CN104039093B - Manufacturing method for magnetic core-laminated type multi-layer printed-circuit board with electro-magnetic induction through blind holes - Google Patents
Manufacturing method for magnetic core-laminated type multi-layer printed-circuit board with electro-magnetic induction through blind holes Download PDFInfo
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- CN104039093B CN104039093B CN201410285999.9A CN201410285999A CN104039093B CN 104039093 B CN104039093 B CN 104039093B CN 201410285999 A CN201410285999 A CN 201410285999A CN 104039093 B CN104039093 B CN 104039093B
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Abstract
The invention relates to the technical field of printed-circuit boards and provides a manufacturing method for a magnetic core-laminated type multi-layer printed-circuit board with electro-magnetic induction through blind holes. The main manufacturing process steps include laminating the magnetic core, circularising the blind holes and combining the multiple layers. The method includes embedding the magnetic core in a double-layer substrate, then forming through holes in the substrate with the magnetic core embedded, and insulating the through holes through vacuum caulking technology; forming concentric metallized blind holes with smaller radiuses in the insulated through holes, allowing the metallized blind holes to generate the electro-magnetic induction with the magnetic core in a non-contact manner to replace the traditional electrical inductance producing; meanwhile, performing a circuitry etching on the substrate surface to electrically conduct the blind holes and the substrate surface, and metallizing the through holes which are formed at the position embedded with the magnetic core of the multi-layer composite substrate after multiple layers are combined, thereby achieving conduction of the metallized blind holes and an outer circuit to meet processing requirements of different layers. The manufacturing method has the advantages of small inductance size, large mounting area, high power stability and capability of processing printed circuit boards of multiple layers.
Description
Technical field
The present invention relates to printed circuit board technology field, particularly to the multilayered printed electricity of magnetic core lamination type blind hole electromagnetic induction
The preparation method of road plate.
Background technology
The mode that the basic inductance component of electron trade interior power module is mounted on printed circuit plate surface at present is realized, according to
This causes the area of inductance element attachment excessively to occupy the surface of printed circuit board, or even account for printed circuit board surface area 50%
Left and right, seriously hinders the process of power supply product miniaturization.
In order to meet the needs of power supply product miniaturization, gradually spread out in the industry the core component core portion inductance
It is embedded in the inside of printed board, the miniaturization of power module is done step-by-step.But, this method can produce conductor contact magnetic core or circle
The problems such as toroidal core mates, there is risk in the reliability of power supply, the versatility of design cannot be realized, processing and fabricating and pushing away
There is larger difficulty in wide use, can cause the high of cost simultaneously.
Content of the invention
Present invention aim to overcome that the deficiency of traditional circuit board manufacturing process, provide magnetic core lamination type blind hole electromagnetism sense
The preparation method answering multilayer printed circuit board.
Present disclosure is:
The preparation method of magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board includes procedure below:
The first step, magnetic core pressing, magnetic core embeds in the inside groove that double layer substrate is combined, and carries out pressing and forms double layer substrate, its
Concrete steps include:
Step one, substrate surface pretreatment: the substrate surface cleaning needing pressing, and stitching surface is roughened；
Step 2, magnetic core size coupling: press the inside groove size of contact surface according to two-layer substrate, select or processing can be embedding
Enter the magnetic core of substrate pressing layer；
Step 3, magnetic core pressing: the magnetic core meeting size coupling requirement is completely embedded into two-layer substrate and presses contact surface
In inside groove, in the outer surface of substrate, stacked on aluminium flake, epoxy plate and silicagel pad are assisted successively, move in press and carry out pressing
To double layer substrate.
The purpose of the first step is that acquisition is embedded among the inside groove of substrate completely using magnetic core, makes full use of substrate lamination
Inside groove, efficiently reduce magnetic core and when printed circuit plate surface is embedded into, printed circuit board surface area occupied, be that power supply is little
Typeization provides and sees feasible way.The pretreatment of substrate surface, can effectively increase the roughness of laminate surface, between lifting substrate
Lamination adhesion；The coupling of magnetic core size, can be designed processing the magnetic core meeting draw-in groove size according to draw-in groove size, flexibly
Property good, interlayer card slot space utilization rate is high；Its outer surface that is pressed together on of magnetic core uses auxiliary material, and lamination both can have been prevented white
Spot, ensures the flatness of substrate laminate surface again.
