CN102064112A - Method for manufacturing copper cylinder through pattern transfer - Google Patents
Method for manufacturing copper cylinder through pattern transfer Download PDFInfo
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- CN102064112A CN102064112A CN2009102381810A CN200910238181A CN102064112A CN 102064112 A CN102064112 A CN 102064112A CN 2009102381810 A CN2009102381810 A CN 2009102381810A CN 200910238181 A CN200910238181 A CN 200910238181A CN 102064112 A CN102064112 A CN 102064112A
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- copper post
- photosensitive resist
- resist agent
- manufacture method
- metal
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Abstract
The invention discloses a method for manufacturing a copper cylinder through pattern transfer, which solves the problems in the prior art that a copper cylinder is tightly combined with a metal layer during pattern plating of the copper cylinder, and in the post process step manufacturing process, skip plating is reduced, stripping and falling are generated and the like, so as to realize inter-layer smooth interconnection. The method particularly comprises the following steps of: attaching a photosensitive anticorrosive additive on the surface of a metal layer to form a photosensitive pattern; performing thermo-curing to reinforce the sensitized photosensitive anticorrosive additive; and dissolving the unexposed photosensitive anticorrosive additive in weak alkaline solution, and cleaning the surface of the exposed metal layer. The method provided by the invention can increase the roughness of a gold surface, thereby enhancing the bonding capacity of gold threads, and simultaneously solving the problem of outlook defects generated therefrom.
Description
Technical field
The invention belongs to the making production field that the present invention relates to base plate for packaging, particularly a kind of base plate for packaging copper post figure transfer manufacture method that is applied to.
Background technology
In packaged substrate technology, can adopt copper post lamination method to make, it is higher that this kind method is communicated with stability, and the external environment that used by base plate for packaging influences less.Adopt in the copper post lamination method manufacturing process, the thickness of dielectric layers of the effect of altitude base plate for packaging of copper post, at present this Application for Field based on build less than 75um's, in the copper post figure transfer that build is higher than 75um is made, be communicated with problem such as open circuit in conjunction with the bad often appearance that comes off because of electroplating plating leakage and copper post and metal level.
In the prior art, employing is traditional figure transfer production program: surperficial pre-treatment, and--pad pasting--electroplate by exposure--development--.In the figure transfer process, because of the aperture too small, development liquid medicine enters that the back is difficult to exchange by the spray mode in the hole after the development, in follow-up washing processing procedure, there is the development liquid medicine of trace that the dry film that has exposed is carried out etch because of residual in the hole, make the dry film dissolving that has exposed and be deposited in the hole, in the drying course after washing, because of liquid medicine in the hole is dried, the dry film of exposure of stripping is deposited at the bottom of the hole, forms the non-conductive dry film that micropore is contained in the skim subregion.In the electroplating process, electroplate liquid medicine and can't form electro-coppering post layer by electroplating in the pore-free zone, this regional electro-coppering post layer forms plating leakage; When plating liquid medicine formed electro-coppering post layer by the zone that micropore is arranged on thin layer dry film surface, this regional electro-coppering post layer easily came off.
Summary of the invention
In order to solve the problem that prior art exists, the present invention proposes a kind of copper post figure transfer manufacture method, solving the copper post when the pattern plating copper post that exists in the prior art combines with metal level closely, in the operation manufacturing process of back, reduce plating leakage, peel off problem such as come off, to realize that inter-level interconnects is unimpeded.
Method of the present invention is specially:
A: the photosensitive resist agent is attached at layer on surface of metal, forms the sensitization figure;
B: carry out hot curing, reinforce the photosensitive resist agent of sensitization;
C: unexposed photosensitive resist agent is dissolved in the weakly alkaline solution;
D: exposed layer on surface of metal is cleaned.
More excellent, the photosensitive resist agent is attached at layer on surface of metal, the operation specific implementation that forms the sensitization figure is: take surface treatment, pad pasting, exposing operation, the photosensitive resist agent is attached at layer on surface of metal, and form the sensitization figure.
More excellent, described photosensitive resist agent is the photosensitive resist agent of thickness at 100-120um.
More excellent, when adopting plasma etch techniques that exposed layer on surface of metal is cleaned, the residue that operation forms in the removing.
More excellent, adopt developing process that unexposed photosensitive resist agent is dissolved in the weakly alkaline solution, stay the figure of sensitization at layer on surface of metal.
More excellent, also comprise following operation:
Photosensitive resist agent surface is regulated, increased the surface infiltration ability of dry film in electroplate liquid.
More excellent, also comprise the operation of graphic plating, form required copper post.
More excellent, after finishing plasma etching, also comprise the operation of adopting chemical cleaning and drying mode that the dust on surface is removed.
More excellent, adopt the thermal cycle baking oven that product is carried out hot curing, reinforce the photosensitive resist agent of sensitization; And strengthen the adhesion of photosensitive resist agent and metal level by photocuring.
More excellent, the operation that described surface-treated can be taked includes but not limited to: volcanic ash nog plate, chemical microetch or plasma splash operation;
The adoptable operation of described pad pasting includes but not limited to: vacuum pad pasting, wet film coating or hot pressing pad pasting;
The adoptable operation of described exposure includes but not limited to: parallel exposure machine, laser direct imaging exposure machine, digital direct imaging exposure machine, projection exposure machine or step printing machine operation.
By method of the present invention, the roughness of golden face is increased, thereby the binding ability of gold thread strengthen, and has also solved the problem of consequent open defect simultaneously.Can guarantee to electroplate phenomenon that back copper post comes off by dropping to more than 95% below 1.5%, the I of the diameter of copper post reaches 80um.
Description of drawings
Fig. 1 is the invention process method flow diagram;
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is set forth.
Main purpose of the present invention is to solve in build is higher than the copper post graphic making of 75um to cause be communicated with the problem that open circuit with metal level in conjunction with bad coming off because of electroplating plating leakage and copper post.Certainly, be suitable for too for the copper post graphic making of build less than 75um.
The present invention is by the following technical solutions: adopt hot curing to reinforce the resist of sensitization after with photosensitive resist agent sensitization, the degree of polymerization of increase photosensitive resist agent reaches the adhesion with metal level, develop the back by the exposed metal level of plasma etching process processes cleaning in the photosensitive resist agent, adjust the wetting capacity of photosensitive resist agent surface with electroplating solution.
The main technique step is as follows:
1.1: the photosensitive resist agent is attached at layer on surface of metal, forms the sensitization figure;
The photosensitive resist agent mainly concentrates between the 100-120um, when being lower than 100um because of the thickness of dry film, the bottom is residual and the surface infiltration ability is little to electroplating influence, and the influence of 120um thickness dry film is more obvious, in less than 100um thickness dry film, above-mentioned flow process is to electroplating the operation that also has some improvement.
--pad pasting--exposure that in this processing step, contains surface treatment, surface treatment is adoptable operations such as volcanic ash nog plate, chemical microetch, plasma splash; Pad pasting is adoptable operations such as vacuum pad pasting, wet film coating, hot pressing pad pasting; Exposing adoptablely has parallel exposure machine, laser direct imaging exposure machine, digital direct imaging exposure machine, projection exposure machine, step-by-step exposure machine etc. to operate.
1.2: carry out hot curing, reinforce the photosensitive resist agent of sensitization;
Adopt the thermal cycle baking oven that product is carried out hot curing in the present embodiment, reinforce the photosensitive resist agent of sensitization.
In order to reach better effect, can also strengthen the adhesion of photosensitive resist agent and metal level.The adhesion of photosensitive resist agent and metal level can improve by photocuring, the exposure in the conventional process flow just, and because of this patent also has the exposure flow process, but such adhesion is further strengthened in the hot curing meeting after the exposure.
1.3: unexposed photosensitive resist agent is dissolved in the weakly alkaline solution;
This step operation mainly is the figure that stays sensitization at layer on surface of metal.Adopt developing process that unexposed photosensitive resist agent is dissolved in the present embodiment and realize above-mentioned purpose in the weakly alkaline solution.
Under more excellent execution mode, can stay the figure of the degree of precision size of sensitization at layer on surface of metal.
Be primarily aimed at traditional laser driller skill herein: traditional laser driller skill, dimensional accuracy can be less than 20um between the hole, high-accuracy laser bores can reach 12um, but the precision that adopts the figure transfer operation to make mainly is subjected to the precision of the film or direct imaging exposure machine, traditional film craft precision can reach 12um, adopt direct imaging technology can reach 10um, in the internal evaluation test, the difficult to understand precious laser direct imaging machine dimension of picture precision of employing can reach below the 8um.
1.4: exposed layer on surface of metal is cleaned.
Adopt plasma etch techniques in the present embodiment, exposed layer on surface of metal is cleaned, the residue that operation forms in the removing.In the case study on implementation of the present invention, the radio frequency source of plasma apparatus adopts intermediate frequency or high frequency, electrode adopts horizontal or rectilinear, handle and can adopt oxygen, carbon tetrafluoride, argon gas or oxygen+carbon tetrafluoride mist, oxygen+argon gas mist with gas, the time was waited setting from 5 minutes to 20 minutes.
In the application process because of plasma etching, there is the dust after the processing to remain in dry film and copper surface, the end, in order to reach better effect, after finishing plasma etching, adopted chemical cleaning and drying mode that the dust on surface is removed in the case study on implementation of the present invention, the mode of chemical cleaning is adoptable horizontal fountain or an immersion type, and the liquid medicine of chemical cleaning is adoptable acid organic degreaser, low concentration acid solution, D.I water etc.
1.5: graphic plating forms the required copper post of technology.
Electroplate with common electroplating technology identically herein, be not described in detail at this.
In order to reach better effect, also can carry out following operation after in the present embodiment exposed layer on surface of metal being cleaned: photosensitive resist agent surface is regulated, increased the wetting capacity of resist surface with electroplating solution.Also promptly at the wetting capacity on dry film surface, for the wetting capacity on dry film surface, professional equipment has contact angle detection, also can adopt the visual way of water break.
Comparative evaluation result is as follows: before not adopting the Plasma flow processing, during the water break test, promptly break after the plate water outlet, can't form uniform moisture film on the dry film surface; After adopting Plasam to handle, during the water break test, form the layer of even thin water film on the film surface after the plate water outlet.The formation of this moisture film shows that the surface infiltration ability of dry film has extremely significantly to be improved.
By method of the present invention, the roughness of golden face is increased, thereby the binding ability of gold thread strengthen, and has also solved the problem of consequent open defect simultaneously.Can guarantee to electroplate phenomenon that back copper post comes off by dropping to more than 95% below 1.5%, the I of the diameter of copper post reaches 80um.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (10)
1. copper post figure transfer manufacture method is characterized in that this method may further comprise the steps:
A: the photosensitive resist agent is attached at layer on surface of metal, forms the sensitization figure;
B: carry out hot curing, reinforce the photosensitive resist agent of sensitization;
C: unexposed photosensitive resist agent is dissolved in the weakly alkaline solution;
D: exposed layer on surface of metal is cleaned.
2. copper post figure transfer manufacture method as claimed in claim 1 is characterized in that the steps A specific implementation is: take surface treatment, pad pasting, exposing operation, the photosensitive resist agent is attached at layer on surface of metal, and form the sensitization figure.
3. copper post figure transfer manufacture method as claimed in claim 2 is characterized in that, described photosensitive resist agent is the photosensitive resist agent of thickness at 100-120um.
4. copper post figure transfer manufacture method as claimed in claim 1 is characterized in that, when adopting plasma etch techniques that exposed layer on surface of metal is cleaned, and the residue that operation forms in the removing.
5. copper post figure transfer manufacture method as claimed in claim 1 is characterized in that, adopts developing process that unexposed photosensitive resist agent is dissolved in the weakly alkaline solution, stays the figure of sensitization at layer on surface of metal.
6. copper post figure transfer manufacture method as claimed in claim 1 is characterized in that, also comprises following operation:
Photosensitive resist agent surface is regulated, increased the surface infiltration ability of dry film in electroplate liquid.
7. as the described copper post of claim 1-6 figure transfer manufacture method, it is characterized in that, also comprise the operation of graphic plating, form required copper post.
8. copper post figure transfer manufacture method as claimed in claim 7 is characterized in that, also comprises the operation of adopting chemical cleaning and drying mode that the dust on surface is removed after finishing plasma etching.
9. copper post figure transfer manufacture method as claimed in claim 1 is characterized in that, adopts the thermal cycle baking oven that product is carried out hot curing, reinforces the photosensitive resist agent of sensitization; And strengthen the adhesion of photosensitive resist agent and metal level by photocuring.
10. copper post figure transfer manufacture method as claimed in claim 2 is characterized in that the operation that described surface-treated can be taked includes but not limited to: volcanic ash nog plate, chemical microetch or plasma splash operation;
The adoptable operation of described pad pasting includes but not limited to: vacuum pad pasting, wet film coating or hot pressing pad pasting;
The adoptable operation of described exposure includes but not limited to: parallel exposure machine, laser direct imaging exposure machine, digital direct imaging exposure machine, projection exposure machine or step printing machine operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102381810A CN102064112A (en) | 2009-11-17 | 2009-11-17 | Method for manufacturing copper cylinder through pattern transfer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102381810A CN102064112A (en) | 2009-11-17 | 2009-11-17 | Method for manufacturing copper cylinder through pattern transfer |
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| CN102064112A true CN102064112A (en) | 2011-05-18 |
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| CN2009102381810A Pending CN102064112A (en) | 2009-11-17 | 2009-11-17 | Method for manufacturing copper cylinder through pattern transfer |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103207534A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A method for improving opening quality of an electroformed plate |
| CN107622951A (en) * | 2016-07-14 | 2018-01-23 | 住友电木株式会社 | The manufacture method of semiconductor device |
| CN110267443A (en) * | 2019-06-17 | 2019-09-20 | 江门崇达电路技术有限公司 | A kind of production method of the positive wiring board with ladder route |
| CN110602890A (en) * | 2019-07-22 | 2019-12-20 | 江门崇达电路技术有限公司 | Manufacturing method of negative film circuit board with step circuit |
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| CN1333561A (en) * | 2001-06-08 | 2002-01-30 | 财团法人工业技术研究院 | Method for preparing non-electroplating more than two layers of metal convex blocks |
| CN1788337A (en) * | 2003-05-27 | 2006-06-14 | 株式会社荏原制作所 | Plating apparatus and plating method |
| CN101146901A (en) * | 2005-01-27 | 2008-03-19 | 高级技术材料公司 | Compositions for processing of semiconductor substrates |
| US20080188071A1 (en) * | 2001-03-05 | 2008-08-07 | Megic Corporation | Low fabrication cost, fine pitch and high reliability solder bump |
-
2009
- 2009-11-17 CN CN2009102381810A patent/CN102064112A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080188071A1 (en) * | 2001-03-05 | 2008-08-07 | Megic Corporation | Low fabrication cost, fine pitch and high reliability solder bump |
| CN1333561A (en) * | 2001-06-08 | 2002-01-30 | 财团法人工业技术研究院 | Method for preparing non-electroplating more than two layers of metal convex blocks |
| CN1788337A (en) * | 2003-05-27 | 2006-06-14 | 株式会社荏原制作所 | Plating apparatus and plating method |
| CN101146901A (en) * | 2005-01-27 | 2008-03-19 | 高级技术材料公司 | Compositions for processing of semiconductor substrates |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103207534A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A method for improving opening quality of an electroformed plate |
| CN107622951A (en) * | 2016-07-14 | 2018-01-23 | 住友电木株式会社 | The manufacture method of semiconductor device |
| CN110267443A (en) * | 2019-06-17 | 2019-09-20 | 江门崇达电路技术有限公司 | A kind of production method of the positive wiring board with ladder route |
| CN110602890A (en) * | 2019-07-22 | 2019-12-20 | 江门崇达电路技术有限公司 | Manufacturing method of negative film circuit board with step circuit |
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Application publication date: 20110518 |