CN108668470B - Processing method, processing system, computer storage medium and equipment of mixed pressing plate - Google Patents
Processing method, processing system, computer storage medium and equipment of mixed pressing plate Download PDFInfo
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- CN108668470B CN108668470B CN201810661336.0A CN201810661336A CN108668470B CN 108668470 B CN108668470 B CN 108668470B CN 201810661336 A CN201810661336 A CN 201810661336A CN 108668470 B CN108668470 B CN 108668470B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention relates to a processing method, a processing system, a computer storage medium and equipment of a hybrid board. The processing method comprises the following steps: acquiring first preset processing data; acquiring first preset expansion and contraction data; acquiring second preset processing data; acquiring second preset expansion and contraction data; processing the data according to a first preset requirement to obtain first processing data; and processing the mixed pressing plate based on the first processing data. The processing system, computer storage media, and devices provide a hardware or software foundation for implementing the processing methods. The first preset expansion and contraction data of the high-frequency plate and the second preset expansion and contraction data of the common plate are obtained respectively, the first preset machining data and the second preset machining data are processed based on the first preset requirements, so that the first machining data are obtained, the first machining data are processed based on the first machining data, the mixed pressing plate is obtained, the problem that different laminated plates are poor in quality or scrapped due to inconsistent expansion and contraction is solved, and production cost is reduced.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a processing method and a processing system of a mixed pressing plate, a computer storage medium and equipment.
Background
A pcb (printed Circuit board), which is generally called a wiring board, also called a printed wiring board or a printed Circuit board, is a support for electronic components and a carrier for electrical connection of electronic components. With the continuous development of the electronic industry, especially the increasing development of wireless network and satellite communication, information products are developing towards high speed and high frequency, communication products are developing towards wireless transmission with large capacity and high speed, and the high frequency board meets the development requirement and is rapidly developed. The high-frequency board is high in manufacturing cost, and in order to meet the requirements of controlling the production cost and meeting the functional requirements, the high-frequency board and a common board such as a glass fiber epoxy resin copper-clad plate (commonly known as an FR-4 board in the industry) are mixed and pressed, so that the mixed and pressed board which is relatively low in manufacturing cost and meets the use requirements is manufactured. Here, the high frequency plate and the general plate are specific concepts to those skilled in the art, and the high frequency plate refers to a plate material capable of satisfying frequencies of 1G to 5G; while a general board (e.g., FR-4 board) refers to a board material that can only satisfy general frequencies, and will not be described herein.
The processing process of the circuit board involves more processes, and different processes may cause different expansions or contractions of the laminates of the circuit board, which may cause inconsistency with expected requirements due to inconsistent expansions and contractions among the different laminates after lamination, thereby causing inconsistency between products and actual products after further processing in the later stage, such as drilling, resulting in the failure of the circuit board to realize the established functions, and the generation of defective products or scrapping.
Disclosure of Invention
Based on this, there is a need for a hybrid board processing method, a hybrid board processing system, a computer storage medium, and an apparatus. The processing method of the mixed pressing plate can avoid defective products or scrapping caused by uneven expansion and shrinkage of different laminated plates in the processing process, and reduce the production cost; the processing system, computer storage medium and equipment are used for providing a hardware basis or a software basis for realizing the processing method of the hybrid board.
The technical scheme is as follows:
on one hand, the processing method of the mixed compression plate comprises the following steps:
acquiring first preset processing data of a high-frequency plate;
analyzing the first preset processing data and acquiring first preset expansion and contraction data;
acquiring second preset processing data of the common plate;
analyzing the second preset processing data and acquiring second preset expansion and contraction data;
processing the first preset processing data, the first preset expansion and contraction data, the second preset processing data and the second preset expansion and contraction data according to a first preset requirement to obtain first processing data;
and processing the mixed pressing plate based on the first processing data.
According to the processing method of the mixed pressing plate, the first preset expansion and contraction data of the high-frequency plate and the second preset expansion and contraction data of the common plate are obtained respectively, the first processing data are obtained by processing based on the first preset requirement, the first preset processing data and the second preset processing data, and then the mixed pressing plate is obtained by processing based on the first processing data, so that the problem of defective products or scrapping of different laminated plates due to inconsistent expansion and contraction is avoided, and the production cost is reduced.
The technical solution is further explained below:
in one embodiment, the step of analyzing the first preset machining data and acquiring the first preset harmomegathus data includes:
acquiring first grinding plate expansion and contraction data of a high-frequency plate;
acquiring first-layer compression data of a high-frequency plate;
processing the first grinding plate expansion and contraction data and the first layer of compression and expansion and contraction data according to a second preset requirement to obtain first preset expansion and contraction data;
or the steps of analyzing the second preset processing data and acquiring the second preset expansion and contraction data further comprise:
acquiring second grinding plate expansion and contraction data of a common plate;
acquiring second lamination harmomegathus data of the common plate;
and processing the second grinding plate expansion and contraction data and the second lamination expansion and contraction data according to a third preset requirement to obtain second preset expansion and contraction data.
In one embodiment, the step of processing the first preset machining data, the first preset expansion and contraction data, the second preset machining data and the second preset expansion and contraction data according to the first preset requirement to obtain the first machining data includes:
processing the first preset processing data and the first preset expansion and contraction data according to a fourth preset requirement to obtain high-frequency processing data;
processing the second preset processing data and the second preset expansion and contraction data according to a fifth preset requirement to obtain common processing data;
and processing the high-frequency machining data and the common machining data according to a sixth preset requirement to obtain first machining data.
In one embodiment, the step of processing the first preset machining data, the first preset expansion and contraction data, the second preset machining data and the second preset expansion and contraction data according to the first preset requirement to obtain the first machining data includes:
acquiring first preset compensation data based on the first preset expansion and contraction data;
acquiring second preset compensation data based on the second preset expansion and contraction data;
acquiring preset drilling data for drilling the mixed pressing plate;
processing the preset drilling data according to a seventh preset requirement and based on the first preset compensation data and the second preset compensation data, and forming actual drilling data;
and processing the first preset machining data, the second preset machining data and the actual drilling data according to an eighth preset requirement to obtain first machining data.
In one embodiment, the step of analyzing the first preset machining data and acquiring the first preset harmomegathus data includes: calling first preset expansion and contraction data corresponding to the first preset processing data from a first preset database;
or the steps of analyzing the second preset processing data and acquiring the second preset expansion and contraction data comprise: and calling second preset expansion and contraction data corresponding to the second preset processing data from a second preset database.
In one embodiment, the step of analyzing the first preset machining data and obtaining the first preset harmomegathus data further includes: acquiring first hole machining data of the high-frequency plate, and if the first hole machining data exist, performing analysis on first preset machining data and acquiring first preset expansion and contraction data; otherwise, entering a step of acquiring second preset processing data of the common plate;
or the steps of analyzing the second preset processing data and obtaining the second preset expansion and contraction data further comprise: acquiring second hole machining data of the common plate, and if the second hole machining data exists, performing analysis on second preset machining data and acquiring second preset expansion and contraction data; otherwise, processing the first preset processing data, the first preset expansion and contraction data, the second preset processing data and the second preset expansion and contraction data according to the first preset requirement to obtain the first processing data.
On the other hand, the processing system of the mixed pressing plate comprises an acquisition module, a processing module and a processing module, wherein the acquisition module is used for acquiring first preset processing data and first preset expansion and contraction data of a high-frequency plate, and the acquisition module is also used for acquiring second preset processing data and second preset expansion and contraction data of a common plate; the analysis module is used for analyzing the first preset processing data and the second preset processing data; and the processing module is used for processing the first preset processing data, the first preset expansion and contraction data, the second preset processing data and the second preset expansion and contraction data.
