CN106455293A - Fabrication method of multilayer, large-size and high-speed back panel - Google Patents
Fabrication method of multilayer, large-size and high-speed back panel Download PDFInfo
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- CN106455293A CN106455293A CN201610866400.XA CN201610866400A CN106455293A CN 106455293 A CN106455293 A CN 106455293A CN 201610866400 A CN201610866400 A CN 201610866400A CN 106455293 A CN106455293 A CN 106455293A
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- rear panel
- speed rear
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a fabrication method of a multilayer, large-size and high-speed back panel. The fabrication method comprises the following steps of (1), project file design, wherein the project file design comprises layered lamination design, drilling, formation file design, lamination structure design and setting of a back drilling test unit; (2), fabrication of the high-speed back panel, wherein the fabrication of the multilayer, large-size and high-speed back panel is performed according to the project file design; (3), through hole processing; (4), back drilling processing, in which fragmental back drilling processing is performed on the high-speed back panel according to a fragmental drilling file and the back drilling test unit in the step (1); (5) forming and processing, and processing is performed on the high-speed back panel according to the fragmental formation file in the step (1); and 6, post-procedure processing, in which package and shipment are performed after electrical detection and final inspection are performed according to a conventional circuit board processing flow. The fabrication method of the multilayer, large-size and the high-speed back panel has the advantages of good lamination quality, low rejection rate, low cost, rapid detection, high efficiency and the like.
Description
Technical field
The present invention relates to High speed rear panel manufacture technology field, specially a kind of making side of multilamellar large scale High speed rear panel
Method.
Background technology
The technological change of information industry 10G, 15G, puts forward higher requirement to signal high-speed transfer, integrity, it is desirable to lose
High precision is carved, impedance control is strict.Communication base station, large-scale industrial control equipment propose the demand of multilamellar large scale High speed rear panel, product
With high content of technology, surcharge is high, and numerous PCB manufacturers all want to strive for the type product market order, but, the type is carried on the back at a high speed
Plate easily occurs problems with process：
1. high multilamellar large scale high speed printed wiring board manufacturing method Shortcomings：
（1）Product size super large, number of plies height, sheet material demand is big, adopts one step press, if wherein there is a central layer skew, will lead
Entirety is caused to scrap, for example：48 layers, made using 23 central layers, Material Cost height, in bonding processes, 1 central layer offset
Senior general causes remaining 22 central layer to be scrapped, and cost allowance is serious, causes existing line plate processor connect this type product；
（2）Product number of plies height, thickness height, product is using gross thickness ＞ after the pressing of 0.1mm central layer+0.05mm106 prepreg
4mm, row's flaggy number height, it is unfavorable for intermediate thermal conductivity, intermediate products pressing-in temp deficiency is caused, causes product rejection；
（3）Large scale high speed printed wiring board size is big, typically in 500mm × more than 800mm, conventional drilling, molding machining
Full-size is in 500mm × 600mm or so, it is impossible to meets and requires, causing need to be using buying large scale process equipment or outgoing
To other processing Shang dynasty processing, time-consuming, the difficult to govern control of outward processing quality is transported back and forth.
2., in High-Speed PCB product, it is to remove the crosstalk for being formed between through hole, it is ensured that signal transmission integrity, can adopts
Back drill is processed.Back drill refers to the severity control function using machine dimensions drill, in specific plated through-hole（PTH）On using larger straight
The drill in footpath processes the non-metallic hole for requiring with certain depth（NPTH）, to remove partial hole copper.The existing PCB factory back of the body
Drill method is uneven, easily occurs that depth is not enough, the excessive problem for causing to scrap of depth, the high multiple layer high speed of inapplicable large scale
The processing of printed wiring board.
Content of the invention
The invention provides a kind of pressing quality better, scrappage be low, low cost, detection are quick, the big chi of efficiency high multilamellar
The manufacture method of very little High speed rear panel.
The present invention can be achieved through the following technical solutions：
A kind of manufacture method of multilamellar large scale High speed rear panel, it is characterised in that：Comprise the steps：
The first step, project file is designed, including
1.1）Layering pressing design, the layering pressing is 1 pressing shaping change of many major generals routine according to the product number of plies
For repeatedly pressing forming mode；
1.2）, drilling, back drill, molding document design, it is to include to bore that drilling file, back drill file and molding file are separately designed
Hole file 1, drilling file 2, the gradation drilling file of back drill file 1 and back drill file 2 and including molding file 1 and molding file
2 gradation molding file；
1.3）, laminar structure is designed, and according to the depth of back drill, determines the interlayer thickness of demand；
1.4）, back drill test cell sets, and in edges of boards white space, sets the back drill depth test of and back drill position consistency
Unit；
Second step, the making of High speed rear panel, multilamellar large scale High speed rear panel is carried out according to the project file design in the first step
Make, the multiple pressing for carrying out High speed rear panel by layering pressing design forms High speed rear panel entirety；
3rd step, through hole processed, carry out the making of High speed rear panel through hole by the gradation drilling file in the first step, subsequently just
Often carry out sink copper plate electric, outside line to make and the electric stannum of figure；
4th step, back drill processed, set to High speed rear panel by the gradation drilling file in the first step and back drill test cell
Gradation back drill process is carried out, is subsequently normally carried out alkali etching, welding resistance printing, character printing and surface treatment；
5th step, processing and forming is processed, and carries out processing and forming process by the gradation molding file in the first step to High speed rear panel；
6th step, rear operation is processed, and after routinely wiring board work flow carries out electrical measurement, examines eventually, carries out packaging shipment.
The manufacture method of multilamellar large scale High speed rear panel of the present invention is used for making multilamellar large scale High speed rear panel, and which has such as
Lower effect：
1st, 1 pressing mode of the prior art is changed to multiple pressing mode by the present invention, is pressed by using layering by several times
Design, effectively reduces in lamination process, the cost that central layer skew is scrapped, while effectively guaranteeing laminate product pressing quality；
2 by the present invention in that with layering pressing design by several times, effectively reduce the pressing product number of plies by several times and height, effectively really
Protect product pressing heat-transfer effect；
3rd, the design of present invention gradation drilling file and gradation molding file, efficiently solves the high multiple layer high speed track of large scale
Road twist drill hole, molding hardly possible, need the problem of special main equipment, complete by making drilling and molding using common twin shaft equipment,
Effectively reducing extra production equipment input, outgoing cost of manufacture being greatly reduced, while effectively guaranteeing processing quality；
4th, the setting of back drill processing mode of the present invention and back drill detector unit, effectively achieves the back drill processing of stay in grade, subtracts
Few product rejection, realizes fast and effectively detecting, effectively lifts working (machining) efficiency.
Further, the layering pressing is multigroup according to many major generals production sharing of the product number of plies, respectively to producing per group
Product are pressed, and the product after then pressing each group by several times for the 1st time is carried out the 2nd total pressing, obtains multilamellar successively after lamination
Large scale backboard.
Further, the drilling, molding document design specifically include following steps, in the side bottom and top two corners position of edges of boards
The first location hole being installed, opposite side bottom and top two corners position arranges the second location hole, the 3rd is arranged in the middle part of the long side of edges of boards and position
Hole, the setting imposite drilling of the 3rd location hole, molding file are divided into 2 parts and form by several times drill file and gradation molding text
Part, the file that drills by several times is respectively drill file 1 and drilling file 2, gradation molding file respectively molding file 1 and molding text
Part 2, first location hole is differed with the second positioning pitch of holes with the 3rd location hole with the 3rd positioning pitch of holes.
Further, the making of second step high speed backboard comprises the steps：
2.1）, core material graphic making, routinely technological process carries out core material sawing sheet, circuit making, automated optical inspection
Survey, brown, wait for the 1st pressing；
2.2）, each set product is pressed for the 1st time by several times, is ready to complete the central layer needed for each group pressing, prepreg respectively, respectively
By each group in the way of central layer, prepreg lamination successively, press Copper Foil after the completion of lamination up and down, form the 1st set product, other
Set product pressing flow process is identical with the 1st set product pressing flow process；
2.3）, graphic making, row line making, automated optical are entered in routinely technological process to the adjacent layer Copper Foil of adjacent set product
Detection, brown, wait for the 2nd total pressing；
2.4）, the 2nd time total to press, and respectively above-mentioned each set product through the 1st pressing is carried out lamination, carries out the after the completion of lamination
2 total pressings form High speed rear panel.
Further, in the 3rd step, through hole processed comprises the steps：
3.1）1st Drilling operation, after High speed rear panel pressing shaping, by the drilling file 1 in gradation drilling file, carries on the back to high speed
Plate carries out the 1st Drilling operation；
3.2）2nd Drilling operation, after the completion of the 1st drilling, by the drilling file 2 in gradation drilling file, to High speed rear panel
Carry out the through hole processing that Drilling operation completes High speed rear panel the 2nd time；
3.3）High speed rear panel makes, and routinely technique carries out sink copper plate electric, outer-layer circuit making, the electric stannum work of figure, waits for
Back drill is processed.
Further, in the 4th step, back drill processed comprises the steps：
4.1）1st Drilling operation, after High speed rear panel figure electricity stannum, by the back drill file 1 in gradation drilling file, to High speed rear panel
Carry out the 1st Drilling operation；
4.2）2nd Drilling operation, after the completion of the 1st drilling, by the back drill file 2 in gradation drilling file, to High speed rear panel
Carry out the back drill that the 2nd Drilling operation completes High speed rear panel.
Further, before the 3rd step back drill processed, by back drill test cell in the first step, circuit tester pair need to be combined
Back drill quality is detected and determined, and specifically includes following steps：
1）Before back drill, make sections observation and each thickness degree is recorded, control is deep to spend for calculating；
2）According to slice thickness, back drill test cell is processed, according to Customer design and requirement, using the circuit tester measurement back of the body
Drilling testing unit drills layer, the non-break-make situation for drilling layer, or sections observation back drill test cell back drill quality, judges initial workpiece
Whether satisfaction is required；
3）If initial workpiece meets quality requirements, normal process is carried out, such as initial workpiece is unsatisfactory for quality requirements, deep according to section adjustment control
Degree, then make initial workpiece and carry out as above step and confirmed.
Further, after the completion of carrying out normal process steps process to High speed rear panel, continue to carry out at rear operation High speed rear panel
Reason, specifically routinely wiring board work flow carries out alkali etching, automated optical, welding resistance printing, character ink-jet and changes gold making.
Further, after the completion of operation is processed after High speed rear panel, processing and forming process is carried out to High speed rear panel, concrete pressing is divided
Molding file 1 in secondary molding file and molding file 2 carry out forming processes, and molding file 1 and 2 cabling of molding file arrange weight
Region is closed, and the overlapping region width is 1mm, then processing and forming process to be carried out using twin shaft forming machine.
The manufacture method of multilamellar large scale High speed rear panel of the present invention, with following beneficial effect：
Firstth, 1 pressing mode of the prior art is changed to multiple pressing mode by the present invention, is pressed by using layering by several times
Design is closed, is effectively reduced in lamination process, the cost that central layer skew is scrapped, while effectively guarantee laminate product pressing quality；
Second by the present invention in that with layering pressing design by several times, effectively reduce the pressing product number of plies by several times and height, effectively
Guarantee product pressing heat-transfer effect；
3rd, the design of present invention gradation drilling file and gradation molding file, efficiently solves the high multiple layer high speed print of large scale
Drilling holes on circuit board processed, molding hardly possible, need the problem of special main equipment, make drilling and molding using complete by common twin shaft equipment
Become, effectively reducing extra production equipment input, outgoing cost of manufacture being greatly reduced, while effectively guaranteeing processing quality；
4th, the setting of back drill processing mode of the present invention and back drill detector unit, effectively achieves the back drill processing of stay in grade,
Reduce product rejection, realize fast and effectively detecting, effectively lift working (machining) efficiency.
Description of the drawings
Accompanying drawing 1 is the process chart of the manufacture method of multilamellar large scale High speed rear panel of the present invention；
Accompanying drawing 2, accompanying drawing 3 are that each several part product of the present invention presses figure 1st time by several times；
Accompanying drawing 4 is the 2nd total pressing figure of the present invention；
Accompanying drawing 5 is conventional drilling document design figure；
Accompanying drawing 6 and accompanying drawing 7 are respectively present invention drilling file 1 and drilling file 2；
Accompanying drawing 8 is conventional molding document design figure；
Accompanying drawing 9 and accompanying drawing 10 are respectively molding file 1 of the present invention and molding file 2；
Accompanying drawing 11 is L10 layer test cell figure of the present invention；
Accompanying drawing 12 is L11 layer test cell figure of the present invention.
Specific embodiment
In order that those skilled in the art more fully understand technical scheme, with reference to embodiment and accompanying drawing
Product of the present invention is described in further detail.
As shown in Figures 1 to 12, a kind of manufacture method of multilamellar large scale High speed rear panel, it is characterised in that：Including as follows
Step：
The first step, project file is designed, including
1.1）Layering pressing design, the layering pressing is 1 pressing shaping change of many major generals routine according to the product number of plies
For repeatedly pressing forming mode, specifically, the layering pressing is, difference multigroup according to many major generals production sharing of the product number of plies
Every set product is pressed, the product after then pressing each group by several times for the 1st time carries out the 2nd total pressing successively after lamination,
Obtain multilamellar large scale backboard；
1.2）Drilling, back drill, molding document design, it is to include drill file 1, brill that drilling file and molding file are separately designed
The gradation drilling file of hole file 2, back drill file 1 and back drill file 2 becomes with the gradation including molding file 1 and molding file 2
Type file, the drilling, molding document design specifically include following steps, arrange first in the side bottom and top two corners position of edges of boards
Location hole, opposite side bottom and top two corners position arranges the second location hole, arranges the 3rd location hole in the middle part of the long side of edges of boards, and the described 3rd
The setting imposite drilling of location hole, molding file are divided into 2 parts and form by several times drill file and gradation molding file, drill by several times
File is respectively the file 1 that drills, drilling file 2, back drill file 1 and back drill file 2, and gradation molding file is respectively molding file
1 and molding file 2, first location hole and the 3rd positioning pitch of holes and the 3rd location hole and the second positioning pitch of holes not phase
With；
1.3）Laminar structure is designed, and according to the depth of back drill, determines the interlayer thickness of demand；
1.4）Back drill test cell sets, and in edges of boards white space, sets the back drill depth test of and back drill position consistency
Unit；
Second step, the making of High speed rear panel, multilamellar large scale High speed rear panel is carried out according to the project file design in the first step
Make, the multiple pressing for carrying out High speed rear panel by layering pressing design forms High speed rear panel entirety；
3rd step, through hole processed, carry out gradation drilling process to High speed rear panel by the gradation drilling file in the first step；
4th step, back drill processed, set to High speed rear panel by the gradation drilling file in the first step and back drill test cell
Carry out gradation back drill process；
5th step, processing and forming is processed, and carries out processing and forming process by the gradation molding file in the first step to High speed rear panel；
6th step, rear operation is processed, and after routinely wiring board work flow carries out electrical measurement, examines eventually, carries out packaging shipment.
The manufacture method of multilamellar large scale High speed rear panel of the present invention is used for making multilamellar large scale High speed rear panel, and which has such as
Lower effect：
1st, 1 pressing mode of the prior art is changed to multiple pressing mode by the present invention, is pressed by using layering by several times
Design, effectively reduces in lamination process, the cost that central layer skew is scrapped, while effectively guaranteeing laminate product pressing quality；
2 by the present invention in that with layering pressing design by several times, effectively reduce the pressing product number of plies by several times and height, effectively really
Protect product pressing heat-transfer effect；
3rd, the design of present invention gradation drilling file and gradation molding file, efficiently solves the high multiple layer high speed track of large scale
Road twist drill hole, molding hardly possible, need the problem of special main equipment, complete by making drilling and molding using common twin shaft equipment,
Effectively reducing extra production equipment input, outgoing cost of manufacture being greatly reduced, while effectively guaranteeing processing quality；
4th, the setting of back drill processing mode of the present invention and back drill detector unit, effectively achieves the back drill processing of stay in grade, subtracts
Few product rejection, realizes fast and effectively detecting, effectively lifts working (machining) efficiency.
As shown in Figures 1 to 12, by taking prepared by 48 layers of 750x480mm High speed rear panel as an example, 48 layers of 750x480mm are carried on the back at a high speed
The manufacture method of plate, comprises the steps：
The first step, project file is designed, including
1.1）Layering pressing design, in conjunction with Fig. 2 to Fig. 4, L1-48 laminate is divided into L1-24 and L25-48 two parts, by original 1
Secondary pressing structure is changed to 2 pressing structures, and the 1st pressing obtains L1-24 and L25-48, then L1-24 and L25-48 is carried out
2nd total pressing obtains L1-48；
1.2）, drilling, molding document design, in conjunction with Fig. 5 to Figure 10, it is to include to bore that drilling file and molding file are separately designed
Hole file 1（See Fig. 6）With drilling file 2（See Fig. 7）Gradation drilling file and including molding file 1（See Fig. 9）With molding text
Part 2（See Figure 10）Gradation molding file, specifically, plate technique edges increase location hole in the side bottom and top two corners position of edges of boards
First location hole is set, and opposite side bottom and top two corners position arranges the second location hole, the 3rd is arranged in the middle part of the long side of edges of boards and positions
Hole, the 3rd location hole is to have additional location hole in plate technique edges, and the setting imposite drilling of the 3rd location hole, molding file divide
Becoming 2 parts that drill file and gradation molding file is formed by several times, large scale is can achieve at a high speed using conventional two-axis rig, gong machine
The drilling of printed wiring board and processing and forming, the file that drills by several times is respectively drill file 1 and drilling file 2, and gradation molding is literary
Part is respectively molding file 1 and molding file 2, in order to prevent file from using mistake, first location hole and the 3rd location hole
Spacing and the 3rd location hole are differed with the second positioning pitch of holes, be 2 files positioning hole length arrange different, described the
One location hole, the 3rd positioning pitch of holes press 4 with the 3rd location hole, the second positioning pitch of holes:6 ratio settings；
1.3）, laminar structure is designed, and according to the depth of back drill, determines the interlayer thickness of demand, back drill depth≤2.0mm, demand
Interlayer thickness need >=0.20mm（Including copper layer thickness）；Back drill depth ＞ 2.0mm, the interlayer thickness need >=0.3mm of demand（Bag
Include copper layer thickness）；The interlayer thickness of demand will drill a layer Ln as needed（Refer to any one layer）To do not drill a layer Ln-x (x refers to 1,
2nd, 3 ...) gross thickness；
1.4）, back drill test cell sets, and in edges of boards white space, sets the back drill depth test of and back drill position consistency
Unit, in conjunction with Figure 11 and Figure 12, with back drill depth as L11-10, that is, requires to drill L11 layer, but as a example by can not boring and hindering L10 layer,
First drilling and back drill hole is bored on line layer, and the back drill hole is identical with the drill center of first drilling and forms orifice ring, and orifice ring makes
4mil is designed as, live width is designed as 8mil, bore edges line space design is that the paving copper of 20mil, other layers is designed, according to actual back drill
The demand of plate, the residual copper rate of corresponding level>50%, full paving copper design is taken, residual copper rate≤50% of level is corresponded to, is taken not and stay copper
Design, setting up for back drill test cell, it is combined into and back drill effect can be detected with table, if back drill depth is excessive, L10 is surveyed
Prospect hole can be drilled brokenly, cause the open lines between via 1 and 2, judge NG；If back drill depth is excessively shallow, L11 instrument connection does not have
It is drilled remove, causes the connection between via 3 and 4 that path is formed, judge NG, effectively reduce microsection manufacture, improve efficiency；
Second step, the making of High speed rear panel, multilamellar large scale High speed rear panel is carried out according to the project file design in the first step
Make, the multiple pressing for carrying out High speed rear panel by layering pressing design forms High speed rear panel entirety, and the making of High speed rear panel includes
Following steps：
2.1）, core material graphic making, routinely technological process carries out core material sawing sheet, circuit making, automated optical inspection
Survey, brown, wait for the 1st pressing；
2.2）, the 1st pressing, L1-48 laminate is divided into L1-24 and L25-48 two parts, respectively by L1-24 and L25-48 two
Partial pressure close needed for central layer, prepreg be ready to complete, by L1-24 part L2-3, L4-5 ..., L22-23 central layer lamination, then
Pressing Copper Foil carries out the 1st pressing up and down, forms L1-24；L25-48 pressing portions flow process is identical with L1-24 pressing flow process；
2.3）, graphic making, row line making, automated optical are entered in routinely technological process to the adjacent layer Copper Foil of adjacent set product
Detection, brown, wait for the 2nd total pressing；
2.4）, the 2nd total pressing, respectively the above-mentioned L1-24 through the 1st pressing and L25-48 is carried out lamination, after the completion of lamination
Carry out the 2nd total pressing and form L1-48 High speed rear panel；
3rd step, through hole processed, carry out gradation drilling process, institute to High speed rear panel by the gradation drilling file in the first step
State through hole processed to comprise the steps：
3.1）1st Drilling operation, after High speed rear panel pressing shaping, by the drilling file 1 in gradation drilling file, carries on the back to high speed
Plate carries out the 1st Drilling operation；
3.2）2nd Drilling operation, after the completion of the 1st Drilling operation, by the drilling file 2 in gradation drilling file, at a high speed
Backboard carries out the 2nd through hole processing that Drilling operation completes High speed rear panel；
3.3）High speed rear panel makes, and routinely technological process carries out sink copper plate electric, outer-layer circuit making, the electric stannum work of figure, waits
Carry out back drill processing；
4th step, back drill processed, set to High speed rear panel by the gradation drilling file in the first step and back drill test cell
Gradation back drill process is carried out, the back drill processed comprises the steps：
4.1）1st Drilling operation, after High speed rear panel pressing shaping, by the drilling file 1 in gradation drilling file, carries on the back to high speed
Plate carries out the 1st Drilling operation；
4.2）2nd Drilling operation, after the completion of the 1st drilling, by the drilling file 2 in gradation drilling file, to High speed rear panel
Carry out the back drill that the 2nd Drilling operation completes High speed rear panel；
5th step, processing and forming is processed, and carries out processing and forming process to High speed rear panel by the gradation molding file in the first step, high
After the completion of operation is processed after fast backboard, processing and forming process is carried out to High speed rear panel, the concrete molding by gradation molding file
File 1 and molding file 2 carry out forming processes, and molding file 1 and 2 cabling of molding file arrange overlapping region, the coincidence area
Field width degree is 1mm, then carries out processing and forming process using twin shaft forming machine；
6th step, rear operation is processed, and after routinely wiring board work flow carries out electrical measurement, examines eventually, carries out packaging shipment.
Before the 3rd step back drill processed, back drill quality need to be entered with reference to circuit tester by back drill test cell in the first step
Row is detected and determined, and specifically includes following steps：
1）Before back drill, make sections observation and each thickness degree is recorded, control is deep to spend for calculating；
2）According to slice thickness, back drill test cell is processed, according to Customer design and requirement, using the circuit tester measurement back of the body
Drilling testing unit drills layer, the non-break-make situation for drilling layer, or sections observation back drill test cell back drill quality, judges initial workpiece
Whether satisfaction is required；
3）If initial workpiece meets quality requirements, normal process is carried out, such as initial workpiece is unsatisfactory for quality requirements, deep according to section adjustment control
Degree, then make initial workpiece and carry out as above step and confirmed.
Further, after the completion of carrying out normal process steps process to High speed rear panel, continue to carry out at rear operation High speed rear panel
Reason, specifically routinely wiring board work flow carries out alkali etching, automated optical, welding resistance printing, character ink-jet and changes gold making.
