CN208125008U - A kind of multi-layer flexible circuit board contraposition offset detection components - Google Patents

A kind of multi-layer flexible circuit board contraposition offset detection components Download PDF

Info

Publication number
CN208125008U
CN208125008U CN201820657815.0U CN201820657815U CN208125008U CN 208125008 U CN208125008 U CN 208125008U CN 201820657815 U CN201820657815 U CN 201820657815U CN 208125008 U CN208125008 U CN 208125008U
Authority
CN
China
Prior art keywords
layer
reverse side
contraposition
copper foil
film layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201820657815.0U
Other languages
Chinese (zh)
Inventor
马萃
王月云
徐玮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhuhai Keno Microelectronics Co Ltd
Original Assignee
Zhuhai Keno Microelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhuhai Keno Microelectronics Co Ltd filed Critical Zhuhai Keno Microelectronics Co Ltd
Priority to CN201820657815.0U priority Critical patent/CN208125008U/en
Application granted granted Critical
Publication of CN208125008U publication Critical patent/CN208125008U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

The utility model proposes a kind of multi-layer flexible circuit boards to align offset detection components, it is related to wiring board technique of counterpoint field, including being set to the contraposition marking scale of front film layer and being set to the contraposition marking scale of reverse side film layer, front substrate layer, internal layer and reverse side substrate layer with drilling are provided between front film layer and reverse side film layer;The contraposition marking scale of front film layer and the contraposition marking scale of reverse side film layer are using dislocation complementary structure;This mark component design is taken to this mark component for checking plate surrounding after the completion of plate surrounding, plate contraposition, can judge route precision within one second.It needs Quality Detection speed to be substantially increased, thus the product turnout efficiency promoted by being faster more convenient when mark component small in apparatus measures data comparison, billboard than the prior art;A large amount of cost of labor has been saved for company, has substantially increased company competitiveness.

Description

A kind of multi-layer flexible circuit board contraposition offset detection components
Technical field
The utility model relates to wiring board technique of counterpoint fields more particularly to a kind of multi-layer flexible circuit board to align offset Detection components.
Background technique
Flexible circuit board (Flexible Printed Circuit Board) is with polyimides or to gather referred to as " FPC " Ester film encloses copper foil above substrate, route is made by processes such as pattern transfer technology, development, etchings as insulating substrate, A layer insulating is bonded or printed again on manufactured route, and the place on line for needing to be connected opens a window, further according to difference It is required that the plate with electric general character energy that a series of this process such as the corresponding reinforcement of fitting, auxiliary material, component are made into.It can be certainly By bending, winding, folding, it has small in size, light-weight, thermal diffusivity and solderability and to be easy to load, overall cost more low Advantage has certain market advantage compared with hardboard.Electronic product is applicable in develop to high density, miniaturization, highly reliable direction It needs.FPC is obtained on the fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or product To being widely applied.Flexible circuit board can be divided into single sided board, single-face hollowed-out board, dual platen, multi-layer board etc. according to the number of plies.
Utility model content
The utility model provides a kind of multi-layer flexible circuit board contraposition offset detection components, simply easily sees, discrimination degree is high, In process of production, it is possible to reduce position aligning time improves efficiency, and can detect offset data quickly, and reaching can accurately line Road contraposition and inspection route precision.
To achieve the goals above, the utility model proposes a kind of multi-layer flexible circuit boards to align offset detection components, Including being set to the contraposition marking scale of front film layer and being set to the contraposition marking scale of reverse side film layer, front film layer and anti- Front substrate layer, internal layer and reverse side substrate layer with drilling are provided between the film layer of face;The contraposition marking scale of front film layer Contraposition marking scale with reverse side film layer is using dislocation complementary structure.
This logo design is taken after the completion of plate surrounding, plate contraposition and checks plate surrounding by the utility model This component can judge route precision in one second;It needs than the prior art by small in apparatus measures data comparison, billboard Contraposition marking scale will be faster more convenient, and substantially increase Quality Detection speed, thus the product turnout efficiency promoted;
Preferably, the contraposition marking scale uses concentric structure, and inner circle is using dislocation complementary structure, according to technique system The semidiameter for making tolerance setting concentric circles, for detecting contraposition offset.
The range difference for the tolerance setting bit identification ruler concentric circles that the utility model makes according to technique, it is wrong by overlooking The alignment situation of position complementary structure, obtains departure quickly, improves Quality Detection speed;
Preferably, be provided with front copper foil layer between the front substrate layer and front film layer, front substrate layer with just Face copper foil layer is provided with drilling.
Preferably, it is provided with reverse side copper foil layer between the reverse side substrate layer and reverse side film layer, reverse side substrate layer and anti- Face copper foil layer is provided with drilling.
Preferably, the internal layer, including the first internal layer copper foil layer, internal layer substrate layer and the second internal layer copper foil layer, internal layer base Material layer is set between the first internal layer copper foil layer and the second internal layer copper foil layer, and the first internal layer copper foil layer and the second internal layer copper foil layer are set It is equipped with drilling.
Preferably, the dislocation complementary structure, specially:The contraposition marking scale and reverse side film layer of front film layer Contraposition marking scale is all made of chessboard type structure, and front checker-wise is partially filled with, the filling of reverse side checker-wise remainder, the two Complementary combinations form complete gridiron pattern.
The utility model divides multiple checker-wises, the number and flexible circuit board of grid according to setting chessboard type structure The number of plies it is related, grid number determines the precision of detection offset;
Preferably, the concentric structure, outside diameter drills with substrate layer and internal layer bore diameter is identical.
Preferably, the chessboard uses nine grids structure.
Preferably, the checker-wise size makes tolerance setting according to technique, for detecting contraposition offset.
Compared with prior art, the utility model provides a kind of multi-layer flexible circuit board contraposition offset detection components, by this Component design is identified in plate surrounding, plate aligns and takes this mark component for checking plate surrounding after the completion, and one second It can judge route precision.Than the prior art is needed through mark component small in apparatus measures data comparison, billboard more It is fast more convenient, Quality Detection speed is substantially increased, thus the product turnout efficiency promoted;It has been saved for company a large amount of artificial Cost substantially increases company competitiveness.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is that multi-layer flexible circuit board contraposition offset detection components structure is shown in a kind of preferred embodiment of the utility model It is intended to;
Fig. 2 is that marking scale schematic diagram is aligned in a kind of preferred embodiment of the utility model, wherein figure (a) is positive in face of position Marking scale;Scheming (b) is that reverse side aligns marking scale;
Fig. 3 is front copper foil layer position view in a kind of preferred embodiment of the utility model;
Fig. 4 is reverse side copper foil layer position view in a kind of preferred embodiment of the utility model;
Fig. 5 is the first internal layer copper foil layer, internal layer substrate layer and the second internal layer copper in a kind of preferred embodiment of the utility model Layers of foil position view;
Symbol description:
1. front film layer;2. reverse side film layer;3. front substrate layer;4. internal layer;5. reverse side substrate layer, 6.-is just Face copper foil layer;7. reverse side copper foil layer;8. the-the first internal layer copper foil layer;9. internal layer substrate layer;10. the-the second internal layer copper foil layer;
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that if related in the utility model embodiment directionality instruction (such as upper and lower, left and right, it is preceding, Afterwards ...), then directionality instruction is only used for explaining opposite between each component under a certain particular pose (as shown in the picture) Positional relationship, motion conditions etc., if the particular pose changes, directionality instruction is also correspondingly changed correspondingly.
In addition, if relating to the description of " first ", " second " etc. in the utility model embodiment, " first ", " the Two " etc. description is used for description purposes only, and is not understood to indicate or imply its relative importance or is implicitly indicated meaning The quantity of the technical characteristic shown." first " is defined as a result, the feature of " second " can explicitly or implicitly include at least one A this feature.It in addition, the technical solution between each embodiment can be combined with each other, but must be with ordinary skill Based on personnel can be realized, this technical side will be understood that when the combination of technical solution appearance is conflicting or cannot achieve The combination of case is not present, also not within the protection scope of the requires of the utility model.
Multiple-plate chief component:Two-sided substrate (polyimides or polyester film add two-sided copper foil), pure copper foil (electricity Solve ED, calendering RA etc.), single side substrate (polyimides or polyester film add single side copper foil), insulating layer (cover film or insulating oil Ink), pure glue, PP piece, FR4 copper clad laminate, reinforcement (electromagnetic membrane, PI, steel disc, gummed paper etc.) etc..Common multiple-plate structure is 1+2,1 + 2+1,2+2,1+2+2+1,1+1+2+1+1 etc.,
1:For single side substrate, one layer of pure copper foil or FR4 copper clad laminate;
2:For dual platen.It is generally combined between layers by pure glue or PP piece.
Stacking multilayer boards contraposition is always that multi-layer flexible circuit board makes difficult point, tolerance and difficult to govern control.
The utility model proposes a kind of multi-layer flexible circuit boards to align offset detection components;
In a kind of preferred embodiment of the present invention, as shown in Figure 1, the component includes the front film for being provided with contraposition marking scale Layer 1. and be provided with contraposition marking scale reverse side film layer 2., be provided between front film layer and the reverse side film layer band drill Front substrate layer 3., internal layer 4. with reverse side substrate layer 5.;The contraposition marking scale of front film layer 1. and pair of reverse side film layer 2. Bit identification ruler is using dislocation complementary structure.
This logo design is taken after the completion of plate surrounding, plate contraposition and checks plate surrounding by the utility model This component can judge route precision in one second;It needs than the prior art by small in apparatus measures data comparison, billboard Contraposition marking scale will be faster more convenient, and substantially increase Quality Detection speed, thus the product turnout efficiency promoted;
In a kind of preferred embodiment of the present invention, as schemed shown in (a) and figure (b) in Fig. 2, the contraposition marking scale is using concentric Circle structure, inner circle make the semidiameter of tolerance setting concentric circles according to technique, for detecting using dislocation complementary structure Align offset;In the embodiment of the present invention, the semidiameter between concentric circles is 0.15mm;By pair for overlooking dislocation complementary structure Position situation, obtains departure quickly, improves Quality Detection speed;The concentric structure, outside diameter and substrate layer bore Hole is identical with internal layer bore diameter, aperture 3mm.
In a kind of preferred embodiment of the present invention, as shown in figure 3, the front substrate layer 3. with front film layer 1. between set It is equipped with front copper foil layer 6., 3. 6. front substrate layer is provided with drilling, aperture 3mm with front copper foil layer.
In a kind of preferred embodiment of the present invention, as shown in figure 4, the reverse side substrate layer 5. with reverse side film layer 2. between set It is equipped with reverse side copper foil layer 7., 5. 7. reverse side substrate layer is provided with drilling, aperture 3mm with reverse side copper foil layer.
In a kind of preferred embodiment of the present invention, as shown in figure 5, the internal layer, including the first internal layer copper foil layer 8., internal layer base Material layer 9. with the second internal layer copper foil layer 10., internal layer substrate layer be 9. set to the first internal layer copper foil layer 8. with the second internal layer copper foil layer 10. Between, 8. the first internal layer copper foil layer is emptied with 10. copper sheet that the second internal layer copper foil layer is diameter 3mm.
In a kind of preferred embodiment of the present invention, the dislocation complementary structure, specially:The contraposition of front film layer identifies The contraposition marking scale of ruler and reverse side film layer is all made of chessboard type structure, and front checker-wise is partially filled with, reverse side checker-wise Remainder filling, the two complementary combinations form complete gridiron pattern;
The utility model divides multiple checker-wises, the number and flexible circuit board of grid according to setting chessboard type structure The number of plies it is related, grid number determines the precision of detection offset;The present embodiment chessboard uses nine grids structure.
In a kind of preferred embodiment of the present invention, the checker-wise size makes tolerance according to technique and is arranged, and uses In detection contraposition offset, the present embodiment, the nine grids cell height for aligning marking scale is 0.6mm, width 0.67mm;
Copper foil drilling after, aligned with front and back sides line film by grid pad, can clearly find out line film and The overlapping situation of copper foil drilling can judge the offset between them according to the folded position of grid pad and copper foil drilling, If offset is excessive;Mark is also placed in the place that TOP/BOT does not drill, the grid made is identified by this to measure Data, for judging whether each stacking conjunction meets processing procedure tolerance;During making route, can faster it align, Quickly detection route registration can be identified by this.This mark is managed convenient for quality and provides data for technology With reference to.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model, Under all utility models in the utility model are conceived, equivalent structure made based on the specification and figures of the utility model Transformation, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.

Claims (9)

1. a kind of multi-layer flexible circuit board aligns offset detection components, which is characterized in that including being set to front film layer Contraposition marking scale and the contraposition marking scale for being set to reverse side film layer are provided with band and bore between front film layer and reverse side film layer Front substrate layer, internal layer and the reverse side substrate layer in hole;The contraposition of the contraposition marking scale and reverse side film layer of front film layer identifies Using dislocation complementary structure between ruler.
2. multi-layer flexible circuit board according to claim 1 aligns offset detection components, which is characterized in that the contraposition Marking scale uses concentric structure, and inner circle makes tolerance setting concentric circles using dislocation complementary structure, according to technique Semidiameter, for detecting contraposition offset.
3. multi-layer flexible circuit board according to claim 1 aligns offset detection components, which is characterized in that the front Front copper foil layer is provided between substrate layer and front film layer, front substrate layer and front copper foil layer are provided with drilling.
4. multi-layer flexible circuit board according to claim 1 aligns offset detection components, which is characterized in that the reverse side Reverse side copper foil layer is provided between substrate layer and reverse side film layer, reverse side substrate layer and reverse side copper foil layer are provided with drilling.
5. multi-layer flexible circuit board according to claim 1 aligns offset detection components, which is characterized in that in described Layer, including the first internal layer copper foil layer, internal layer substrate layer and the second internal layer copper foil layer, internal layer substrate layer are set to the first internal layer copper foil Between layer and the second internal layer copper foil layer, the first internal layer copper foil layer and the second internal layer copper foil layer are provided with drilling.
6. multi-layer flexible circuit board according to claim 1 or 2 aligns offset detection components, which is characterized in that described Dislocation complementary structure, specially:The contraposition marking scale of front film layer and the contraposition marking scale of reverse side film layer are all made of chess Tray type structure, front checker-wise are partially filled with, and reverse side checker-wise remainder filling, the two complementary combinations form complete chess Disk lattice.
7. multi-layer flexible circuit board according to claim 2 aligns offset detection components, which is characterized in that described is same The heart justifies structure, and outside diameter drills with substrate layer and internal layer bore diameter is identical.
8. multi-layer flexible circuit board according to claim 6 aligns offset detection components, which is characterized in that the chess Disk uses nine grids structure.
9. multi-layer flexible circuit board according to claim 6 aligns offset detection components, which is characterized in that the chess Disk grid size makes tolerance setting according to technique, for detecting contraposition offset.
CN201820657815.0U 2018-05-04 2018-05-04 A kind of multi-layer flexible circuit board contraposition offset detection components Active CN208125008U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820657815.0U CN208125008U (en) 2018-05-04 2018-05-04 A kind of multi-layer flexible circuit board contraposition offset detection components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820657815.0U CN208125008U (en) 2018-05-04 2018-05-04 A kind of multi-layer flexible circuit board contraposition offset detection components

Publications (1)

Publication Number Publication Date
CN208125008U true CN208125008U (en) 2018-11-20

Family

ID=64184442

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820657815.0U Active CN208125008U (en) 2018-05-04 2018-05-04 A kind of multi-layer flexible circuit board contraposition offset detection components

Country Status (1)

Country Link
CN (1) CN208125008U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109506610A (en) * 2018-12-11 2019-03-22 东莞市五株电子科技有限公司 A kind of method and system of measurement pressure screen finger spacing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109506610A (en) * 2018-12-11 2019-03-22 东莞市五株电子科技有限公司 A kind of method and system of measurement pressure screen finger spacing
CN109506610B (en) * 2018-12-11 2020-11-03 东莞市五株电子科技有限公司 Method and system for measuring distance between fingers pressing screen

Similar Documents

Publication Publication Date Title
CN103179812B (en) The preparation method of high multistage HDI printed circuit board (PCB)
CN101662895A (en) Multilayer circuit board, manufacturing method thereof and method for detecting alignment of circuit board
CN103648240A (en) Method for manufacturing symmetrical rigid-flexible printed circuit board
CN104427762B (en) Bury resistance printed board and preparation method thereof
CN103327756A (en) Multilayer circuit board with partial mixed structure and manufacturing method thereof
CN208125008U (en) A kind of multi-layer flexible circuit board contraposition offset detection components
CN106793583A (en) A kind of pcb board local electric thick gold with it is non local electricity gold wiring preparation method
CN107278023A (en) Flex circuit application reinforcement and flex circuit application
CN104023467B (en) Multi-layer circuit board with high mechanical hole drilling yield and manufacturing method thereof
CN108495486A (en) A kind of production method and High speed rear panel of High speed rear panel
JPH10163630A (en) Multi-layer printed circuit board and its manufacturing method
CN105072824B (en) A kind of preparation method of embedded lines plate
CN208125007U (en) A kind of Double-layer flexible circuit board contraposition offset detection components
CN207305080U (en) FPC jigsaw
CN206713175U (en) The composing structure of circuit board
CN106696475A (en) 3D (Three-dimensional) printer and method for utilizing 3D printer for printing printed circuit board
CN203350285U (en) Clamping device for detecting on-off of flying probe of flexible printed circuit board (PFC)
CN207692130U (en) Flexible circuit board cover film fitting contraposition and detection mark structure
CN208125006U (en) A kind of flexible circuit board silk-screen contraposition offset detection components
CN203912365U (en) Soft and hard multilayer circuit board
CN207327759U (en) A kind of doublesided copperclad laminate
CN207832062U (en) It is a kind of to be used to check the film whether multilayer line plate hole position deviates
CN102036486B (en) Method for making false double-sided board
CN112504183B (en) Hole deviation detection method
CN114615830A (en) Method for improving copper block embedded circuit board stitching glue overflow

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant