CN115135009A - Method for manufacturing PCB character - Google Patents
Method for manufacturing PCB character Download PDFInfo
- Publication number
- CN115135009A CN115135009A CN202210651256.3A CN202210651256A CN115135009A CN 115135009 A CN115135009 A CN 115135009A CN 202210651256 A CN202210651256 A CN 202210651256A CN 115135009 A CN115135009 A CN 115135009A
- Authority
- CN
- China
- Prior art keywords
- character
- characters
- photosensitive ink
- screen printing
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Abstract
The invention discloses a method for manufacturing PCB characters, which comprises the following steps: manufacturing a screen printing plate for screen printing, and arranging a light-transmitting window on the screen printing plate, wherein the window corresponds to a character area of characters to be printed in the production plate; silk-screen printing photosensitive ink on a production board with a solder mask layer manufactured through a screen printing plate, so as to silk-screen a layer of photosensitive ink at a position corresponding to a windowing position in the production board, and pre-curing the photosensitive ink through pre-baking; manufacturing an exposure film according to the character graph to be printed, and exposing the photosensitive ink on the production plate through the exposure film so as to expose and solidify the photosensitive ink at the position corresponding to the character graph; and removing the photosensitive ink which is not cured by exposure except the character pattern through development to form a character, and finally completely curing the character through baking. The method solves the problem that the silk-screen characters cannot be made into dense and fine characters due to the processing capacity, and also solves the problems that the characters printed by a character printer drop characters and cannot be made into character color diversity.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for manufacturing PCB characters.
Background
The character process in the PCB manufacturing process is to form character patterns on the PCB surface by silk-screen printing of a certain mesh of character ink required by customers or by ink-jet printing of a character printer, so as to provide indication information for the installation, maintenance and the like of customer elements.
Wherein, the minimum processing capability of the screen printing is the line width/line distance/character height of the characters: 0.1/0.1/0.8mm, the conventional screen printing characters are manufactured by using thermocuring printing ink, image-text meshes corresponding to character patterns are firstly manufactured on a screen printing plate, then the characters are directly silk-printed by utilizing the image-text meshes and then are cured, the characters cannot be silk-printed into clear fonts due to the limitation of photosensitive paste for manufacturing the image-text meshes, and the silk printing can cause fat oil and unclear characters.
The process capability of the character printer is the line width/line distance/word height of the character: 0.075/0.075/0.5mm, but the printed characters have defects, the UV curing ink is used, the ink has small particles, small tension and weak diffusion capability, and is cured when meeting light, the formed characters have weaker bonding force with the plate surface than silk-screen characters, and the characters are easy to drop; further, due to the limitation of the ink colors for printing characters, it is impossible to make the colors of characters other than white.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for manufacturing a PCB character, which solves the problems that the silk-screen character cannot be manufactured into dense and fine characters due to the manufacturing process capability, and also solves the problems that a character printer prints characters, falls off the characters and cannot manufacture the color diversity of the characters.
In a first aspect, to solve the above technical problem, the present invention provides a method for manufacturing a PCB character, including the following steps:
s1, manufacturing a screen printing plate for screen printing, and arranging a light-transmitting window on the screen printing plate, wherein the window corresponds to a character area of characters to be printed in the production plate;
s2, silk-screening photosensitive ink on the production board with the solder mask layer through a screen printing plate, so as to silk-screen a layer of photosensitive ink at the position corresponding to the windowing position in the production board;
s3, pre-baking the photosensitive ink to pre-cure the photosensitive ink;
s4, manufacturing an exposure film according to the character graph to be printed, and exposing the photosensitive ink on the production board through the exposure film so as to expose and solidify the photosensitive ink at the position corresponding to the character graph;
and S5, removing the photosensitive ink which is not exposed and solidified except the character pattern through development to form a character, and finally completely solidifying the character through baking.
Further, the following steps are included between steps S1 and S2:
and S11, performing sand blasting treatment on the production board with the solder mask layer.
Further, in step S1, the one side of the window is 0.5mm to 1mm larger than the character area.
Further, in step S3, the temperature during pre-baking is 75 ℃ and the time is 30 min.
Further, in step S5, the baking temperature is 150 ℃ and the baking time is 30 min.