Second step, blind hole annulus: carry out through hole processing in the region of double layer substrate embedded magnetic core, through hole is carried out to through hole
Insulating, is internally formed with through hole concentric in insulating through hole and radius is less than the blind hole of through hole, then carry out gold to blind hole
Genusization is processed, and conductive blind hole produce electromagnetic induction contactless with magnetic core realizes conducting, and its concrete steps includes:
Step one, through hole processing: the double layer substrate after the first step is processed carries out boring process at the position being embedded with magnetic core,
Form double layer substrate through hole；
Step 2, through hole insulating: the Copper Foil of process of having holed in the upper and lower surface laminating of double layer substrate through hole, then will be partly
Cured sheets are put in the outside of Copper Foil, then double layer substrate are put into press, vacuumize, heat, pressurized treatments, so that prepreg is melted
Melt vacuum suction completely to fill out in double layer substrate through hole, then cool and solidify, form insulating through hole；
Step 3, blind hole processing: carry out boring inside the insulating through hole of double layer substrate and form blind hole, blind hole and through hole
The center of circle overlap, the radius of blind hole is less than the radius of through hole；
Step 4, blind hole metallization: the blind hole in through hole is carried out with metalized, forms the metal with electric conductivity
Change blind hole.
The annulusization of blind hole is processed, and makes the blind hole after metallization form insulating properties annulus, insulated wire annulus cylindrical for magnetic core,
Realize the electromagnetic induction conducting between blind hole and magnetic core, there is the function of inductance component.Through hole is processed, and can be embedded into magnetic core
Place carries out selective processing, and the number in hole can be presetting when magnetic core presses, and aperture can be entered as needed inside magnetic core
Row expands, and flexibility ratio is high；Through hole through hole insulating adopt vacuum moulding technology, effectively can fill up through hole, prevent cavity or
Filler is discontented with the problem that the electromagnetic induction causing turns on stability difference；Blind hole is processed, and carries out, work in the through hole after vacuum moulding
Skill is simple, and dimensional controllability is high, and the radius of blind hole is less than the radius of through hole, makes to be formed insulating annulus between blind hole and magnetic core；
Blind hole metalized, it is possible to achieve the effect that the electromagnetic induction of blind hole and magnetic core produces can pass through the metallized inwall of blind hole
It is conducting to outer-layer circuit, be that later stage attachment is provided the foundation using inner core.
3rd step, MULTILAYER COMPOSITE, are successively combined new substrate, double-layer base on the double layer substrate completing blind hole metalized
Plate realizes conducting of double layer substrate and metalized blind vias by internal layer circuit, and new substrate passes through plated-through hole with double layer substrate
Realization conducts, and its concrete steps includes:
Step one, compound sandwich circuit make: be etched on the double layer substrate surface of metalized blind vias oral area upper surface, shape
Become compound sandwich circuit, metalized blind vias and compound sandwich circuit are realized conducting；
Step 2, composite bed pressing: overlap new substrate in the composite bed circuit surface of double layer substrate, put in press and carry out
Pressing, forms multilager base plate；
Step 3, through hole conducting: on multilager base plate, through hole processing is carried out according to circuit design, and the through hole of processing is entered
Row metalization is processed.
Complete the regulation number of plies be combined after, to multilager base plate etching carry out outer-layer circuit making, carry out rear operation making, you can
Obtain magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board of the present invention.
The process of MULTILAYER COMPOSITE, so that printed circuit board expands to the application of multilager base plate from double-deck substrate, and no
Inductance component attachment, the electromagnetic induction directly producing using the magnetic core being embedded within substrate need to be repeated, realize once
It is embedded into, the purpose repeatedly utilizing.The making of compound sandwich circuit, it is possible to achieve the electromagnetic induction between blind hole and magnetic core is conducting to print
Circuit board substrate surface processed, provides for MULTILAYER COMPOSITE and sees turn-on condition；Composite bed presses, and extends the number of plies of substrate, expands
Its application；The conducting of through hole, by introducing plated-through hole it is achieved that metalized blind vias, compound layer line between multilager base plate
Conducting between road, plated-through hole, the later stage only need to be etched process in outer layer and form outer-layer circuit i.e. achievable substrate table
Face mounts the conducting of components and parts and inner core electromagnetic induction.
Preferably, described magnetic core is cuboid, cylinder or prism.Rectangular parallelepiped core, cutting processing is simple；Cylinder
Body magnetic core, card slot space utilization rate is high, and prism magnetic core can meet the needs of different shape draw-in groove；The variation of core shapes,
Effectively ensure the matching of magnetic core size in magnetic core bonding processes, meet the demand of different application scene.
Preferably, described composite bed line manufacturing process is asymmetric copper thickness step-etching, etches the top of substrate respectively
Portion and bottom, protect non-etched position with dry film during making.Asymmetric copper thickness step-etching is effectively directed to printed circuit
The variability issues etching while top of the plate layer and underlayer thickness inconsistent generation, both ensure that the effect that circuit makes, and had been again
Multilager base plate is combined and provides feasibility.
Preferably, described boring method is machine drilling, digital control hole drilling, plasma pit, laser drill or chemistry
Pit.The selection of different bore modes, can enter according to the number of the thickness of printed circuit board, the number of plies, the size in aperture, boring
Row selects the realizability it is ensured that holing.
Preferably, described method for metallising be chemical plating, plating, evaporation, sputtering, vapour deposition or painting conducting resinl.Gold
The variation of genusization method, can need pore size, the metal film of metallized metal species, through hole or blind hole as needed
The parameter such as thickness be directed to Sexual behavior mode it is ensured that conducting effect after metallization.
Preferably, in described blind hole annulus concentric round tube hole and blind hole radial difference be more than 0.4mm.Through hole with
Blind hole radial difference be more than 0.4mm, effectively achieve the insulation effect of blind hole and magnetic core, prevent blind hole from contacting with magnetic core,
Have impact on the stability of inductance component work.
The invention has the beneficial effects as follows:
1st, adopt magnetic core to press technology, efficiently utilize the inside groove between substrate lamination, decrease in printed circuit board table
Face is embedded into magnetic core to the occupancy of printed circuit board surface area it is achieved that power supply minimizes.
2nd, adopt blind hole to justify cyclization reaction, form insulating properties annulus between metalized blind vias and magnetic core, effectively prevent magnetic
The contact with magnetic core for the blind hole, improves the stability of inductance component.
3rd, using compound sandwich circuit and plated-through hole technology it is achieved that the conducting of electromagnetic induction and outer-layer circuit, break through
Substrate is combined the restriction of the number of plies, has expanded the range of core inductance components and parts.
4th, adopt vacuum moulding technology, effectively prevent the cavity of through hole resin plug glue and filling discontented it is ensured that blind hole
The insulation effect of annulus, reduces the probability occurring because of the printed circuit board defective products that inductance component causes.
5th, adopt asymmetric etching technique, the top layer and bottom of printed circuit board is etched respectively, effectively prevent printing
The problem of the circuit etching conduction difference that circuit board top layer and bottom cause because of copper layer thickness difference, improves and sees that printed circuit board becomes
The yield of product.
Brief description
Fig. 1 is the technological process of the preparation method of magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board of the present invention
Figure；
Fig. 2 is the magnetic core lamination knot of the preparation method of magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board of the present invention
Structure schematic diagram；
Fig. 3 is the blind hole annulus of the preparation method of magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board of the present invention
Cross-sectional view figure；
Fig. 4 is the blind hole annulus of the preparation method of magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board of the present invention
Feature cross-section structural representation.
Specific embodiment
Below in conjunction with the accompanying drawings the specific embodiment of the present invention is conducted further description:
As shown in the process chart of Fig. 1 present invention, we select the thick copper-clad plate of 1.0mm as the base of pressing magnetic core
Plate, using the thick copper-clad plate of 0.2mm as the substrate of composite bed, according to the following steps enforcement present invention:
First, to need press magnetic core substrate carry out front operation process, front operation include substrate blanking, bore location hole,
The steps such as cnc groove milling, internal layer circuit making.
Secondly, carry out magnetic core pressing process, magnetic core embeds in the inside groove that double layer substrate is combined, carry out pressing and form double-layer base
Plate, includes in conjunction with its concrete steps shown in Fig. 2:
Step one, substrate surface pretreatment: substrate 4 surface cleaning needing pressing, and stitching surface is roughened；
Step 2, magnetic core size coupling: press the inside groove size of contact surface according to two-layer substrate 4, select the magnetic of cuboid
Core 5 embeds in substrate pressing layer；
Step 3, magnetic core pressing: the magnetic core 5 meeting size coupling requirement is completely embedded into two-layer substrate 4 and presses contact surface
Inside groove in, in the outer surface of substrate, stacked on aluminium flake 3, epoxy plate 2 and silicagel pad 1 are assisted successively, move in press and carry out
Pressing obtains double layer substrate, and the concrete magnetic core laminar structure structure of double layer substrate is as shown in Figure 2；
After magnetic core pressing, practiced shooting by x-ray and check, whether checking magnetic core is completely embedded into is pressed together on double-deck basic card
Among groove.
