CN114126260A - Manufacturing method of ultra-thick copper PCB with 6oz inner layer and 12oz outer layer - Google Patents
Manufacturing method of ultra-thick copper PCB with 6oz inner layer and 12oz outer layer Download PDFInfo
- Publication number
- CN114126260A CN114126260A CN202111291977.XA CN202111291977A CN114126260A CN 114126260 A CN114126260 A CN 114126260A CN 202111291977 A CN202111291977 A CN 202111291977A CN 114126260 A CN114126260 A CN 114126260A
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- layer
- board
- copper
- plate
- thickness
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Abstract
The invention discloses a manufacturing method of an ultra-thick copper PCB with an inner layer of 6oz and an outer layer of 12oz, which comprises the following steps: manufacturing an inner layer circuit pattern with the line width of 240 mu m larger than the preset line width on a core plate with the copper thickness of 6oz, and etching to obtain an inner layer circuit; laminating the core board and the outer layer copper foil with the thickness of 6oz into a production board through a prepreg; sequentially electroplating the production plate for five times, and thickening the thickness of a plate surface copper layer to 11 oz; drilling holes on the plate, depositing copper and electroplating the whole plate, and thickening the thickness of a copper layer on the plate surface to 12 oz; making an outer layer circuit pattern with the line width being 480 mu m larger in advance on a production board, and etching to obtain an outer layer circuit; sequentially manufacturing a first ink layer and a second ink layer on a plate by adopting an air pressure spraying mode, and manufacturing a third ink layer on the plate by adopting a screen printing mode; and carrying out surface treatment and molding procedures on the board to obtain the ultra-thick copper PCB. The method improves the processing capacity of the PCB by optimizing the process flow and controlling the processes of all the working procedures, and realizes the manufacture of the ultra-thick copper PCB with the inner layer of 6oz and the outer layer of 12 oz.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method of an ultra-thick copper PCB with an inner layer of 6oz and an outer layer of 12 oz.
Background
A Printed Circuit Board (PCB), also called a Printed Circuit Board, is called a Circuit Board or a Printed Board for short, and is a provider of electrical connection of electronic components. Generally, a printed board needs to be subjected to solder resist processing, and a layer of solder resist material is coated to play a role in solder resist insulation and line oxidation prevention.
The super-thick copper circuit board is a circuit board with the thickness of an inner conductive circuit layer being more than or equal to 100 mu m; the super-thick copper circuit board has the advantages of being capable of passing through large current, good in heat dissipation and the like, the requirements of high-end markets such as the automobile electronic industry on the circuit board are better met, and the super-thick copper circuit board has great market development potential.
With the development of the manufacturing process of printed boards, ultra-thick copper printed boards with the thickness of the outer layer circuit layer exceeding 5oz or even 10oz begin to appear. For the super-thick copper printed board, the process capability of the existing method is limited, the manufacture of inner and outer layer circuits and the resistance welding processing have great difficulty, and the specific problems are as follows:
1. when the thickness of the inner layer copper exceeds 4oz, the wet film is separated when the inner layer circuit is manufactured by adopting the wet film;
2. the highest specification of the thickness of the copper foil produced by the existing copper foil manufacturer is 6oz, when the outer layer copper thickness requires 12oz, the rest 6oz needs to be supplemented by electroplating, and the problems of copper plating thickness and copper plating uniformity exist in one-time electroplating;
3. when the outer layer circuit is manufactured, two times of etching are usually adopted due to the fact that the circuit is too thick, but the adhesion force of a dry film cannot resist the two times of etching;
4. the thickness of a thick copper circuit layer on the surface layer of the board is too large, the circuit gap is too deep, when the solder mask processing is carried out by adopting screen printing, the solder mask material is difficult to fully fill the circuit gap, especially the bottom, the problem of suspended bottom exists, a large amount of gaps and air bubbles exist, and when the solder mask material is cured subsequently, the air bubbles are dissipated, so that the curing quality is seriously influenced; finally, the processed solder mask layer is easy to foam and fall off, the quality is not critical, and the solder mask ink cannot cover the line angle.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for manufacturing an inner 6oz and outer 12oz ultra-thick copper PCB, which improves the processing capacity of the PCB and realizes the manufacture of the inner 6oz and outer 12oz ultra-thick copper PCB by optimizing the process flow and controlling the processes of all the working procedures.
In order to solve the technical problem, the invention provides a method for manufacturing an ultra-thick copper PCB with an inner layer of 6oz and an outer layer of 12oz, which comprises the following steps:
s1, cutting a core board according to the size of the jointed board, wherein the thickness of the copper layers on the two surfaces of the core board is 6 oz;
s2, attaching a dry film on the core board, forming an inner layer circuit pattern through exposure and development in sequence, wherein the line width of the inner layer circuit pattern is 240 microns larger than that required by design, etching to obtain an inner layer circuit, and removing the film;
s3, laminating the core board and the outer layer of copper foil into a production board through prepregs according to the laminating sequence, wherein the thickness of the outer layer of copper foil is 6 oz;
s4, sequentially carrying out full-plate electroplating on the production plate five times, and carrying out full-plate electroplating on the thickened plate surface copper layer 1oz each time to finally thicken the plate surface copper layer to 11 oz;
s5, drilling holes in the plate, depositing copper and electroplating the whole plate in sequence to thicken the thickness of the copper layer on the plate surface to 12 oz;
s6, pasting a dry film on the production board, forming an outer layer circuit pattern through exposure and development in sequence, wherein the line width of the outer layer circuit pattern is 480 microns larger than that required by design, etching to obtain an outer layer circuit, and removing the film;
s7, printing a first layer of ink on the board surface by adopting an air pressure spraying mode, and then sequentially forming a first ink layer with the thickness of 120 microns through pre-baking, exposure, development and post-baking;
s8, printing a second layer of ink on the plate by adopting an air pressure spraying mode, and then sequentially forming a second ink layer with the thickness of 100 microns through pre-baking, exposure, development and post-baking;
s9, silk-screen printing a third layer of printing ink on the board by adopting a silk-screen printing mode, then sequentially carrying out pre-baking, exposure, development and post-baking to form a third printing ink layer, and enabling the thickness of a solder mask layer formed by the first printing ink layer, the second printing ink layer and the third printing ink layer to reach the thickness required by design;
and S10, sequentially carrying out surface treatment and molding procedures on the board to obtain the ultra-thick copper PCB with the inner layer of 6oz and the outer layer of 12 oz.
Further, in step S2, the shower pressure at the time of development was controlled to 2.0Kg/cm2(ii) a The etching speed was controlled to 1.5 m/min.
Further, in step S4, the current density at each time of full plate plating was controlled to 3.5ASD at a speed of 0.7 m/min.
Further, in step S4, the position of the pinch point on the board is changed after each full board plating, so that the position of the pinch point is different during each full board plating.
Further, in step S5, the hole is ground twice before the copper deposition after the drilling, and the grinding directions are opposite to each other, so as to remove the burr at the hole.
Further, in steps S4 and S5, a VCP vertical continuous plating line is used for full-plate plating.
Further, in step S6, the shower pressure at the time of development was controlled to 2.0Kg/cm2(ii) a The etching speed was controlled to 0.7 m/min.
Further, in steps S7 and S8, the production board is subjected to super-roughening treatment before printing the first layer of ink and the second layer of ink.
Further, in step S9, the production board is processed by volcanic ash before the third layer of ink is printed.
Further, in step S10, lead-free tin spraying is adopted for surface treatment, and the tin thickness is controlled to be 1-40 μm.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, firstly, the inner layer circuit and the outer layer circuit are manufactured by using the dry film instead, so that the problem of falling of a wet film is solved; the line widths of the inner layer and the outer layer are respectively increased by 240 micrometers and 480 micrometers, so that one-time etching is adopted during etching, and the problem that a dry film is attached and cannot resist two-time etching is solved; when the copper layer on the board surface is thickened, the copper layer is thickened by adopting multiple times of full-board electroplating, and the copper thickness of each thickening is the same, so that the problem of uniformity of the copper thickness of the copper-plated layer can be solved; first named talent and second printing ink layer of atmospheric pressure spraying preparation earlier through twice when preparation solder mask, utilize the dispersion and the pressure of atmospheric pressure spraying to make printing ink fully fill the clearance bottom between the circuit, then printing ink layer of the uppermost one deck is printed in the mode that improves the silk screen printing, ensure that printing ink can cover the line angle, and adopt the mode of preparation printing ink layer many times also can avoid leading to the bad problem of solidification because of printing ink layer thickness is too big, the quality of improved solder mask, still all advance the coarsing processing before the printing ink layer of preparation at every turn, in order to ensure that the cohesion between printing ink and face and printing ink is good, avoid appearing the problem of printing ink layering.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The manufacturing method of the ultra-thick copper PCB with the inner layer of 6oz and the outer layer of 12oz shown in the embodiment sequentially comprises the following processing procedures:
(1) cutting: the core board and the outer copper foil are cut according to the dimension of the jointed board of 460mm multiplied by 620mm, the thickness of the core board is 0.7mm (the thickness does not include the thickness of the outer copper foil), the thickness of the copper layers on the two surfaces of the core board is 6oz, and the thickness of the outer copper foil is 6 oz.
(2) Inner layer circuit manufacturing (negative film process): transferring an inner layer pattern, namely pasting a dry film with the model number of DF40 on a core plate, adopting a full-automatic exposure machine and a negative film circuit film, completing the exposure of the inner layer circuit by a 5-6-grid exposure ruler (21-grid exposure ruler), and developing to form an inner layer circuit pattern, wherein the line width of the inner layer circuit pattern is pre-increased by 240 microns on the basis required by design to be used as the side etching allowance during one-time etching, and the problem of line fineness after etching can be avoided by controlling the line width on the value; etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is 0.4 mm; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
In the above, the spray pressure during development is controlled at 2.0Kg/cm2(ii) a The etching speed was controlled to 1.5 m/min.
(3) And (3) laminating: before pressing, performing brown oxidation treatment on the core board, wherein the brown oxidation speed is 3m/min, sequentially overlapping the core board, the prepreg and the outer layer copper foil according to requirements, and then pressing the laminated board by selecting proper lamination conditions according to the Tg of the board to form the production board.
(4) Electroplating the whole plate: sequentially carrying out full-plate electroplating on the production board five times by adopting a VCP vertical continuous electroplating production line, and thickening the board surface copper layer by 1oz in each full-plate electroplating process so as to finally thicken the board surface copper layer to 11 oz; thickening face copper layer earlier before drilling, firstly avoid the problem that the hole is little, secondly avoid need make the hole sealing figure and influence efficiency.
In the above, the current density during each full-plate electroplating is controlled at 3.5ASD, the speed is 0.7m/min, and the full-plate electroplating is carried out by using small current and low speed, so that the electroplating uniformity after each electroplating is improved; and the position of the clamping point on the plate is changed after the whole plate is electroplated every time, so that the position of the clamping point is different when the whole plate is electroplated every time, the thickness difference of the copper layer at the position of the clamping point is ensured to be small, and the uniformity of copper plating is further improved.
(5) Drilling: according to the existing drilling technology, drilling processing is carried out on a production plate according to design requirements, the hole is ground twice after drilling, and the grinding directions of the two times are opposite, so that burrs at the hole are effectively removed.
(6) Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the hole wall by using an electroless copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(7) Electroplating the whole plate: and (3) carrying out full-plate electroplating by adopting a VCP vertical continuous electroplating production line at the current density of 3.5ASD, and thickening the thicknesses of the hole copper layer and the plate surface copper layer to 12oz, wherein the thickness of the hole copper layer is 20-25 mu m.
(8) Manufacturing an outer layer circuit (negative film process): transferring an outer layer pattern, pasting a dry film with the type number DF40 on a production board, completing outer layer circuit exposure by a 5-7 grids exposure ruler (21 grids exposure ruler) by adopting a full-automatic exposure machine and a negative film circuit film, forming the outer layer circuit pattern on the production board through development, wherein the line width of the outer layer circuit pattern is pre-enlarged by 480 mu m on the basis required by design to be used as a side etching allowance during one-time etching, and controlling the line width on the value so as to avoid the problem of line fineness after etching; then etching and removing the film in sequence, etching an outer layer circuit on the production board, wherein the outer layer line width is measured to be 0.8 mm; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
In the above, the spray pressure during development is controlled at 2.0Kg/cm2(ii) a The etching speed was controlled to 0.7 m/min.
(9) Solder resist and silk screen printing of characters: after solder resist ink is printed on the surface of a production board, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, solder resist ink is coated on the TOP surface, and UL marks are added to the TOP surface characters, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and meanwhile, the effect of beautifying the appearance is achieved; the manufacturing process of the solder mask layer specifically comprises the following steps:
a. carrying out super-roughening treatment on the production board to roughen the board surface, so as to improve the bonding force between the board surface and the printing ink; printing a first layer of printing ink on the board surface by adopting an air pressure spraying mode, and then forming a first printing ink layer with the thickness of 120 microns through pre-baking, exposure, development and post-baking in sequence; the temperature of the post-baking is 150 ℃, and the time is 30 min;
b. carrying out super-roughening treatment on the production plate to roughen the first ink layer and improve the bonding force between the first ink layer and the ink manufactured at the back; printing a second layer of printing ink on the plate by adopting an air pressure spraying mode, and then sequentially carrying out pre-baking, exposure, development and post-baking to form a second printing ink layer with the thickness of 100 microns; baking at 150 deg.C for 30 min;
c. performing volcanic ash plate grinding treatment on the production plate to coarsen the second ink layer and improve the bonding force between the second ink layer and the ink manufactured later; silk-screen printing a third layer of printing ink on a board by adopting a silk-screen printing mode, then forming a third printing ink layer by pre-baking, exposing, developing and post-baking in sequence, and enabling the thickness of a solder mask layer formed by the first printing ink layer, the second printing ink layer and the third printing ink layer to reach the thickness required by design, wherein the thickness of the printing ink layer at a line corner is more than or equal to 5 microns, and the thickness of the printing ink layer on the surface of a circuit is more than or equal to 25 microns; the baking temperature is 150 deg.C, and the baking time is 30 min.
(10) Surface treatment (lead-free tin spraying): evenly plating a tin layer with certain thickness on the copper surface of the welding pad at the position of the solder resisting window, wherein the thickness of the nickel layer is as follows: 1-40 μm.
(11) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(12) And forming: according to the prior art and according to the design requirement, the shape is milled, the tolerance of the shape is +/-0.05mm, and the ultra-thick copper PCB with the inner layer of 6oz and the outer layer of 12oz is manufactured.
(13) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the ultra-thick copper PCB is inspected, if a defect exists, the defect is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(14) FQA: and measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the ultra-thick copper PCB meet the requirements of customers or not.
(15) And packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (10)
1. A manufacturing method of an ultra-thick copper PCB with an inner layer of 6oz and an outer layer of 12oz is characterized by comprising the following steps:
s1, cutting a core board according to the size of the jointed board, wherein the thickness of the copper layers on the two surfaces of the core board is 6 oz;
s2, attaching a dry film on the core board, forming an inner layer circuit pattern through exposure and development in sequence, wherein the line width of the inner layer circuit pattern is 240 microns larger than that required by design, etching to obtain an inner layer circuit, and removing the film;
s3, laminating the core board and the outer layer of copper foil into a production board through prepregs according to the laminating sequence, wherein the thickness of the outer layer of copper foil is 6 oz;
s4, sequentially carrying out full-plate electroplating on the production plate five times, and carrying out full-plate electroplating on the thickened plate surface copper layer 1oz each time to finally thicken the plate surface copper layer to 11 oz;
s5, drilling holes in the plate, depositing copper and electroplating the whole plate in sequence to thicken the thickness of the copper layer on the plate surface to 12 oz;
s6, pasting a dry film on the production board, forming an outer layer circuit pattern through exposure and development in sequence, wherein the line width of the outer layer circuit pattern is 480 microns larger than that required by design, etching to obtain an outer layer circuit, and removing the film;
s7, printing a first layer of ink on the board surface by adopting an air pressure spraying mode, and then sequentially forming a first ink layer with the thickness of 120 microns through pre-baking, exposure, development and post-baking;
s8, printing a second layer of ink on the plate by adopting an air pressure spraying mode, and then sequentially forming a second ink layer with the thickness of 100 microns through pre-baking, exposure, development and post-baking;
s9, silk-screen printing a third layer of printing ink on the board by adopting a silk-screen printing mode, then sequentially carrying out pre-baking, exposure, development and post-baking to form a third printing ink layer, and enabling the thickness of a solder mask layer formed by the first printing ink layer, the second printing ink layer and the third printing ink layer to reach the thickness required by design;
and S10, sequentially carrying out surface treatment and molding procedures on the board to obtain the ultra-thick copper PCB with the inner layer of 6oz and the outer layer of 12 oz.
2. The method for fabricating an ultra-thick copper PCB having an inner layer of 6oz and an outer layer of 12oz as claimed in claim 1, wherein the spraying pressure during the developing is controlled to be 2.0Kg/cm in step S22(ii) a The etching speed was controlled to 1.5 m/min.
3. The method as claimed in claim 1, wherein the current density is controlled to be 3.5ASD at a speed of 0.7m/min at each full plate plating in step S4.
4. The method as claimed in claim 1, wherein the position of the pinch point on the board is changed after each full board plating in step S4, so that the position of the pinch point is different each time the full board plating is performed.
5. The method as claimed in claim 1, wherein in step S5, the openings are ground twice in opposite directions to remove burrs at the openings before the copper is deposited after the holes are drilled.
6. The method as claimed in claim 1, wherein in the steps S4 and S5, VCP vertical continuous electroplating line is used for full-plate electroplating.
7. The method for fabricating an ultra-thick copper PCB having an inner layer of 6oz and an outer layer of 12oz as claimed in claim 1, wherein the spraying pressure during the developing is controlled to be 2.0Kg/cm in step S62(ii) a The etching speed was controlled to 0.7 m/min.
8. The method of claim 6, wherein the first layer of ink and the second layer of ink are printed before the super-roughening treatment is performed on the production board in steps S7 and S8.
9. The method of manufacturing an ultra-thick copper PCB with an inner layer of 6oz and an outer layer of 12oz as claimed in claim 1, wherein the volcanic ash is processed on the manufactured board before the third layer of ink is printed in step S9.
10. The method for manufacturing an ultra-thick copper PCB having an inner layer of 6oz and an outer layer of 12oz as claimed in claim 1, wherein the surface treatment is lead-free tin spraying and the tin thickness is controlled to be 1-40 μm in step S10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111291977.XA CN114126260A (en) | 2021-11-02 | 2021-11-02 | Manufacturing method of ultra-thick copper PCB with 6oz inner layer and 12oz outer layer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111291977.XA CN114126260A (en) | 2021-11-02 | 2021-11-02 | Manufacturing method of ultra-thick copper PCB with 6oz inner layer and 12oz outer layer |
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| CN114126260A true CN114126260A (en) | 2022-03-01 |
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| CN202111291977.XA Withdrawn CN114126260A (en) | 2021-11-02 | 2021-11-02 | Manufacturing method of ultra-thick copper PCB with 6oz inner layer and 12oz outer layer |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115003039A (en) * | 2022-07-25 | 2022-09-02 | 广东通元精密电路有限公司 | Thick copper HDI circuit board and manufacturing method of fine circuit thereof |
| WO2024045977A1 (en) * | 2022-08-29 | 2024-03-07 | 中兴通讯股份有限公司 | Printed circuit board, electronic device, and printed circuit board manufacturing method |
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| CN101959372A (en) * | 2010-05-24 | 2011-01-26 | 大连太平洋多层线路板有限公司 | Super-thick copper circuit board solder resisting processing method |
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| CN107613678A (en) * | 2017-10-24 | 2018-01-19 | 深圳市昶东鑫线路板有限公司 | A kind of manufacture craft of thick copper coin |
| CN108718480A (en) * | 2018-06-07 | 2018-10-30 | 江门荣信电路板有限公司 | A kind of ectonexine 6OZ super-thick copper pcb boards and preparation method thereof |
| CN112888186A (en) * | 2021-02-24 | 2021-06-01 | 铜陵安博电路板有限公司 | Production process of PCB for quick-charging pile of new energy automobile |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101959372A (en) * | 2010-05-24 | 2011-01-26 | 大连太平洋多层线路板有限公司 | Super-thick copper circuit board solder resisting processing method |
| CN102510668A (en) * | 2011-11-08 | 2012-06-20 | 景旺电子（深圳）有限公司 | Super thick copper PCB plate production method and its circuit board |
| CN107613678A (en) * | 2017-10-24 | 2018-01-19 | 深圳市昶东鑫线路板有限公司 | A kind of manufacture craft of thick copper coin |
| CN108718480A (en) * | 2018-06-07 | 2018-10-30 | 江门荣信电路板有限公司 | A kind of ectonexine 6OZ super-thick copper pcb boards and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115003039A (en) * | 2022-07-25 | 2022-09-02 | 广东通元精密电路有限公司 | Thick copper HDI circuit board and manufacturing method of fine circuit thereof |
| CN115003039B (en) * | 2022-07-25 | 2023-10-31 | 江西景伟电子电路有限公司 | Thick copper HDI circuit board and manufacturing method of fine circuit thereof |
| WO2024045977A1 (en) * | 2022-08-29 | 2024-03-07 | 中兴通讯股份有限公司 | Printed circuit board, electronic device, and printed circuit board manufacturing method |
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