CN107949148B - Method for manufacturing high-frequency circuit board by using secondary pressing - Google Patents
Method for manufacturing high-frequency circuit board by using secondary pressing Download PDFInfo
- Publication number
- CN107949148B CN107949148B CN201711006231.3A CN201711006231A CN107949148B CN 107949148 B CN107949148 B CN 107949148B CN 201711006231 A CN201711006231 A CN 201711006231A CN 107949148 B CN107949148 B CN 107949148B
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- Prior art keywords
- board
- pressing
- frequency
- circuit board
- frequency substrate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Abstract
The high-frequency circuit board is manufactured by adopting secondary pressing, the FR4 board is manufactured by primary pressing, the expansion and contraction value of the board is measured, and the expansion and contraction value of the high-frequency substrate during exposure is adjusted according to the expansion and contraction value so as to ensure the alignment accuracy when the FR4 board and the high-frequency substrate are mixed and pressed; in addition, before measuring the expansion and shrinkage value of the FR4 board, the FR4 board is drilled and resin is adopted for plugging holes, and meanwhile, before adjusting the expansion and shrinkage value of the high-frequency substrate, the high-frequency substrate is drilled and resin is adopted for plugging holes, so that the glue flow of a prepreg between the FR4 board and the high-frequency substrate is prevented during mixed compression, the uniformity of the thickness of a dielectric layer is ensured, and the yield of the high-frequency circuit board is further ensured.
Description
Technical Field
The invention relates to the field of manufacturing of high-frequency circuit boards, in particular to a method for manufacturing a high-frequency circuit board by adopting secondary pressing.
Background
The conventional high-frequency circuit board is prepared by laminating a high-frequency substrate and a common FR4 substrate so as to reduce the cost; at present, in order to reduce the production time, a high-frequency circuit board is prepared by a one-time pressing mode of a high-frequency substrate and a common FR4 substrate, but due to the fact that the high-frequency substrate and the common FR4 substrate have different expansion and shrinkage values, the expansion and shrinkage values of the two parts are difficult to control during one-time pressing, the product has layer deviation, and the yield is low.
Disclosure of Invention
The invention provides a method for manufacturing a high-frequency circuit board by adopting secondary pressing, which is beneficial to controlling the expansion and shrinkage value during mixed pressing and ensuring the thickness uniformity of a medium layer during pressing of the circuit board. The main content of the invention is as follows:
a method for manufacturing a high-frequency circuit board by using secondary pressing comprises the following steps:
step S1, manufacturing an FR4 board, and pressing the FR4 substrate, the FR4 prepreg and the metal foil once to manufacture an FR4 board;
step S2, drilling and copper plating are carried out on an FR4 board, a through hole of the FR4 board is processed and manufactured, and the through hole is plugged by resin;
step S3, measuring the pressing expansion and contraction value of the FR4 board;
step S4, processing the high-frequency substrate, and plugging the via holes on the high-frequency substrate with resin;
step S5, adjusting the expansion and contraction value of the high-frequency substrate during exposure according to the compression expansion and contraction value of the FR4 plate so as to ensure the alignment precision of the FR4 plate and the high-frequency substrate during compression;
in step S6, the FR4 board, the prepreg, and the high frequency substrate are sequentially laminated and bonded.
Preferably, after the resin is filled in the holes in the step S2 and the step 4, cleaning the resin remained on the FR4 board after the hole is filled so as to ensure that the FR4 board surface is clean.
Preferably, the resin remaining on the face of FR4 board is removed by belt sanding.
Preferably, in step 6, before the FR4 board, the prepreg, and the high-frequency substrate are sequentially laminated and bonded, the FR4 board and the high-frequency substrate are roughened.
Preferably, the roughening treatment is blackening or browning treatment.
Preferably, the pressing is performed in step S6 by using a voltage method.
Preferably, when voltage lamination is performed, a first release film and a first metal foil are provided on a surface of the FR4 board away from the high-frequency substrate, and a second release film and a second metal foil are provided on a surface of the high-frequency substrate away from the FR4 board; and the first metal foil is arranged between the first release film and the FR4 board, and the second metal foil is arranged between the second release film and the high-frequency substrate.
Preferably, step S7 is further included, in which solder masks are disposed on the upper and lower surfaces of the high-frequency circuit board after the press-fitting.
Preferably, the solder mask layer is solder mask ink.
Preferably, the metal foil is a copper foil.
The invention has the beneficial effects that: the high-frequency circuit board is manufactured by adopting secondary pressing, the FR4 board is manufactured by primary pressing, the expansion and contraction value of the board is measured, and the expansion and contraction value of the high-frequency substrate during exposure is adjusted according to the expansion and contraction value so as to ensure the alignment accuracy when the FR4 board and the high-frequency substrate are mixed and pressed; in addition, before measuring the expansion and shrinkage value of the FR4 board, the FR4 board is drilled and resin is adopted for plugging holes, and meanwhile, before adjusting the expansion and shrinkage value of the high-frequency substrate, the high-frequency substrate is drilled and resin is adopted for plugging holes, so that the glue flow of a prepreg between the FR4 board and the high-frequency substrate is prevented during mixed compression, the uniformity of the thickness of a dielectric layer is ensured, and the yield of the high-frequency circuit board is further ensured.
Detailed Description
The technical solution protected by the present invention is specifically described below with reference to specific embodiments.
The invention provides a method for manufacturing a high-frequency circuit board by adopting secondary pressing, which comprises the following steps:
a method for manufacturing a high-frequency circuit board by using secondary pressing comprises the following steps:
step S1, manufacturing an FR4 board, and pressing the FR4 substrate, the FR4 prepreg and the metal foil once to manufacture an FR4 board;
step S2, drilling and copper plating are carried out on an FR4 board, a through hole of the FR4 board is processed and manufactured, and the through hole is plugged by resin;
step S3, measuring the pressing expansion and contraction value of the FR4 board;
step S4, processing the high-frequency substrate, and plugging the via holes on the high-frequency substrate with resin;
step S5, adjusting the expansion and contraction value of the high-frequency substrate during exposure according to the compression expansion and contraction value of the FR4 plate so as to ensure the alignment precision of the FR4 plate and the high-frequency substrate during compression;
in step S6, the FR4 board, the prepreg, and the high frequency substrate are sequentially laminated and bonded.
In this embodiment, the metal foil is a copper foil.
In the step S2, resin is used for plugging the through holes on the FR4 board, and in the step S4, resin plugging is performed for the via holes on the high-frequency substrate, so that the glue flow of the prepreg between the FR-4 board and the high-frequency substrate during the secondary lamination can be prevented, and the uniformity of the thickness of the dielectric layer is ensured.
After the step S2 is completed, some resin for plugging holes may remain on the FR4 board surface, and in order to ensure that the board surface of the FR4 board is clean, the resin remaining on the FR4 board after plugging holes needs to be cleaned, in this embodiment, the resin remaining on the FR4 board surface is removed by using abrasive belt grinding; similarly, after step S4 is completed, the resin for via holes may remain on the high-frequency substrate, in this embodiment, the resin remaining on the surface of the high-frequency substrate may be removed by belt grinding,
in step 6, before the FR4 board, the prepreg, and the high-frequency substrate are sequentially laminated and bonded, the FR4 board and the high-frequency substrate are subjected to roughening treatment, which is blackening or browning treatment in this embodiment.
In this embodiment, in step S6, a voltage mode is used to realize the second pressing, and the FR4 board and the high-frequency substrate are pressed in a mixed manner; when the FR4 board is pressed in a voltage mode, a first release film and a first metal foil are arranged on the surface of the FR4 board far away from the high-frequency substrate, and a second release film and a second metal foil are arranged on the surface of the high-frequency substrate far away from the FR4 board; and the first metal foil is arranged between the first release film and the FR4 board, and the second metal foil is arranged between the second release film and the high-frequency substrate.
And finally, after the pressing, arranging solder mask layers on the upper surface and the lower surface of the high-frequency circuit board, wherein the solder mask layers are made of solder mask ink in the embodiment.
The high-frequency circuit board is manufactured by adopting secondary pressing, the FR4 board is manufactured by primary pressing, the expansion and contraction value of the board is measured, and the expansion and contraction value of the high-frequency substrate during exposure is adjusted according to the expansion and contraction value so as to ensure the alignment accuracy when the FR4 board and the high-frequency substrate are mixed and pressed; in addition, before measuring the expansion and shrinkage value of the FR4 board, the FR4 board is drilled and resin is adopted for plugging holes, and meanwhile, before adjusting the expansion and shrinkage value of the high-frequency substrate, the high-frequency substrate is drilled and resin is adopted for plugging holes, so that the glue flow of a prepreg between the FR4 board and the high-frequency substrate is prevented during mixed compression, the uniformity of the thickness of a dielectric layer is ensured, and the yield of the high-frequency circuit board is further ensured.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. A method for manufacturing a high-frequency circuit board by using secondary pressing is characterized by comprising the following steps:
step S1, manufacturing an FR4 board, and pressing the FR4 substrate, the FR4 prepreg and the metal foil once to manufacture an FR4 board;
step S2, drilling and copper plating are carried out on an FR4 board, a through hole of the FR4 board is processed and manufactured, and the through hole is plugged by resin;
step S3, measuring the pressing expansion and contraction value of the FR4 board;
step S4, processing the high-frequency substrate, and plugging the via holes on the high-frequency substrate with resin;
step S5, adjusting the expansion and contraction value of the high-frequency substrate during exposure according to the compression expansion and contraction value of the FR4 plate so as to ensure the alignment precision of the FR4 plate and the high-frequency substrate during compression;
step S6, laminating and pressing the FR4 board, the prepreg and the high-frequency substrate in sequence;
pressing in a voltage mode in the step S6; when voltage pressing is carried out, a first release film and a first metal foil are arranged on the surface of the FR4 board far away from the high-frequency substrate, and a second release film and a second metal foil are arranged on the surface of the high-frequency substrate far away from the FR4 board; and the first metal foil is arranged between the first release film and the FR4 board, and the second metal foil is arranged between the second release film and the high-frequency substrate.
2. The method for manufacturing a high-frequency circuit board by using double pressing as claimed in claim 1, wherein the step S2 and the step S4 further comprise, after the resin hole plugging, cleaning the resin remained on the FR4 board after the hole plugging so as to ensure that the surface of the FR4 board is clean.
3. The method for manufacturing a high-frequency circuit board by using double pressing according to claim 2, wherein the resin remained on the surface of FR4 board is removed by belt sanding.
4. The method for manufacturing a high-frequency circuit board by using two-step pressing as claimed in claim 1, wherein in step 6, the FR4 board and the high-frequency substrate are roughened before the FR4 board, the prepreg and the high-frequency substrate are sequentially laminated and pressed.
5. The method for manufacturing a high-frequency circuit board by using secondary pressing according to claim 4, wherein the roughening treatment is blackening or browning treatment.
6. The method for manufacturing a high-frequency circuit board by using two-step pressing as claimed in claim 1, further comprising step S7 of disposing solder masks on the upper and lower surfaces of the high-frequency circuit board after pressing.
7. The method for manufacturing a high-frequency circuit board by using double pressing as claimed in claim 6, wherein said solder mask layer is solder mask ink.
8. The method for manufacturing a high-frequency circuit board by using double pressing according to any one of claims 1 to 7, wherein the metal foil is a copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711006231.3A CN107949148B (en) | 2017-10-25 | 2017-10-25 | Method for manufacturing high-frequency circuit board by using secondary pressing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711006231.3A CN107949148B (en) | 2017-10-25 | 2017-10-25 | Method for manufacturing high-frequency circuit board by using secondary pressing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107949148A CN107949148A (en) | 2018-04-20 |
| CN107949148B true CN107949148B (en) | 2020-05-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711006231.3A Active CN107949148B (en) | 2017-10-25 | 2017-10-25 | Method for manufacturing high-frequency circuit board by using secondary pressing |
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| CN (1) | CN107949148B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108668470B (en) * | 2018-06-25 | 2019-12-24 | 广州兴森快捷电路科技有限公司 | Processing method, processing system, computer storage medium and equipment of mixed pressing plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4201616A (en) * | 1978-06-23 | 1980-05-06 | International Business Machines Corporation | Dimensionally stable laminated printed circuit cores or boards and method of fabricating same |
| CN104470265A (en) * | 2014-11-19 | 2015-03-25 | 广州兴森快捷电路科技有限公司 | Manufacturing method of multi-layer circuit board |
| CN105307428A (en) * | 2015-11-24 | 2016-02-03 | 悦虎电路(苏州)有限公司 | Method for manufacturing a hybrid PCB |
-
2017
- 2017-10-25 CN CN201711006231.3A patent/CN107949148B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4201616A (en) * | 1978-06-23 | 1980-05-06 | International Business Machines Corporation | Dimensionally stable laminated printed circuit cores or boards and method of fabricating same |
| CN104470265A (en) * | 2014-11-19 | 2015-03-25 | 广州兴森快捷电路科技有限公司 | Manufacturing method of multi-layer circuit board |
| CN105307428A (en) * | 2015-11-24 | 2016-02-03 | 悦虎电路(苏州)有限公司 | Method for manufacturing a hybrid PCB |
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| Publication number | Publication date |
|---|---|
| CN107949148A (en) | 2018-04-20 |
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