CN111901974B - Manufacturing process of N + N blind pressing large back plate - Google Patents
Manufacturing process of N + N blind pressing large back plate Download PDFInfo
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- CN111901974B CN111901974B CN202010899397.8A CN202010899397A CN111901974B CN 111901974 B CN111901974 B CN 111901974B CN 202010899397 A CN202010899397 A CN 202010899397A CN 111901974 B CN111901974 B CN 111901974B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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Abstract
The invention discloses a manufacturing process of an N + N blind pressing large back plate, which comprises the following steps: providing a first sub-board, a second sub-board, an inner core board and an outer copper foil, wherein drilling positions are arranged at corresponding positions of the first sub-board, the second sub-board and the inner core board; respectively manufacturing inner layer circuits on the first sub-board, the second sub-board and the inner layer core board, wherein the inner layer circuits on the first sub-board and the second sub-board respectively comprise first hole rings arranged around the drilling positions, and the inner layer circuits on the inner layer core board comprise second hole rings arranged around the drilling positions; sequentially overlapping the outer copper foil, the first sub-plate, the inner core plate, the second sub-plate and the outer copper foil through PP according to requirements and then pressing to form a production plate; drilling through holes on two surfaces of the production plate in an up-down opposite drilling mode; and carrying out post-processing on the production board to obtain the N + N blind pressing large back board. The invention solves the problem of hole ring edge cavity caused by poor inner layer hole ring filling, reduces the problem of drill bit interruption in the drilling process, and also solves the problem of deviation in the drilling process.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing process of an N + N blind pressing large back plate.
Background
The existing manufacturing process of the high-multilayer back plate comprises the following steps: the method comprises the steps of cutting → first inner layer pattern → first inner layer etching → first inner layer AOI → first laminating → inner layer drilling → copper deposition → whole plate electroplating → second inner layer pattern → second inner layer etching → second inner layer AOI → nickel deposition → second laminating → second outer layer drilling → outer layer copper deposition → outer layer whole plate electroplating → outer layer pattern → pattern electroplating → outer layer etching → post process.
The manufacturing method of the high multi-layer back plate has the following defects:
(1) the interlayer is pressed by adopting a single piece of no-flow adhesive PP, the step position of a hole ring in the inner layer is generally the same as the hole diameter of a drilling hole required by the outer layer, and the inner diameter of the hole ring is larger, so that insufficient glue filling is easy to occur, and the problems of resin cavities at the edge of the hole ring and the like are caused;
(2) in the production process of the high multi-layer back plate, a plurality of drilling operations are usually required, and in the prior art, when a common plate is drilled, a method that a cutter directly drills from one surface of the plate to the other surface is usually adopted; for thinner plates this method has little effect, but for thicker plates problems can occur, such as broken drill due to poor chip removal, over-demand drill hole diameter, and failure to drill through due to drill depth exceeding the length of the drill tip. In the circuit board industry, particularly when a thicker circuit board motherboard is drilled, the problem of poor chip removal can occur, so that the problems of broken drill and too thick bore diameter of the drilled hole are caused, and the quality of the circuit board is seriously affected. Meanwhile, for a thicker circuit board motherboard, the problem of deviation in the drilling process is also easily caused by adopting a method of directly drilling from one surface of the motherboard to the other surface by a cutter;
(3) in the process of multiple times of pressing, the problem of inner layer short circuit caused by layer deviation is easily caused.
(4) For the plate with the step platform, the step position is covered by the copper foil, and due to the action of gravity, air cannot be discharged in the process of vacuum suction in the lower step groove; in the hot-pressing discharging process, residual air in the groove expands to cause the copper foil to blister after pressure is relieved due to high temperature.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a manufacturing process of an N + N blind pressing large back plate, which solves the problem of hole at the edge of a hole ring caused by poor filling of an inner layer hole ring, reduces the problem of drill bit interruption in the drilling process, and solves the problem of deviation in the drilling process.
In order to solve the technical problem, the invention provides a manufacturing process of an N + N blind-pressed large back plate, which comprises the following steps:
s1, providing a first sub-board, a second sub-board, an inner core board and an outer copper foil, wherein drilling positions are arranged at corresponding positions of the first sub-board, the second sub-board and the inner core board, and the drilling positions are positions needing drilling in subsequent processing;
s2, respectively manufacturing inner-layer circuits on the first sub-board, the second sub-board and the inner-layer core board through a negative film process, wherein the inner-layer circuits on the first sub-board and the second sub-board respectively comprise first hole rings which are arranged around the center of the drilling position and have inner diameters smaller than the diameter of the drilling position, the inner-layer circuits on the inner-layer core board comprise second hole rings which are arranged around the center of the drilling position and have inner diameters smaller than the diameter of the drilling position, the outer diameters of the first hole rings and the second hole rings are larger than the diameter of the drilling position, and the inner diameters of the first hole rings are larger than the inner diameter of the second hole rings;
s3, sequentially overlapping the outer copper foil, the first sub-plate, the inner core plate, the second sub-plate and the outer copper foil through PP according to requirements, and pressing to form a production plate;
s4, performing multi-section equally-divided drilling on the first surface of the production plate perpendicular to the drilling position, wherein the drilling depth is 1/2-2/3 of the thickness of the production plate, and forming blind holes;
s5, performing multi-section uniform drilling on the second surface of the production board perpendicular to the drilling position, and drilling the blind holes to drill through holes on the production board;
and S6, sequentially carrying out copper deposition, full-board electroplating, outer-layer circuit manufacturing, solder mask manufacturing, surface treatment and molding on the production board to obtain the N + N blind-pressed back board.
Further, in step S1, the first sub-board and the second sub-board are both multi-layer boards formed by laminating a plurality of core boards and copper foils into a laminated board by a prepreg and then pressing the laminated board into a whole, and 5 pieces of kraft paper are laminated on the upper and lower surfaces of the laminated board during pressing.
Further, in step S1, the core board is manufactured with an inner layer circuit through a negative process before lamination, and an LDI exposure machine is used in an exposure process in the negative process.
Further, in step S1, after the inner layer wiring is formed on the core board, a rivet hole is drilled in the core board by OPE punching.
Further, the inner diameter of the first annular ring is 0.15mm, and the inner diameter of the second annular ring is 0.1 mm.
Further, in step S2, before the inner layer circuits are formed on the first sub board and the second sub board, the first sub board and the second sub board are drilled, and the holes are metallized by copper deposition and full board electroplating in sequence.
Further, the following steps are included between steps S2 and S3:
s21, routing a step platform on the first sub-board and the second sub-board in a mechanical depth control routing mode;
and S22, performing nickel and gold deposition treatment on the first sub-board and the second sub-board, and sequentially depositing a nickel layer and a gold layer on the copper surface.
Further, in step S3, the step platforms of the first sub-board and the second sub-board are both disposed outward, and a cushion pad is placed in the step platform before the pressing.
Furthermore, in the hot pressing process of pressing and synthesizing the production plate, the time of a later cooling section is increased by 30min on the basis of design, so that the tapping temperature of the production plate is less than 100 ℃.
Further, in step S4, drilling is performed in a five-segment drilling manner, and the depth of each segment of drilling is the same; in step S5, a four-step drilling method is used to drill holes, and the depth of each drill hole is the same as the depth of each drill hole in step S4.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the inner diameter of the hole ring in the inner layer is designed to be smaller than the diameter of the drilling position, so that the size of the inner part of the step position of the hole ring can be effectively reduced, and the glue filling amount of the step position of the hole ring is reduced, thereby solving the problem of hole ring edge holes caused by poor glue filling of the hole ring in the inner layer; the through holes are drilled in the production board in a multi-section up-down opposite drilling mode, chip removal of drilling is reduced, the problem that a drill bit is interrupted in the drilling process is solved, the drilling quality of the circuit board is improved, and meanwhile, the problem of deviation in the drilling process is solved by adopting a method of drilling from two sides; in the method, the cushion pads are arranged in the step platform for pressing together, so that residual air in the step position can be exhausted during pressing, the cooling time in the working procedure is increased for 30min, the tapping temperature of the plate is ensured to be less than 100 ℃, and the problem of foaming of the copper foil at the step position is avoided.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The embodiment provides a manufacturing process of a 64-layer N + N blind-pressed large back plate, which comprises the following specific processes:
(1) cutting: 29 core plates, prepregs and copper foils are cut according to the size of the jointed board of 467mm multiplied by 620mm, the thickness of the core plate is 0.25mm (the thickness is the thickness without the outer copper foil), and the thickness of the outer copper foil is 0.5 oz.
(2) And inner layer circuit manufacturing (negative film process): transferring inner layer patterns, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing inner layer line exposure on all core plates by using a 5-6-grid exposure ruler (21-grid exposure ruler) by adopting an LDI (laser direct immersion) exposure machine, wherein the deviation between an upper layer and a lower layer can be controlled within 25 mu m; etching an inner layer, namely etching the exposed and developed core plate to form an inner layer circuit, wherein the inner layer circuit of one core plate comprises a second hole ring which is arranged around the center of a hole drilling position and has the inner diameter smaller than the diameter of the hole drilling position, the inner diameter of the second hole ring is 0.1mm, the outer diameter of the second hole ring is larger than the diameter of the hole drilling position, the hole drilling position is a position needing to be drilled in subsequent processing, and the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And OPE punching: rivet holes for pressing were punched at corresponding positions of the 28 core plates and prepregs in which the second eye ring was not provided.
(4) And one-time pressing: according to the browning speed, according to the thickness of copper in the bottom copper, carrying out brown oxidation on 14 core plates, prepregs and copper foils (the stacking sequence is that the copper foils, the prepregs, the 14 core plates, the prepregs and the copper foils are separated by the prepregs between the core plates) which are subjected to the OPE punching procedure are sequentially stacked according to requirements, riveting is firstly carried out through rivets by using rivets through rivet holes after a stacked plate is formed, and then the stacked plate is pressed by selecting proper lamination conditions according to the Tg of a plate material to form a 30-layer first sub-plate; sequentially overlapping the other 14 core plates, the prepregs and the copper foils (the order of the laminated plates is that the copper foils, the prepregs, the 14 core plates, the prepregs and the copper foils are arranged, and the core plates are separated by the prepregs) which are subjected to the OPE punching procedure according to requirements, riveting the laminated plates by rivets through rivet holes, and then pressing the laminated plates according to the Tg of the plates to form a 30-layer second sub-plate; in the above, before the first sub-board and the second sub-board are laminated, 5 pieces of kraft paper are laminated on the upper and lower surfaces of the laminated board for the anti-skid board in the laminating process to reduce the layer deviation amount during lamination, thereby effectively reducing or avoiding the problem of inner layer short circuit caused by layer deviation,
(5) drilling: according to the existing drilling technology, through holes are drilled on the first sub-board and the second sub-board according to design requirements.
(6) And copper deposition: metallizing the through holes on the first sub-board and the second sub-board, and testing the backlight to 10 grades, wherein the thickness of the copper deposition in the holes is 0.5 mu m.
(7) And electroplating the whole plate: the whole plate is electroplated for 60min at a current density of 1.8ASD, and the thickness of the hole copper is more than 20 μm.
(8) And inner layer circuit manufacturing (negative film process): transferring inner layer pattern, coating photosensitive film with vertical coating machine, controlling film thickness of the photosensitive film to 8 μm, and completing inner layer circuit exposure on the first sub-board and the second sub-board with 5-6 exposure rulers (21 exposure rulers) by using a full-automatic exposure machine; etching an inner layer, namely etching the exposed and developed first sub-board and the exposed and developed second sub-board to form an inner layer circuit, wherein the inner layer circuits on the first sub-board and the second sub-board respectively comprise a first hole ring which is arranged around the center of a drilling position and has an inner diameter smaller than the diameter of the drilling position, the inner diameter of the first hole ring is 0.15mm, the outer diameter of the first hole ring is larger than the diameter of the drilling position, the drilling position is a position needing drilling in subsequent processing, and the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(9) The gong platform: according to design requirements, the first sub-board and the second sub-board are provided with a ladder platform in a mechanical depth control gong mode.
(10) And depositing nickel and gold: the chemical principle is communicated with the copper surfaces of the first sub-board and the second sub-board, nickel and gold deposition is carried out on the first sub-board and the second sub-board, a nickel layer and a gold layer are uniformly deposited on the copper surfaces, and the copper surfaces on the first sub-board and the second sub-board are prevented from being oxidized.
(11) And secondary pressing: the browning speed is that the remaining 1 core plate, the first sub-plate, the second sub-plate, the PP and the outer copper foil (the stacking sequence is that the outer copper foil, the PP, the first sub-plate, the PP, the core plate, the PP, the second sub-plate, the PP and the outer copper foil) are sequentially overlapped according to requirements, then the stacking plate is pressed by selecting proper lamination conditions according to the Tg of the plate material to form 64 layers of production plates, and the first hole ring and the second hole ring are correspondingly arranged up and down; the stepped platforms on the first sub-board and the second sub-board are both arranged outwards, namely towards the outer copper foil, and a buffer pad is placed in the stepped platforms before lamination; and in the hot pressing process of pressing and synthesizing the production plate, the time of a later cooling section is increased by 30min on the basis of the original design, so that the tapping temperature of the production plate is less than 100 ℃.
In the foregoing, the two PP's that are used for connecting two daughter boards and outer copper foil correspond the position department and carry out the size windowing, the position of windowing is the metallization hole position on corresponding two daughter boards, open the window that the diameter is 0.3mm on one of them PP, open the window that the diameter is 0.5mm on another piece PP, the setting of windowing like this can guarantee that the excessive glue does not go up the metallization hole ring (PAD) in two daughter boards during pressfitting, also can guarantee the bonding with outer copper foil simultaneously to two windowing size difference, the volume change of excessive glue can be less, well control.
(12) And outer layer drilling: drilling a through hole with the aperture being more than or equal to 1.5mm on the production plate by adopting a nine-section (upper five sections and lower 4 sections) up-down counter drilling mode according to the drilling data, wherein the aperture of the through hole is smaller than the outer diameters of the first hole ring and the second hole ring; specifically, five-section type uniform drilling is carried out on the first surface of the production plate perpendicular to the drilling position, the depth of each section of drilling is 1.1mm, and the total drilling depth is 1/2-2/3 of the thickness of the production plate to form blind holes; and then, uniformly drilling four sections of holes perpendicular to the drilling positions on the second surface of the production plate, wherein the depth of each section of drilled hole is 1.1mm, and drilling through the blind holes formed in the section of drilled holes, so that through holes are drilled in the production plate.
(13) And copper deposition: and a layer of thin copper is deposited on the hole wall in a chemical reaction mode to provide a foundation for the subsequent full-board electroplating, the backlight test is 10 grades, the thickness of the copper deposited in the hole is 0.5 mu m, and the copper layer on the hole wall is communicated with the first hole ring and the second hole ring.
(14) And electroplating the whole plate: according to the mechanism of electrochemical reaction, a layer of copper is electroplated on the basis of copper deposition, the thickness of the hole copper is ensured to meet the product requirement, and electroplating parameters are set according to the thickness of the finished hole copper.
(15) And manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, then respectively plating copper and tin on the production plate, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production board; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(16) Solder resist and silk screen printing of characters: by making a green oil layer on the outer layer of the production plate and silk-printing characters, the thickness of the green oil is as follows: 10-50 μm, so that the influence of environmental change on the production plate can be reduced in the subsequent use process.
(17) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(18) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(19) And forming: according to the prior art, the shape is milled according to the design requirement, the tolerance of the shape is +/-0.05mm, then cutting is carried out on the production board corresponding to the step platform in a mechanical depth control milling mode, the cut waste material part is stripped from the product by uncovering, the buffer cushion inside is taken out, the step platform is formed, and the N + N blind pressing large back board is manufactured.
(20) FQC: according to the customer acceptance standard and the I's inspection standard, the appearance of the N + N blind-pressed large back plate is inspected, if a defect exists, the defect is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(21) FQA: and measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the N + N blind pressing large back plate meet the requirements of customers or not.
(22) And packaging: and (4) hermetically packaging the N + N blind-pressed back plates according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (7)
1. A manufacturing process of an N + N blind-pressed large back plate is characterized by comprising the following steps:
s1, providing a first sub-board, a second sub-board, an inner core board and an outer copper foil, wherein drilling positions are arranged at corresponding positions of the first sub-board, the second sub-board and the inner core board, and the drilling positions are positions needing drilling in subsequent processing;
s2, respectively manufacturing inner-layer circuits on the first sub-board, the second sub-board and the inner-layer core board through a negative film process, wherein the inner-layer circuits on the first sub-board and the second sub-board respectively comprise first hole rings which are arranged around the center of the drilling position and have inner diameters smaller than the diameter of the drilling position, the inner-layer circuits on the inner-layer core board comprise second hole rings which are arranged around the center of the drilling position and have inner diameters smaller than the diameter of the drilling position, the outer diameters of the first hole rings and the second hole rings are larger than the diameter of the drilling position, and the inner diameters of the first hole rings are larger than the inner diameter of the second hole rings;
s21, routing a step platform on the first sub-board and the second sub-board in a mechanical depth control routing mode;
s22, performing nickel and gold deposition treatment on the first sub-board and the second sub-board, and sequentially depositing a nickel layer and a gold layer on the copper surface;
s3, sequentially overlapping the outer copper foil, the first sub-plate, the inner core plate, the second sub-plate and the outer copper foil through PP according to requirements, and pressing to form a production plate; the step platforms on the first sub-board and the second sub-board are arranged outwards, and a cushion pad is placed in the step platforms before pressing; in the hot pressing process of pressing and synthesizing the production plate, the time of a later cooling section is increased by 30min on the basis of design, so that the tapping temperature of the production plate is less than 100 ℃;
s4, performing multi-section equally-divided drilling on the first surface of the production plate perpendicular to the drilling position, wherein the drilling depth is 1/2-2/3 of the thickness of the production plate, and forming blind holes;
s5, performing multi-section uniform drilling on the second surface of the production board perpendicular to the drilling position, and drilling the blind holes to drill through holes on the production board;
and S6, sequentially carrying out copper deposition, full-board electroplating, outer-layer circuit manufacturing, solder mask manufacturing, surface treatment and molding on the production board to obtain the N + N blind-pressed back board.
2. The process of manufacturing an N + N blind-pressed large back sheet according to claim 1, wherein in step S1, the first sub-sheet and the second sub-sheet are both multi-layer sheets formed by laminating a plurality of core sheets and copper foils to form a laminated sheet, and then laminating 5 pieces of kraft paper on the upper and lower surfaces of the laminated sheet.
3. The process of claim 2, wherein in step S1, the core board is first processed with inner layer circuits by a negative process before lamination, and an LDI exposure machine is used in the exposure process in the negative process.
4. The process of manufacturing an N + N blind enlarged backplane according to claim 3, wherein in step S1, after the inner layer circuit is manufactured on the core board, rivet holes are drilled on the core board by OPE punching.
5. The process for manufacturing an N + N blind enlarged backplate according to claim 1, wherein the inner diameter of the first annular ring is 0.15mm, and the inner diameter of the second annular ring is 0.1 mm.
6. The process for manufacturing an N + N blind large backplane according to claim 1, wherein in step S2, before inner circuits are manufactured on the first daughter board and the second daughter board, the first daughter board and the second daughter board are drilled, and the holes are metallized by copper deposition and full-board electroplating in sequence.
7. The manufacturing process of the N + N blind enlarged back plate according to claim 1, wherein in step S4, a five-segment drilling manner is adopted for drilling, and the depth of each segment of drilling is the same; in step S5, a four-step drilling method is used to drill holes, and the depth of each drill hole is the same as the depth of each drill hole in step S4.
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| WO2003073812A1 (en) * | 2002-02-05 | 2003-09-04 | Force10 Networks, Inc. | Method of fabricating a high-layer-count backplane |
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| CN106973525A (en) * | 2017-04-21 | 2017-07-21 | 深圳崇达多层线路板有限公司 | A kind of preparation method of the high multilayer backboard of N+N types |
| CN108770238A (en) * | 2018-07-13 | 2018-11-06 | 深圳崇达多层线路板有限公司 | A kind of inner figure design method for improving drilling and pulling copper |
| CN110461106A (en) * | 2019-07-26 | 2019-11-15 | 江门崇达电路技术有限公司 | A method of making large aperture via hole on thick copper circuit board |
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2020
- 2020-08-31 CN CN202010899397.8A patent/CN111901974B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003073812A1 (en) * | 2002-02-05 | 2003-09-04 | Force10 Networks, Inc. | Method of fabricating a high-layer-count backplane |
| CN106455293A (en) * | 2016-09-27 | 2017-02-22 | 惠州市金百泽电路科技有限公司 | Fabrication method of multilayer, large-size and high-speed back panel |
| CN106973525A (en) * | 2017-04-21 | 2017-07-21 | 深圳崇达多层线路板有限公司 | A kind of preparation method of the high multilayer backboard of N+N types |
| CN108770238A (en) * | 2018-07-13 | 2018-11-06 | 深圳崇达多层线路板有限公司 | A kind of inner figure design method for improving drilling and pulling copper |
| CN110461106A (en) * | 2019-07-26 | 2019-11-15 | 江门崇达电路技术有限公司 | A method of making large aperture via hole on thick copper circuit board |
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