CN110785013A - Manufacturing method for improving foaming and explosion of circuit board - Google Patents
Manufacturing method for improving foaming and explosion of circuit board Download PDFInfo
- Publication number
- CN110785013A CN110785013A CN201910993276.7A CN201910993276A CN110785013A CN 110785013 A CN110785013 A CN 110785013A CN 201910993276 A CN201910993276 A CN 201910993276A CN 110785013 A CN110785013 A CN 110785013A
- Authority
- CN
- China
- Prior art keywords
- board
- hole
- heat dissipation
- foaming
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Abstract
The invention discloses a manufacturing method for improving foaming explosion of a circuit board, which comprises the following steps: drilling heat dissipation holes in the production plate; metallizing the heat dissipation hole sequentially through copper deposition and full-plate electroplating; manufacturing a plating hole pattern on the production plate, and then thickening the thickness of a copper layer in the radiating hole by electroplating; removing the plated hole pattern, and drilling a via hole on the production plate; metallizing the through hole by copper deposition and full-plate electroplating in sequence; and sequentially manufacturing an outer layer circuit, a solder mask layer, surface treatment and molding on the production board to obtain the circuit board. According to the method, the resin is not filled in the heat dissipation holes, the purpose of heat dissipation is achieved only through the copper plating layer, the problem that foaming occurs due to poor heat resistance caused by the difference of CTE values between the plate and the resin filler is solved, and the problem of plate explosion caused by foaming can be effectively avoided.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method for improving foaming and explosion of a circuit board.
Background
The circuit board has the problems that foaming is abnormal and board explosion is caused in the manufacturing process of the circuit board, and the main reasons are that when the board is subjected to thermal shock, the board at the position of dense resin hole plugging easily generates bubbles, so that the size of the board is enlarged and expanded, and the outer layer copper foil is stressed greatly, so that the board explosion is caused; the foaming position is located the intensive position of resin consent louvre, and specific foaming reason influence factor analysis is as follows:
1. from the material point of view, the CTE values of the plate CTE and the CTE of the heat dissipation hole filler resin are matched and lower, the heat resistance of the circuit board is better, and the problem of foaming is easily caused when the CTE values of the plate CTE and the heat dissipation hole filler resin are different greatly;
2. in view of the pitch between the cell walls, the smaller the pitch between the cell walls, the worse the heat resistance between the cells, so that the board is liable to cause a problem of foaming after being heated.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a manufacturing method for improving the foaming and explosion of a circuit board, the method achieves the purpose of heat dissipation by only plating a copper layer without filling resin in a heat dissipation hole, solves the problem of foaming caused by poor heat resistance due to the difference of CTE (coefficient of thermal expansion) values between a board and resin filler, and can effectively avoid the problem of board explosion caused by foaming.
In order to solve the technical problem, the invention provides a manufacturing method for improving the foaming explosion of a circuit board, which comprises the following steps:
s1, drilling heat dissipation holes on the production plate;
s2, metallizing the heat dissipation holes through copper deposition and full-board electroplating in sequence;
s3, manufacturing a plated hole pattern on the production board, and then thickening the thickness of a copper layer in the radiating hole by electroplating;
s4, removing the plated hole pattern, and drilling a via hole on the production board;
s5, metallizing the through hole by copper deposition and full-plate electroplating in sequence;
and S6, sequentially manufacturing an outer layer circuit, a solder mask layer, a surface treatment and a forming process on the production board to obtain the circuit board.
Further, in step S1, when the heat dissipation holes are drilled, the hole pitch between adjacent heat dissipation holes is greater than or equal to 0.5 mm.
Further, in step S1, the diameter of the heat dissipation hole is 0.5 mm.
Further, in step S3, the hole wall copper layer in the heat dissipation hole is thickened to 30 μm.
Further, in step S5, the copper layer of the hole wall in the heat dissipation hole is thickened to 40 μm after the full board electroplating.
Further, in steps S1 and S4, the production board is subjected to plasma glue removal after drilling.
Further, in step S2, the thickness of the copper layer to be plated during the full-plate electroplating is controlled to be 10-15 μm.
Further, in step S2, after the full-plate electroplating, the thickness of the copper layer on the plate surface of the produced plate is controlled to be 20-25 μm.
Furthermore, the production board is a multilayer board formed by pressing an inner core board and an outer copper foil into a whole through a prepreg.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the drilled heat dissipation holes are not filled with resin, the purpose of heat dissipation is achieved only through the copper plating layer in the holes, and the problem of CTE (coefficient of thermal expansion) value difference between the plate and the resin filler does not exist because the holes are not filled with resin, so that the problem of foaming caused by poor heat resistance due to the difference of CTE values between the plate and the resin filler is solved, and the problem of plate explosion due to foaming can be effectively avoided; compared with the prior art that the hole edge distance between adjacent heat dissipation holes is 0.25mm, when the heat dissipation holes are designed and drilled, the hole edge distance between the adjacent heat dissipation holes is larger than or equal to 0.5mm, the problem of foaming caused by poor heat resistance due to the fact that the hole edge distance is too small is avoided, and the problem of board explosion due to foaming is further solved; the thickness of the copper plating layer of the heat dissipation hole in the prior art is generally 20 microns, then resin is filled in the hole to be matched with the copper plating layer to achieve the good heat dissipation purpose, and the copper plating layer on the inner hole wall of the heat dissipation hole is increased to 40 microns from the prior 20 microns, so that the heat dissipation effect of the heat dissipation hole is ensured by increasing the copper thickness.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The manufacturing method of the circuit board shown in the embodiment can effectively solve the problem of foaming and board explosion of the circuit board, and sequentially comprises the following processing procedures:
(1) cutting: the core board is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core board is 0.5mm, and the thickness of the copper layers on the two surfaces of the core board is 0.5 OZ.
(2) Inner layer circuit manufacturing (negative film process): transferring the inner layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing the exposure of the inner layer circuit by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers); etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And (3) laminating: and (3) brown-oxidizing at the speed of brown-oxidizing according to the thickness of the bottom copper, sequentially laminating the core plate, the prepreg and the outer copper foil according to requirements, and then pressing the laminated plate by selecting proper lamination conditions according to the Tg of the plate to form the production plate.
(4) Drilling heat dissipation holes: according to the existing drilling technology, drilling the heat dissipation holes on the production plate according to the design requirements; when the heat dissipation holes are drilled, the hole edge distance between every two adjacent heat dissipation holes is larger than or equal to 0.5mm, and the hole diameter of each heat dissipation hole is 0.5 mm.
(5) Removing glue: the production plate removes the glue residue in the heat dissipation hole through plasma glue removing treatment.
(6) Copper deposition: and depositing a layer of thin copper on the plate surface and the hole wall of the heat dissipation hole by using a chemical copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(7) Electroplating the whole plate: carrying out full-plate electroplating at the current density of 18ASF, and thickening the thickness of hole copper and plate surface copper layer; the thickness of the board surface copper layer which is added during the whole board electroplating is controlled to be 10-15 mu m, and the thickness of the board surface copper layer of the produced board is controlled to be 20-25 mu m after the whole board electroplating.
(8) Plating a hole pattern: and pasting a dry film on the production board, and windowing at the position corresponding to the heat dissipation hole through exposure and development to form a plated hole pattern.
(9) Plating holes: and then the copper layer on the hole wall in the radiating hole is thickened to 30 mu m by electroplating.
(10) Drilling a through hole: according to the existing drilling technology, drilling processing is carried out on the production plate according to design requirements.
(11) Removing glue: and removing the glue residues in the via holes of the production plate through plasma glue removing treatment.
(12) Copper deposition: and depositing a layer of thin copper on the plate surface and the hole wall by using a chemical copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the through hole is 0.5 mu m.
(13) Electroplating the whole plate: and performing full-board electroplating at a current density of 18ASF, thickening the thicknesses of via hole copper and board surface copper layers, and thickening the hole wall copper layer in the radiating hole to 40 mu m.
(14) Manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, then respectively plating copper and tin on the production plate, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production board; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(15) Solder resist and silk screen printing of characters: after the solder resist ink is printed on the surface of the production board in a silk-screen manner, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, TOP surface solder resist ink is printed by a white screen, and the TOP surface characters are added with UL marks, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and the effect of beautifying the appearance is achieved.
(16) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(17) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(18) And forming: according to the prior art and according to the design requirement, routing the shape, and obtaining the circuit board with the external tolerance of +/-0.05 mm.
