and is stored in
In the data base.
The data base of the bad position analysis system of other embodiments of the present invention can store the design data of coordinate form,
The coordinate converting section can utilize design data to grasp the origin of the reference block in panel, the row based on the block in the panel
Column information grasps each piece of origin, and the profile that the block in panel is calculated using the arrangement anglec of rotation of block and the profile coordinate of block is sat
Mark, and store in the database.
The bad position analysis system of other embodiments of the present invention, block benchmark is being transformed to not by the bad coordinate of panel benchmark
In the case of good coordinate, the coordinate converting section can grasp bad piece matched with the bad coordinate of panel benchmark, according to institute
The origin of each piece of described bad piece of origin grasp is stated, from the bad coordinate of the panel benchmark bad piece grasped of original is deducted
Point, calculates the bad coordinate of block benchmark in panel.
The data collection unit of the bad position analysis system of other embodiments of the present invention can with the bad coordinate of collecting tab benchmark,
The coordinate converting section can be transformed to the bad coordinate of piece benchmark transmitted via the data collection unit with the origin of panel
On the basis of the bad coordinate of panel benchmark or the bad coordinate of block benchmark on the basis of the origin of block.
The bad position analysis system of other embodiments of the present invention, can also be included based on storage in the database
The bad coordinate of each object, generates and provides the prison of the bad statistical information of the bad coordinate in each region or each region according to the requirement of user
Depending on portion.
The design data of the bad position analysis system of other embodiments of the present invention can include panel（Panel）Interior piece
Block arrangement information, block profile coordinate, block internal symbol and feature in arrangement information, piece profile coordinate, panel（Feature）
Information, the monitoring unit can with the bad coordinate of the panel unit for having stored, the bad coordinate of piece unit, the bad coordinate of block unit,
On the basis of the outer contour of the outer contour of panel, the outer contour of piece and block, set described based on bad coordinate inside and outside block
Count the bad coordinate position of output.
The bad position analysis system of other embodiments of the present invention is additionally may included in the bad position analysis system
The output section of the information that output is shown to user.
The monitoring unit of the bad position analysis system of other embodiments of the present invention can be by bad coordinate by bad number area
It is divided into form and aspect and is exported via the output section.
The bad position analysis method of other embodiments of the present invention is for each object in bad position analysis system
The bad position analysis method that bad coordinate is managed, the method can include：Bad position analysis system storage design number
According to the stage with product information；The panel for manufacturing tellite is being carried out every time（Panel）Inspection operation when, receive
Collect the stage of the bad coordinate of panel benchmark from the transmission of multiple check devices；And using the design data and coordinate transform base
The bad coordinate of panel benchmark described in brigadier is transformed to the stage of the bad coordinate of each object, and the object can include printed circuit base
The block of plate（Piece）, including multiple described piece of piece（Sheet）.
The bad position analysis method of the embodiment of the present invention can be in the storage design data and the stage of product information
In, the design data is transformed to into coordinate and is stored with designing coordinate form.
The design data of the bad position analysis method of the embodiment of the present invention can include panel（Panel）Interior piece arrangement
Block arrangement information, block profile coordinate, block internal symbol and feature in information, piece profile coordinate, panel（Feature）Letter
Breath, the bad coordinate of the panel benchmark can include identification number, and the bad position analysis method be additionally may included in conversion
Before stage for the bad coordinate of each object, the knowledge with the bad coordinate of the panel benchmark is grasped based on the product information
The type information of alias code-phase matching, and extract the stage of the design data of grasped type information.
The storage design data of the bad position analysis method of the embodiment of the present invention and the stage of product information can also wrap
Include：The stage of the origin of the reference plate in panel is grasped using the design data；Arrangement based on the piece in the panel is believed
Breath grasps the stage of the origin of each；And the arrangement anglec of rotation using piece and described profile coordinate calculate the piece in panel
Profile coordinate stage.
The bad position analysis method of the embodiment of the present invention, by the bad coordinate of panel benchmark the bad seat of piece benchmark is being transformed to
In the case of target, the stage for being transformed to the bad coordinate of each object can include：Grasp and the bad coordinate of the panel benchmark
The stage of bad for matching；The stage of the origin of described bad is grasped according to the origin of described each；And from described
The bad coordinate of panel benchmark deducts the origin of bad grasped, and calculates the stage of the bad coordinate of piece benchmark in panel.
The storage design data of the bad position analysis method of the embodiment of the present invention and the stage of product information can also wrap
Include：The stage of the origin of the reference block in panel is grasped using the design data；Arrangement based on the block in the panel is believed
Breath grasps the stage of each piece of origin；And the arrangement anglec of rotation using block and described piece of profile coordinate calculate the block in panel
Profile coordinate stage.
