CN106304692A - A kind of Wiring board processing method plating thick through hole - Google Patents
A kind of Wiring board processing method plating thick through hole Download PDFInfo
- Publication number
- CN106304692A CN106304692A CN201610766291.4A CN201610766291A CN106304692A CN 106304692 A CN106304692 A CN 106304692A CN 201610766291 A CN201610766291 A CN 201610766291A CN 106304692 A CN106304692 A CN 106304692A
- Authority
- CN
- China
- Prior art keywords
- hole
- pcb surface
- wiring board
- dry film
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
Abstract
The invention discloses a kind of Wiring board processing method plating thick through hole, comprise the following steps: 1) complete normal drill, plating in PCB surface；2) last layer dry film is pasted in PCB surface；3) with liquid medicine, the dry film needing the hole site of plating thickness is taken off, make hole expose；4) hole internal layer is electroplated to desired thickness；5) take off PCB surface dry film, PCB surface is polished.The present invention uses brand-new process, well meets the requirement that copper facing thickness in through hole is big, top layer copper thickness will not be produced any impact simultaneously, and copper facing precision is high, and superior product quality, scrappage is low.
Description
Technical field
The present invention relates to field of printed circuit board fabrication, a kind of Wiring board processing method plating thick through hole.
Background technology
At present, in wiring board makes, it is often desirable that the copper facing thickness in through hole is more than the copper facing thickness on top layer, particularly
In the region having dense holes to design as source of heat release, and existing technique is to use repeatedly copper facing to meet requirement, but can bring
Table copper thickness exceeds standard, or the problem that table copper thickness is uneven, causes etching clean, and wiring board is short-circuit and scraps.
Summary of the invention
It is contemplated that one of above-mentioned technical problem solved the most to a certain extent in correlation technique.To this end, this
A kind of Wiring board processing method plating thick through hole of bright proposition.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of Wiring board processing method plating thick through hole, comprises the following steps:
1) normal drill, plating are completed in PCB surface；
2) last layer dry film is pasted in PCB surface；
3) with liquid medicine, the dry film needing the hole site of plating thickness is taken off, make hole expose；
4) hole internal layer is electroplated to desired thickness；
5) take off PCB surface dry film, PCB surface is polished.
Further, step 3) liquid medicine is developing agent.
Further, step 5) uses abrasive band to polish wiring board.
The invention has the beneficial effects as follows: use brand-new process, in well meeting through hole, copper facing thickness is big
Requirement, will not produce any impact to top layer copper thickness simultaneously, and copper facing precision is high, and superior product quality, scrappage is low.
Detailed description of the invention
A kind of Wiring board processing method plating thick through hole of the present invention, comprises the following steps:
1) normal drill, plating are completed in PCB surface；
2) last layer dry film is pasted in PCB surface；A kind of macromolecular compound of dry film, after ultraviolet irradiation
Polyreaction can be produced, form a kind of stable material and be attached to plate face, thus reach to stop plating and the function of etching；
3) with liquid medicine, the dry film needing the hole site of plating thickness is taken off, make hole expose；Developing agent can be used as taking off film liquid medicine, imitate
Fruit is more preferably；
4) hole internal layer is electroplated to desired thickness；
5) take off PCB surface dry film, PCB surface is polished；Abrasive belt grinding is used to be ground off by the copper in projecting plate face, with this
Different hole copper requirements is met in the case of reaching not change table copper.
The present invention uses brand-new process, well meets the requirement that copper facing thickness in through hole is big, simultaneously will not
Top layer copper thickness is produced any impact, and copper facing precision is high, and superior product quality, scrappage is low.
Above concrete structure and sized data are to be illustrated presently preferred embodiments of the present invention, but present invention wound
Making and be not limited to described embodiment, those of ordinary skill in the art it may also be made that kind on the premise of spirit of the present invention
The equivalent variations planted or replacement, deformation or the replacement of these equivalents are all contained in the application claim limited range.
Claims (3)
1. the Wiring board processing method plating thick through hole, it is characterised in that comprise the following steps:
1) normal drill, plating are completed in PCB surface；
2) last layer dry film is pasted in PCB surface；
3) with liquid medicine, the dry film needing the hole site of plating thickness is taken off, make hole expose；
4) hole internal layer is electroplated to desired thickness；
5) take off PCB surface dry film, PCB surface is polished.
2. the Wiring board processing method plating thick through hole, it is characterised in that step 3) liquid medicine is developing agent.