Then, blind hole annulus is carried out to the double layer substrate after magnetic core pressing: enter in the region of double layer substrate embedded magnetic core
Row through hole is processed, and carries out through hole insulating to through hole, is internally formed with through hole concentric in insulating through hole and radius is less than and leads to
The blind hole in hole, then carries out metalized to blind hole, and conductive blind hole produce electromagnetic induction contactless with magnetic core is realized
Conducting, includes in conjunction with its concrete steps shown in Fig. 3, Fig. 4:
Step one, through hole processing: the double layer substrate after the first step is processed carries out boring process at the position being embedded with magnetic core,
Forming the through hole on double layer substrate. boring, using the mode of machine drilling, selects the rotor of a diameter of 1.65mm, and control rotating speed is
30krpm, feed speed is 1.2m/min, and withdrawing speed is 15 m/min, finally forms 1000 apertures on double layer substrate surface and is
1.65mm through hole；
Step 2, through hole insulating: hole the Copper Foil of process in the upper and lower surface laminating of double layer substrate through hole, then by type
Number be put in the outside of Copper Foil for fr-4 pp prepreg, then double layer substrate put into press, vacuumize, in 98 minutes plus
Heat is forced into 230n/qcm, pressurize 180 minutes to maximum temperature less than in 200 DEG C, 120 minutes, makes fr-4 pp prepreg
Melting vacuum suction is completely filled out in double layer substrate through hole, then cools and solidifies, and forms insulating through hole 9；
Step 3, blind hole processing: carry out boring inside the insulating through hole 9 of double layer substrate and form blind hole, the hole of blind hole
Footpath is 0.85mm, and blind hole is overlapped with the center of circle of insulating through hole 9；
Step 4, blind hole metallization: the blind hole in through hole is carried out with electroless copper metalized, is formed and there is electric conductivity
The metalized blind vias 7 of energy, the blind hole structure finally giving is as shown in Figure 3 and Figure 4.In figs. 3 and 4, metalized blind vias 7 with absolutely
It is insulating barrier 8 that the contact surface of edge through hole 9 is formed between metallized conductive layer 6. metallized conductive layer 6 and insulating through hole 9.
Then, carry out MULTILAYER COMPOSITE process, the double layer substrate completing blind hole metalized be successively combined new substrate,
Double layer substrate realizes conducting of double layer substrate and metalized blind vias by internal layer circuit, and new substrate is passed through in magnetic with double layer substrate
The processing plated-through hole at core blank position is realized conducting, and its concrete steps includes:
Step one, compound sandwich circuit make: be etched on the double layer substrate surface of metalized blind vias oral area upper surface, shape
Become compound sandwich circuit, metalized blind vias and compound sandwich circuit are realized conducting；
Step 2, composite bed pressing: overlap, in the composite bed circuit surface of double layer substrate, the new substrate that thickness is 0.2mm,
Put in press and pressed, form multilager base plate, the substrate of 0.2mm needs to carry out boring location hole and internal layer circuit before compound
Before etching etc., operation is processed,
Step 3, through hole conducting: the brill of a diameter of 0.2-1.0mm is selected in the way of machine drilling on multilager base plate
Knife, control rotating speed is 30krpm, and regulation feed speed is 1.2m/min and withdrawing speed carries out through hole processing for 15 m/min, through hole
Aperture is 0.2-1.0mm, and carries out metalized using the method for electroless copper to the through hole of processing.
Finally, complete the printed circuit board after the regulation number of plies is combined and carry out rear operation process, complete to press stagnation pressure, outer layer brill
Hole, deposition plate electricity, outer-layer circuit making, graphic plating, milling half-edge hole, etching gtl face, etching gbl face, aoi detection, welding resistance print
Brush, surface treatment, shaping etc., you can obtain magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board of the present invention
Whole finished product.
The above, only presently preferred embodiments of the present invention, are not intended to limit embodiment of the present invention, this area skill
Art personnel, should be within protection scope of the present invention according to the design of the present invention, done appropriate adaptation or modification.
Claims (9)
1. the preparation method of magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board is it is characterised in that include procedure below:
The first step, magnetic core pressing, magnetic core embeds in the inside groove that double layer substrate is combined, and carries out pressing and forms double layer substrate；
Second step, blind hole annulus: carry out through hole processing in the region of double layer substrate embedded magnetic core, through hole insulation is carried out to through hole
Change, be internally formed with through hole concentric in the through hole of through hole insulating and radius is less than the blind hole of through hole, then blind hole is carried out
Metalized, conductive blind hole produce electromagnetic induction contactless with magnetic core is realized conducting；
3rd step, MULTILAYER COMPOSITE, are successively combined new substrate on the double layer substrate completing blind hole metalized, and double layer substrate leads to
Cross internal layer circuit and realize conducting of double layer substrate and metalized blind vias, new substrate and double layer substrate pass through at magnetic core blank position
Processing plated-through hole realize conduct；
Complete the regulation number of plies be combined after, to multilager base plate etching carry out outer-layer circuit making, carry out rear operation making, you can obtain
Magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board.
2. the preparation method of magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board according to claim 1, it is special
Levy and be: described magnetic core pressing comprises the following steps:
Step one, substrate surface pretreatment: the substrate surface cleaning needing pressing, and stitching surface is roughened；
Step 2, magnetic core size coupling: press the inside groove size of contact surface according to two-layer substrate, select or processing can embed base
The magnetic core of plate pressing layer；
Step 3, magnetic core pressing: the magnetic core meeting size coupling requirement is completely embedded into the inside groove that two-layer substrate presses contact surface
In, in the outer surface of substrate, stacked on aluminium flake, epoxy plate and silicagel pad are assisted successively, move into carry out in press pressing obtain double
Laminar substrate.
3. the preparation method of magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board according to claim 1 and 2, its
It is characterised by: described blind hole annulus comprises the following steps:
Step one, through hole processing: the double layer substrate after the first step is processed carries out boring process at the position being embedded with magnetic core, is formed
Double layer substrate through hole；
Step 2, through hole insulating: hole the Copper Foil of process in the upper and lower surface laminating of double layer substrate through hole, then by semi-solid preparation
Piece is put in the outside of Copper Foil, then double layer substrate is put into press, vacuumizes, heats, pressurized treatments, so that prepreg is melted true
Suction is attached completely to fill out in double layer substrate through hole, then cools and solidifies, and forms insulating through hole；
Step 3, blind hole processing: carry out boring inside the insulating through hole of double layer substrate and form blind hole, the circle of blind hole and through hole
The heart overlaps, and the radius of blind hole is less than the radius of through hole；
Step 4, blind hole metallization: the blind hole in through hole is carried out with metalized, the metallization that formation has electric conductivity is blind
Hole.
4. the preparation method of magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board according to claim 1 and 2, its
It is characterised by: described MULTILAYER COMPOSITE comprises the following steps:
Step one, compound sandwich circuit make: be etched on the double layer substrate surface of metalized blind vias oral area upper surface, formed multiple
Close sandwich circuit, metalized blind vias and compound sandwich circuit are realized conducting；
Step 2, composite bed pressing: overlap new substrate in the composite bed circuit surface of double layer substrate, put in press and pressed
Close, form multilager base plate；
Step 3, through hole conduct: carry out through hole processing according to circuit design on multilager base plate, and the through hole of processing is carried out
Metalized.
5. the preparation method of magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board according to claim 1 and 2, its
It is characterised by: described magnetic core is cuboid, cylinder or prism.
6. the preparation method of magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board according to claim 4, it is special
Levy and be: described composite bed line manufacturing process is asymmetric copper thickness step-etching, the top of etching substrate and bottom respectively,
Non-etched position is protected with dry film during making.
7. the preparation method of magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board according to claim 3, it is special
Levy and be: described boring method is machine drilling, digital control hole drilling, plasma pit, laser drill or chemical pit.
8. the preparation method of magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board according to claim 3, it is special
Levy and be: described method for metallising be chemical plating, plating, evaporation, sputtering, vapour deposition or painting conducting resinl.
9. the preparation method of magnetic core lamination type blind hole electromagnetic induction multilayer printed circuit board according to claim 8, it is special
Levy and be: in described blind hole annulus, insulating through hole and the radial difference of blind hole are more than 0.4mm.
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| CN201410285999.9A CN104039093B (en) | 2014-06-25 | 2014-06-25 | Manufacturing method for magnetic core-laminated type multi-layer printed-circuit board with electro-magnetic induction through blind holes |
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| CN104394653B (en) * | 2014-11-29 | 2017-07-21 | 惠州市金百泽电路科技有限公司 | A kind of preparation method of Multi-layer Al-based sandwich printed board |
| CN106163128A (en) * | 2015-04-07 | 2016-11-23 | 深南电路股份有限公司 | A kind of flattening integrated circuit structure and processing method thereof |
| CN105530771A (en) * | 2016-02-02 | 2016-04-27 | 东莞翔国光电科技有限公司 | Process of manufacturing multilayer printed circuit board with embedded magnetic core |
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| CN112788870A (en) * | 2021-01-31 | 2021-05-11 | 惠州中京电子科技有限公司 | Method for manufacturing multilayer printed circuit board with embedded magnetic core power supply module |
| CN115955783B (en) * | 2022-12-30 | 2024-03-08 | 福莱盈电子股份有限公司 | Method for improving size stability of ACF golden finger of LCM soft and hard plate |
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