The bad position analysis method of the embodiment of the present invention, by the bad coordinate of panel benchmark the bad seat of block benchmark is being transformed to
In the case of target, the stage for being transformed to the bad coordinate of each object can include：Grasp and the bad coordinate phase of panel benchmark
The stage of bad piece for matching somebody with somebody；The stage of described bad piece of origin is grasped according to described each piece of origin；And from the panel
The bad coordinate of benchmark deducts bad piece grasped of origin, calculates the stage of the bad coordinate of block benchmark in panel.
The bad position analysis method of the embodiment of the present invention is additionally may included in the stage for being transformed to the bad coordinate of each object
Afterwards, generated according to the requirement of user based on the bad coordinate of each object and provide the bad coordinate in each region or each region is bad
The stage of statistical information.
The design data of the bad position analysis method of the embodiment of the present invention can include panel（Panel）Interior piece arrangement
Block arrangement information, block profile coordinate, block internal symbol and feature in information, piece profile coordinate, panel（Feature）Letter
Breath, the bad position analysis method can also include：After the stage of the bad coordinate of each object is transformed to, set based on described
The stage of the outer contour of the block profile coordinate identification block for counting；And with the bad coordinate of the block unit for having stored and described piece
Outer contour on the basis of grasp bad coordinate inside and outside block, and the stage of bad coordinate position is exported in the design data.
Invention effect
The bad position analysis system of the embodiment of the present invention and method, flame is reflected in design data and is carried out
Export, therefore the design fragile to bad generation can be found out in the manufacturing process of tellite and repair so as to perform design
Just（Correction）, multiple product design and process capability can be connected and be analyzed to bad, therefore energy can be expected
The effect for improving process capability.
Additionally, the embodiment of the present invention can be with the panel of tellite（Panel）Benchmark, piece（Sheet）Benchmark and
Block（Piece）The bad coordinate of benchmark confirmation, therefore the working load of the bad grasp of operator can be reduced, productivity ratio can be improved.
Additionally, the embodiment of the present invention can be entered to the region of user's setting or the region for having certain characteristic in design
Row setting simultaneously carries out coordinatograph, can be poor by the generation frequency of set each region differentiation flame, therefore can be to spatially
Improvement subject area set.
Description of the drawings
Fig. 1 is the figure of the structure of the bad position analysis system that illustrate in detail the embodiment of the present invention.
Fig. 2 is for illustrating that the bad coordinate of the embodiment of the present invention grasps the figure of method.
Fig. 3 is for illustrating that the bad coordinate of the embodiment of the present invention grasps the figure of method.
Fig. 4 is for illustrating that the bad coordinate of the embodiment of the present invention grasps the figure of method.
Fig. 5 is the figure for illustrating the output example of the monitoring unit of the embodiment of the present invention.
Fig. 6 is the figure for illustrating the output example of the monitoring unit of the embodiment of the present invention.
Fig. 7 is the figure for illustrating the output example of the monitoring unit of the embodiment of the present invention.
Fig. 8 is the figure for illustrating the output example of the monitoring unit of the embodiment of the present invention.
Fig. 9 is the flow chart for illustrating the bad position analysis method of the embodiment of the present invention.
Figure 10 is for illustrating to grasp the bad flow chart for sitting calibration method inside and outside the block of the embodiment of the present invention.
Description of reference numerals
100：Bad position analysis system 110：Data collection unit 120：Coordinate converting section
130：Monitoring unit 140：Output section 150：Data base
Specific embodiment
Explanation and preferred embodiment by reference to the greater detail below of accompanying drawing, the purpose of the present invention, specific advantage with
And new feature will become clearer from.It has to be noticed that in this manual, in the element mark accompanying drawing mark to each accompanying drawing
Clock, be limited to identical element, even if being shown in different accompanying drawings also marks identical reference as far as possible.Additionally, " one
The term such as face ", " another side ", " first ", " second " is in order to by an element and other element Jin Hang Qu Do
And use, element is not limited by the term.When below the present invention will be described, for there is a possibility that this
Bright purport becomes unsharp related known technology and will omit detailed description.
The preferred embodiments of the present invention are described in detail referring to the drawings.
Bad position analysis system
Fig. 1 is the figure of the structure of the bad position analysis system that illustrate in detail the embodiment of the present invention, and reference is used to say
Fig. 2 to Fig. 4 and the Fig. 5 to Fig. 8 for illustrating the output example of monitoring unit that bright bad coordinate grasps method is illustrated.
As shown in figure 1, bad position analysis system 100 can include data collection unit 110, coordinate converting section 120, monitoring
Portion 130, output section 140 and data base 150.
Illustrate in greater detail as data collection unit 110 can be with collector panels（Panel）The bad coordinate of benchmark, but do not limit
In this, can be with the bad coordinate of collecting tab benchmark, the bad coordinate of block benchmark.
As shown in Fig. 2 because tellite during fabrication as（a）Like that in panel（Panel）Electricity is performed under state
Road checks, so the bad data collected from check device will be collected as the bad coordinate of panel benchmark.
Now, the bad coordinate of panel benchmark means the bad seat of the bad position calculated on the basis of the origin of panel
Mark.
Design data can be transformed to coordinate form and be stored in the database 150 by coordinate converting section 120.
Illustrating in greater detail can utilize design data to grasp the origin of the reference plate in panel for, coordinate converting section 120,
The origin of each is grasped based on the arrangement information of the piece in panel, is calculated using the arrangement anglec of rotation of piece and the profile coordinate of piece
The profile coordinate of the piece in panel, and store in the database 150.
Now, coordinate converting section can derive the origin of each according to mathematical expression 1.
【Mathematical expression 1】
Here, Sij（X）Mean the i in panel（X-axis arrangement position）、j（Y-axis arrangement position）Piece X-axis origin sit
Mark, Q means the X-axis origin of the reference plate in panel, and DX means distance between the X axis datum origin of each, NX meanings
The X-axis arrangement number of piece.
Additionally, Sij（Y）Mean the i in panel（X-axis arrangement position）、j（Y-axis arrangement position）Piece Y-axis origin sit
Mark, R means the Y-axis origin of the reference plate in panel, and DY means distance between the Y axis datum origin of each, NY meanings
The Y-axis arrangement number of piece.
Additionally, design data can include panel（Panel）Block in interior piece arrangement information, piece profile coordinate, panel
Arrangement information, block profile coordinate, block internal symbol and feature（Feature）Information.Described piece of internal symbol means design
Graphical information in data, characteristic information means the characteristic information for design.
The described arrangement anglec of rotation such as Fig. 2（a）It is shown, it is meant that the angle that the piece B in panel A is rotated and arranged
Degree, the profile coordinate of the piece in panel means the piece calculated based on the state for being arranged in panel A for not being the independent state of piece
Profile coordinate.
The panel（Panel）Interior piece arrangement information can include the piece in the origin of the reference plate in panel, panel
Between initial point distance, the piece arrangement anglec of rotation, the profile coordinate of piece can include starting point, via point and end point.
Additionally, coordinate converting section 120 can utilize design data to grasp the origin of the reference block in panel, based in panel
The arrangement information of block grasp each piece of origin, the block in panel is calculated using the arrangement anglec of rotation of block and the profile coordinate of block
Profile coordinate and store in the database 150.
The described piece arrangement anglec of rotation such as Fig. 2（a）It is shown, it is meant that the angle that the block C in panel A is rotated and arranged
Degree, the profile coordinate of the block in panel means the block calculated based on the state for being arranged in panel A for not being the independent state of block
Profile coordinate.
Block arrangement information in the panel can include between the origin of reference block in panel, the block in panel origin away from
From, the block arrangement anglec of rotation, the profile coordinate of block can include starting point, via point and end point.
Additionally, coordinate converting section 120 can utilize design data and coordinate transform benchmark to collect from data collection unit 110
The bad coordinate of panel benchmark is transformed to the bad coordinate of each object and stores in the database 150.
Now, object can include the block of tellite（Piece）（Fig. 2（c））, including multiple pieces of pieces
（Sheet）（Fig. 2（b））, but be not restricted to that this, can also include panel, the panel includes multiple（Fig. 2（a））.
Additionally, the bad coordinate of panel benchmark includes identification number.
That is, coordinate converting section 120 is by the check device of tellite（For example, channel check device, visual examination
Device, optical detection device etc.）The piece benchmark that the bad coordinate of panel benchmark of middle offer is transformed on the basis of piece origin is bad
Coordinate or the bad coordinate of block benchmark on the basis of block origin, such that it is able to the bad coordinate of panel benchmark is separated into into piece list
Position and makes its overlapped at block unit, shows bad position.
For example, as shown in Fig. 3, Fig. 5 to Fig. 7, can be with panel unit（Fig. 3（a））, piece unit（Fig. 3（b））Or block unit
（Fig. 3（c））Show bad coordinate.
Illustrate in greater detail as coordinate converting section 120 can be based on the knowledge of product information grasp and the bad coordinate of panel benchmark
The type information of alias code-phase matching, extracts the design data of grasped type information, utilize extracted design data and
The bad coordinate of panel benchmark is transformed to the bad coordinate of each object by the bad coordinate of panel benchmark and coordinate transform benchmark.
In the case where the bad coordinate of panel benchmark is transformed to into the bad coordinate of piece benchmark, coordinate converting section 120 can be slapped
Bad matched with the bad coordinate of panel benchmark is held, the origin of bad is grasped according to the origin of each, from panel benchmark
Bad coordinate deducts the origin of bad grasped, and calculates the bad coordinate of piece benchmark in panel.
Now, it is being intended to that the bad coordinate of piece benchmark in panel is transformed to Fig. 3（b）The form that shown mode is configured
In the case of piece benchmark, the rotation information of the bad coordinate reflection piece of piece benchmark that can be in panel enters line translation.