In a second aspect, the invention also provides another method for manufacturing the characters of the PCB, aiming at the board with the characters printed on both sides, which comprises the following steps:
s10, manufacturing a first screen printing plate and a second screen printing plate for silk screen printing, and respectively arranging a first light-transmitting window and a second light-transmitting window on the first screen printing plate and the second screen printing plate, wherein the first window corresponds to a first character area of characters to be printed in the first surface of the production plate, and the second window corresponds to a second character area of the characters to be printed in the second surface of the production plate;
s20, silk-screening photosensitive ink on the production board with the solder mask layer through the first screen printing plate, so as to silk-screen a layer of photosensitive ink on the first surface of the production board at a position corresponding to the first windowing, and pre-curing the photosensitive ink through pre-baking;
s30, silk-screening photosensitive ink on the production board with the solder mask layer through a second screen printing plate to silk-screen a layer of photosensitive ink at a position corresponding to a second windowing position on the second surface of the production board, and pre-curing the photosensitive ink through pre-baking;
s40, respectively manufacturing exposure films according to the character patterns to be printed on the two surfaces of the production plate, and respectively exposing the photosensitive ink on the two surfaces of the production plate through the two exposure films so as to expose and solidify the photosensitive ink on the corresponding character patterns on the two surfaces of the production plate;
and S50, removing the photosensitive ink which is not exposed and solidified except the character pattern through development to form a character, and finally completely solidifying the character through baking.
Further, the following steps are included between steps S10 and S20:
and S12, performing sand blasting treatment on the production board with the solder mask layer.
Further, in step S10, the first window has a single side 0.5mm to 1mm larger than the first character region, and the second window has a single side 0.5mm to 1mm larger than the second character region.
Further, in steps S20 and S30, the temperature during pre-baking is 75 ℃ and the time is 30 min.
Further, in step S50, the baking temperature is 150 ℃ and the baking time is 30 min.
Furthermore, the thick copper plate is a multilayer plate formed by pressing an inner core plate and an outer copper foil into a whole through a prepreg, and the multilayer plate is subjected to the working procedures of drilling, copper deposition, full-plate electroplating and outer circuit manufacturing in sequence.
Compared with the prior art, the invention has the following beneficial effects:
the method adopts the method of silk-screen photosensitive ink to manufacture characters to replace the existing method of silk-screen characters by using thermosetting ink, and adopts the photosensitive ink to manufacture character patterns by means of pre-baking, exposure and development, so that the character fonts are clearer and more compact, more characters can be completed in a more concentrated area, the binding force is better, and the problem that the silk-screen characters cannot be manufactured into dense and fine characters due to the processing capability is solved; the screen printing method has the advantages that the requirement on the precision of the screen printing screen is not strict, high-precision image-text meshes do not need to be manufactured on the screen printing screen, the process difficulty is reduced, whether the characters of the screen printing are clear or not does not need to be checked specially after the screen printing, and the character area can be covered and manufactured in a local oil printing mode.
In addition, the characters manufactured by the method are higher in precision compared with outer layer graphs and resistance welding windowing, the characters can be manufactured in high density, the distance between the characters can be made to be 0.05mm at least, a large number of characters can be completed in a small area, the color of the characters can meet any requirements of customers, generally speaking, the resistance welding ink can be used for manufacturing characters with various colors according to the colors, even for special graphs and marks, the mixed manufacturing of characters with various colors can be realized, and the problems that characters printed by a character printer drop characters and the color diversity of the characters cannot be manufactured are solved.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Example 1
The manufacturing method of the circuit board shown in this embodiment sequentially includes the following processing steps:
(1) cutting: the core board is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core board is 0.5mm, and the thickness of the copper layers on the two surfaces of the core board is 0.5 oz.
(2) Inner layer circuit manufacturing (negative film process): transferring the inner layer pattern, coating a photosensitive film with a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 μm, completing the exposure of the inner layer circuit by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers), and forming the inner layer circuit pattern after development; etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And (3) laminating: and (3) brown-oxidizing at a speed of brown-oxidizing according to the thickness of the bottom copper, sequentially laminating the core plate, the prepreg and the outer copper foil according to requirements, and then pressing the laminated plate by selecting proper lamination conditions according to the Tg of the plate to form the multilayer plate.
(4) Drilling: according to the existing drilling technology, the multilayer board is drilled according to the design requirements.
(5) Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the hole wall by using an electroless copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(6) Electroplating the whole plate: and performing full-board electroplating for 120min at the current density of 18ASF, and thickening the thicknesses of the hole copper and the board surface copper layer.