3. the Wiring board processing method plating thick through hole, it is characterised in that step 5) uses abrasive band to polish wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610766291.4A CN106304692A (en) | 2016-08-31 | 2016-08-31 | A kind of Wiring board processing method plating thick through hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610766291.4A CN106304692A (en) | 2016-08-31 | 2016-08-31 | A kind of Wiring board processing method plating thick through hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106304692A true CN106304692A (en) | 2017-01-04 |
Family
ID=57675526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610766291.4A Pending CN106304692A (en) | 2016-08-31 | 2016-08-31 | A kind of Wiring board processing method plating thick through hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106304692A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548302A (en) * | 2018-11-14 | 2019-03-29 | 深圳崇达多层线路板有限公司 | A kind of production method of the wiring board with thick copper hole |
| CN110582167A (en) * | 2019-10-23 | 2019-12-17 | 四会富仕电子科技股份有限公司 | Method for manufacturing strippable mesh copper foil |
| CN110785013A (en) * | 2019-10-18 | 2020-02-11 | 珠海崇达电路技术有限公司 | Manufacturing method for improving foaming and explosion of circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841972A (en) * | 2010-04-23 | 2010-09-22 | 汕头超声印制板公司 | Method for manufacturing high-AR and fine-line PCB |
| CN102883558A (en) * | 2012-10-17 | 2013-01-16 | 无锡江南计算技术研究所 | Manufacturing method of single plating hole copper |
| CN103731992A (en) * | 2013-12-27 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Method for reducing pits generated in gold-plated area of circuit board |
| CN103732011A (en) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Method for manufacturing blind holes of printed circuit board |
| CN104349587A (en) * | 2013-07-31 | 2015-02-11 | 北大方正集团有限公司 | Method for manufacturing printed circuit board and via thereof, and printed circuit board |
-
2016
- 2016-08-31 CN CN201610766291.4A patent/CN106304692A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841972A (en) * | 2010-04-23 | 2010-09-22 | 汕头超声印制板公司 | Method for manufacturing high-AR and fine-line PCB |
| CN102883558A (en) * | 2012-10-17 | 2013-01-16 | 无锡江南计算技术研究所 | Manufacturing method of single plating hole copper |
| CN104349587A (en) * | 2013-07-31 | 2015-02-11 | 北大方正集团有限公司 | Method for manufacturing printed circuit board and via thereof, and printed circuit board |
| CN103732011A (en) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Method for manufacturing blind holes of printed circuit board |
| CN103731992A (en) * | 2013-12-27 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Method for reducing pits generated in gold-plated area of circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548302A (en) * | 2018-11-14 | 2019-03-29 | 深圳崇达多层线路板有限公司 | A kind of production method of the wiring board with thick copper hole |
| CN110785013A (en) * | 2019-10-18 | 2020-02-11 | 珠海崇达电路技术有限公司 | Manufacturing method for improving foaming and explosion of circuit board |
| CN110582167A (en) * | 2019-10-23 | 2019-12-17 | 四会富仕电子科技股份有限公司 | Method for manufacturing strippable mesh copper foil |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101841972B (en) | Method for manufacturing high-AR and fine-line PCB | |
| CN105517374B (en) | A kind of production method of thin core plate HDI plate | |
| CN106304692A (en) | A kind of Wiring board processing method plating thick through hole | |
| TW200500500A (en) | Plating apparatus and plating method | |
| US20140304977A1 (en) | Fabrication process of stepped circuit board | |
| CN103687309A (en) | Production process for high-frequency circuit board | |
| CN101720167A (en) | Method for producing circuit board by filling resin in holes on inner core plate | |
| CN103945648A (en) | Production technology for high-frequency circuit board | |
| CN104582319A (en) | Metallized semi-hole forming method and printed circuit board manufacturing method | |
| CN107660069A (en) | A kind of PCB plate production method with half bore | |
| CN103917046A (en) | Circuit board comprising blind hole and manufacturing method of circuit board | |
| CN106358385A (en) | Printed circuit board processing method adopting etching process for forming backdrilled holes | |
| CN106455345A (en) | Method of machining burr-free hole of PCB copper-based core board | |
| WO2008111309A1 (en) | Recognition mark, and circuit substrate manufacturing method | |
| CN103823603A (en) | OGS touch screen and manufacturing method thereof | |
| CN111491447B (en) | Manufacturing method of radio frequency module switching PCB | |
| CN105170576B (en) | The cleaning method and its system of volume to volume polyimide film | |
| CN104582332B (en) | A kind of fine-line package substrate and preparation method thereof | |
| CN104735926B (en) | A kind of filling holes with resin method for circuit board | |
| CN107949148B (en) | Method for manufacturing high-frequency circuit board by using secondary pressing | |
| CN103823330A (en) | Manufacturing technology of glue homogenizing plate | |
| DE602005026057D1 (en) | RECYCLING OF PCB | |
| JP2012099768A (en) | Manufacturing method of wiring board | |
| CN103781291A (en) | Process for plugging holes in printed board by using resin | |
| KR101154145B1 (en) | Electro-formed master manufacturing method for flexible electronic circuit parts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |