CN110602890A - Manufacturing method of negative film circuit board with step circuit - Google Patents
Manufacturing method of negative film circuit board with step circuit Download PDFInfo
- Publication number
- CN110602890A CN110602890A CN201910665414.9A CN201910665414A CN110602890A CN 110602890 A CN110602890 A CN 110602890A CN 201910665414 A CN201910665414 A CN 201910665414A CN 110602890 A CN110602890 A CN 110602890A
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- circuit
- board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a negative circuit board with a step circuit. According to the invention, the circuit board with the step circuit is manufactured by two times of full-board electroplating, dry film exposure and development are utilized to manufacture the circuit pattern, and the copper layer in the non-circuit area is removed by acid etching, so that the circuit board with the step circuit is manufactured by a negative process, and the problem that the step circuit cannot be manufactured by the conventional negative process is solved. In addition, the invention adopts the vacuum film pressing machine and the LDI exposure machine to carry out corresponding film pasting and exposure procedures when manufacturing the outer layer circuit graph, optimizes film pasting process parameters, ensures the bonding force and the exposure precision between a dry film and a board surface, ensures that the protective performance of the outer layer graph on the production board meets the requirements in the etching process by optimizing the process parameters in acid etching, avoids the quality problems of open circuit, gap and the like caused by the infiltration of etching liquid into the outer layer graph, can reduce the side etching, and avoids the problem of large line width and line gap tolerance caused by the side etching.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a negative circuit board with a step circuit.
Background
The printed circuit board can be divided into a positive plate and a negative plate according to the manufacturing process of the outer layer circuit, the negative plate is a circuit board product which is manufactured by using a dry film exposure developing technology to manufacture a circuit pattern on a board surface when the outer layer circuit is manufactured, the circuit pattern covers a copper surface for forming the circuit, other copper surfaces are exposed, and then the same acid etching process as that used for manufacturing the inner layer circuit is adopted to manufacture the circuit, and the conventional manufacturing process comprises the following steps: cutting → inner layer pattern → acid etching → inner layer AOI → brown oxidation → pressing → drilling → copper deposition → whole plate plating → outer layer pattern → acid etching → outer layer AOI → solder resist, character → surface treatment → electric test → FQC → FQA → packaging. The circuit board with the ladder circuit, namely the circuit with different copper thicknesses on the same surface of the circuit board and/or the same circuit with different copper thicknesses, can not be manufactured by adopting the conventional negative film process.
Disclosure of Invention
The invention provides a method for manufacturing a negative circuit board with a step circuit, aiming at the problem that the circuit board with the step circuit cannot be manufactured by adopting the conventional negative process.
In order to achieve the purpose, the invention adopts the following technical scheme.
The invention provides a method for manufacturing a negative circuit board with a step circuit, wherein an outer layer circuit on the negative circuit board comprises a thin copper circuit and a thick copper circuit with the thickness larger than that of the thin copper circuit, and the method comprises the following steps:
s1, sequentially carrying out copper deposition and full-board electroplating on the production board to plate the thickness of the copper layer on the board surface to the thickness of copper required by the thin copper circuit;
s2, pasting a film on the production board, and windowing at the position corresponding to the thick copper circuit;
s3, performing full-plate electroplating on the production plate again, plating the thickness of the copper layer at the windowing position to the thickness of copper required by the thick copper circuit, and then stripping the film;
s4, pasting a film on the production board, and forming an outer-layer circuit pattern after sequentially exposing and developing; the outer layer circuit pattern covers the copper surface of the copper layer to be reserved;
s5, carrying out acid etching on the production board to remove the copper layer on the exposed copper surface, and then removing the film to obtain an outer layer circuit;
and S6, sequentially manufacturing a solder mask layer on the production board, performing surface treatment and molding to obtain the negative circuit board.
Further, step S1 is preceded by step S0: and drilling on the production plate.
Further, in both step S1 and step S3, full plate plating was performed at a current density of 18 ASF.
Further, in step S2, the film is bonded to the production board by a rapid press, where the parameters of the rapid press are: the temperature is 120 ℃, the pressure is 0.5MPa, and the speed is 1.0 m/min.
Further, in step S4, a vacuum laminator is used to laminate the film on the production board, and an LDI exposure machine is used to expose the film.
Further, in step S4, the film is bonded to the production board by pressing, where the pressing parameters are: the temperature is 45 +/-5 ℃, and the pressure is 4.2 +/-0.5 Kgf/cm2The time is 30 +/-10 s, and the speed is 3.0 +/-0.5 m/min.
Further, in step S5, the acidic etching parameters are: acidity of 2.0-3.0N, Cu2+The concentration is 110-3CAP value of 20-60, temperature of 50 + -2 deg.C, etching rate of 2.0-7.0m/min, and upper spray pressure of 2.2 + -0.5 kg/cm2The lower spray pressure is 1.8 plus or minus 0.5kg/cm2。
Furthermore, the production board is a multilayer board formed by pressing an inner core board and an outer copper foil into a whole through a prepreg.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the surface copper is plated to the thickness required by the thin copper circuit in a thick manner during the first full-board electroplating, then the copper surface at the thick copper circuit is exposed by making a pattern, the second full-board electroplating is carried out, the thickness required by the thick copper circuit is increased to the thick copper circuit, then the circuit pattern is made by utilizing dry film exposure and development, and the copper layer at the non-circuit area is removed by acid etching, so that the circuit board with the step circuit is made by using a negative film process, and the problem that the step circuit cannot be made by using the existing negative film process is solved. In addition, the invention adopts the vacuum film pressing machine and the LDI exposure machine to carry out corresponding film pasting and exposure procedures when manufacturing the outer layer circuit graph, optimizes film pasting process parameters, ensures the bonding force and the exposure precision between a dry film and a board surface, ensures that the protective performance of the outer layer graph on the production board meets the requirements in the etching process by optimizing the process parameters in acid etching, avoids the quality problems of open circuit, gap and the like caused by the infiltration of etching liquid into the outer layer graph, can reduce the side etching, and avoids the problem of large line width and line gap tolerance caused by the side etching.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to the following specific embodiments.
Example 1
The embodiment provides a method for manufacturing a negative circuit board with a step circuit, wherein an outer layer circuit on the negative circuit board comprises a thin copper circuit and a thick copper circuit, the copper thickness of the thick copper circuit is 2oz, the copper thickness of the thin copper circuit is 1oz, the line width and line gap are 4mil/4mil, and the tolerance of the line width and line gap is +/-3 μm. The method comprises the following specific steps:
(1) cutting: the core board is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core board is 0.5mm, and the thickness of the copper layers on the two surfaces of the core board is 0.50Z.
(2) Inner layer circuit manufacturing (negative film process): transferring inner layer pattern, coating photosensitive film with vertical coating machine, controlling film thickness of the photosensitive film to 8 μm, and completing inner layer circuit exposure with 6-8 exposure rulers (21 exposure rulers) by using full-automatic exposure machine; etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the inner layer line width is measured to be 4 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And (3) laminating: and (3) brown-oxidizing at the speed of brown-oxidizing according to the thickness of the bottom copper, sequentially laminating the core plate, the prepreg and the outer copper foil according to requirements, and then pressing the laminated plate by selecting proper lamination conditions according to the Tg of the plate to form the production plate.
(4) Drilling: according to the existing drilling technology, drilling processing is carried out on the production plate according to design requirements.
(5) Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the hole wall by using an electroless copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(6) Electroplating the whole plate: and performing full-plate electroplating at a current density of 18ASF, and plating the copper layer on the plate surface to the copper thickness required by the thin copper circuit part at one time.
(7) An outer layer pattern I: pasting a dry film on the production board, windowing the dry film at the position corresponding to the thick copper circuit, and covering and protecting the part of the board surface, which is not the thick copper circuit, by the dry film; specifically, the dry film is bonded on the production plate in a quick pressing mode, and the parameters of the quick pressing are as follows: the temperature is 120 ℃, the pressure is 0.5MPa, and the speed is 1.0 m/min.
(8) Electroplating the whole plate II: and performing full-plate electroplating at the current density of 18ASF, plating the copper layer at the windowing position to the copper thickness required by the thick copper circuit part, and then stripping the film.