Additionally, in the case where the bad coordinate of panel benchmark is transformed to into the bad coordinate of block benchmark, coordinate converting section 120 can
To grasp bad piece matched with the bad coordinate of panel benchmark, bad piece of origin is grasped according to each piece of origin, from panel
The bad coordinate of benchmark deducts bad piece grasped of origin, calculates the bad coordinate of block benchmark in panel.
Now, it is being intended to that the bad coordinate of block benchmark in panel is transformed to Fig. 3（c）The form that shown mode is configured
In the case of block benchmark, the rotation information of the bad coordinate reflection block of block benchmark that can be in panel enters line translation.
On the other hand, coordinate converting section 120 can not only utilize the bad coordinate of panel benchmark, and can be bad using piece benchmark
Coordinate or the bad coordinate of block benchmark are transformed to the bad coordinate of each object.
For example, coordinate converting section 120 can be by the bad coordinate of piece benchmark transmitted via data collection unit 110 or block benchmark
Bad coordinate is transformed to the bad coordinate of panel benchmark on the basis of the origin of panel or the block benchmark on the basis of the origin of block
Bad coordinate or the bad coordinate of piece benchmark.
Now, to be transformed to each object bad for the bad coordinate of the aforesaid utilization panel benchmark of the applied in reverse of coordinate converting section 120
The principle of coordinate, in this regard, detailed description will be omitted.
Thus, data collection unit 110 can be with the bad coordinate of collecting tab benchmark and the bad coordinate of block benchmark.
That is, coordinate converting section 120 can be separated into panel unit, block unit and be made it using the bad coordinate of piece benchmark
It is overlapped, show bad position.
Additionally, coordinate converting section 120 can be based on the outer contour that the block profile coordinate of design data recognizes block, grasp
The bad coordinate of block unit of grasp is located in block or outside block on the basis of the outer contour of block, and is stored in data base
In 150.Now, because block profile coordinate can recognize the outer of block including starting point, via point and end point based on this
Contour line.
For example, when the bad coordinate of block unit is pressed in block, coordinate converting section 120 together matches identification information " 1 "
Get up to be stored, when outside block, identification information " 0 " together is matched to get up to be stored by coordinate converting section 120.
Monitoring unit 130 can be based on the storage bad coordinate of each object in the database 150 and be generated according to the requirement of user
And provide the bad coordinate in each region or each region bad statistical information（Fig. 5 to Fig. 7）.
Illustrate in greater detail as shown in Figures 5 to 7, monitoring unit 130 can be specified according to panel, piece, tuber according to user
Specific region, distinguish the bad coordinate produced in the region and simultaneously shown.
Now, the region can manually set region by user, or according to the special datum of input（For example, circuit pattern
Line/interval（space）For 50/50 μm region etc.）Automatically set.
Additionally, the bad coordinate information in each region for being generated can be stored in the database 150, with the area information together
Stored.
Additionally, as shown in Figures 5 to 7, monitoring unit 130 can automatically calculate the bad statistical information in each region（For example, it is bad
Produce block number, bad generation piece number, bad number of coordinates etc.）There is provided, thus can expect to reduce operator for grasp not
The effect of good working load.
Additionally, monitoring unit 130 can be on the basis of the outer contour of the bad coordinate of the block unit for having stored and block, based on block
Inside and outside bad coordinate grasps the bad generation quantity in same, derives bad number of blocks, calculates fraction defective statistical data.
Additionally, monitoring unit 130 can be with the bad coordinate of the panel unit for having stored, the bad coordinate of piece unit, block unit not
On the basis of the outer contour of good coordinate, the outer contour of panel, the outer contour of piece and block, existed based on bad coordinate inside and outside block
Bad coordinate position is exported in the design data.
Now, because block profile coordinate is including starting point, via point and end point, it is possible to based on this identification block
Outer contour.
For example, such as Fig. 4（a）It is shown, by showing bad coordinate in the design data inside block, so as to user can use
Naked eyes monitoring generates bad in which position.
Additionally, according to bad coordinate is confirmed in design data, user can with the naked eye confirm that Jing often produces bad setting
Meter, therefore design etc. after can informing, can expect the effect that can improve product credibility.
Additionally, such as Fig. 4（b）With（c）Shown, monitoring unit 130 can be carried out to the specific region in the design data inside block
Amplify and provide, or actual bad photo is provided.
Thus, data base 150 must store the bad photo of reality of design data.
As shown in Figures 5 to 7, monitoring unit 130 can by bad coordinate with divide into panel（Panel）, piece（Sheet）, block
（Piece）Design data match, so as to grasp the bad position of actual product, via output section 140 with a picture
In the mode that specific bad mode performs monitoring can only be selected to be exported by the form and aspect that bad mode distinguishes bad coordinate.
Additionally, as shown in figure 8, bad number can be divided into form and aspect by monitoring unit 130 by bad coordinate, via output section
140 are exported.For example, the bad coordinate 1. of Fig. 8 means to generate one to two bad situation, bad seat 2.
Mark means to generate the bad situation of more than 51.
That is, as shown in figure 8, monitoring unit 130 is by panel（Panel）Divide into imaginary grid（Grid）, according in each lattice
The different form and aspect of the bad number application of generation in sub, it is possible thereby to easily detect the bad repetition of same position.
Output section 140 can export the information shown to user in bad position analysis system 100.That is, export
Portion 140 can rise with the structural nexuss including the bad position analysis system 100 including monitoring unit 130 and coordinate converting section 120
Carry out output information.
Now, output section 140 can be exported with the word that can with the naked eye be confirmed or sound form.
For example, output section 140 can export on picture by monitoring unit 130 transmit including bad coordinate position, bad
Rate statistical data is in interior various information.
Data base 150 can store including including design data and product information with the phase of bad position analysis system 100
The information of association.
Additionally, data base 150 can store the design data of coordinate form.
Further illustrate for, data base 150 can be transformed to coordinate form including design data, product information, each
The bad coordinate of object（Such as bad coordinate of panel benchmark, the bad coordinate of piece benchmark, the bad coordinate of block benchmark etc.）It is interior with not
The associated all information of good position analyses system 100 are stored.
Additionally, type information and identification number matching are got up to be stored by product information.
Additionally, design data can include panel（Panel）Block in interior piece arrangement information, piece profile coordinate, panel
Arrangement information, block profile coordinate, block internal symbol and feature（Feature）Information, the bad coordinate of the panel benchmark can be with
Including identification number, and matched together with type information.
Bad position analysis method
Fig. 9 is the flow chart for illustrating the bad position analysis method of the embodiment of the present invention, and Figure 10 is for illustrating the palm
Hold the bad flow chart for sitting calibration method inside and outside the block of the embodiment of the present invention.
When illustrating to bad position analysis method, with reference to the Fig. 2 for illustrating bad coordinate grasp method to figure
4th, illustrate for illustrating Fig. 5 to Fig. 8 of the output example of monitoring unit.
First, as shown in figure 9, design data and product can be stored in the data base 150 of bad position analysis system 100
Product information（S101）.
At this point it is possible to design data is transformed to into coordinate be stored with designing coordinate form.
Illustrate in greater detail as the profile coordinate of the piece in design data can enter line translation and store up via the following stage
Deposit in the database 150, the stage is：Using the stage of the origin of the reference plate in design data grasp panel, based on panel
The arrangement information of interior piece grasps the stage of the origin of each and the profile coordinate of the arrangement anglec of rotation using piece and piece is calculated
The stage of the profile coordinate of the piece gone out in panel.
Additionally, the profile coordinate of the block in design data can be converted and be stored in data base via the such as next stage
In 150, the stage is：Stage, the row based on the block in panel of the origin of the reference block in panel are grasped using design data
Column information grasps the stage of each piece of origin and the profile coordinate of the arrangement anglec of rotation using block and block is calculated in panel
The stage of the profile coordinate of block.
Then, as shown in figure 9, the panel for manufacturing tellite can every time carried out（Panel）Inspection
Collect from multiple check devices during operation（For example, channel check device, appearance inspection device, optical detection device etc.）（Do not scheme
Show）The bad coordinate of panel benchmark of transmission（S103）.
As shown in Fig. 2 because tellite is during fabrication as Fig. 2（a）Like that in panel（Panel）Perform under state
Including the various inspections including channel check, so the bad data collected from check device will be used as the bad coordinate of panel benchmark
It is collected.
Now, the bad coordinate of panel benchmark means the bad seat of the bad position calculated on the basis of the origin of panel
Mark.
Then, match with the identification number of the bad coordinate of panel benchmark as shown in figure 9, can be grasped based on product information
Type information, extract the design data of grasped type information（S105）.
Now, type information and identification number matching are got up to be stored by product information.
Additionally, design data includes panel（Panel）Block arrangement in interior piece arrangement information, piece profile coordinate, panel
Information, block profile coordinate, block internal symbol and feature（Feature）Information, the bad coordinate of the panel benchmark includes identification
Number, can match with type information.Described piece of internal symbol means the graphical information in design data, characteristic information meaning
Taste the characteristic information for design.
The panel（Panel）Interior piece arrangement information can include the piece in the origin of the reference plate in panel, panel
Between initial point distance, the piece arrangement anglec of rotation, the profile coordinate of piece can include starting point, via point and end point.
Then, as shown in Figure 9, it is possible to use design data and coordinate transform benchmark are transformed on the bad coordinate of panel benchmark
The bad coordinate storage of each object is in the database 150（S107、S109）.
Now, object can include the block of tellite（Piece）With the piece including multiple described piece（Sheet）,
But be not restricted to that this, can also include panel, the panel includes multiple.
On the other hand, in the case where the bad coordinate of panel benchmark is transformed to into the bad coordinate of piece benchmark, it is each right to be transformed to
As the stage of bad coordinate（S107）Can include：Grasp the stage of bad matched with the bad coordinate of panel benchmark；Root
The stage of the origin of bad is grasped according to the origin of each；And deduct bad for being grasped from the bad coordinate of panel benchmark
Origin, calculates the stage of the bad coordinate of piece benchmark in panel.
On the other hand, in the case where the bad coordinate of panel benchmark is transformed to into the bad coordinate of block benchmark, it is each right to be transformed to
As the stage of bad coordinate（S107）Can include：Grasp bad piece matched with the bad coordinate of panel benchmark of stage；Root
The stage of bad piece of origin is grasped according to each piece of origin；And deduct bad piece for being grasped from the bad coordinate of panel benchmark
Origin, calculates the stage of the bad coordinate of block benchmark in panel.
The panel（Panel）Interior block arrangement information can include former between the block in the origin of the block in panel, panel
Point distance, the block arrangement anglec of rotation, the profile coordinate of block can be including starting point, via point and end point.
Then, the bad coordinate in each region or each can be generated and provide according to the requirement of user based on the bad coordinate of each object
The bad statistical information in region（S111）.
For example, monitoring unit 130 can be based on block on the basis of the outer contour of the bad coordinate of the block unit for having stored and block
Inside and outside bad coordinate grasps the bad generation quantity in same, can derive bad number of blocks and calculate fraction defective statistical data.
Additionally, in the stage for being transformed to the bad coordinate of each object（S107）After, monitor information in the offer of stage S111
Stage, bad position analysis system 100 can export external information in the block of bad coordinate.
Illustrate in greater detail as exporting the method for external information in the block of bad coordinate can include：Based on design data
The stage of the outer contour of block profile coordinate identification block；And with the bad coordinate of the block unit for having stored and described piece of outline
Bad coordinate inside and outside block is grasped on the basis of line, bad coordinate position is exported in the design data（Fig. 7）Stage.
Bad seat calibration method inside and outside block is grasped on the basis of the outer contour of block as described below.
First, as shown in Figure 10, extended line can be produced on arbitrary direction in specific bad coordinate position（S201）.
Then, as shown in Figure 10, can confirm that whether extended line is odd number with the number of the intersection point of block outer contour
（S203）.
Then, as shown in Figure 10, the confirmation result in stage S203 be intersection point number be odd number in the case of, Ke Yizhang
It is to be located at the coordinate inside block to hold the bad coordinate（S205）.
If, stage S203 confirmation result be intersection point number be even number in the case of, it is possible to grasp this bad
Coordinate is to be located at the coordinate outside block（S207）.
The embodiment of the present invention will can be produced in inspection operation in the manufacture process of tellite from each check device
Raw bad coordinate is reflected in design data and is provided, the bad letter of output with conditions in region that can be according to required by user
Breath, accordingly, it is capable to the effect of the bad management for expecting systematically to perform tellite.
Additionally, the embodiment of the present invention can carry out bad coordinate transform by object, therefore offer can be needed according to user
The bad coordinate of panel benchmark, the bad coordinate of piece benchmark or the bad coordinate of block benchmark, thus, can further improve user with printing
The associated bad analysis working performance of the manufacturing process of circuit substrate.
Additionally, the embodiment of the present invention is managed the bad coordinate storage produced in specific inspection operation in data base
Reason, therefore the bad inspection of the position of repetition can be omitted in next inspection operation, thus, by reducing tellite
Inspection operation working load, so as to improve productivity ratio, the credibility of inspection result can be improved.
Further, in an embodiment of the present invention user is able to confirm that the bad coordinate being reflected in design data, so logical
Cross to derive in the design and produce fragile part to bad, and be modified to the design for reducing bad generation, then be applied to
Manufacturing process, so as to reduce fraction defective.
More than, although the present invention is illustrated in detail based on specific embodiment, but this is intended merely to specifically
The present invention will be described on ground, and the present invention is not limited to this, it is clear that as long as the people with common sense in the field, just can be at this
Deformed in the range of bright technological thought, improved.
The simple deformation or change of the present invention belongs to the field of the invention, the specific protection domain of the present invention by
Appended claims institute is clearly.
Claims (21)
1. a kind of bad position analysis system, wherein, the bad position analysis system includes：To believing including design data and product
The data base that breath is stored in the interior information being associated with bad position analysis system；The bad coordinate of collector panels benchmark
Data collection unit；And the panel that will be collected from the data collection unit using the design data and coordinate transform benchmark
The bad coordinate of benchmark is transformed to the bad coordinate of each object and storage coordinate converting section in the database, and the object includes
The block of the tellite and including multiple described piece of piece,
Wherein, the bad coordinate of the panel benchmark includes identification number, and the coordinate converting section is grasped based on the product information
The type information matched with the identification number of the bad coordinate of the panel benchmark, the design number for extracting grasped type information
According to, utilize extracted design data and the bad coordinate of the panel benchmark and the coordinate transform benchmark by the panel base
Accurate bad coordinate is transformed to the bad coordinate of each object.
2. bad position analysis system according to claim 1, wherein, the design data includes the piece arrangement in panel
Block arrangement information, block profile coordinate, block internal symbol and characteristic information in information, piece profile coordinate, panel.
3. bad position analysis system according to claim 1, wherein, the data base stores the design number of coordinate form
According to the coordinate converting section is using the origin of the reference plate in design data grasp panel, based on the piece in the panel
The profile coordinate of the arrangement information origin, the arrangement anglec of rotation using piece and piece of grasping each calculate the wheel of the piece in panel
Wide coordinate is simultaneously stored in the database.
4. bad position analysis system according to claim 3, wherein, the bad coordinate of the panel benchmark is being transformed to
In the case of the bad coordinate of piece benchmark, the coordinate converting section is grasped bad with what the bad coordinate of the panel benchmark matched
Piece, the origin that described bad is grasped according to the origin of described each, deduct what is grasped from the bad coordinate of the panel benchmark
The origin of bad, the bad coordinate of piece benchmark calculated in panel.
5. bad position analysis system according to claim 2, wherein, described piece of profile coordinate include starting point, via
Point and end point.
6. bad position analysis system according to claim 1, wherein, the coordinate converting section is based on the design data
Block profile coordinate identification block outer contour, the bad coordinate of block unit grasped of grasp with described piece of outer contour as base
Standard is in block or outside block and stores in the database.
7. bad position analysis system according to claim 1, wherein, the data base stores the design number of coordinate form
According to the coordinate converting section grasps origin, the row based on the block in the panel of the reference block in panel using design data
Column information grasps the profile seat that the profile coordinate of each piece of origin, the arrangement anglec of rotation using block and block calculates the block in panel
Mark and store in the database.
8. bad position analysis system according to claim 7, wherein, the bad coordinate of the panel benchmark is being transformed to
In the case of the bad coordinate of block benchmark, the coordinate converting section grasps bad piece, the root matched with the bad coordinate of panel benchmark
Bad piece for being grasped is deducted according to the origin of described each piece of described bad piece of origin grasp, from the bad coordinate of the panel benchmark
Origin, the bad coordinate of block benchmark calculated in panel.
9. bad position analysis system according to claim 1, wherein, the bad seat of the data collection unit collecting tab benchmark
Mark, the coordinate converting section the bad coordinate of piece benchmark transmitted via the data collection unit is transformed to be with the origin of panel
The bad coordinate of panel benchmark of benchmark or the bad coordinate of block benchmark on the basis of the origin of block.
10. bad position analysis system according to claim 1, wherein, the bad position analysis system also includes being based on
The storage bad coordinate of each object in the database, the bad coordinate in each region or each is generated and provided according to the requirement of user
The monitoring unit of the bad statistical information in region.
11. bad position analysis systems according to claim 10, wherein, the design data includes the piece row in panel
Block arrangement information, block profile coordinate, block internal symbol and characteristic information in column information, piece profile coordinate, panel, the prison
Depending on portion with the bad coordinate of the panel unit for having stored, the bad coordinate of piece unit, the bad coordinate of block unit, the outer contour of panel,
On the basis of the outer contour of piece and the outer contour of block, export bad in the design data based on bad coordinate inside and outside block
Coordinate position.
12. bad position analysis systems according to claim 10, wherein, the bad position analysis system is additionally included in institute
State the output section that the information shown to user is exported in bad position analysis system.
13. bad position analysis systems according to claim 12, wherein, the monitoring unit is by bad coordinate by bad
Number is divided into form and aspect and is exported via the output section.
A kind of 14. bad position analysis methods, the bad coordinate of each object during the method is used for bad position analysis system enters
Row management, wherein, the bad position analysis method includes：Bad position analysis system stores the rank of design data and product information
Section；In the inspection operation for carrying out the panel for manufacturing tellite every time, to the face transmitted from multiple check devices
The stage that the bad coordinate of plate benchmark is collected；And using the design data and coordinate transform benchmark by the panel benchmark
Bad coordinate is transformed to the stage of the bad coordinate of each object, and the object includes the block of the tellite and including multiple
Described piece of piece,
Wherein, the design data includes block arrangement information, the block in the piece arrangement information in panel, piece profile coordinate, panel
Profile coordinate, block internal symbol and characteristic information, the bad coordinate of the panel benchmark includes identification number, the bad position
Analysis method also includes：Grasp and institute before the stage of the bad coordinate of each object is transformed to, based on the product information
State type information that the identification number of the bad coordinate of panel benchmark matches, extract the design data of grasped type information
Stage.
15. bad position analysis methods according to claim 14, wherein, storing the design data and product information
Stage in, by the design data be transformed to coordinate and with design coordinate form stored.
16. bad position analysis methods according to claim 14, wherein, store the design data and product information
Stage also includes：The stage of the origin of the reference plate in panel is grasped using the design data；Based on the piece in the panel
Arrangement information grasp each origin stage；And the arrangement anglec of rotation using piece and described profile coordinate calculate face
The stage of the profile coordinate of the piece in plate.
17. bad position analysis methods according to claim 16, wherein, by the bad coordinate transform of the panel benchmark
In the case of for the bad coordinate of piece benchmark, being transformed to the stage of the bad coordinate of each object includes：Grasp and the panel base
The stage of match bad of accurate bad coordinate；The stage of the origin of described bad is grasped according to the origin of described each；
And deduct the origin of bad grasped, the bad coordinate of piece benchmark calculated in panel from the bad coordinate of the panel benchmark
Stage.
18. bad position analysis methods according to claim 14, wherein, store the design data and product information
Stage also includes：The stage of the origin of the reference block in panel is grasped using the design data；Based on the block in the panel
Arrangement information grasp each piece origin stage；And the arrangement anglec of rotation using block and described piece of profile coordinate calculate face
The stage of the profile coordinate of the block in plate.
19. bad position analysis methods according to claim 18, wherein, by the bad coordinate transform of the panel benchmark
In the case of for the bad coordinate of block benchmark, being transformed to the stage of the bad coordinate of each object includes：Grasp with panel benchmark not
The stage of match bad piece of good coordinate；The stage of described bad piece of origin is grasped according to described each piece of origin；And
From the bad coordinate of the panel benchmark deduct bad piece grasped origin, the bad coordinate of block benchmark calculated in panel rank
Section.
20. bad position analysis methods according to claim 14, wherein, the bad position analysis method also includes：
Generate and provide according to the requirement of user after being transformed to the stage of the bad coordinate of each object, based on the bad coordinate of each object
The stage of each bad coordinate in region or the bad statistical information in each region.
21. bad position analysis methods according to claim 14, wherein, the design data includes the piece row in panel
Block arrangement information, block profile coordinate, block internal symbol and characteristic information in column information, piece profile coordinate, panel, it is described not
Good position analyses method also includes：Block wheel after the stage of the bad coordinate of each object is transformed to, based on the design data
The stage of the outer contour of wide coordinate identification block；And be with the bad coordinate of the block unit for having stored and described piece of outer contour
Benchmark grasps inside and outside block bad coordinate and stage of bad coordinate position is exported in the design data.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0121288 | 2012-10-30 | ||
| KR1020120121288A KR101474611B1 (en) | 2012-10-30 | 2012-10-30 | System and method for analyzing of defect position |
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| CN103793544A CN103793544A (en) | 2014-05-14 |
| CN103793544B true CN103793544B (en) | 2017-04-12 |
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| CN201310162917.7A Expired - Fee Related CN103793544B (en) | 2012-10-30 | 2013-05-06 | System and method for analyzing of defect position |
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| Country | Link |
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| JP (1) | JP5480424B1 (en) |
| KR (1) | KR101474611B1 (en) |
| CN (1) | CN103793544B (en) |
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| CN106020548B (en) * | 2016-05-27 | 2019-02-22 | 京东方科技集团股份有限公司 | A kind of touch control detection device, touch control display apparatus and touch control detecting method |
| CN110837717B (en) * | 2019-11-06 | 2022-09-06 | 成都数之联科技股份有限公司 | Map-based glass panel multi-defect root cause analysis method |
| CN114441559A (en) * | 2021-12-24 | 2022-05-06 | 杭州电子科技大学 | Method for rapidly detecting positive surface fault point in AOI (automated optical inspection) of PCB (printed circuit board) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1773301A (en) * | 2004-11-11 | 2006-05-17 | 三星电子株式会社 | Inspection apparatus for display panel and method for testing the same apparatus for the same display panel assembly |
| CN102486829A (en) * | 2010-12-01 | 2012-06-06 | 鸿富锦精密工业（深圳）有限公司 | Image analysis system and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004179234A (en) * | 2002-11-25 | 2004-06-24 | Renesas Technology Corp | Manufacturing method of semiconductor device |
| JP2007109778A (en) * | 2005-10-12 | 2007-04-26 | Matsushita Electric Ind Co Ltd | Method for mounting electronic component |
| JP5342422B2 (en) * | 2009-12-10 | 2013-11-13 | ルネサスエレクトロニクス株式会社 | Semiconductor device and manufacturing method thereof |
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2012
- 2012-10-30 KR KR1020120121288A patent/KR101474611B1/en active IP Right Grant
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1773301A (en) * | 2004-11-11 | 2006-05-17 | 三星电子株式会社 | Inspection apparatus for display panel and method for testing the same apparatus for the same display panel assembly |
| CN102486829A (en) * | 2010-12-01 | 2012-06-06 | 鸿富锦精密工业（深圳）有限公司 | Image analysis system and method |
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| KR101474611B1 (en) | 2014-12-18 |
| JP2014090154A (en) | 2014-05-15 |
| CN103793544A (en) | 2014-05-14 |
| KR20140055039A (en) | 2014-05-09 |
| JP5480424B1 (en) | 2014-04-23 |
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