CN105163520A - Preparation method of fine-line printed circuit board with mechanical blind holes and buried holes - Google Patents
Preparation method of fine-line printed circuit board with mechanical blind holes and buried holes Download PDFInfo
- Publication number
- CN105163520A CN105163520A CN201510508922.8A CN201510508922A CN105163520A CN 105163520 A CN105163520 A CN 105163520A CN 201510508922 A CN201510508922 A CN 201510508922A CN 105163520 A CN105163520 A CN 105163520A
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- Prior art keywords
- copper
- hole
- thickness
- buried
- blind
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0353—Making conductive layer thin, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a preparation method of a fine-line printed circuit board with mechanical blind holes and buried holes. The method comprises the steps as follows: lamination is carried out on a copper foil with the thickness of 35 microns to ensure the smoothness of the laminated surface, so that resin can be smoothly cut when ground; blind holes and buried holes are drilled in a mechanical drilling manner; electroplating is carried out, so that hole copper and surface copper simultaneously reach 20 microns in thickness, or a hole plating technology is adopted; the blind holes or the buried holes are stuffed with epoxy resin, and excessive resin in openings of the holes are ground smoothly to ensure the welding effect of a surface mount technology (SMT); the surface copper of which the thickness is 35 microns+20 microns is thinned to 15-20 microns in a chemical manner to ensure the preparation requirements of a fine line; and for electroplating of the hole plating technology, the surface copper of which the thickness is 35 microns is thinned to 15-20 microns in the chemical manner. Through the method, the barrier that the fine line cannot be prepared by a mechanical blind hole and buried hole structure in the printed board industry can be solved; and the method is very suitable for the mechanical blind hole and buried hole structure of a non-fine line.
Description
Technical field
The present invention relates to circuit board manufacturing area, particularly blind, the buried via hole fine-line method for manufacturing printed circuit board of a kind of machinery.
Background technology
The development of electron trade, the printing printed circuit board (PCB) of buried blind via structure are seen everywhere, and have almost become the essential structure that electronic product Terminal Design is enhanced product performance, and wherein iPhone4,5,6 all adopts buried blind via project organization.This type of structural design is printed printed circuit andante industry and is divided into two kinds of Drilling operation modes and two kinds of filling perforation processing modes, and wherein, two kinds of bore modes are laser drilling and machine drilling, and two kinds of filling perforation modes are plating filling perforation and resin filling perforation.
Above two kinds of techniques need the effect that reaches to be identical with object for designer, and electric performance conducting has can farthest save printed board volume, but just needs careful consideration concerning printed board makes, adopts which kind of mode to make.The technique way of machine drilling resin plug can only be confined to, printed board top layer traverse design uses when enough large, otherwise resin will be there will be and polish hourglass base material problem, or etching unclean problem during thick etching wire partially thick in copper, two kinds of problems are scrapped directly causing printed circuit board.
The technology of laser drilling plating filling perforation is the most advanced in the industry technique of printed board, but still there are certain requirements the thickness of aperture and dielectric layer, the maximum straight apertures 0.15mm of laser drilling, depth capacity 0.125mm, and can only adjacent layer boring.Therefore, the situation of mechanical hole resin plug just will inevitably occur, the design adopting this technique to make the two ends conductor layer of printed board hole when just seems extremely important.Live width line-spacing once the wire at two ends is less than 0.075mm and just cannot makes.
Visible, above-mentioned two kinds of techniques respectively have pluses and minuses, the printed board adopting laser drilling plating process for filling hole method to make buried blind via structure needs to consider, medium thick (decision working depth), need the maximum diameter of hole of via, and each laser drilling can only conducting adjacent layer, if so there is the circuit of four layers to need that just needs three radium-shine processing and plating filling perforation of conducting, this can cause the increase greatly of cost, and the cycle of manufacturing is very of a specified duration.
Adopt the process of machine drilling resin plug to make buried blind via structure printed board it is envisaged that the conductor width at two ends, hole and wire pitch, cannot make when live width line-spacing is less than 0.075mm, be less than 0.1mm and have wire risk of delamination.
See like this, adopt the process of machine drilling resin plug to be produced on production efficiency to be better than, to adopt laser drilling to electroplate the making of process for filling hole method, but by the impact of live width line-spacing, machine drilling resin plug technique way is when electroplating, hole copper and face copper increase simultaneously, the face copper on this meeting top layer, causing hole two ends thickens, and when etching, difficulty or ease etching totally causes short circuit.If the pressing copper at two ends is changed thin, will be easy to when grinding smooth after such filling holes with resin occur leaking base material problem, its reason is that the reduction that difference and Copper Foil owing to being pressed together on inner lead distribution changes thin rear toughness causes skin to occur the larger phenomenon that is uneven, higher point occurs that when resin ground layers of copper is ground problem not, base material is leaked if not polished, so surface layers of copper also can be very thin, if the thickness being less than 5um go out to subsides part station just there will be layers of copper be heated after lamination problem.
Summary of the invention
The invention provides blind, the buried via hole fine-line method for manufacturing printed circuit board of a kind of machinery, the problem of fine-line cannot be made to solve mechanical buried blind via structure in prior art printed board industry.
For solving the problem, as one aspect of the present invention, providing blind, the buried via hole fine-line method for manufacturing printed circuit board of a kind of machinery, comprising: step 1, sawing sheet; Step 2, makes inner conductor by wire pattern; Step 3, selects 35um thickness Copper Foil to carry out pressing, to ensure pressing rear surface planarization, and cutting that can be smooth when making resin ground; Step 4, adopts machine drilling mode to bore blind buried via hole; Step 5, changes copper: make metallization in blind buried via hole reach interlayer conduction; Step 6, plating; Make hole copper and face copper reach 20um thickness simultaneously, or adopt plated hole technique; Step 7, filling holes with resin: adopt epoxy resin to clog blind hole or buried via hole, at the welding effect by smooth for resin ground unnecessary for aperture guarantee SMT; Step 8, subtracts copper: adopt chemical mode to reduce between 15-20um by the face copper of 35um+20um thickness, ensure the making demand of fine wire; For the plating adopting plated hole technique, chemical mode is adopted to reduce between 15-20um by the face copper of its 35um thickness; Step 9, boring: adopt power auger hole drill insert hole; Step 10, changes copper: make metallization in insert hole reach interlayer conduction; Step 11, plating: make insert hole copper reach predetermined thickness; Step 12, makes outer layer conductor by wire pattern; Step 13, carries out graphic plating, reaches predetermined thickness to make hole copper and face copper; Step 14, etches away unwanted for wire copper; Step 15, printing welding resistance, covers unwanted for SMT wire when preventing welding and connects tin short circuit.
Preferably, also comprise: step 16, do copper face protection and make the anti-oxidation of copper face.
Preferably, also comprise: step 17, electrical measurement, to test printed board electrical property.
Preferably, also comprise: step 18, shaping.
Owing to have employed technique scheme, mechanical buried blind via structure in printed board industry can be solved by this method and cannot make the barrier of fine-line, also very applicable to the mechanical buried blind via structure of non-fine-line, lamination problem after can preventing from being heated between wire layers of copper, leaks base material problem with copper thickness ununiformity during resin ground; While guaranteed performance and operability, for electronic product buried blind via structural design provides a kind of making thinking, greatly reduce Production Time and the cost of the printed board of part buried blind via structure.
Embodiment
The present invention has considered the pluses and minuses at present in the industry when blind buried-hole structure makes, and process characteristics during the blind buried-hole structure production of printed circuit board, reversely propose ameliorative way, the method well solves the barrier that mechanical buried blind via fine structure circuit makes, for the electronics of buried blind via structure produces the blank opened herein.Efficient, the high-quality production of this electronic product printed board can be made.
The invention provides blind, the buried via hole fine-line method for manufacturing printed circuit board of a kind of machinery, comprising: step 1, sawing sheet; Step 2, makes inner conductor by wire pattern; Step 3, selects 35um thickness Copper Foil to carry out pressing, to ensure pressing rear surface planarization, and cutting that can be smooth when making resin ground; Step 4, adopts machine drilling mode to bore blind buried via hole; Step 5, changes copper: make metallization in blind buried via hole reach interlayer conduction; Step 6, plating; Make hole copper and face copper reach 20um thickness simultaneously, or adopt plated hole technique; Step 7, filling holes with resin: adopt epoxy resin to clog blind hole or buried via hole, at the welding effect by smooth for resin ground unnecessary for aperture guarantee SMT; Step 8, subtracts copper: adopt chemical mode to reduce between 15-20um by the face copper of 35um+20um thickness, ensure the making demand of fine wire; For the plating adopting plated hole technique, chemical mode is adopted to reduce between 15-20um by the face copper of its 35um thickness; Step 9, boring: adopt power auger hole drill insert hole; Step 10, changes copper: make metallization in insert hole reach interlayer conduction; Step 11, plating: make insert hole copper reach predetermined thickness; Step 12, makes outer layer conductor by wire pattern; Step 13, carries out graphic plating, reaches predetermined thickness to make hole copper and face copper; Step 14, etches away unwanted for wire copper; Step 15, printing welding resistance, covers unwanted for SMT wire when preventing welding and connects tin short circuit.
The present invention is when step 3 pressing, adopt thick Copper Foil (35um), thus when having broken traditional fabrication fine-line (being less than 0.075mm), the making thinking of thin copper foil 12um or 9um is selected in pressing, well improve the planarization in plate face after pressing.Further, in step 8, subtract copper and adopt chemical mode, can make that printing board surface copper is thick evenly to successively decrease, subtract the normal making that ensure that fine-line between copper to 15-20um and can prevent again between layers of copper in subsides part layered problem.
Owing to have employed technique scheme, mechanical buried blind via structure in printed board industry can be solved by this method and cannot make the barrier of fine-line, also very applicable to the mechanical buried blind via structure of non-fine-line, lamination problem after can preventing from being heated between wire layers of copper, leaks base material problem with copper thickness ununiformity during resin ground; While guaranteed performance and operability, for electronic product buried blind via structural design provides a kind of making thinking, greatly reduce Production Time and the cost of the printed board of part buried blind via structure.
Preferably, also comprise: step 16, do copper face protection and make the anti-oxidation of copper face.Preferably, also comprise: step 17, electrical measurement, to test printed board electrical property.Preferably, also comprise: step 18, shaping.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (4)
1. blind, the buried via hole fine-line method for manufacturing printed circuit board of machinery, is characterized in that, comprising:
Step 1, sawing sheet;
Step 2, makes inner conductor by wire pattern;
Step 3, selects 35um thickness Copper Foil to carry out pressing, to ensure pressing rear surface planarization, and cutting that can be smooth when making resin ground;
Step 4, adopts machine drilling mode to bore blind buried via hole;
Step 5, changes copper: make metallization in blind buried via hole reach interlayer conduction;
Step 6, plating; Make hole copper and face copper reach 20um thickness simultaneously, or adopt plated hole technique;
Step 7, filling holes with resin: adopt epoxy resin to clog blind hole or buried via hole, at the welding effect by smooth for resin ground unnecessary for aperture guarantee SMT;
Step 8, subtracts copper: adopt chemical mode to reduce between 15-20um by the face copper of 35um+20um thickness, ensure the making demand of fine wire; For the plating adopting plated hole technique, chemical mode is adopted to reduce between 15-20um by the face copper of its 35um thickness;
Step 9, boring: adopt power auger hole drill insert hole;
Step 10, changes copper: make metallization in insert hole reach interlayer conduction;
Step 11, plating: make insert hole copper reach predetermined thickness;
Step 12, makes outer layer conductor by wire pattern;
Step 13, carries out graphic plating, reaches predetermined thickness to make hole copper and face copper;
Step 14, etches away unwanted for wire copper;
Step 15, printing welding resistance, covers unwanted for SMT wire when preventing welding and connects tin short circuit.
2. method according to claim 1, is characterized in that, also comprises:
Step 16, does copper face protection and makes the anti-oxidation of copper face.
3. according to the method described in claim 1 to 2, it is characterized in that, also comprise:
Step 17, electrical measurement, to test printed board electrical property.
4. the method according to claims 1 to 3, is characterized in that, also comprises:
Step 18, shaping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510508922.8A CN105163520A (en) | 2015-08-19 | 2015-08-19 | Preparation method of fine-line printed circuit board with mechanical blind holes and buried holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510508922.8A CN105163520A (en) | 2015-08-19 | 2015-08-19 | Preparation method of fine-line printed circuit board with mechanical blind holes and buried holes |
Publications (1)
| Publication Number | Publication Date |
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| CN105163520A true CN105163520A (en) | 2015-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510508922.8A Pending CN105163520A (en) | 2015-08-19 | 2015-08-19 | Preparation method of fine-line printed circuit board with mechanical blind holes and buried holes |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413891A (en) * | 2018-11-20 | 2019-03-01 | 广东依顿电子科技股份有限公司 | A kind of blind hole wiring board and preparation method thereof |
| CN110213895A (en) * | 2019-06-10 | 2019-09-06 | 深圳市鼎盛电路技术有限公司 | A kind of PCB circuit manufacturing method and PCB |
| CN111343800A (en) * | 2020-03-18 | 2020-06-26 | 四川英创力电子科技股份有限公司 | Processing technology for local electroplating of blind buried hole |
| CN112672508A (en) * | 2020-11-30 | 2021-04-16 | 重庆凯歌电子股份有限公司 | Resin hole plugging method for PCB |
| CN113260163A (en) * | 2021-05-07 | 2021-08-13 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing circuit board fine line |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413891A (en) * | 2018-11-20 | 2019-03-01 | 广东依顿电子科技股份有限公司 | A kind of blind hole wiring board and preparation method thereof |
| CN109413891B (en) * | 2018-11-20 | 2020-12-22 | 广东依顿电子科技股份有限公司 | Blind hole circuit board and manufacturing method thereof |
| CN110213895A (en) * | 2019-06-10 | 2019-09-06 | 深圳市鼎盛电路技术有限公司 | A kind of PCB circuit manufacturing method and PCB |
| CN111343800A (en) * | 2020-03-18 | 2020-06-26 | 四川英创力电子科技股份有限公司 | Processing technology for local electroplating of blind buried hole |
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| CN112672508A (en) * | 2020-11-30 | 2021-04-16 | 重庆凯歌电子股份有限公司 | Resin hole plugging method for PCB |
| CN113260163A (en) * | 2021-05-07 | 2021-08-13 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing circuit board fine line |
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| CB02 | Change of applicant information |
Address after: Baoan District manhole Street sand Shenzhen city 518000 four Guangdong province Dongbao Industrial Zone No. H building, the first floor of building G, Room 203, floor two floor Applicant after: Shenzhen City Xing Xing Polytron Technologies Inc Address before: Baoan District manhole Street sand Shenzhen city Guangdong province 518000 Industrial Zone No. four Dongbao building H Applicant before: Shenzhen Xunjiexing Circuit Tech Co., Ltd. |
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Application publication date: 20151216 |
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| RJ01 | Rejection of invention patent application after publication |