The above, only presently preferred embodiments of the present invention, not makees any pro forma restriction to the present invention；All
The those of ordinary skill of the industry all can shown in by specification accompanying drawing and the above and swimmingly implement the present invention；But, all
Those skilled in the art in the range of without departing from technical solution of the present invention, using disclosed above technology contents
A little change, modification and the equivalent variations for developing that makes, are the Equivalent embodiments of the present invention；Meanwhile, all according to the present invention
The change of substantial technological any equivalent variations that above example is made, modification with develop etc., all still fall within the present invention's
Within the protection domain of technical scheme.
Claims (10)
1. a kind of manufacture method of multilamellar large scale High speed rear panel, it is characterised in that：Comprise the steps：
The first step, project file is designed, including
1.1）Layering pressing design, the layering pressing is 1 pressing shaping change of many major generals routine according to the product number of plies
For repeatedly pressing forming mode；
1.2）, drilling, back drill, molding document design, it is to include to bore that drilling file, back drill file and molding file are separately designed
Hole file 1, drilling file 2, the gradation drilling file of back drill file 1 and back drill file 2 and including molding file 1 and molding file
2 gradation molding file；
1.3）, laminar structure is designed, and according to the depth of back drill, determines the interlayer thickness of demand；
1.4）, back drill test cell sets, and in edges of boards white space, sets the back drill depth test of and back drill position consistency
Unit；
Second step, the making of High speed rear panel, multilamellar large scale High speed rear panel is carried out according to the project file design in the first step
Make, the multiple pressing for carrying out High speed rear panel by layering pressing design forms High speed rear panel entirety；
3rd step, through hole processed, carry out the making of High speed rear panel through hole by the gradation drilling file in the first step, subsequently just
Often carry out sink copper plate electric, outside line to make and the electric stannum of figure；
4th step, back drill processed, set to High speed rear panel by the gradation drilling file in the first step and back drill test cell
Gradation back drill process is carried out, is subsequently normally carried out alkali etching, welding resistance printing, character printing and surface treatment；
5th step, processing and forming is processed, and carries out processing and forming process by the gradation molding file in the first step to High speed rear panel；
6th step, rear operation is processed, and after routinely wiring board work flow carries out electrical measurement, examines eventually, carries out packaging shipment.
2. the manufacture method of multilamellar large scale High speed rear panel according to claim 1, it is characterised in that：The layering pressing
It is multigroup according to many major generals production sharing of the product number of plies, respectively every set product is pressed, then by the 1st gradation of each group
Product after pressing is carried out the 2nd total pressing, obtains multilamellar large scale backboard successively after lamination.
3. the manufacture method of multilamellar large scale High speed rear panel according to claim 1, it is characterised in that：The drilling, become
Type document design specifically includes following steps, arranges the first location hole in the side bottom and top two corners position of edges of boards, and opposite side is upper and lower
Two Angle Position arrange the second location hole, arrange the 3rd location hole, the setting imposite of the 3rd location hole in the middle part of the long side of edges of boards
Drilling, molding file are divided into 2 parts and form by several times drill file and gradation molding file, and drilling file is respectively the text that drills by several times
Part 1 and drilling file 2, gradation molding file is respectively molding file 1 and molding file 2, and first location hole and the 3rd is determined
Position pitch of holes is differed with the second positioning pitch of holes with the 3rd location hole.
4. the manufacture method of the multilamellar large scale High speed rear panel according to claims 1 to 3 any one claim, its feature
It is：The making of second step high speed backboard comprises the steps：
2.1）, core material graphic making, routinely technological process carries out core material sawing sheet, circuit making, automated optical inspection
Survey, brown, wait for the 1st pressing；
2.2）, each set product is pressed for the 1st time by several times, is ready to complete the central layer needed for each group pressing, prepreg respectively, respectively
By each group in the way of central layer, prepreg lamination successively, press Copper Foil after the completion of lamination up and down, form the 1st set product, other
Set product pressing flow process is identical with the 1st set product pressing flow process；
2.3）, graphic making, row line making, automated optical are entered in routinely technological process to the adjacent layer Copper Foil of adjacent set product
Detection, brown, wait for the 2nd total pressing；
2.4）, the 2nd time total to press, and respectively above-mentioned each set product through the 1st pressing is carried out lamination, carries out the after the completion of lamination
2 total pressings form High speed rear panel.
5. the manufacture method of multilamellar large scale High speed rear panel according to claim 4, it is characterised in that：Through hole in 3rd step
Processed comprises the steps：
3.1）1st Drilling operation, after High speed rear panel pressing shaping, by the drilling file 1 in gradation drilling file, carries on the back to high speed
Plate carries out the 1st Drilling operation；
3.2）2nd Drilling operation, after the completion of the 1st drilling, by the drilling file 2 in gradation drilling file, to High speed rear panel
Carry out the through hole processing that Drilling operation completes High speed rear panel the 2nd time；
3.3）High speed rear panel makes, and routinely technique carries out sink copper plate electric, outer-layer circuit making, the electric stannum work of figure, waits for
Back drill is processed.
6. the manufacture method of multilamellar large scale High speed rear panel according to claim 5, it is characterised in that：Back drill in 4th step
Processed comprises the steps：
4.1）1st Drilling operation, after High speed rear panel figure electricity stannum, by the back drill file 1 in gradation drilling file, to High speed rear panel
Carry out the 1st Drilling operation；
4.2）2nd Drilling operation, after the completion of the 1st drilling, by the back drill file 2 in gradation drilling file, to High speed rear panel
Carry out the back drill that the 2nd Drilling operation completes High speed rear panel.
7. the manufacture method of multilamellar large scale High speed rear panel according to claim 6, it is characterised in that：In the 3rd step back drill
Before processed, back drill quality need to be detected and determined with reference to circuit tester by back drill test cell in the first step, concrete bag
Include following steps：
1）Before back drill, make sections observation and each thickness degree is recorded, control is deep to spend for calculating；
2）According to slice thickness, back drill test cell is processed, according to Customer design and requirement, using the circuit tester measurement back of the body
Drilling testing unit drills layer, the non-break-make situation for drilling layer, or sections observation back drill test cell back drill quality, judges initial workpiece
Whether satisfaction is required；
3）If initial workpiece meets quality requirements, normal process is carried out, such as initial workpiece is unsatisfactory for quality requirements, deep according to section adjustment control
Degree, then make initial workpiece and carry out as above step and confirmed.
8. the manufacture method of multilamellar large scale High speed rear panel according to claim 7, it is characterised in that：High speed rear panel is entered
After the completion of row normal process steps are processed, continue to carry out High speed rear panel rear operation process, specifically routinely wiring board work flow enters
Row alkali etching, automated optical, welding resistance printing, character ink-jet and change gold make.
9. the manufacture method of multilamellar large scale High speed rear panel according to claim 1, it is characterised in that：Work after High speed rear panel
After the completion of sequence is processed, processing and forming process is carried out to High speed rear panel, specifically by the molding file 1 in gradation molding file and molding
File 2 carries out forming processes, and molding file 1 and 2 cabling of molding file are arranged overlapping region, then carried out using twin shaft forming machine
Processing and forming is processed.
10. the manufacture method of multilamellar large scale High speed rear panel according to claim 9, it is characterised in that：The coincidence area
Field width degree is 1mm.
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| CN109492329A (en) * | 2018-12-03 | 2019-03-19 | 郑州云海信息技术有限公司 | A kind of design method of back drill setting |
| CN110290631A (en) * | 2019-06-13 | 2019-09-27 | 广合科技（广州）有限公司 | A kind of High Speed PCB Board ectonexine loss control technique |
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| CN117156692A (en) * | 2023-10-30 | 2023-12-01 | 圆周率半导体(南通)有限公司 | Press fit method for effectively improving flatness of whole PCB |
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| CN112328554A (en) * | 2020-11-23 | 2021-02-05 | 迈普通信技术股份有限公司 | Method and device for generating secondary drilling file, electronic equipment and storage medium |
| CN112328554B (en) * | 2020-11-23 | 2022-09-13 | 迈普通信技术股份有限公司 | Method and device for generating secondary drilling file, electronic equipment and storage medium |
| CN117156692A (en) * | 2023-10-30 | 2023-12-01 | 圆周率半导体(南通)有限公司 | Press fit method for effectively improving flatness of whole PCB |
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