Above-mentioned system of processing of mixing and pressing board through the setting that acquires module, analysis module and processing module for realize avoiding in the course of working defective products or scrapping problem that different plywoods caused because of the harmomegathus is inhomogeneous, and reduction in production cost's technological effect.
The technical solution is further explained below:
in one embodiment, the system further includes a retrieving module, where the retrieving module is configured to retrieve first preset expansion and contraction data corresponding to the first preset processing data from a first preset database, and retrieve second preset expansion and contraction data corresponding to the second preset processing data from a second preset database.
In addition, a computer storage medium is provided, on which a computer program is stored, and the computer program is executed by a processor to implement the method for processing a hybrid board according to any one of the above-mentioned technical solutions.
The computer storage medium is used for achieving the technical effects of avoiding the problem of defective products or scrapping caused by uneven expansion and contraction of different laminated plates in the machining process and reducing the production cost.
In addition, a computer device is provided, which includes a memory, a processor and a computer program stored in the memory and capable of running on the processor, and when the processor executes the program, the method for processing the hybrid board according to any one of the above technical solutions is implemented.
The computer equipment is used for achieving the technical effects of avoiding the problem of defective products or scrapping caused by uneven expansion and contraction of different laminated plates in the machining process and reducing the production cost.
Drawings
Fig. 1 is a flowchart of a processing method of a mixing plate according to an embodiment.
Detailed Description
Embodiments of the present invention are described in detail below with reference to the accompanying drawings:
it will be understood that when an element is referred to herein as being "secured" to another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the embodiment shown in fig. 1, a method for processing a hybrid board is provided, which includes the following steps:
acquiring first preset processing data of a high-frequency plate;
analyzing the first preset processing data and acquiring first preset expansion and contraction data;
acquiring second preset processing data of the common plate;
analyzing the second preset processing data and acquiring second preset expansion and contraction data;
processing the first preset processing data, the first preset expansion and contraction data, the second preset processing data and the second preset expansion and contraction data according to a first preset requirement to obtain first processing data;
and processing the mixed pressing plate based on the first processing data.
The first preset expansion and contraction data of the high-frequency plate and the second preset expansion and contraction data of the common plate are obtained respectively, the first preset machining data and the second preset machining data are processed based on the first preset requirements, so that the first machining data are obtained, the first machining data are processed based on the first machining data, the mixed pressing plate is obtained, the problem that different laminated plates are poor in quality or scrapped due to inconsistent expansion and contraction is solved, and production cost is reduced.
It should be noted that, the first preset machining data herein includes preset plate length data and preset plate width data of the high-frequency plate; the second preset processing data comprises preset plate length data and preset plate width data of the common plate; the first processing data includes actual processing data for the high frequency plate and actual processing data for the normal plate, which are formed after the processing. And after the first processing data are obtained, processing is carried out based on the first processing data, and the mixed pressing plate is obtained.
According to the requirement, the mixed pressing plate is usually formed by mixed pressing of a high-frequency plate and a common plate (such as an FR-4 plate), the high-frequency plate is usually processed with a blind hole structure or a through hole structure, the blind hole structure or the through hole structure is usually required to be electroplated after drilling is completed so as to finally become a hole structure meeting the functional requirement, a dry film pasting operation is usually required during electroplating, a window is subsequently opened at the corresponding hole structure position so as to carry out electroplating operation, the window opening size is usually larger than the hole size of the hole structure during windowing, so that the outer edge position of the hole structure after electroplating is also electroplated, namely the high-frequency plate position of the hole structure position is thickened, in order to avoid the influence of the bulge at the position on lamination and on the processing of a circuit board during subsequent lamination, the plate grinding processing is usually required, namely, the electroplating layer position of the bulge is ground according to the requirement. However, the precision of the plate grinding cannot be accurately controlled during plate grinding, and the expansion and shrinkage of the laminated plate caused by stress cannot be avoided during the plate grinding process, for example, when the thickness of a common plate or a high-frequency plate is smaller, the larger expansion and shrinkage deformation of the plate can be caused during plate grinding; similarly, if a common board is provided with blind holes or through holes, new expansion and contraction deformation can be caused, and the expansion and contraction deformation of the common board and the high-frequency board has difference, which can also cause a series of problems such as mismatch, deviation and the like of the positions of the circuit patterns between the layers after lamination.
In this embodiment, the harmomegathus data of the high-frequency plate and the common plate are respectively obtained to further process (for example, perform harmomegathus compensation) the high-frequency plate and the common plate according to a first preset requirement, so as to obtain first processing data, and then the first processing data after compensation processing is used for processing, so as to obtain a mixed pressing plate.
The hybrid board may be a finished circuit board as needed, or may be a semi-finished board that is prepared to enter a next process after a certain process is completed.
In addition, the expansion and contraction data may be data of expansion condition or data of contraction condition, and needs to be determined according to factors such as specific conditions of the high-frequency board or the common board, processing conditions, and the like, and is not fixed, and is not described herein again.
Further, the step of analyzing the first preset processing data and acquiring the first preset harmomegathus data includes:
acquiring first grinding plate expansion and contraction data of a high-frequency plate;
acquiring first-layer compression data of a high-frequency plate;
processing the first grinding plate expansion and contraction data and the first layer of compression and expansion and contraction data according to a second preset requirement to obtain first preset expansion and contraction data;
or the steps of analyzing the second preset processing data and acquiring the second preset expansion and contraction data further comprise:
acquiring second grinding plate expansion and contraction data of a common plate;
acquiring second lamination harmomegathus data of the common plate;
and processing the second grinding plate expansion and contraction data and the second lamination expansion and contraction data according to a third preset requirement to obtain second preset expansion and contraction data.
The influence of the expansion and contraction caused by grinding the plate and the expansion and contraction caused by lamination on the whole expansion and contraction accounts for a certain proportion, so that grinding plate expansion and contraction data and lamination expansion and contraction data corresponding to the high-frequency plate and the common plate are respectively obtained and processed to obtain corresponding preset expansion and contraction data.
It should be noted that the expansion and contraction value generated by the grinding plate is related to the plate material, thickness, grinding plate condition and other factors; the expansion and shrinkage value generated by lamination is related to factors such as a laminated structure, residual copper rate, laminate thickness and the like;
meanwhile, the grinding plate mentioned in the application refers to all process flows needing the grinding plate, such as the process flows of the plate grinding operation of the electroplating hole according to the needs; and (3) carrying out a plate grinding operation flow according to the requirement by the resin hole plugging process.
Further, the step of processing the first preset machining data, the first preset expansion and contraction data, the second preset machining data and the second preset expansion and contraction data according to the first preset requirement and obtaining the first machining data includes:
processing the first preset processing data and the first preset expansion and contraction data according to a fourth preset requirement to obtain high-frequency processing data;
processing the second preset processing data and the second preset expansion and contraction data according to a fifth preset requirement to obtain common processing data;
and processing the high-frequency machining data and the common machining data according to a sixth preset requirement to obtain first machining data.
According to the requirement, a person skilled in the art can process the first preset processing data and the first preset expansion and contraction data of the high-frequency plate to obtain high-frequency processing data, and then the high-frequency processing data and the first preset expansion and contraction data are used as data for subsequent high-frequency plate processing, and then the first preset processing data and the first preset expansion and contraction data of the common plate are processed to obtain common processing data, and the common processing data are used as data for subsequent common plate processing, and then the corresponding data are respectively called for processing the high-frequency plate and the common plate during processing, so that the influence of expansion and contraction on the processing is avoided.
Of course, those skilled in the art may further process the high-frequency machining data and the normal machining data as needed to obtain machining data usable in the overall processing or to form first machining data as a data basis for subsequent machining.
Further, the step of processing the first preset machining data, the first preset expansion and contraction data, the second preset machining data and the second preset expansion and contraction data according to the first preset requirement and obtaining the first machining data includes:
acquiring first preset compensation data based on the first preset expansion and contraction data;
acquiring second preset compensation data based on the second preset expansion and contraction data;
acquiring preset drilling data for drilling the mixed pressing plate;
processing the preset drilling data according to a seventh preset requirement and based on the first preset compensation data and the second preset compensation data, and forming actual drilling data;
and processing the first preset machining data, the second preset machining data and the actual drilling data according to an eighth preset requirement to obtain first machining data.
The first preset compensation data, the second preset compensation data and the preset drilling data are processed as required, and the compensated actual drilling data are obtained, so that subsequent drilling processing is carried out based on the data; the actual drilling data, the first preset processing data and the second preset processing data form first processing data together, after the first processing data are obtained, the operations such as drilling, grinding and laminating of the flitch are carried out based on the first processing data, and the mixed pressing plate is finally processed.
It should be noted that: the board grinding operation affects the processing precision, causes dislocation between different laminates of the mixed pressing board, and causes dislocation between through holes or blind holes on the same layer or different layers or wiring dislocation, thereby affecting the realization of a series of functions such as circuit conduction, plug-in communication and the like.
In addition, the actual drilling data can be a separate drilling strip file, and can also be other databases or other files arranged according to needs.
Further, the step of analyzing the first preset processing data and acquiring the first preset harmomegathus data includes: calling first preset expansion and contraction data corresponding to the first preset processing data from a first preset database; or the steps of analyzing the second preset processing data and acquiring the second preset expansion and contraction data comprise: and calling second preset expansion and contraction data corresponding to the second preset processing data from a second preset database.
It should be noted that, whether to acquire the first preset expansion and contraction data or the second preset expansion and contraction data may be selected as needed. If the effect of expansion and contraction of a common plate is considered to be small in a specific certain process, only the first preset expansion and contraction data can be acquired, and the process can be performed without considering the second preset expansion and contraction data, that is, the operation steps of the second preset expansion and contraction data are omitted.
In addition, the first preset database can be established according to different plate materials, sizes, plate grinding conditions, laminated structures, residual copper rate, plate thickness and other conditions of the high-frequency plate; the establishment of the second preset database is the same, and is not described herein again.
Further, the step of analyzing the first preset machining data and obtaining the first preset harmomegathus data further includes: acquiring first hole machining data of the high-frequency plate, and if the first hole machining data exist, performing analysis on first preset machining data and acquiring first preset expansion and contraction data; otherwise, entering a step of acquiring second preset processing data of the common plate; or the steps of analyzing the second preset processing data and obtaining the second preset expansion and contraction data further comprise: acquiring second hole machining data of the common plate, and if the second hole machining data exists, performing analysis on second preset machining data and acquiring second preset expansion and contraction data; otherwise, processing the first preset processing data, the first preset expansion and contraction data, the second preset processing data and the second preset expansion and contraction data according to the first preset requirement to obtain the first processing data.
This embodiment refers to the situation where the wear plate impact is greater than usual: respectively judging whether the high-frequency plate and the common plate need to be subjected to hole machining (namely whether hole machining data exist), if the high-frequency plate and the common plate need to be subjected to hole drilling machining (namely the subsequent plate grinding inevitably causes the expansion and shrinkage problem), acquiring corresponding preset expansion and shrinkage data, and further adopting compensation data such as compensation and the like to solve the problem; if hole machining is not needed (namely, hole machining data do not exist), the step is directly skipped to enter the next step, so that the processing efficiency is improved, and the machining quality of the mixed pressing plate is further improved.
In one embodiment, the composite board comprises a laminated high-frequency board and a normal board (FR-4 board), wherein the high-frequency board comprises a board grinding process, and the normal board does not comprise the board grinding process. If the expansion data of the high-frequency plate caused by plate grinding is plate length direction a1 and plate width direction b 1; the shrinkage data in press fitting are a plate length direction c1 and a plate width direction d 1; when the contraction data of the common board is in the board length direction c2 and the board width direction d2, the compensation data of the high-frequency board can be set as c1-a1 and d1-b1 according to requirements, and the expansion and contraction data of the circuit pattern layer (or the copper foil layer) is automatically extracted by an LDI (laser direct imaging) exposure machine for further compensation processing; the compensation data of the circuit pattern layer (or copper foil layer) of the common board is the board length direction c2 and the board width direction d 2.
What needs to be explained above is: except for the content that the sequence steps exist in the specific description, the sequence steps in this embodiment have no strict execution sequence, and those skilled in the art can make appropriate adjustments as needed to meet specific requirements, so as to achieve the purpose claimed in this application of avoiding the problem of defective products or scrap caused by uneven expansion and shrinkage in the mixed compression plate processing, for example, in the embodiment shown in fig. 1, there is no step of obtaining second preset expansion and shrinkage data of a common plate;
in addition, a person skilled in the art may set specific first preset requirements, second preset requirements, third preset requirements, fourth preset requirements, fifth preset requirements, sixth preset requirements, seventh preset requirements, and eighth preset requirements as needed to perform specific processing on data so as to meet specific processing requirements, such as requirements of different processing accuracies, which are not described herein in detail.
The processing system comprises an acquisition module, a processing module and a processing module, wherein the acquisition module is used for acquiring first preset processing data and first preset expansion and contraction data of a high-frequency plate, and the acquisition module is also used for acquiring second preset processing data and second preset expansion and contraction data of a common plate; the analysis module is used for analyzing the first preset processing data and the second preset processing data; and the processing module is used for processing the first preset processing data, the first preset expansion and contraction data, the second preset processing data and the second preset expansion and contraction data.
Through the setting of acquisition module, analysis module and processing module for realize avoiding the defective products or the scrapping problem that different plywoods caused because of the harmomegathus is inhomogeneous in the course of working, and reduction in production cost's technological effect.
The system further comprises a calling module, wherein the calling module is used for calling first preset expansion and contraction data corresponding to the first preset processing data from a first preset database and calling second preset expansion and contraction data corresponding to the second preset processing data from a second preset database.
It should be noted that, a person skilled in the art may add modules required for processing the hybrid board as needed to meet actual processing requirements.
In addition, a computer storage medium is provided, on which a computer program is stored, which when executed by a processor implements the processing method of the hybrid board as described in any one of the above embodiments.
The computer storage medium is used for achieving the technical effects of avoiding the problem of defective products or scrapping caused by uneven expansion and contraction of different laminated plates in the machining process and reducing the production cost.
In addition, a computer device is provided, which includes a memory, a processor and a computer program stored in the memory and capable of running on the processor, and when the processor executes the program, the processing method of the hybrid board according to any one of the above embodiments is implemented.
The computer equipment is used for achieving the technical effects of avoiding the problem of defective products or scrapping caused by uneven expansion and contraction of different laminated plates in the machining process and reducing the production cost.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The processing method of the mixed compression plate is characterized by comprising the following steps of:
acquiring first preset processing data of a high-frequency plate;
analyzing the first preset processing data and acquiring first preset expansion and contraction data;
acquiring second preset processing data of the common plate;
analyzing the second preset processing data and acquiring second preset expansion and contraction data;
processing the first preset processing data, the first preset expansion and contraction data, the second preset processing data and the second preset expansion and contraction data according to a first preset requirement to obtain first processing data;
and processing the mixed pressing plate based on the first processing data.
2. The method as claimed in claim 1, wherein the step of analyzing the first preset processing data and obtaining the first preset expansion and contraction data comprises:
acquiring first grinding plate expansion and contraction data of the high-frequency plate;
acquiring first-layer compression and expansion data of the high-frequency plate;
processing the first grinding plate expansion and contraction data and the first layer of compression and expansion and contraction data according to a second preset requirement to obtain first preset expansion and contraction data;
or the steps of analyzing the second preset processing data and acquiring the second preset expansion and contraction data further comprise:
acquiring second grinding plate expansion and contraction data of the common plate;
acquiring second lamination harmomegathus data of the common plate;
and processing the second grinding plate expansion and contraction data and the second lamination expansion and contraction data according to a third preset requirement to obtain second preset expansion and contraction data.
3. The method as claimed in claim 1, wherein the step of processing the first preset processing data, the first preset expansion and contraction data, the second preset processing data and the second preset expansion and contraction data according to a first preset requirement and obtaining the first processing data comprises:
processing the first preset machining data and the first preset expansion and contraction data according to a fourth preset requirement to obtain high-frequency machining data;
processing the second preset machining data and the second preset expansion and contraction data according to a fifth preset requirement to obtain common machining data;
and processing the high-frequency machining data and the common machining data according to a sixth preset requirement to obtain the first machining data.
4. The method as claimed in claim 1, wherein the step of processing the first preset processing data, the first preset expansion and contraction data, the second preset processing data and the second preset expansion and contraction data according to a first preset requirement and obtaining the first processing data comprises:
acquiring first preset compensation data based on the first preset expansion and contraction data;
acquiring second preset compensation data based on the second preset expansion and contraction data;
acquiring preset drilling data for drilling the mixed pressing plate;
processing the preset drilling data according to a seventh preset requirement and based on the first preset compensation data and the second preset compensation data, and forming actual drilling data;
and processing the first preset machining data, the second preset machining data and the actual drilling data according to an eighth preset requirement to obtain the first machining data.
5. The method as claimed in claim 1, wherein the step of analyzing the first preset processing data and obtaining the first preset expansion and contraction data comprises: calling the first preset expansion and contraction data corresponding to the first preset processing data from a first preset database;
or the step of analyzing the second preset processing data and acquiring the second preset expansion and contraction data comprises the following steps: and calling the second preset expansion and contraction data corresponding to the second preset processing data from a second preset database.
6. The method as claimed in claim 1, wherein the step of analyzing the first preset processing data and obtaining the first preset expansion and contraction data further comprises: acquiring first hole machining data of the high-frequency plate, and if the first hole machining data exist, performing analysis on the first preset machining data and acquiring first preset expansion and contraction data; otherwise, entering a step of acquiring the second preset processing data of the common plate;
or the steps of analyzing the second preset processing data and acquiring the second preset expansion and contraction data further comprise: acquiring second hole machining data of the common plate, and if the second hole machining data exist, performing analysis on second preset machining data and acquiring second preset expansion and contraction data; otherwise, processing the first preset processing data, the first preset expansion and contraction data, the second preset processing data and the second preset expansion and contraction data according to the first preset requirement, and obtaining the first processing data.
7. A system for processing a composite platen, comprising:
the system comprises an acquisition module, a processing module and a processing module, wherein the acquisition module is used for acquiring first preset processing data and first preset expansion and contraction data of a high-frequency plate, and the acquisition module is also used for acquiring second preset processing data and second preset expansion and contraction data of a common plate;
an analysis module for analyzing the first preset processing data and the second preset processing data; and
and the processing module is used for processing the first preset processing data, the first preset expansion and contraction data, the second preset processing data and the second preset expansion and contraction data.
8. The system for processing composite boards according to claim 7, further comprising a retrieving module for retrieving the first preset expansion and contraction data corresponding to the first preset processing data from a first preset database and retrieving the second preset expansion and contraction data corresponding to the second preset processing data from a second preset database.
9. A computer storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the method of processing a hybrid board according to any one of claims 1 to 6.
10. A computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor executes the program to implement the method of processing a hybrid board according to any one of claims 1 to 6.
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| CN112750050B (en) * | 2020-12-30 | 2024-09-10 | 广州兴森快捷电路科技有限公司 | Processing method, processing device, processing equipment and storage medium |
| CN114980511B (en) * | 2021-02-19 | 2023-05-12 | 珠海方正科技高密电子有限公司 | Circuit board manufacturing method and circuit board |
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