(7) Manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on the multilayer board through development; electroplating an outer layer pattern, then respectively plating copper and tin on the multilayer board, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the multilayer board, wherein the copper thickness of the outer layer circuit is greater than or equal to 70 mu m; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(8) Solder resist: after the solder resist ink is silk-screened on the surface of the multilayer board, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermosetting treatment in sequence; specifically, the ink is welded on the TOP surface, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and the protective layer plays a role in beautifying the appearance.
(9) Silk-screen printing of characters: the method specifically comprises the following steps:
a. manufacturing a screen printing plate for silk screen printing, arranging a light-transmitting window on the screen printing plate, wherein the window corresponds to a character area of characters to be printed in a production plate, namely the window range can cover all the areas for printing the characters, and the window is generally manufactured into a square window, namely the window which can cover all the characters is determined by the span length and the width of all the characters, so that the manufacturing is convenient and the procedure is simplified;
in the method, the window opening single side is 0.5mm-1mm larger than the character area, so that the range of photosensitive ink for later stage silk printing is larger than the span length and width of all characters, the problem that the character deviation exceeds the range of stamp ink due to manufacturing errors to cause incompleteness is avoided, the character edge of later stage manufacturing is clear and complete, the window opening precision requirement on the screen printing plate can be reduced, the manufacturing is convenient, and the production efficiency can be improved.
b. The production board is subjected to sand blasting treatment, so that oil residues attached to the surface of the solidified solder resist ink can be removed through the sand blasting treatment, the surface tension can be improved, and the binding force between the solder resist surface and the character ink is improved.
c. And silk-printing photosensitive ink on the production board through the screen printing plate so as to silk-print a layer of photosensitive ink at the position of the character area corresponding to the windowing in the production board.
d. Then, pre-baking the photosensitive ink to pre-cure the photosensitive ink and prevent the ink from flowing outwards randomly; the temperature during prebaking is 75 ℃, the time is 30min, and the prebaking temperature and time are reasonably controlled, so that the ink can be developed and removed while a certain curing performance is kept, and the ink except the character and the figure at the later stage can be ensured to be developed and removed.
e. Making an exposure film according to the character patterns to be printed in the production plate so that the positions corresponding to the character patterns in the exposure film are light transmission areas, and then exposing the photosensitive ink on the production plate through the exposure film so that the photosensitive ink at the positions corresponding to the character patterns is exposed and cured; wherein the exposure is carried out using a 21-stage exposure scale and in 9-11 stages.
f. Removing unexposed and solidified photosensitive ink except the character pattern through development to form characters, and finally baking to completely solidify the characters; the baking temperature is 150 deg.C, and the baking time is 30 min.
(10) Surface treatment (nickel-gold deposition): the chemical principle is applied to a copper surface of a welding pad of a welding-resistant window opening position, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(11) Electrical testing: the electric conduction performance of the finished board is tested, and the board use test method comprises the following steps: and (5) flying probe testing.
(12) Molding: according to the prior art and according to the design requirement, routing the shape, and obtaining the circuit board with the external tolerance of +/-0.05 mm.
(13) FQC: and (4) inspecting the appearance of the circuit board according to a customer acceptance standard and a customer inspection standard, and timely repairing the circuit board if a defect exists so as to ensure that excellent quality control is provided for customers.
(14) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not.
(15) Packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
Example 2
In the manufacturing method of the circuit board shown in this embodiment, characters need to be manufactured on both surfaces of the circuit board, the processing procedure is basically the same as that in embodiment 1, except that step (9) is specifically as follows:
(9) silk-screen printing of characters: the method specifically comprises the following steps:
a. manufacturing a first screen printing plate and a second screen printing plate for silk screen printing, and respectively arranging a first light-transmitting window and a second light-transmitting window on the first screen printing plate and the second screen printing plate, wherein the first window corresponds to a first character area of characters to be printed in the first surface of the production plate, and the second window corresponds to a second character area of the characters to be printed in the second surface of the production plate, namely the window can cover all areas of the characters to be printed on the corresponding surface of the production plate in a window range, and the window is generally manufactured into a square window, namely the window which can cover all the characters is determined according to the span length and the width of all the characters on each surface, so that the manufacturing and the procedure simplification are facilitated;
in the above, the single side of the first window is 0.5mm-1mm larger than the first character area, and the single side of the second window is 0.5mm-1mm larger than the second character area, so that the range of the photosensitive ink for later-stage screen printing is larger than the span length and the width of all characters on the corresponding surface, the problem of incomplete character deviation exceeding the range of the printing ink due to manufacturing errors is avoided, the clear and complete character edge of later-stage manufacturing is ensured, the requirement on the window-opening precision on a screen printing plate can be reduced, the manufacturing is convenient, and the production efficiency can be improved.
b. The production board is subjected to sand blasting treatment, so that oil residues attached to the surface of the solidified solder resist ink can be removed through the sand blasting treatment, the surface tension can be improved, and the binding force between the solder resist surface and the character ink is improved.
c. Silk-screen printing photosensitive ink on the production plate through a first screen printing plate so as to silk-screen a layer of photosensitive ink at a position, corresponding to a first windowing position, in the first surface of the production plate, and pre-curing the photosensitive ink through pre-baking; the pre-baking temperature is 75 deg.C, and the baking time is 30 min.
d. Silk-screen printing photosensitive ink on the production plate through a second screen printing plate so as to silk-screen a layer of photosensitive ink at a position, corresponding to a second windowing position, in the second surface of the production plate, and pre-curing the photosensitive ink through pre-baking; the pre-baking temperature is 75 deg.C, and the baking time is 30 min.
e. Respectively manufacturing an exposure film according to the character graphs to be printed on the two surfaces of the production plate, so that the positions, corresponding to the character graphs, in the exposure films are light transmission areas, and then respectively exposing the photosensitive ink on the two surfaces of the production plate through the two exposure films, so that the photosensitive ink on the positions, corresponding to the character graphs, in the two surfaces of the production plate is exposed and solidified.
f. Removing unexposed and solidified photosensitive ink except the character pattern through development to form characters, and finally baking to completely solidify the characters; the baking temperature is 150 deg.C, and the baking time is 30 min.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, the specific implementation manners and the application ranges may be changed, and in conclusion, the content of the present specification should not be construed as limiting the invention.
Claims (10)
1. A method for manufacturing PCB characters is characterized by comprising the following steps:
s1, manufacturing a screen printing plate for screen printing, and arranging a light-transmitting window on the screen printing plate, wherein the window corresponds to a character area of characters to be printed in the production plate;
s2, silk-screening photosensitive ink on the production board with the solder mask layer through a screen printing plate, so as to silk-screen a layer of photosensitive ink at the position corresponding to the windowing position in the production board;
s3, pre-baking the photosensitive ink to pre-cure the photosensitive ink;
s4, manufacturing an exposure film according to the character pattern to be printed, and exposing the photosensitive ink on the production plate through the exposure film so as to expose and solidify the photosensitive ink at the position corresponding to the character pattern;
and S5, removing the photosensitive ink which is not exposed and solidified except the character pattern through development to form a character, and finally completely solidifying the character through baking.
2. The method for fabricating PCB characters as recited in claim 1, further comprising the steps between steps S1 and S2:
and S11, performing sand blasting treatment on the production board with the solder mask layer.
3. The method for manufacturing characters on PCB as claimed in claim 1, wherein in step S1, the one side of the window is 0.5mm-1mm larger than the character area.
4. The method for manufacturing a PCB character of claim 1, wherein the temperature of the pre-baking in step S3 is 75 ℃ for 30 min.
5. The method for manufacturing PCB characters as claimed in claim 1, wherein in step S5, the baking temperature is 150 ℃ and the baking time is 30 min.
6. A method for manufacturing PCB characters is characterized by comprising the following steps:
s10, manufacturing a first screen printing plate and a second screen printing plate for silk screen printing, and respectively arranging a first light-transmitting window and a second light-transmitting window on the first screen printing plate and the second screen printing plate, wherein the first window corresponds to a first character area of characters to be printed in the first surface of the production plate, and the second window corresponds to a second character area of the characters to be printed in the second surface of the production plate;
s20, silk-screening photosensitive ink on the production board with the solder mask layer through the first screen printing plate, so as to silk-screen a layer of photosensitive ink on the first surface of the production board at a position corresponding to the first windowing, and pre-curing the photosensitive ink through pre-baking;
s30, silk-screening photosensitive ink on the production board with the solder mask layer through a second screen printing plate to silk-screen a layer of photosensitive ink at a position corresponding to a second windowing position on the second surface of the production board, and pre-curing the photosensitive ink through pre-baking;
s40, respectively manufacturing an exposure film according to the character patterns to be printed on the two surfaces of the production board, and respectively exposing the photosensitive ink on the two surfaces of the production board through the two exposure films so as to expose and solidify the photosensitive ink on the corresponding character patterns on the two surfaces of the production board;
and S50, removing the photosensitive ink which is not exposed and solidified except the character pattern through development to form a character, and finally completely solidifying the character through baking.
7. The method for fabricating PCB characters as recited in claim 6, further comprising the steps between steps S10 and S20:
and S12, performing sand blasting treatment on the production board with the solder mask layer.
8. The method for fabricating PCB characters as claimed in claim 6, wherein in step S10, the first window has a single side 0.5mm-1mm larger than the first character region, and the second window has a single side 0.5mm-1mm larger than the second character region.
9. The method for fabricating PCB characters of claim 6, wherein the pre-baking temperature is 75 ℃ and the pre-baking time is 30min in steps S20 and S30.
10. The method for manufacturing characters on PCB of claim 6, wherein in step S50, the baking temperature is 150 ℃ and the baking time is 30 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210651256.3A CN115135009A (en) | 2022-06-09 | 2022-06-09 | Method for manufacturing PCB character |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210651256.3A CN115135009A (en) | 2022-06-09 | 2022-06-09 | Method for manufacturing PCB character |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115135009A true CN115135009A (en) | 2022-09-30 |
Family
ID=83378468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210651256.3A Pending CN115135009A (en) | 2022-06-09 | 2022-06-09 | Method for manufacturing PCB character |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115135009A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116321781A (en) * | 2023-05-25 | 2023-06-23 | 深圳市龙腾电路科技有限公司 | Method for manufacturing thick copper plate character and application of thick copper plate character in preparation of circuit board |
-
2022
- 2022-06-09 CN CN202210651256.3A patent/CN115135009A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116321781A (en) * | 2023-05-25 | 2023-06-23 | 深圳市龙腾电路科技有限公司 | Method for manufacturing thick copper plate character and application of thick copper plate character in preparation of circuit board |
| CN116321781B (en) * | 2023-05-25 | 2023-08-04 | 深圳市龙腾电路科技有限公司 | Method for manufacturing thick copper plate character and application of thick copper plate character in preparation of circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110831336B (en) | Resin hole plugging method for large-aperture back drilling hole | |
| CN109275277B (en) | Solder mask manufacturing method for preventing small holes of PCB from entering ink | |
| CN110351955B (en) | Manufacturing method of PCB with local electrical thick gold PAD | |
| CN109348637B (en) | Film alignment method for preventing incomplete etching of negative plate circuit | |
| CN109195344B (en) | Method for enhancing dry film adhesion of fine circuit printed board | |
| CN110802963B (en) | Character processing method for PCB (printed circuit board) super-thick copper plate | |
| CN110913601B (en) | Method for manufacturing solder mask translation film | |
| CN111867271A (en) | Method for manufacturing variegated ink solder mask of thick copper plate | |
| CN110121239B (en) | Manufacturing method of mechanical blind hole and half hole | |
| CN112739039A (en) | Manufacturing method of PCB with large PTH hole and fine line | |
| CN111867266A (en) | Circuit design method for preventing short circuit of isolated circuit of PCB | |
| CN110785013A (en) | Manufacturing method for improving foaming and explosion of circuit board | |
| CN109548321B (en) | Manufacturing method of positive undercut PCB | |
| CN115135009A (en) | Method for manufacturing PCB character | |
| CN110545633A (en) | Manufacturing method of circuit board of blind hole plug-in | |
| CN114126260A (en) | Manufacturing method of ultra-thick copper PCB with 6oz inner layer and 12oz outer layer | |
| CN114040598A (en) | Method for removing flash of metalized half hole of electric gold plate | |
| CN114158195A (en) | Method for manufacturing precise circuit with assistance of laser | |
| CN111669905B (en) | Core plate, manufacturing method thereof and method for preventing bending plate of laminated plate from warping | |
| CN113660794A (en) | Manufacturing method of high-reliability printed circuit board | |
| CN113784545B (en) | Method for preventing resin plug hole from being broken by printed board | |
| CN113286433B (en) | Design method for fool-proofing of laser target of blind buried hole circuit board | |
| CN111741615B (en) | Method for pressing and filling glue of blind hole with high thickness-diameter ratio | |
| CN109640520B (en) | Manufacturing method of buried resistance circuit board | |
| CN110809372B (en) | Manufacturing method for improving solder resist white oil dropping |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |