CN103823330A - Manufacturing technology of glue homogenizing plate - Google Patents

Manufacturing technology of glue homogenizing plate Download PDF

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Publication number
CN103823330A
CN103823330A CN201410052503.3A CN201410052503A CN103823330A CN 103823330 A CN103823330 A CN 103823330A CN 201410052503 A CN201410052503 A CN 201410052503A CN 103823330 A CN103823330 A CN 103823330A
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China
Prior art keywords
glass substrate
hectograph
polishing
film
glue
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CN201410052503.3A
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CN103823330B (en
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石孟阳
熊波
庄奎乾
谢庆丰
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KELEAD PHOTOELECTRIC MATERIALS CO Ltd SHENZHEN
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KELEAD PHOTOELECTRIC MATERIALS CO Ltd SHENZHEN
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  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

A manufacturing technology of a glue homogenizing plate comprising the following steps: (1) polishing: preparing a glass substrate with a corresponding size according to the size of the glue homogenizing plate to be produced, subjecting the glass substrate to a polishing treatment, wherein the polishing treatment comprises a coarse polishing treatment and a fine polishing treatment; (2) washing: arranging a support to support the polished glass substrate in the water tank of a washing machine, arranging an air knife in the second section to dry the glass substrate; (3) film coating: first electroplating a layer of nitrided metal film on the glass substrate, then electroplating a layer of nitrided metal film and a layer of oxidized metal film; (4) glue coating: painting a layer of photoresist on the film of the glass substrate, wherein the photoresist is dropwise added when the glass substrate rotates at the same time, and a static dropwise adding technology is adopted; (5) film hardening: after the glue coating process, the glass substrate firstly is horizontally placed, and then vertically placed so as to harden the film. Through improvements on technological parameters in each process, the manufacturing technology can produce large-sized glue homogenizing plate with abnormal sizes on the basis of manufacture equipment which is used for manufacturing conventional glue homogenizing plates with normal sizes, and moreover the production cost is largely reduced.