(9) And (5) outer layer pattern II: because the copper thickness of the surface of the production plate has step difference, the conventional film pressing and exposure process cannot be adopted, a dry film is pasted on the production plate by adopting a vacuum film pressing machine, then the outer-layer circuit exposure is completed by adopting an LDI exposure machine, an outer-layer circuit pattern is formed on the production plate through development, and the outer-layer circuit pattern covers the copper surface of the copper layer to be reserved. Because of follow-up thick copper layer of getting rid of through acid etching (plate the thickness to thin copper circuit when electroplating for the first time whole board), for the protectiveness of outer circuit figure satisfies the requirement when guaranteeing follow-up acid etching, the pressfitting parameter when needing to optimize the pad pasting, it is specific, the pressfitting parameter of gluing dry film on the production board through vacuum film pressing machine is: the temperature is 45 +/-5 ℃, and the pressure is 4.2 +/-0.5 Kgf/cm2The time is 30 +/-10 s, and the speed is 3.0 +/-0.5 m/min. The parameters are preferably controlled at the median value: the temperature is 45 ℃ and the pressure is 4.2Kgf/cm2Time 30s, speed 3.0 m/min.
(10) Etching: acid etching is carried out on the production plate to remove the exposed copper surfaceRemoving the film to obtain an outer circuit; the acid etch use parameters were: the acid etch parameters were: acidity of 2.0-3.0N, Cu2+The concentration is 110-3CAP value of 20-60, temperature of 50 + -2 deg.C, etching rate of 2.0-7.0m/min (transport speed of production plate in etching cylinder, length of etching cylinder of 17m), and upper spray pressure of 2.2 + -0.5 kg/cm2The lower spray pressure is 1.8 plus or minus 0.5kg/cm2. Preferred parameters are acidity, NaClO3CAP value, temperature, upper spray pressure and lower spray pressure are controlled to be median, and etching speed is controlled to be 4.8-5.8 m/min.
(11) Outer layer AOI: and (4) detecting defects such as open short circuit, gap, pin hole and the like of the step line, repairing or scrapping the defects, and discharging the products without defects to the next flow.
(12) Solder resist and silk screen printing of characters: after the solder resist ink is printed on the surface of the production board in a silk-screen manner, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, TOP surface solder resist ink is printed by a white screen, and the TOP surface characters are added with UL marks, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and meanwhile, the effect of beautifying the appearance is achieved.
(13) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(14) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(15) And forming: according to the prior art and according to the design requirement, routing the shape, and obtaining the circuit board with the external tolerance of +/-0.05 mm.
(16) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the circuit board is inspected, if a defect exists, the circuit board is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(17) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not again.
(18) And packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
The same batch of circuit boards (total 1000 pieces) prepared by the method of the embodiment have no problems of open circuit and circuit notch caused by the fact that etching liquid medicine permeates into the outer layer pattern, and have no problems of repair or scrap caused by side corrosion, and the tolerance of line width and line gap meets the requirement.
Example 2
The embodiment provides a method for manufacturing a negative circuit board with a step circuit, wherein an outer layer circuit on the negative circuit board comprises a thin copper circuit and a thick copper circuit, the copper thickness of the thick copper circuit is 2oz, the copper thickness of the thin copper circuit is 1oz, the line width and line gap are 4mil/4mil, and the tolerance of the line width and line gap is +/-3 μm. The specific steps are basically the same as those of the embodiment 1, except that the pressing parameters used in the outer layer pattern II in the step (9) are as follows: the temperature is 120 ℃, the pressure is 0.5MPa, and the speed is 1.0 m/min.
In the same batch of circuit boards (total 50) prepared by the method of the embodiment, 5 of the circuit boards have the problems of open circuit and circuit notch caused by the fact that etching liquid medicine permeates into the outer layer pattern, but the problem that the circuit boards need to be repaired or scrapped caused by side etching does not occur, and the tolerance of line width and line gap meets the requirement.
Example 3
The embodiment provides a method for manufacturing a negative circuit board with a step circuit, wherein an outer layer circuit on the negative circuit board comprises a thin copper circuit and a thick copper circuit, the copper thickness of the thick copper circuit is 2oz, the copper thickness of the thin copper circuit is 1oz, the line width and line gap are 4mil/4mil, and the tolerance of the line width and line gap is +/-3 μm. The specific steps are substantially the same as those of example 1, except that etching is performed in step (10) as follows: carrying out acid etching on the production board to remove the copper layer on the exposed copper surface, and then removing the film to obtain an outer layer circuit; the parameters used for the acid etch were: acidity of 2.0-3.0N, Cu2+The concentration is 110-150g/L，NaClO3CAP value of 20-60, temperature of 50 + -2 deg.C, etching rate of 2.0-7.0m/min (transport speed of production plate in etching cylinder, length of etching cylinder of 17m), and upper spray pressure of 2.2 + -0.5 kg/cm2The lower spray pressure is 1.8 plus or minus 0.5kg/cm2. Preferred parameters are acidity, NaClO3The CAP value, temperature, upper and lower pressure are controlled to be median, and the etching rate is controlled to be 2.0-4.8 m/min.
The same batch of circuit boards (total 50) prepared by the method of the embodiment have the problems of open circuit and circuit gap due to the fact that etching liquid permeates into the outer layer pattern of 3 circuit boards, and have the problem of large line width and line gap tolerance caused by side etching, wherein the line width tolerance of the line gap is +/-5 mu m.
The technical contents of the present invention are further illustrated by the examples, so as to facilitate the understanding of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention.
Claims (8)
1. A manufacturing method of a negative circuit board with a step circuit is provided, wherein an outer layer circuit on the negative circuit board comprises a thin copper circuit and a thick copper circuit with the thickness larger than that of the thin copper circuit, and the manufacturing method comprises the following steps:
s1, sequentially carrying out copper deposition and full-board electroplating on the production board to plate the thickness of the copper layer on the board surface to the thickness of copper required by the thin copper circuit;
s2, pasting a film on the production board, and windowing at the position corresponding to the thick copper circuit;
s3, performing full-plate electroplating on the production plate again, plating the thickness of the copper layer at the windowing position to the thickness of copper required by the thick copper circuit, and then stripping the film;
s4, pasting a film on the production board, and forming an outer-layer circuit pattern after sequentially exposing and developing; the outer layer circuit pattern covers the copper surface of the copper layer to be reserved;
s5, carrying out acid etching on the production board to remove the copper layer on the exposed copper surface, and then removing the film to obtain an outer layer circuit;
and S6, sequentially manufacturing a solder mask layer on the production board, performing surface treatment and molding to obtain the negative circuit board.
2. The method of claim 1, wherein the full-plate electroplating is performed at a current density of 18ASF in both step S1 and step S3.
3. The method of claim 1, wherein in step S2, the film is adhered to the production board by rapid press bonding, and the parameters of the rapid press bonding are: the temperature is 120 ℃, the pressure is 0.5MPa, and the speed is 1.0 m/min.
4. The method of claim 1, wherein in step S4, a vacuum laminator is used to apply the film on the production board, and an LDI exposure machine is used to expose the film.
5. The method of claim 4, wherein in step S4, the film is adhered to the production board by pressing with a vacuum laminator, the pressing parameters are: the temperature is 45 +/-5 ℃, and the pressure is 4.2 +/-0.5 Kgf/cm2The time is 30 +/-10 s, and the speed is 3.0 +/-0.5 m/min.
6. The method of claim 5, wherein in step S5, the parameters of the acid etching are: acidity of 2.0-3.0N, Cu2+The concentration is 110-3CAP value of 20-60, temperature of 50 + -2 deg.C, etching rate of 2.0-7.0m/min, and upper pressure range of 2.2 + -0.5 kg/cm2The lower pressure is 1.8 plus or minus 0.5kg/cm2。
7. The method of claim 1, further comprising a step S0 before the step S1: and drilling on the production plate.
8. The method for manufacturing a negative wiring board with a ladder circuit according to claim 1, wherein the production board is a multi-layer board in which an inner core board and an outer copper foil are laminated into a whole by a prepreg.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910665414.9A CN110602890A (en) | 2019-07-22 | 2019-07-22 | Manufacturing method of negative film circuit board with step circuit |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910665414.9A CN110602890A (en) | 2019-07-22 | 2019-07-22 | Manufacturing method of negative film circuit board with step circuit |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111954383A (en) * | 2020-09-10 | 2020-11-17 | 星河电路（福建）有限公司 | Manufacturing method of local convex copper circuit board |
| CN114269076A (en) * | 2021-12-22 | 2022-04-01 | 无锡天杨电子有限公司 | Etching method for two-step pattern of thick-coated copper ceramic substrate |
| CN114521071A (en) * | 2022-01-24 | 2022-05-20 | 珠海市凯诺微电子有限公司 | Production process of multilayer impedance flexible printed circuit board |
| WO2023040116A1 (en) * | 2021-09-17 | 2023-03-23 | 无锡深南电路有限公司 | Circuit board processing method and circuit board |
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| CN114521071A (en) * | 2022-01-24 | 2022-05-20 | 珠海市凯诺微电子有限公司 | Production process of multilayer impedance flexible printed circuit board |
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Application publication date: 20191220 |