CN206713175U - The composing structure of circuit board - Google Patents
The composing structure of circuit board Download PDFInfo
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- CN206713175U CN206713175U CN201720341525.0U CN201720341525U CN206713175U CN 206713175 U CN206713175 U CN 206713175U CN 201720341525 U CN201720341525 U CN 201720341525U CN 206713175 U CN206713175 U CN 206713175U
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- circuit board
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Abstract
The utility model provides a kind of composing structure of circuit board, including daughter board, daughter board includes even number circuit board unit, even number circuit board unit is divided into first group of circuit board unit and second group of circuit board unit, the quantity of circuit board unit is one or more in every group of circuit board unit, the circuit number of plies of each circuit board unit is multilayer, and two groups of circuit board units are symmetrical arranged on the first symmetry axis, during so that daughter board carrying out pressing making motherboard with another identical daughter board, first group of circuit board unit of daughter board can be corresponding with second group of circuit board unit of another identical daughter board, second group of circuit board unit of daughter board can be corresponding with first group of circuit board unit of another identical daughter board.The composing structure of circuit board provided by the utility model, by the typesetting of negative and positive back-off, design C faces and S faces simultaneously in a daughter board, corresponding internal layer and figure press corresponding level typesetting, realize that individual daughter board is pressed with any one same daughter board.
Description
Technical field
The utility model relates to printed circuit field, more specifically, is related to a kind of composing structure of circuit board.
Background technology
With the fast development of electronic technology, electronic product develops to high precision direction, and volume constantly reduces, and density is in
Exponential increase.As shown in Figures 1 to 5, when common high laminate high density of integration can not meet more high-density line in the future and
When high-level product limitation requires, there is the deisgn product that another special N+N folds structure.N+N folds the circuit of structure design
Plate, and a kind of blind hole plate series of products, refer to multiple core materials and 2 multilayer daughter boards that PP (polypropylene) pressings form,
Daughter board can carry out multiple single pcs typesettings according to consumer product size and stock utilization.Wherein, in Fig. 51 ' for insulation PP layers.
The Making programme of daughter board need to pass through the process such as one step press, drilling, plating, filling holes with resin, Etching, then by by two sons
Plate carries out the high-level blind hole plate that pressing forms motherboard, and the product of this similar designs solves current high-level highly integrated control
Problem processed, effectively increase the transmission quality of wiring density and signal.
Because N+N daughter boards all need the making by multiple processes, pretreatment machine nog plate, electricity after one step press simultaneously
Liquid medicine immersion, resin ground, the transfer of secondary outer graphics are plated, harmomegathus shape of two daughter boards in by nog plate stress and process can be made
Into difference, causing daughter board to be misplaced up and down with daughter board, layer is inclined and product qualification rate is extremely low.Industry is typically using adjustment internal layer core at present
The harmomegathus compensation (harmomegathus coefficient is changed to compensate the drawing coefficient of internal layer according to pressing harmomegathus and processing procedure) of plate, while control system
Journey processing equipment grinding stress.Following defect be present in the production technology of this type product：
1st, it is to form two daughter boards by one step press by multiple core materials that N+N, which folds structure, a C face, a S face, this
Technique needs to use multiple egative film (silver salt piece) multiexposure, multiple exposures in the inner figure of daughter board, influences production efficiency.
2nd, the internal layer film of two daughter boards uses multiple egative film (silver salt piece) multiexposure, multiple exposures, the aligning accuracy of figure and coincidence
Degree can not meet the requirement of high-precision Aligning degree.
3rd, two daughter boards need after one step press by once drilling, once plating, filling holes with resin, secondary outer layer figure turn etc.
Process, harmomegathus of two daughter boards in by nog plate stress and process can be made to form difference, cause daughter board to be misplaced up and down with daughter board
Layer is partially.
Utility model content
The utility model is intended at least solve one of technical problem present in prior art.
Therefore, the purpose of this utility model is to provide a kind of composing structure of circuit board.
To achieve the above object, embodiment of the present utility model provides a kind of composing structure of circuit board, including：Son
Plate, the daughter board include even number circuit board unit, circuit board unit described in even number be divided into first group of circuit board unit and
Second group of circuit board unit, the quantity of circuit board unit described in circuit board unit described in every group is one or more, Mei Yisuo
The circuit number of plies for stating circuit board unit is multilayer, and circuit board unit is symmetrical arranged on the first symmetry axis described in two groups, so that
When the daughter board carries out pressing making motherboard with daughter board described in another identical, first group of circuit board unit of the daughter board can
Corresponding with second group of circuit board unit of daughter board described in another identical, second group of circuit board unit of the daughter board can be with
First group of circuit board unit of daughter board described in another identical is corresponding.
The composing structure for the circuit board that the utility model above-described embodiment provides, daughter board include even number circuit board unit,
Even number circuit board unit is divided into two groups of circuit board units (first group of circuit board unit and second group of circuit board unit), two groups
Circuit board unit is on the first symmetrical axial symmetry, so as to realize the typesetting technique of negative and positive mirror image, so, a daughter board (
One daughter board) and same another daughter board (the second daughter board) when carrying out pressing and preparing motherboard, the set of circuits of the first daughter board
Slab element can second group of circuit board unit corresponding with second group of circuit board unit of the second daughter board, the first daughter board can be with
First group of circuit board unit of two daughter boards is corresponding, forms negative and positive back-off typesetting, so as to which the first daughter board and the second daughter board be pressed
Close and motherboard is made.
By taking 12 laminates as an example, the Making programme of daughter board is in the prior art：A. core material sawing sheet (L1-6 layers) →
Internal layer figure turn (pre-treatment/wet film/exposure/development) → etching → AOI → X-ray target practices → daughter board pressing → daughter board drilling →
PTH → plating → filling holes with resin → resin ground → pattern transfer (L1 layers protect copper face) → Xray bores target → pairing two and pressed.
B. core material sawing sheet (L7-12 layers) → internal layer figure turn (pre-treatment/wet film/exposure/development) → etching → AOI →
X-ray target practices → daughter board pressing → daughter board drilling → PTH → plating → filling holes with resin → resin ground → pattern transfer (L12 layers
Protection copper face) → X-ray bore target → pairing two press.
The Making programme of daughter board is in the application：
Core material sawing sheet (L1-12 layers) → internal layer figure turns (pre-treatment/wet film/exposure/development) → etching → AOI → X-
Ray target practices → daughter board pressing → daughter board drilling → PTH → plating → filling holes with resin → resin ground → pattern transfer (L1 layers and
L12 layers protect copper face) → X-ray bore target → pairing two press.
Wherein, L1 layers are copper foil, are component side, and L2, L3, L4, L5 layer are core plate, and L6 layers are internal layer, are copper foil, L12 layers
It is component side for copper foil, L11, L10, L9, L8 layer are core plate, and L7 layers are internal layer, are copper foil.
Therefore, the daughter board in the application is made up of a daughter board, and a daughter board can be with same any one height
Plate carries out lamination pressing (second pressing) and motherboard is made, and the daughter board product that N+N folds structure in the prior art is by two different layers
Secondary individual daughter board (being respectively L1-6 layers and L12-7 layers) composition, second pressing is pressed by the daughter board of two different levels
Close what is realized, two daughter boards need after one step press by once drilling, once plating, filling holes with resin, secondary outer layer figure turn etc.
Process, harmomegathus of two daughter boards in by nog plate stress and process can be made to form difference, cause daughter board to be misplaced up and down with daughter board
Layer is inclined, so the application realizes that N+N folds the high accuracy and high density circuit board of structure by a kind of type-setting mode of negative and positive back-off, and
Have the following advantages that：
1. change two daughter boards design that traditional N+N folds structure, by a kind of typesetting technique of negative and positive back-off, in a daughter board
C faces (L1 layers, L12 layers) and S faces (L6 layers, L7 layers) are designed in the inside simultaneously, and corresponding internal layer and figure are pressed corresponding level typesetting, formed
Negative and positive back-off typesetting, realize that individual daughter board carries out pressing with any one same daughter board and forms complete circuit board.
2. by negative and positive back-off typesetting, realize that a daughter board makes processing by original two daughter boards change negative and positive back-off mode
Technology, effective improving production efficiency 50% reduces cost 10%, improves product yield 30%.
In addition, the composing structure for the circuit board that the utility model above-described embodiment provides also has following supplementary technology special
Sign：
In above-mentioned technical proposal, it is preferable that the daughter board is symmetrical arranged on the second symmetry axis, second symmetry axis with
First symmetry axis is substantially vertical.
Daughter board is substantially vertical on the second symmetrical axial symmetry, the second symmetry axis and the first symmetry axis, it is preferable that first is symmetrical
Axle and the second symmetry axis can be horizontal and vertical, thus allow for horizontal and vertical negative and positive back-off typesetting, realize that N+N folds structure
Product simultaneously also lifted layout utilization rate.Designing typesetting (quantity of circuit board unit) in the plate of negative and positive back-off typesetting must be
Even number, and preferably, two groups of circuit board units are centrosymmetric design, and left and right (or's up and down) wherein can be carried out on one side
Back-off.
In above-mentioned technical proposal, it is preferable that the daughter board interlayer is provided with two groups of rivet holes, and rivet hole is on institute described in two groups
The first symmetry axis is stated to be symmetrical arranged, and the quantity of rivet hole described in rivet hole described in every group is one or more, described in every group
Rivet hole is asymmetric on second symmetry axis.
By taking above-mentioned 12 laminate as an example, positioned when being drilled in order to facilitate outer layer, daughter board interlayer (L2, L3, L 4, L5 layers,
L11, L10, L9, L8 layer) two groups of rivet holes of design are aligned (respectively positioned at first group of rivet of first group of circuit board unit side
Hole and second group of rivet hole positioned at second group of circuit board unit side), two groups of rivet holes are on the first symmetrical axial symmetry so that
During second pressing, second group of rivet hole of the second daughter board can align with first group of rivet hole of the first daughter board, the second daughter board
First group of rivet hole can align with second group of rivet hole of the first daughter board.In order to prevent daughter board second pressing lamination from mixing wrong face time
And direction, every group of rivet hole are staggeredly arranged, i.e., every group of rivet hole is asymmetric on the second symmetry axis, during for second pressing
Fool proof.For example, the first symmetry axis is set along the vertical direction, one group of rivet hole is respectively provided with left and right sides of the first symmetry axis,
Two groups of rivet holes are symmetrical, and every group of rivet hole is asymmetric on the second symmetry axis of daughter board left and right directions.
In above-mentioned technical proposal, it is preferable that the long side of the daughter board is provided with least two rivet holes, the daughter board
Short side is provided with least one rivet hole.
Daughter board is generally rectangular, positions and prevent daughter board second pressing lamination from mixing wrong face time when being drilled for convenience of outer layer,
Each long side of daughter board is provided with least two rivet holes, and each short side of the daughter board is provided with least one rivet hole.
In above-mentioned technical proposal, it is preferable that the long side of the daughter board is provided with multiple rivet holes, multiple rivets
Hole is located along the same line；And/or the short side of the daughter board is provided with multiple rivet holes, multiple rivet holes are located at
On same straight line.
Daughter board long side is provided with multiple rivet holes, and multiple rivet holes are located along the same line, and is realizing to the good of daughter board
While positioning, beneficial to technique edges of the multiple rivet holes of control without departing from daughter board；When setting multiple rivet holes on the short side of daughter board
When, multiple rivet holes are located along the same line, beneficial to technique edges of the multiple rivet holes on control short side without departing from daughter board.
Preferably, two pressure (outer layer pressing) rivet hole positioning are designed by Central Symmetry, while awl plate mechanical blind hole
Rivet hole is drilled out, is designed as NPTH holes (non-heavy copper hole) attribute.
Certainly, can be adjusted flexibly for the daughter board of different shape and size, the set location and quantity of rivet hole.
In above-mentioned technical proposal, it is preferable that the rivet hole is non-heavy copper hole.
In above-mentioned technical proposal, it is preferable that the daughter board is provided with two groups of grooves, and groove is on described first described in two groups
Symmetry axis is symmetrical, and the quantity of groove described in groove described in every group is one or more, and groove is on institute described in every group
State the second symmetry axis asymmetry.
Groove in every group is asymmetric on the second symmetry axis, fool proof during for daughter board second pressing.For example, first pair
Claim axle to set along the vertical direction, one group of groove is respectively provided with left and right sides of the first symmetry axis, and two groups of grooves are symmetrical, often
Group groove includes a groove, and groove is located at the top of daughter board, the fool proof up and down for daughter board.
In above-mentioned technical proposal, it is preferable that the groove is generally rectangular, and the length of the groove is more than or equal to
10mm, the width of the groove are more than or equal to 5mm, but in milling groove, it is impossible to milling to figure.Certainly, groove can also be in
Other shapes, the size of groove can also specifically determine according to actual conditions.
In above-mentioned technical proposal, it is preferable that the motherboard is provided with two groups of tacking nail, tacking nail described in two groups
On the described first symmetrical axial symmetry, and the quantity of tacking nail described in tacking nail described in every group is one or more
Individual, tacking nail described in every group is asymmetric on second symmetry axis.
Two daughter boards press to form motherboard, and the preparation flow of motherboard is：
Daughter board brown → outer layer pressing (two pressure) → go brown film → drilling (through hole) → PTH → plating → filling holes with resin →
Resin ground → PTH → plating POFV → outer graphics → graphic plating → etching → AOI → welding resistance → word → surface treatment
→ shaping → ET → FQC.
Such as first symmetry axis set along the vertical direction, two groups of tacking nail respectively be located at the first symmetry axis left and right two
Side, and be symmetrical set, and tacking nail is asymmetric on the second symmetry axis of left and right directions, plays foolproof function, keeps away
Exempt from boring positioning and misplace plate.
In above-mentioned technical proposal, it is preferable that the line of the tacking nail in the same plane forms isosceles trapezoid.
Additional aspect and advantage of the present utility model will become obvious in following description section, or new by this practicality
The practice of type is recognized.
Brief description of the drawings
Of the present utility model above-mentioned and/or additional aspect and advantage will in the description from combination accompanying drawings below to embodiment
Become obvious and be readily appreciated that, wherein：
Fig. 1 is L1-6 stratons plate planar structure schematic diagram in the prior art；
Fig. 2 is the cross section structure diagram of the plates of L1-6 stratons shown in Fig. 1；
Fig. 3 is L12-7 stratons plate planar structure schematic diagram in the prior art；
Fig. 4 is the cross section structure diagram of the L12-7 straton plates shown in Fig. 3；
Fig. 5 is the folded structure schematic diagram that daughter board is pressed into motherboard in the prior art.
Wherein, corresponding relations of the Fig. 1 into Fig. 5 between reference and component names is：
1 ' insulation PP layers.
Fig. 6 is the positive typesetting schematic diagram of daughter board described in embodiment of the present utility model；
Fig. 7 is the typesetting schematic diagram of the daughter board reverse side described in embodiment of the present utility model；
Fig. 8 is the structural representation of the daughter board described in embodiment of the present utility model；
Fig. 9 is the folded structure schematic diagram of the motherboard described in embodiment of the present utility model, layout in arrow display plate wherein at A
Spacing；
Figure 10 is a kind of structural representation of typesetting in negative and positive back-off typesetting plate described in embodiment of the present utility model；
Figure 11 is another structural representation of typesetting in negative and positive back-off typesetting plate described in embodiment of the present utility model；
Figure 12 is the structural representation of the daughter board technique edges design described in embodiment of the present utility model；
Figure 13 is the structural representation of the motherboard technique edges design described in embodiment of the present utility model.
Wherein, corresponding relations of the Fig. 6 into Figure 13 between reference and component names is：
10 insulation PP layers, 20 circuit board units, 30 rivet holes, 40 grooves, 50 tacking nail, 60 first symmetry axis.
Embodiment
In order to be more clearly understood that above-mentioned purpose of the present utility model, feature and advantage, below in conjunction with the accompanying drawings and tool
The utility model is further described in detail body embodiment.It should be noted that in the case where not conflicting, this Shen
The feature in embodiment and embodiment please can be mutually combined.
Many details are elaborated in the following description in order to fully understand the utility model, still, this practicality
It is new to be different from mode described here using other and implement, therefore, the scope of protection of the utility model not by
The limitation of following public specific embodiment.
The composing structure of circuit board according to the utility model some embodiments is described with reference to the accompanying drawings.
As shown in Fig. 6 to Figure 13, according to a kind of composing structure of circuit board of the utility model some embodiments offer, bag
Enclosed tool plate, daughter board include even number circuit board unit 20, and even number circuit board unit 20 is divided into first group of circuit board unit 20
With second group of circuit board unit 20, the quantity of circuit board unit 20 is one or more in every group of circuit board unit 20, Mei Yi electricity
The circuit number of plies of road Slab element 20 is multilayer, and two groups of circuit board units 20 are symmetrical arranged on the first symmetry axis, so that daughter board
When carrying out pressing making motherboard with another identical daughter board, first group of circuit board unit 20 of daughter board can be with another identical
Second group of circuit board unit 20 of plate is corresponding, and second group of circuit board unit 20 of daughter board can be with the of another identical daughter board
Set of circuits Slab element 20 is corresponding.
The composing structure for the circuit board that the utility model above-described embodiment provides, daughter board include even number circuit board unit
20, even number circuit board unit 20 can be divided into two groups of circuit board units 20 (first group of circuit board unit 20 and second group of electricity
Road Slab element 20), two groups of circuit board units 20 are symmetrical on the first symmetry axis 60, so as to realize the typesetting skill of negative and positive mirror image
Art, so, when a daughter board (the first daughter board) and same another daughter board (the second daughter board) carry out pressing and prepare motherboard,
First group of circuit board unit 20 of one daughter board can corresponding with second group of circuit board unit 20 of the second daughter board, the first daughter board
Two groups of circuit board units 20 can be corresponding with first group of circuit board unit 20 of the second daughter board, forms negative and positive back-off typesetting, so as to
First daughter board and the second daughter board are carried out pressing obtained motherboard.
By taking 12 laminates as an example, the Making programme of daughter board is in the prior art：
A. core material sawing sheet (L1-6 layers) → internal layer figure turns (pre-treatment/wet film/exposure/development) → etching → AOI (certainly
Dynamic optical detection) → X-ray target practices → daughter board pressing → daughter board drilling → PTH (plated-through-hole) → plating → filling holes with resin → resin
Grinding → pattern transfer (L1 layers protect copper face) → X-ray bores target → pairing two and pressed.
B. core material sawing sheet (L7-12 layers) → internal layer figure turn (pre-treatment/wet film/exposure/development) → etching → AOI →
X-ray target practices → daughter board pressing → daughter board drilling → PTH → plating → filling holes with resin → resin ground → pattern transfer (L12 layers
Protection copper face) → X-ray bore target → pairing two press.
The Making programme of daughter board is in the application：
Core material sawing sheet (L1-12 layers) → internal layer figure turns (pre-treatment/wet film/exposure/development) → etching → AOI → X-
Ray target practices → daughter board pressing → daughter board drilling → PTH → plating → filling holes with resin → resin ground → pattern transfer (L1 layers and
L12 layers protect copper face) → X-ray bore target → pairing two press.
Wherein, L1 layers are copper foil, are component side, and L2, L3, L4, L5 layer are core plate, and L6 layers are internal layer, are copper foil, L12 layers
It is component side for copper foil, L11, L10, L9, L8 layer are core plate, and L7 layers are internal layer, are copper foil.
Therefore, N+N folds the daughter board product of structure and is made up of a daughter board in the application, daughter board can with it is same
Any one daughter board carry out lamination pressing (second pressing) be made motherboard, and in the prior art N+N fold structure daughter board product be by
Daughter board (being respectively L1-6 layers and L12-7 layers) composition of two different levels, second pressing is the son by two different levels
Plate press realization, two daughter boards need after one step press by once drilling, once plating, filling holes with resin, it is secondary outside
The processes such as layer figure turn, harmomegathus of two daughter boards in by nog plate stress and process can be made to form difference, cause daughter board and daughter board
Dislocation layer is inclined up and down, so the application realizes that N+N folds the high accuracy and high density of structure by a kind of type-setting mode of negative and positive back-off
Circuit board, and have the following advantages that：
1. change two daughter boards design that traditional N+N folds structure, by a kind of typesetting technique of negative and positive back-off, in a daughter board
C faces (L1 layers, L12 layers) and S faces (L6 layers, L7 layers) are designed in the inside simultaneously, and corresponding internal layer and figure are pressed corresponding level typesetting, formed
Negative and positive back-off typesetting, realize that individual daughter board carries out pressing with any one same daughter board and forms complete circuit board.
2. by negative and positive back-off typesetting, realize that a daughter board makes processing by original two daughter boards change negative and positive back-off mode
Technology, effective improving production efficiency 50% reduces cost 10%, improves product yield 30%.
In above-mentioned technical proposal, it is preferable that daughter board is symmetrical arranged on the second symmetry axis, the second symmetry axis and first symmetrical
Axle 60 is substantially vertical.
In Fig. 8, Figure 10 and Figure 11, two groups of circuit board units 20 are symmetrically outer on the first symmetry axis 60 of above-below direction,
Second symmetrical axial symmetry of the daughter board on left and right directions, the second symmetry axis and the first symmetry axis 60 are substantially vertical, it is preferable that first
The symmetry axis of symmetry axis 60 and second can be horizontal and vertical, thus allow for horizontal and vertical negative and positive back-off typesetting, realize N
The product that+N folds structure also lifts layout utilization rate simultaneously.Design typesetting (quantity of circuit board unit) in the plate of negative and positive back-off typesetting
Must be even number, and preferably, two groups of circuit board units 20 are centrosymmetric design, left and right (or up and down) wherein while entering
Row back-off.First symmetry axis 60 can be along the vertical direction, can also in left-right direction, certainly, the first symmetry axis 60 can also
Set along other directions.
Preferably, as shown in figure 12, daughter board interlayer is provided with two groups of rivet holes 30, and two groups of rivet holes 30 are on the first symmetry axis
60 are symmetrical arranged, and the quantity of rivet hole 30 is one or more in every group of rivet hole 30, and every group of rivet hole 30 is on second pair
Claim axle asymmetric.
By taking above-mentioned 12 laminate as an example, be positioned at when being drilled in order to facilitate outer layer daughter board interlayer (L2, L3, L4, L5 layer, L11,
L10, L9, L8 layer) two groups of rivet holes 30 of design are aligned (respectively positioned at first group of rivet hole of first group of circuit board unit side
With second group of rivet hole positioned at second group of circuit board unit side), two groups of rivet holes 30 are symmetrical on the first symmetry axis 60, make
When obtaining second pressing, second group of rivet hole 30 of the second daughter board can align with first group of rivet hole 30 of the first daughter board, and second
First group of rivet hole 30 of daughter board can align with second group of rivet hole 30 of the first daughter board.In order to prevent daughter board second pressing from folding
Plate mixes wrong face time and direction, every group of rivet hole 30 are staggeredly arranged, i.e., every group of rivet hole 30 is asymmetric on the second symmetry axis,
Fool proof during for second pressing.For example, the first symmetry axis 60 is set along the vertical direction, in the left and right sides of the first symmetry axis 60
Be respectively provided with one group of rivet hole 30, two groups of rivet holes 30 are symmetrical, and every group of rivet hole 30 on daughter board left and right directions
Two symmetry axis are asymmetric.
Preferably, as shown in figure 12, the long side of daughter board is provided with least two rivet holes 30, and the short side of daughter board is provided with least one
Individual rivet hole 30.
Daughter board is generally rectangular, positions and prevent daughter board second pressing lamination from mixing wrong face time when being drilled for convenience of outer layer,
Each long side of daughter board is provided with least two rivet holes 30, and each short side of daughter board is provided with least one rivet hole 30.
Preferably, as shown in figure 12, the rivet hole 30 in the long side of daughter board is located along the same line；And/or daughter board is short
Side is provided with multiple rivet holes 30, and multiple rivet holes 30 are located along the same line.
Daughter board long side is provided with multiple rivet holes, and multiple rivet holes are located along the same line, and is realizing to the good of daughter board
While positioning, beneficial to technique edges of the multiple rivet holes of control without departing from daughter board；When setting multiple rivet holes on the short side of daughter board
When, multiple rivet holes are located along the same line, then realize internal layer positioning while, beneficial to control short side on multiple rivet holes not
Beyond the technique edges of daughter board.
Preferably, two pressure (outer layer pressing) rivet hole positioning are designed by Central Symmetry, while awl plate mechanical blind hole
Rivet hole is drilled out, is designed as NPTH holes (non-heavy copper hole) attribute.
Certainly, can be adjusted flexibly for the daughter board of different shape and size, the set location and quantity of rivet hole.
Preferably, as shown in figure 12, daughter board is provided with two groups of grooves 40, and two groups of grooves 40 are symmetrical on the first symmetry axis 60
Distribution, and the quantity of every group of further groove 40 of groove 40 is one or more, every group of groove 40 is asymmetric on the second symmetry axis.
Groove 40 in every group is asymmetric on the second symmetry axis, fool proof during for daughter board second pressing.For example, first
Symmetry axis 60 is set along the vertical direction, and one group of groove 40, and two groups of grooves 40 are respectively provided with the left and right sides of the first symmetry axis 60
Symmetrical, every group of groove 40 includes a groove 40, and groove 40 is located at the top of daughter board, the fool proof up and down for daughter board.
Preferably, groove 40 is generally rectangular, and the length of groove 40 is more than or equal to 10mm, and the width of groove 40 is more than
Equal to 5mm, but in milling groove 40, it is impossible to milling to figure.Certainly, groove 40 can also be in other shapes, the size of groove 40
Can also specifically it be determined according to actual conditions.
Preferably, rivet hole is NPTH holes (non-heavy copper hole) attribute.
Preferably, as shown in figure 13, motherboard is provided with two groups of tacking nail 50, and two groups of tacking nail 50 are on first
Symmetry axis 60 is symmetrical, and the quantity of tacking nail 50 is one or more, every group of quilting rivet in every group of tacking nail 50
Hole 50 is asymmetric on the second symmetry axis.
Two daughter boards press to form motherboard, and the preparation flow of motherboard is：
Daughter board brown → outer layer pressing (two pressure) → go brown film → drilling (through hole) → PTH → plating → filling holes with resin →
Resin ground → PTH → plating POFV → outer graphics → graphic plating → etching → AOI → welding resistance → word → surface treatment
→ shaping → ET → FQC (inspection eventually).
Wherein, 10 insulation PP layers 10 are provided between two daughter boards.
Such as first symmetry axis 60 set along the vertical direction, two groups of tacking nail 50 are respectively positioned at the first symmetry axis 60
The left and right sides, and be symmetrical set, and tacking nail 50 is asymmetric on the second symmetry axis of left and right directions, plays fool proof
Effect, avoids boring positioning from misplacing plate.
Preferably, the line of tacking nail 50 in the same plane forms isosceles trapezoid.
As shown in figure 13, the first symmetry axis 60 is set along the vertical direction, and two tacking nail 50 on motherboard top are with
The line of four tacking nail 50 in portion forms isosceles trapezoid, a tacking nail of upper left-hand and the two of lower left side
Individual tacking nail forms first group of tacking nail, a tacking nail on the right side of bottom and two positioning on the right side of bottom
Rivet hole forms second group of tacking nail, and two groups of tacking nail are symmetrical arranged on the first symmetry axis 60, and first group is determined
Position rivet hole and second group of tacking nail are asymmetric on the second symmetry axis of left and right directions.Certainly, tacking nail
Quantity is set flexibly to be determined according to the size of motherboard, shape etc..
In summary, the utility model embodiment provide circuit board composing structure, two groups of circuit board units 20 on
First symmetry axis 60 is symmetrical, and so, first group of circuit board unit 20 in a daughter board can be with the in another identical daughter board
Two groups of correspondences of circuit board unit 20, second group of circuit board unit 20 of the second daughter board can be with above-mentioned another identical daughter board
The correspondence of set of circuits Slab element 20, so as to carry out pressing obtained motherboard first daughter board and second daughter board.
In description of the present utility model, unless otherwise clearly defined and limited, term " multiple " refers to two or two
More than individual；Unless otherwise prescribed or illustrate, term " connection ", " fixation " etc. all should be interpreted broadly, for example, " connection " can be
It is fixedly connected or is detachably connected, or is integrally connected, or electrical connection；Can be joined directly together, can also be in
Between medium be indirectly connected.For the ordinary skill in the art, above-mentioned term can be understood at this as the case may be
Concrete meaning in utility model.
In the description of this specification, it is to be understood that the instruction such as term " on ", " under ", "front", "rear", "left", "right"
Orientation or position relationship be based on orientation shown in the drawings or position relationship, be for only for ease of description the utility model and letter
Change description, rather than instruction or imply signified device or unit must have specific direction, with specific azimuth configuration and
Operation, it is thus impossible to be interpreted as to limitation of the present utility model.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that combining specific features, structure, material or feature that the embodiment or example describe is contained in of the present utility model at least one
In individual embodiment or example.In this manual, identical embodiment is not necessarily referring to the schematic representation of above-mentioned term
Or example.Moreover, specific features, structure, material or the feature of description can be in any one or more embodiments or example
In combine in an appropriate manner.
Preferred embodiment of the present utility model is the foregoing is only, is not limited to the utility model, for this
For the technical staff in field, the utility model can have various modifications and variations.It is all in the spirit and principles of the utility model
Within, any modification, equivalent substitution and improvements made etc., it should be included within the scope of protection of the utility model.
Claims (10)
- A kind of 1. composing structure of circuit board, it is characterised in that including：Daughter board, the daughter board include even number circuit board unit, and circuit board unit described in even number is divided into first group of circuit board Unit and second group of circuit board unit, the quantity of circuit board unit described in circuit board unit described in every group are one or more, The circuit number of plies of each circuit board unit is multilayer, and circuit board unit described in two groups is set on the first symmetrical axial symmetry Put, so that the daughter board with daughter board described in another identical press when making motherboard, first group of circuit board of the daughter board Unit can be corresponding with second group of circuit board unit of daughter board described in another identical, second group of circuit board list of the daughter board Member can be corresponding with first group of circuit board unit of daughter board described in another identical.
- 2. the composing structure of circuit board according to claim 1, it is characterised in thatThe daughter board on the second symmetrical axial symmetry, wherein, second symmetry axis is substantially vertical with first symmetry axis.
- 3. the composing structure of circuit board according to claim 2, it is characterised in thatThe daughter board interlayer is provided with two groups of rivet holes, and rivet hole described in two groups is symmetrical arranged on first symmetry axis, and often The quantity of rivet hole described in the group rivet hole for one or more, rivet hole described in every group on second symmetry axis not Symmetrically.
- 4. the composing structure of circuit board according to claim 3, it is characterised in thatThe long side of the daughter board is provided with least two rivet holes, and the short side of the daughter board is provided with least one rivet Hole.
- 5. the composing structure of circuit board according to claim 3, it is characterised in thatThe long side of the daughter board is provided with multiple rivet holes, and multiple rivet holes are located along the same line；And/or institute The short side for stating daughter board is provided with multiple rivet holes, and multiple rivet holes are located along the same line.
- 6. the composing structure of circuit board according to claim 3, it is characterised in thatThe rivet hole is non-heavy copper hole.
- 7. the composing structure of the circuit board according to any one of claim 2 to 6, it is characterised in thatThe daughter board is provided with two groups of grooves, and groove described in two groups is symmetrical on first symmetry axis, and described in every group For the quantity of groove described in groove for one or more, groove described in every group is asymmetric on second symmetry axis.
- 8. the composing structure of circuit board according to claim 7, it is characterised in thatThe groove is generally rectangular, and the length of the groove is more than or equal to 10mm, the width of the groove be more than or Equal to 5mm.
- 9. the composing structure of the circuit board according to any one of claim 2 to 6, it is characterised in thatThe motherboard is provided with two groups of tacking nail, tacking nail described in two groups on the described first symmetrical axial symmetry, and The quantity of tacking nail described in tacking nail described in every group is one or more, and tacking nail is on institute described in every group State the second symmetry axis asymmetry.
- 10. the composing structure of circuit board according to claim 9, it is characterised in thatThe line of the tacking nail in the same plane forms isosceles trapezoid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720341525.0U CN206713175U (en) | 2017-04-01 | 2017-04-01 | The composing structure of circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720341525.0U CN206713175U (en) | 2017-04-01 | 2017-04-01 | The composing structure of circuit board |
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| CN206713175U true CN206713175U (en) | 2017-12-05 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109451683A (en) * | 2018-12-11 | 2019-03-08 | 深圳市景旺电子股份有限公司 | A kind of asymmetric multi-layer board pressing back plate that solves sticks up undesirable method and compression method |
| CN112954914A (en) * | 2021-01-29 | 2021-06-11 | 深圳市强达电路有限公司 | Manufacturing method of voltage-resistant reinforced printed circuit board |
| CN114501809A (en) * | 2022-01-13 | 2022-05-13 | 惠州市金百泽电路科技有限公司 | Dimension high-precision processing method of millimeter wave radar PCB |
-
2017
- 2017-04-01 CN CN201720341525.0U patent/CN206713175U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109451683A (en) * | 2018-12-11 | 2019-03-08 | 深圳市景旺电子股份有限公司 | A kind of asymmetric multi-layer board pressing back plate that solves sticks up undesirable method and compression method |
| CN109451683B (en) * | 2018-12-11 | 2020-09-04 | 深圳市景旺电子股份有限公司 | Method for solving poor warping of asymmetric multilayer board after lamination and lamination method |
| CN112954914A (en) * | 2021-01-29 | 2021-06-11 | 深圳市强达电路有限公司 | Manufacturing method of voltage-resistant reinforced printed circuit board |
| CN114501809A (en) * | 2022-01-13 | 2022-05-13 | 惠州市金百泽电路科技有限公司 | Dimension high-precision processing method of millimeter wave radar PCB |
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Effective date of registration: 20220627 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. |