Description

Even hectograph manufacturing process
Technical field
The present invention relates to the manufacture of even hectograph, particularly relate to the manufacturing process of the even hectograph of large scale.
Background technology
Even hectograph is a kind of hard surface photomask base version; there is the features such as high luminous sensitivity, high resolving power, fabricating low-defect-density, good, the easy to clean processing of wearing quality, long service life; being widely used in the making of the product mask such as IC, LCD, PCB, PDP, is the main flow photosensitive material that current and following microfabrication photomask is made.
Even hectograph has several stock sizes, as 450mm*550mm, 406.4mm*457.2mm etc., correspondingly the production equipment of even hectograph is also equipped with mutually according to its stock size, in the time need to making the even hectograph of Commonly Used Size, need to change existing production equipment or manufacture in addition the equipment matching, the former can affect to the stability of this manufacturing process, latter can significantly increase production cost, in addition, for the production of large-sized even hectograph, can there is series of problems with existing equipment and technological standards, as buffing machine swing arm scope exceeds, burnishing powder vestige can't is washed off clearly, the little inertia of spin coater power is excessive etc.
Summary of the invention
In view of this, provide a kind of even hectograph manufacturing process, be applicable to the manufacturing of unconventional large-sized even hectograph.
A kind of even hectograph manufacturing process, comprises the following steps: polishing, and provide the even hectograph that will produce the glass substrate of corresponding size is provided and carries out polishing, described polishing comprises twice polishing of rough polishing and essence throwing; Clean, when cleaning, in the water tank of cleaning machine, increase bracing frame and support the glass substrate after polishing, and air knife is arranged to second segment glass substrate is dried up; Plated film, first plates one deck metal nitride film on the glass substrate after cleaning, and then plating one deck metal nitride film and one deck oxidized metal film; Gluing is coated with one deck photoresist on the film of glass substrate, and described photoresist adopts the rotation limit, mode limit of static glue to drip glue; And post bake, glass substrate first level after gluing leaves standstill, then erects and cure post bake.
The even hectograph generating process of the present invention, on the basis of manufacturing equipment that utilizes the even hectograph of stock size, by the improvement to each link technological parameter, is produced unconventional large-sized even hectograph, has significantly reduced production cost.
Accompanying drawing explanation
Fig. 1 is the even hectograph manufacturing process flow diagram of the present invention.
Embodiment
Below with reference to the drawings and the specific embodiments, the present invention is described in detail.
The even hectograph manufacturing process of the present invention is for the production of manufacturing unconventional large-sized even hectograph, as the specification even hectograph that is 508mm*609mm etc., utilizes the production equipment of the even hectograph of existing stock size, reduces to the full extent production cost.As shown in Figure 1, the production technology of the even hectograph of the present invention comprises the following steps: polishing, cleaning, plated film, gluing and post bake.To produce the even hectograph of 508mm*609mm as example, the even hectograph manufacturing process of the present invention is elaborated below.
First, provide the glass substrate of corresponding size according to the size of the even hectograph that will manufacture, and glass substrate is carried out to polishing make it reach higher flatness and smooth finish.
Described glass substrate can be soda-lime glass plate, Pyrex plate, quartz glass plate etc.As the glass substrate being used in the present embodiment is of a size of 508mm*609mm*4.8mm, while carrying out polishing, defect point is large, throws the mode of twice polishing by rough polishing, essence, adopt existing burnishing powder, rough polishing is pressed tow sides polishing 30 minutes for the first time, and after defect is by jettisoning, the smart throwing time is that front is less than 1 minute for the second time, reverse side 1-3 minute, defect is ground accepting in scope, and the residual burnishing powder vestige in the glass substrate back side is effectively processed simultaneously, is convenient to follow-up cleaning.In polishing process, for avoiding bumping against the fence of surrounding, can suitably turn the buffing machine rocking arm amplitude of oscillation down.
After polishing completes, need to clean glass substrate, remove chip, dust, the residual burnishing powder etc. of glass baseplate surface.
Because used glass substrate is large compared with stock size, the weight of glass substrate is also correspondingly larger, and polishing defensive position is clean very effort directly, obtains better cleaning performance can add a bracing frame in water tank after.When cleaning, because the air knife first paragraph water yield is larger, large-sized glass substrate from air knife mouth too close to, cause blowing to such an extent that be not clean especially, second segment can leave mark when blowing with air knife again, through the test of many times of air knife is changed and regulated, air knife was changed into second segment by being originally placed on first paragraph, first paragraph air knife stop need not, avoid disposable air knife can not dry up surface, the water soaking causing.In addition, can correspondingly change the meshing gear that round brush and round brush go out, make large-sized glass substrate smooth and easyly pass through round brush section, as round brush is added and grows to 510mm.
After cleaning, carry out plated film, on glass plate, generate nitrogenize/oxidized metal rete.
Because conventional plated film vehicle frame is not suitable for large-sized glass substrate plated film, the conventional plated film vehicle frame of 2 restrictions can be modified to the Special frame of sized rectangular glass substrate plated film.Described plated film comprises plated film twice, only plates for the first time one deck metal nitride film on glass substrate, and when plated film, electric current is turned one times down.After plated film, clean for the first time, and then carry out plated film for the second time, and plated film is on glass substrate, to plate one deck metal nitride film and one deck oxidized metal film for the second time, twice plated film forms nitrogenize/oxidized metal rete, pin hole is considerably less, and after plate-making, effect is remarkable.
After plated film completes, carry out gluing operation, on the rete of the nitrogenize/oxidized metal of glass substrate, apply photoresist.
Conventional spin coater power is little, inertia is large, for the coating technique of large-sized glass substrate, seriously inhomogeneous in the middle of four jiaos after gluing, and occurs that lower wall prints.The PVC backing plate of drip glue mode, droplet glue laminated power, droplet glue rotating speed, acceleration rotating speed, constant velocity time, photoresist viscosity and the making pallet of the present invention to existing spin coater has all carried out change or adjustment.Take 508mm*609mm*4.8mm specification glass substrate as example, to drip glue mode and adopt static glue, glue is dripped on rotation limit, limit, on the PVC backing plate using, has air-breathing aperture, and other design parameter is as shown in table 1:
Table 1508mm*609mm*4.8mm glass substrate coating technique parameter
Finally, i.e. post bake, at high temperature cures glass substrate, improves the adhesiveness of photoresist, makes photoresist really can protect nitrogenize/oxidized metal rete.
The even hectograph of stock size adopts and keeps flat the mode of post bake, but for large-sized glass substrate, is limited to the size of existing equipment, after gluing, level left standstill after 20 minutes, then was erected to put into oven-baked, erect post bake, the horizontal post bake of its effect and stock size is suitable.
As shown in the above, the even hectograph generating process of the present invention, on the basis of manufacturing equipment that utilizes the even hectograph of stock size, by the improvement to each link technological parameter, is produced unconventional large-sized even hectograph, has significantly reduced production cost.It should be noted that; the present invention is not limited to above-mentioned embodiment, and according to creative spirit of the present invention, those skilled in the art can also make other variations; the variation that these do according to creative spirit of the present invention, within all should being included in the present invention's scope required for protection.

Claims (6)

1. an even hectograph manufacturing process, comprises the following steps:
Polishing, provides the even hectograph that will produce the glass substrate of corresponding size is provided and carries out polishing, and described polishing comprises twice polishing of rough polishing and essence throwing;
Clean, when cleaning, in the water tank of cleaning machine, increase bracing frame and support the glass substrate after polishing, and air knife is arranged to second segment glass substrate is dried up;
Plated film, first plates one deck metal nitride film on the glass substrate after cleaning, and then plating one deck metal nitride film and one deck oxidized metal film;
Gluing is coated with one deck photoresist on the film of glass substrate, and described photoresist adopts the rotation limit, mode limit of static glue to drip glue; And
Post bake, glass substrate first level after gluing leaves standstill, then erects and cure post bake.
2. even hectograph manufacturing process as claimed in claim 1, is characterized in that, described rough polishing is pressed tow sides polishing 30 minutes.
3. even hectograph manufacturing process as claimed in claim 1, is characterized in that, the described smart throwing time is that front is less than 1 minute, reverse side 1-3 minute.
4. even hectograph manufacturing process as claimed in claim 1, is characterized in that, in post bake, the standing time of glass substrate level is 20 minutes.
5. even hectograph manufacturing process as claimed in claim 1, is characterized in that, in gluing, dripping the glue time is 28s, and pressure is 0.11MPa, and dripping glue hop count is second segment.
6. even hectograph manufacturing process as claimed in claim 1, is characterized in that, described glass substrate is for being of a size of 508mm*609mm, and the even hectograph of manufacturing is for being of a size of 508mm*609mm.
CN201410052503.3A 2014-02-14 2014-02-14 Spin coating version manufacturing process Active CN103823330B (en)

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CN103823330B CN103823330B (en) 2017-07-14

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105739243A (en) * 2016-04-22 2016-07-06 长葛市汇达感光材料有限公司 Fabrication method of light sensitive material plate
CN106226926A (en) * 2016-08-08 2016-12-14 深圳市科利德光电材料股份有限公司 A kind of liquid crystal display and improve the method that nurse draws phenomenon
CN106937486A (en) * 2015-12-31 2017-07-07 苏州市迪飞特电子有限公司 A kind of pcb board surface automatic processing apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1506759A (en) * 2002-12-09 2004-06-23 中国科学院光电技术研究所 Photoresist mask and its making process
US20120115328A1 (en) * 2009-10-23 2012-05-10 Semiconductor Manufacturing International (Shanghai) Corporation Electroforming technique for mask formation
CN103235481A (en) * 2013-03-28 2013-08-07 深圳市科利德光电材料股份有限公司 Glue uniformization chromium plate manufacturing process
CN103365070A (en) * 2012-03-29 2013-10-23 山东浪潮华光光电子股份有限公司 Phase shift mask plate of PSS (patterned sapphire substrates) graphics and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1506759A (en) * 2002-12-09 2004-06-23 中国科学院光电技术研究所 Photoresist mask and its making process
US20120115328A1 (en) * 2009-10-23 2012-05-10 Semiconductor Manufacturing International (Shanghai) Corporation Electroforming technique for mask formation
CN103365070A (en) * 2012-03-29 2013-10-23 山东浪潮华光光电子股份有限公司 Phase shift mask plate of PSS (patterned sapphire substrates) graphics and preparation method thereof
CN103235481A (en) * 2013-03-28 2013-08-07 深圳市科利德光电材料股份有限公司 Glue uniformization chromium plate manufacturing process

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106937486A (en) * 2015-12-31 2017-07-07 苏州市迪飞特电子有限公司 A kind of pcb board surface automatic processing apparatus
CN106937486B (en) * 2015-12-31 2019-11-05 苏州市迪飞特电子有限公司 A kind of pcb board surface automatic processing apparatus
CN105739243A (en) * 2016-04-22 2016-07-06 长葛市汇达感光材料有限公司 Fabrication method of light sensitive material plate
CN106226926A (en) * 2016-08-08 2016-12-14 深圳市科利德光电材料股份有限公司 A kind of liquid crystal display and improve the method that nurse draws phenomenon
CN106226926B (en) * 2016-08-08 2019-08-23 深圳市科利德光电材料股份有限公司 A kind of liquid crystal display and improve the method that nurse draws phenomenon

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