(19) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the circuit board is inspected, if a defect exists, the circuit board is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(20) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not again.
(21) And packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (9)
1. A manufacturing method for improving the foaming explosion of a circuit board is characterized by comprising the following steps:
s1, drilling heat dissipation holes on the production plate;
s2, metallizing the heat dissipation holes through copper deposition and full-board electroplating in sequence;
s3, manufacturing a plated hole pattern on the production board, and then thickening the thickness of a copper layer in the radiating hole by electroplating;
s4, removing the plated hole pattern, and drilling a via hole on the production board;
s5, metallizing the through hole by copper deposition and full-plate electroplating in sequence;
and S6, sequentially manufacturing an outer layer circuit, a solder mask layer, a surface treatment and a forming process on the production board to obtain the circuit board.
2. The method for improving the foaming explosion plate of the circuit board according to claim 1, wherein in step S1, when the heat dissipation holes are drilled, the hole pitch between adjacent heat dissipation holes is greater than or equal to 0.5 mm.
3. The method for improving the foaming and bursting of the circuit board as claimed in claim 1, wherein in step S1, the diameter of the heat dissipation hole is 0.5 mm.
4. The method for improving the foaming explosion of the circuit board according to the claim 1, wherein in the step S3, the wall copper layer in the heat dissipation hole is thickened to 30 μm.
5. The method for improving the foaming explosion of the circuit board according to the claim 4, wherein in the step S5, the copper layer of the hole wall in the heat dissipation hole is thickened to 40 μm after the whole board is electroplated.
6. The method for improving the foaming and popping properties of the circuit board according to claim 1, wherein in steps S1 and S4, the plasma degumming treatment is performed on the production board after the hole is drilled.
7. The method for improving the foaming explosion of the circuit board according to the claim 1, wherein in the step S2, the thickness of the copper layer plated during the whole board electroplating is controlled to be 10-15 μm.
8. The method for improving the foaming explosion-proof board of the circuit board according to the claim 7, wherein in the step S2, after the whole board is electroplated, the thickness of the copper layer on the board surface of the produced board is controlled to be 20-25 μm.
9. The manufacturing method for improving the foaming and bursting of the circuit board according to claim 1, wherein the production board is a multi-layer board formed by laminating an inner core board and an outer copper foil into a whole through a prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910993276.7A CN110785013A (en) | 2019-10-18 | 2019-10-18 | Manufacturing method for improving foaming and explosion of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910993276.7A CN110785013A (en) | 2019-10-18 | 2019-10-18 | Manufacturing method for improving foaming and explosion of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110785013A true CN110785013A (en) | 2020-02-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910993276.7A Pending CN110785013A (en) | 2019-10-18 | 2019-10-18 | Manufacturing method for improving foaming and explosion of circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN110785013A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111601461A (en) * | 2020-06-08 | 2020-08-28 | 大连崇达电路有限公司 | Improvement method for no copper of circuit board hole |
| CN111642071A (en) * | 2020-05-14 | 2020-09-08 | 大连崇达电路有限公司 | Circuit board and method for improving board explosion and copper sheet foaming of circuit board |
| CN115038261A (en) * | 2022-05-06 | 2022-09-09 | 江门崇达电路技术有限公司 | Manufacturing method of PCB large-size metallized slotted hole |
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| US6430047B2 (en) * | 1999-05-28 | 2002-08-06 | Agere Systems Guardian Corp. | Standardized test board for testing custom chips |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111642071A (en) * | 2020-05-14 | 2020-09-08 | 大连崇达电路有限公司 | Circuit board and method for improving board explosion and copper sheet foaming of circuit board |
| CN111642071B (en) * | 2020-05-14 | 2023-03-31 | 大连崇达电路有限公司 | Circuit board and method for improving board explosion and copper sheet foaming of circuit board |
| CN111601461A (en) * | 2020-06-08 | 2020-08-28 | 大连崇达电路有限公司 | Improvement method for no copper of circuit board hole |
| CN115038261A (en) * | 2022-05-06 | 2022-09-09 | 江门崇达电路技术有限公司 | Manufacturing method of PCB large-size metallized slotted hole |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200211 |
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| RJ01 | Rejection of invention patent application after publication |