CN103429008A - Manufacture method of printed circuit board with via on pad - Google Patents
Manufacture method of printed circuit board with via on pad Download PDFInfo
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- CN103429008A CN103429008A CN2012101661407A CN201210166140A CN103429008A CN 103429008 A CN103429008 A CN 103429008A CN 2012101661407 A CN2012101661407 A CN 2012101661407A CN 201210166140 A CN201210166140 A CN 201210166140A CN 103429008 A CN103429008 A CN 103429008A
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Abstract
The invention relates to a manufacture method of a printed circuit board with a via on pad. The manufacture method comprises the steps that a via is drilled on the printed circuit board, wherein resin via plugging is going to be carried out on the via; photosensitive resin covering is carried out on the surface of the printed circuit board; after exposure and development, the via is exposed; the copper layer around the via is thinned; the via is electroplated with copper, and at the same time the copper layer around the via is thickened; photosensitive resin is peeled; overall electroplating is carried out on the printed circuit board, so that the thickness of the copper layer in the via meets a requirement; resin via plugging is carried out on the via; leveling treatment is carried out on the surface of the printed circuit board; excess via plugging resin on the board surface is removed; copper plating and blocking are carried out on the surface of the via after resin via plugging; and outer layer graph manufacture is carried out, so as to form the via on pad.
Description
Technical field
The present invention relates to the print circuit plates making technical field, particularly containing the manufacturing technology of the printed circuit board (PCB) of through-hole construction in weld pad.
Background technology
Development along with electronic information technology, electronic product is towards lightweight, microminiaturization, high speed future development, printed circuit board (PCB) is had higher requirement, also thereby derive the different printed circuit board arrangements of form in the past, as contained through-hole construction (Via on pad) etc. in weld pad, as shown in Figure 9.
In weld pad, through-hole construction is, carry out filling holes with resin in completing the through hole of plating after, the end-blocking plating to be carried out in the two in hole; After completing the outer making of printed circuit board (PCB), the two ends of through hole form weld pad, for part on follow-up electronic component.This design is more and more general in multilayer board.
Usually the technological process of making through-hole construction in weld pad is as follows:
Boring 1, electroplate 1, filling holes with resin, leveling 1, subtract copper, flatten 2, hole 2, electroplate 2, skin
Can find out from top flow process, make through-hole construction in weld pad and need to carry out 2 plating.In order to guarantee that the copper layer thickness in through hole meets 25.4 microns, twice plating at least increases the copper layer of 60 micron thick at the printed circuit board (PCB) skin, add approximately 18 microns of copper of outer original end, outer total copper is thick will reach 78 microns, cause carrying out the making on fine rule road.Therefore, increased the step that subtracts copper in above-mentioned flow process, purpose is exactly to reduce the thickness of copper, is beneficial to the making of circuit.But, while subtracting copper, subtract copper liquid medicine and easily through hole (hole that especially resin was clogged) copper layer is on every side excessively stung to erosion, make after copper facing to produce depression, the reliability problem while causing part on subsequent element.
The development trend of current printed circuit board (PCB) is to make the high circuit board product of line density.The purpose that through-hole construction occurs in weld pad also is this, but, due to the thick problem of outer copper when the actual fabrication, has limited the raising of line density.Therefore, when need to have a kind of way to make the interior through-hole construction of weld pad, solve the problem that outer copper is thick.
Summary of the invention
Therefore, be necessary to provide a kind of print circuit plates making method containing through-hole construction in weld pad, the outer-layer circuit that can the method produce when solving the interior through-hole construction of actual fabrication weld pad is blocked up, can't make the problem on fine rule road.
Below will a kind of print circuit plates making method containing through-hole construction in weld pad be described with embodiment:
Get out the through hole that will carry out filling holes with resin on printed circuit board (PCB); Printed circuit board surface is carried out to the photosensitive resin covering, after overexposure, developing, expose through hole; Copper layer around the attenuate through hole; Through hole copper layer is on every side thickeied in the through hole electro-coppering simultaneously; Divest photosensitive resin, printed circuit board (PCB) is carried out to integral body and electroplate, make the copper layer thickness in through hole reach requirement; Through hole is carried out to filling holes with resin; Printed circuit board surface is flattened to processing, remove the unnecessary plug socket resin of plate face; The copper facing end-blocking is also carried out in through hole surface after filling holes with resin; Carry out the outer graphics making, form containing through-hole construction in weld pad.
Compared with prior art, the method adopts carries out around the hole of filling holes with resin carrying out that selectivity subtracts copper and selectivity is plated his copper to needs, solved the existing printed circuit board surface copper layer containing through-hole construction in weld pad blocked up, and the problem that can't carry out the dense wire making.
The accompanying drawing explanation
Fig. 1 is the structural representation of the substrate that provides of the technical program embodiment.
Fig. 2 is that in Fig. 1, substrate covers and reveal around through hole the structural representation of copper through boring, photosensitive resin.
Fig. 3 is that in Fig. 2, substrate subtracts the structural representation of copper through selectivity.
Fig. 4 is the structural representation of substrate process selective electroplating in Fig. 3.
Fig. 5 is the structural representation that in Fig. 4, the substrate process divests photosensitive resin.
Fig. 6 is the structural representation of substrate through flattening in Fig. 5.
Fig. 7 is the structural representation that in Fig. 6, substrate is electroplated through end-blocking.
Fig. 8 is the structural representation that in Fig. 7, substrate is made through outer graphics.
Fig. 9 is containing through-hole construction in weld pad in prior art.
Embodiment
A kind of print circuit plates making method containing through-hole construction in weld pad the technical program embodiment provided below in conjunction with embodiment is described in further detail
Refer to Fig. 1 to Fig. 8, a kind of print circuit plates making method containing through-hole construction in weld pad that the present embodiment provides:
The first step, provide a substrate 100
As shown in Figure 1, in the present embodiment, substrate 100, for needing the semi-finished product of holing and making in the print circuit plates making process, comprises copper layer 110, insulating barrier 120.Copper layer 110 can be cathode copper or calendering copper, and thickness can be 5 microns ~ 210 microns, and insulating barrier 120 can be the epoxy resin of glass cloth enhancing, polyphenylene oxide, and polyimides or polytetrafluoroethylene etc., thickness is 5 microns ~ 500 microns; Can select the substrate 100 of different structure according to the structure of the circuit board that will make, can be single sided board, double sided board or multi-layer sheet.In the present embodiment, substrate 100 is double sided board.
Second step, get out the through hole that will carry out filling holes with resin, and the printed circuit board surface after boring is carried out to the photosensitive resin covering, after overexposure, developing, exposes through hole and hole copper layer on every side;
As shown in Figure 2, after substrate 100 borings, become printed circuit boards half-finished product 200.
Substrate surface is carried out to the photosensitive resin covering, form photosensitive resin layer 210.The mode that photosensitive resin covers can be the modes such as roller coat, curtain painting, electrostatic spraying, also can adopt the mode of being suppressed light-sensitive surface (dry film) at substrate surface.The thickness of photosensitive resin or light-sensitive surface is 3 microns ~ 50 microns, preferably, and 10 microns ~ 30 microns.
The substrate 200 that effects on surface scribbles photosensitive resin is exposed and is developed.Ultraviolet light take during exposure as light source, can be directional light, can be also scattered light; After exposure, the photosensitive resin generation cross-linking reaction in UV-irradiation district, the photosensitive resin in non-UV-irradiation district does not react, and in follow-up developing process, is developed liquid and dissolves, and exposes through hole and hole copper layer 220 on every side.The long-pending maximum of the copper aspect of exposing around through hole must not surpass the final pad area containing through-hole construction in weld pad, can be circle, square, and rectangle etc. is consistent with the final pad shapes containing through-hole construction in weld pad.
The 3rd step, the copper layer around the attenuate through hole
Subtracting thin copper layer can be undertaken by the mode of chemical etching, and the etching solution used can be acidic copper chloride, and sulfuric acid-hydrogen peroxide or alkaline copper chloride system be take sulfuric acid-hydrogen peroxide system as optimum.Form structure as shown in Figure 3,310 after subtracting copper
Processed rear remaining copper layer for subtracting copper around through hole.This copper layer thickness is 2 microns ~ 12 microns, preferably, and 5 microns ~ 10 microns; Subtract the number of times that copper processes and do not limit, but subtract copper 1 time as excellent in order to reduce the generation of lateral erosion, to take, subtract the copper amount and take and do not expose insulating barrier 120 as good.In the present embodiment, substrate copper layer 110 thickness are 17 microns, subtract copper through 1 time, and 310 regional copper layer thickness are 7 microns ~ 10 microns.After subtracting copper and completing, obtain printed circuit boards half-finished product 300.
The 4th step, through hole copper layer is on every side thickeied in the through hole electro-coppering simultaneously
Printed circuit boards half-finished product 300 is carried out to the electro-coppering processing.Electro-coppering be take phosphorous copper balls as anode, and printed circuit boards half-finished product 300 is negative electrode, and electroplate liquid consists of copper sulphate, sulfuric acid and electroplating additives.Due to the existence of photosensitive resin layer 210, copper only 310 is deposited in through hole and around through hole, the final copper electroplating layer 410 that forms the parcel through hole.By controlling the parameters such as electroplating time, current density, the thickness of copper electroplating layer 410 is consistent with the copper layer thickness of photosensitive resin institute cover part.Now, obtained printed circuit boards half-finished product 400.
The 5th step, divest photosensitive resin, printed circuit board (PCB) carried out to integral body and electroplate, and makes the copper layer thickness in through hole reach requirement
Printed circuit boards half-finished product 400 is put in the sodium carbonate liquor that mass percent is 3% ~ 5%, covers after the photosensitive resin on 400 surfaces and sodium carbonate react and be dissolved in sodium carbonate liquor and divested; And then printed circuit boards half-finished product is carried out to the electro-coppering operation, copper layer thickness derives from the requirement of final printed circuit panel products to copper layer thickness in through hole, if can obtain meeting the copper layer thickness of product demand in previous step, in this step, one of copper facing can be cancelled.By above step, obtained printed circuit boards half-finished product 500
The 6th step, carry out filling holes with resin to through hole, and printed circuit board surface is flattened to processing
Printed circuit boards half-finished product 500 is carried out to the filling holes with resin processing.The mode of available silk screen printing, the mode of Vacuum printing or vacuum taphole machine carry out consent to through hole, obtain the printed circuit board arrangement shown in Fig. 6, wherein 610 through holes that just refer to after resin is clogged; Consent resin used be take epoxy resin as main body, adds filler, curing agent and flexibilizer etc., but not containing any organic solvent, solid content is 100%; After consent, plug socket resin projecting plate face is 1 ~ 100 micron, preferably, and 3 microns ~ 10 microns; After the through hole filling holes with resin, put into baking oven and toasted, make plug socket resin fully curing.The mode that condition of cure can the employing stage heats up, also can directly be warmed up to high temperature and be cured, and the curing mode that the stage heats up of take is best; After solidifying, require in through hole without bubble free from flaw.Due to plug socket resin projecting plate face, need to adopt the mode of polish-brush will protrude from the outer resin of printed circuit board and grind off, the polish-brush adhesive-bonded fabric, nylon bruss and pottery are brushed and are carried out.Obtain printed circuit boards half-finished product 600 after leveling
The 7th step, also carry out the copper facing end-blocking to the through hole surface after filling holes with resin;
As shown in Figure 7, printed circuit boards half-finished product 600 is electroplated, obtained copper layer 710 and printed circuit boards half-finished product 700 to the through hole end-blocking after filling holes with resin.If also have other in PCB design without the through hole formed containing through-hole construction in weld pad, to before this step, to printed circuit boards half-finished product 600, be holed, thereby electroplate except will, to the through hole end-blocking after filling holes with resin, also to other through hole, having carried out the hole wall plating specifically.The thickness of end-blocking copper layer is by the designing requirement decision of printed circuit board (PCB), and General Requirements is 15 microns ~ 50 microns, take 25 microns ~ 35 microns as good.The parameter such as electroplating time, electroplating current that can regulate electro-coppering during practical operation reaches.
The 8th step, carry out the outer graphics making, forms containing through-hole construction in weld pad.
As shown in Figure 8, printed circuit boards half-finished product 700 is carried out to common outer graphics making, comprise and press dry film, exposure, develop, and etching obtains the printed circuit board (PCB) 800 containing through-hole construction 810 in weld pad.
Above, completed the making containing the printed circuit board (PCB) of through-hole construction in weld pad.Method of the present invention adopts selectivity to subtract copper and selectivity copper coating, has solved the existing printed circuit board surface copper layer containing through-hole construction in weld pad blocked up, and the problem that can't carry out the dense wire making.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection range of the claims in the present invention.
Claims (11)
1. the print circuit plates making method containing through-hole construction in weld pad, it comprises the following steps: get out the through hole that will carry out filling holes with resin on printed circuit board (PCB); Printed circuit board surface is carried out to the photosensitive resin covering, after overexposure, developing, expose through hole; Copper layer around the attenuate through hole; Through hole copper layer is on every side thickeied in the through hole electro-coppering simultaneously; Divest photosensitive resin, printed circuit board (PCB) is carried out to integral body and electroplate, make the copper layer thickness in through hole reach requirement; Through hole is carried out to filling holes with resin; Printed circuit board surface is flattened to processing, remove the unnecessary plug socket resin of plate face; The copper facing end-blocking is also carried out in through hole surface after filling holes with resin; Carry out the outer graphics making, form containing through-hole construction in weld pad.
2. the print circuit plates making technology containing through-hole construction in weld pad as claimed in claim 1, is characterized in that adopting the method for photosensitive resin optionally to subtract copper to copper layer around through hole.
3. selectivity according to claim 2 subtracts copper technology, and it is characterized in that subtracting copper layer thickness after copper is 2 microns ~ 12 microns.
4. selectivity according to claim 2 subtracts copper technology, and it is characterized in that subtracting copper layer thickness after copper is 5 microns ~ 10 microns.
5. selectivity according to claim 2 subtracts copper technology, it is characterized in that repeatedly subtracting copper.
6. selectivity according to claim 2 subtracts copper technology, it is characterized in that repeatedly subtracting copper.
7. the print circuit plates making technology containing through-hole construction in weld pad as claimed in claim 1, is characterized in that adopting the method for photosensitive resin to carry out optionally copper facing to copper layer around through hole.
8. selectivity copper facing technology as claimed in claim 7, is characterized in that copper layer thickness after copper facing is consistent with the copper layer thickness of photosensitive resin institute cover part.
9. the print circuit plates making technology containing through-hole construction in weld pad as claimed in claim 1, is characterized in that through hole is carried out to filling holes with resin.
10. the print circuit plates making technology containing through-hole construction in weld pad as claimed in claim 1, is characterized in that printed circuit board (PCB) is flattened.
11. the print circuit plates making technology containing through-hole construction in weld pad as claimed in claim 1, is characterized in that the copper facing end-blocking is also carried out in the through hole surface after filling holes with resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101661407A CN103429008A (en) | 2012-05-25 | 2012-05-25 | Manufacture method of printed circuit board with via on pad |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012101661407A CN103429008A (en) | 2012-05-25 | 2012-05-25 | Manufacture method of printed circuit board with via on pad |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103781291A (en) * | 2014-02-25 | 2014-05-07 | 昆山苏杭电路板有限公司 | Process for plugging holes in printed board by using resin |
| CN104185385A (en) * | 2014-08-21 | 2014-12-03 | 江苏迪飞达电子有限公司 | Method for machining micro buried hole board |
| CN104717845A (en) * | 2013-12-13 | 2015-06-17 | 深圳崇达多层线路板有限公司 | Technological method for outer layer circuit board resin hole plugging of multi-layer circuit board |
| CN104780711A (en) * | 2015-05-07 | 2015-07-15 | 博敏电子股份有限公司 | Method for reworking abnormal blind hole filling copper electroplating circuit board |
| CN104968162A (en) * | 2015-05-26 | 2015-10-07 | 维沃移动通信有限公司 | PCB processing method and PCB |
| CN105163520A (en) * | 2015-08-19 | 2015-12-16 | 深圳市迅捷兴电路技术有限公司 | Preparation method of fine-line printed circuit board with mechanical blind holes and buried holes |
| CN106163102A (en) * | 2015-04-02 | 2016-11-23 | 富葵精密组件(深圳)有限公司 | Flexible PCB and preparation method thereof |
| CN106332443A (en) * | 2015-06-29 | 2017-01-11 | 富葵精密组件(深圳)有限公司 | Manufacturing method for flexible printed circuit board |
| CN111988920A (en) * | 2020-10-27 | 2020-11-24 | 智恩电子(大亚湾)有限公司 | Solder-resisting hole plugging method for BMU printed circuit board |
| CN113316310A (en) * | 2021-05-18 | 2021-08-27 | 南京宏睿普林微波技术股份有限公司 | Microwave multilayer board and manufacturing method thereof |
| WO2021184231A1 (en) * | 2020-03-18 | 2021-09-23 | 柏承科技(昆山)股份有限公司 | Low-cost and high-process-capability printed circuit board manufacturing method |
| CN113936545A (en) * | 2021-10-15 | 2022-01-14 | 业成科技（成都）有限公司 | Backlight module and manufacturing method thereof |
| CN113973436A (en) * | 2021-10-26 | 2022-01-25 | 广州添利电子科技有限公司 | Method for protecting PCB surface in resin plug hole and PCB resin plug hole process |
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| US6222136B1 (en) * | 1997-11-12 | 2001-04-24 | International Business Machines Corporation | Printed circuit board with continuous connective bumps |
| US20120043128A1 (en) * | 2010-08-18 | 2012-02-23 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
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Patent Citations (2)
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| US6222136B1 (en) * | 1997-11-12 | 2001-04-24 | International Business Machines Corporation | Printed circuit board with continuous connective bumps |
| US20120043128A1 (en) * | 2010-08-18 | 2012-02-23 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104717845A (en) * | 2013-12-13 | 2015-06-17 | 深圳崇达多层线路板有限公司 | Technological method for outer layer circuit board resin hole plugging of multi-layer circuit board |
| CN103781291A (en) * | 2014-02-25 | 2014-05-07 | 昆山苏杭电路板有限公司 | Process for plugging holes in printed board by using resin |
| CN104185385A (en) * | 2014-08-21 | 2014-12-03 | 江苏迪飞达电子有限公司 | Method for machining micro buried hole board |
| CN106163102B (en) * | 2015-04-02 | 2018-11-23 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and preparation method thereof |
| CN106163102A (en) * | 2015-04-02 | 2016-11-23 | 富葵精密组件(深圳)有限公司 | Flexible PCB and preparation method thereof |
| CN104780711B (en) * | 2015-05-07 | 2018-05-25 | 博敏电子股份有限公司 | A kind of blind hole fills out the rework method of copper plating abnormal circuit plate |
| CN104780711A (en) * | 2015-05-07 | 2015-07-15 | 博敏电子股份有限公司 | Method for reworking abnormal blind hole filling copper electroplating circuit board |
| CN104968162A (en) * | 2015-05-26 | 2015-10-07 | 维沃移动通信有限公司 | PCB processing method and PCB |
| CN106332443A (en) * | 2015-06-29 | 2017-01-11 | 富葵精密组件(深圳)有限公司 | Manufacturing method for flexible printed circuit board |
| CN106332443B (en) * | 2015-06-29 | 2019-03-08 | 庆鼎精密电子（淮安）有限公司 | The production method of flexible circuit board |
| CN105163520A (en) * | 2015-08-19 | 2015-12-16 | 深圳市迅捷兴电路技术有限公司 | Preparation method of fine-line printed circuit board with mechanical blind holes and buried holes |
| WO2021184231A1 (en) * | 2020-03-18 | 2021-09-23 | 柏承科技(昆山)股份有限公司 | Low-cost and high-process-capability printed circuit board manufacturing method |
| CN111988920A (en) * | 2020-10-27 | 2020-11-24 | 智恩电子(大亚湾)有限公司 | Solder-resisting hole plugging method for BMU printed circuit board |
| CN111988920B (en) * | 2020-10-27 | 2021-01-01 | 智恩电子(大亚湾)有限公司 | Solder-resisting hole plugging method for BMU printed circuit board |
| CN113316310A (en) * | 2021-05-18 | 2021-08-27 | 南京宏睿普林微波技术股份有限公司 | Microwave multilayer board and manufacturing method thereof |
| CN113936545A (en) * | 2021-10-15 | 2022-01-14 | 业成科技（成都）有限公司 | Backlight module and manufacturing method thereof |
| CN113936545B (en) * | 2021-10-15 | 2024-01-16 | 业成科技（成都）有限公司 | Backlight module and manufacturing method thereof |
| CN113973436A (en) * | 2021-10-26 | 2022-01-25 | 广州添利电子科技有限公司 | Method for protecting PCB surface in resin plug hole and PCB resin plug hole process |
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