CN112788870A - Method for manufacturing multilayer printed circuit board with embedded magnetic core power supply module - Google Patents
Method for manufacturing multilayer printed circuit board with embedded magnetic core power supply module Download PDFInfo
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- CN112788870A CN112788870A CN202110132623.4A CN202110132623A CN112788870A CN 112788870 A CN112788870 A CN 112788870A CN 202110132623 A CN202110132623 A CN 202110132623A CN 112788870 A CN112788870 A CN 112788870A
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- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000005553 drilling Methods 0.000 claims abstract description 39
- 238000005530 etching Methods 0.000 claims abstract description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 238000003825 pressing Methods 0.000 claims abstract description 26
- 238000003801 milling Methods 0.000 claims abstract description 8
- 238000007747 plating Methods 0.000 claims abstract description 8
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 238000001514 detection method Methods 0.000 claims abstract description 4
- 238000010019 resist printing Methods 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 4
- 230000008685 targeting Effects 0.000 claims abstract description 4
- 239000011162 core material Substances 0.000 claims description 99
- 238000003475 lamination Methods 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 239000000741 silica gel Substances 0.000 claims description 8
- 229910002027 silica gel Inorganic materials 0.000 claims description 8
- 238000013461 design Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 239000012467 final product Substances 0.000 claims 1
- 238000012827 research and development Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 description 18
- 238000012545 processing Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 241000519995 Stachys sylvatica Species 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a method for manufacturing a multilayer printed circuit board of a power module with a buried magnetic core, which comprises the following steps: the method comprises the steps of cutting a substrate → drilling a whole hole → CNC milling a groove → an inner layer circuit → inner layer etching → core embedding pressing → etching for reducing copper → X-RAY targeting → core embedding drilling → core embedding degumming → drilling a through hole → copper plating → outer layer circuit → L2 and L3 layer circuit → inner layer etching → browning → pressing total pressure → outer layer drilling → copper plating → outer layer circuit → half milling a hole → etching T surface → etching B surface → outer layer detection → solder resist printing. According to the invention, research and development of the multilayer printed board with the embedded magnetic core are realized, the inductor is embedded into the printed board, the surface area of the printed board is greatly reduced, other components can be more reasonably distributed in the saved area, and a good solution is provided for high density and miniaturization of the power module.
Description
Technical Field
The invention belongs to the technical field of PCB processing, and particularly relates to a method for manufacturing a multilayer printed circuit board of a power module with a buried magnetic core.
Background
The power module is an important component of a power product, and along with the rapid development of the power product, the trend of high density and miniaturization of the power module is increasingly obvious. In the current power module, in the surface mount device, the area of the inductance element occupies the largest surface area of the printed board (about 50% of the surface area), so the inductance element is one of the technical bottlenecks affecting the miniaturization of the power product.
No such special technique for embedding magnetic cores exists in the industry at present. Through process optimization, the processing and production of the multilayer printed board of the embedded magnetic core power module are realized by adopting an embedded magnetic core lamination positioning technology, a magnetic core material concentric circle trepanning technology, a blind embedded hole vacuum resin plug hole technology and an asymmetric copper thickness step-by-step etching technology.
Disclosure of Invention
In view of the above, the invention provides a method for manufacturing a multilayer printed circuit board of a magnetic core embedded power supply module, which realizes research and development of the multilayer printed circuit board of the embedded magnetic core by an embedded magnetic core lamination positioning technology, a magnetic core material concentric circle trepanning technology, a blind embedded hole vacuum resin plug hole and an asymmetric copper thickness step-by-step etching technology; meanwhile, special requirements on resistance, inductance, magnetic core loss and the like are met. If the inductor (including the magnetic core) is buried in the printed board, the surface area of the printed board is greatly reduced, other components can be more reasonably distributed in the saved area, and a good solution is provided for high density and miniaturization of the power module.
The technical scheme of the invention is as follows:
a method for manufacturing a multilayer printed circuit board of a power module with a buried magnetic core is characterized by comprising the following steps: the method comprises the steps of cutting a substrate → drilling a whole hole → CNC milling a groove → an inner layer circuit → inner layer etching → core embedding pressing → etching for reducing copper → X-RAY targeting → core embedding drilling → core embedding degumming → drilling a through hole → copper plating → outer layer circuit → L2 and L3 layer circuit → inner layer etching → browning → pressing total pressure → outer layer drilling → copper plating → outer layer circuit → half milling a hole → etching T surface → etching B surface → outer layer detection → solder resist printing.
The method further comprises the step of designing an isolating ring, namely a concentric circle in advance at the position of the metalized through hole, wherein the concentric circle adopts a drilling mode, and the magnetic core hole needs to be compensated by 0.4 mm in unilateral pre-enlargement according to the blind hole and the outer layer through hole file.
The method also comprises magnetic core lamination positioning, wherein the size of the magnetic core material is measured firstly, and the dimensional tolerance of the material is controlled within 0.05 mm in a subsequent precision machining mode; secondly, by presetting different sizes of the inner grooves, the magnetic cores are used for confirming which size design is optimally matched with the magnetic cores one by one; and finally, when the magnetic core is embedded, the magnetic core is accurately embedded into the printed board by adopting a vacuum pressing mode and an auxiliary silica gel pad and aluminum sheet laminating mode.
Cleaning is needed before the magnetic core is pressed, and the surface is coarsened to improve the lamination bonding force; meanwhile, a silica gel pad, an aluminum sheet and an epoxy plate are adopted for auxiliary pressing, so that lamination white spots are prevented.
Still include the magnetic core drilling, the drilling parameter is: drilling to the diameter of 1.66mm, the drilling speed of 30kr/min, the feed speed of 1.2m/min, the withdrawal speed of 1.5m/min, the drilling number: 1000 pieces.
The magnetic core concentric circle glue pressing device further comprises a magnetic core concentric circle glue pressing device, and vacuum glue pressing is adopted.
The method also comprises asymmetrical copper thickness distribution etching, wherein the top layer finished product copper thickness is 64.8mm, the bottom layer copper thickness is 137.2 mm, the difference is 64.8mm, two circuits cannot be synchronously etched, otherwise, the top layer circuit is etched to be thin, namely the top layer circuit is etched firstly, a dry film is used for protection after OK, and then the bottom layer circuit is etched.
In the invention, the main innovation points are as follows:
1. designing concentric circles of a magnetic core: since the magnetic core is embedded in the printed board, in order to perform the electromagnetic induction function, a conductive through hole needs to be used for replacing an electrified winding to penetrate through the magnetic core, but the conductive through hole cannot be in direct contact with the magnetic core, so that a spacer ring, namely a concentric circle needs to be designed in advance at the position of a metalized through hole. The concentric circles adopt a drilling mode, and according to the files of the blind holes and the outer layer through holes, the magnetic core holes need to be compensated by 0.4 mm which is preset on one side.
2. Magnetic core lamination positioning technology: because the size of the magnetic core material is small (9.7 mm multiplied by 14.8 mm), and the special requirement is also met on the deviation of the embedded position of the magnetic core (the error is controlled within +/-0.15 mm between the center of the magnetic core and the center with four through holes as vertexes), the lamination positioning of the magnetic core material is very important; in addition, the magnetic core and the FR-4 material are mixed and pressed, and the lamination bonding force is also a great technical bottleneck and needs to be subjected to key control. Aiming at the problem, firstly, the size of the magnetic core material is measured, and the dimensional tolerance of the material is controlled within 0.05 mm in a subsequent precision machining mode; secondly, by presetting different sizes of the inner grooves, the magnetic cores are used for confirming which size design is optimally matched with the magnetic cores one by one; and finally, when the magnetic core is embedded, the magnetic core is accurately embedded into the printed board by adopting a vacuum pressing mode and an auxiliary silica gel pad and aluminum sheet laminating mode. The size of the magnetic core needs to be matched with the size of an inner groove of a printed board, otherwise, offset is generated, and the position tolerance requirement of +/-0.15 mm cannot be met. In order to meet the positioning precision of the magnetic core of the product, the optimal size of the inner groove is designed to be as large as the magnetic core. Cleaning is needed before the magnetic core is pressed, and the surface is coarsened to improve the lamination bonding force; meanwhile, a silica gel pad, an aluminum sheet and an epoxy plate are adopted for auxiliary pressing, so that lamination white spots are prevented.
3. Magnetic core drilling technology: the magnetic core material has high hardness, and is pressed together by multiple layers of thin sheets, so that potential quality hazards such as cracks, delamination and the like can be easily caused by external force. In order to ensure the drilling quality, local fine adjustment needs to be carried out on drilling parameters, the test effect is good, and the magnetic core has no microcrack.
4. Magnetic core concentric circle vacuum moulding technique: because the cavity area of the magnetic core after the concentric circle is drilled is large (the diameter of 1.65 mm), the direct pressing can cause the glue shortage in the hole and influence the electrical insulating property of the hole wall, and therefore, 100 percent of the concentric circle needs to be effectively filled before the total pressure. For the similar buried hole design, the filling is performed by a resin hole plugging method, but the process is usually limited to small holes of 0.2 mm-0.5 mm, and for large holes of 1.3 mm in plate thickness and 1.65 mm in drill, the hole plugging by the traditional printing method is very difficult. Therefore, through improvement, the technical problem of difficulty in glue filling with ultra-large aperture is effectively solved by adopting the research and development of the improved vacuum glue pressing technology, and a great breakthrough is made in the magnetic core embedding technology. And after the magnetic core hole is filled with glue in a vacuum mode, processing the blind hole and the through hole according to a conventional process mode.
5. Asymmetric copper thickness distribution etching technology: the thickness of the top finished copper layer is 64.8mm, the thickness of the bottom copper layer is 137.2 mm, the difference is 64.8mm, the two circuits cannot be synchronously etched, otherwise, the circuit on the top layer is etched to be thin, namely, the top circuit is etched, a dry film is used for protection after OK, and then the bottom circuit is etched.
The invention has the beneficial effects that:
1. through research and development of the multilayer printed board with the embedded magnetic core, the lamination positioning technology of the embedded magnetic core, the concentric circle drilling technology of the magnetic core material, the blind embedded hole vacuum resin hole plugging and the step-by-step etching technology of the asymmetric copper thickness are adopted, the technical problems that the positioning precision of the magnetic core is not accurate, the drilling of the magnetic core material is easy to crack slightly, the etching of the asymmetric copper thickness is difficult and the like are effectively solved, and the processing and production of the multilayer printed board with the embedded magnetic core are successfully realized. The printed board is verified to meet the design requirements in the aspects of electrical insulation, inductance, electromagnetic loss and the like, and meets the special requirements for the embedded magnetic core product.
2. The magnetic core is embedded into the printed board, and the function of the inductance coil is realized through blind embedding hole conduction, so that the processing size of the printed board is further reduced.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
A method for manufacturing a multilayer printed circuit board of a power module with a buried magnetic core is characterized by comprising the following steps: the method comprises the steps of cutting a substrate → drilling a whole hole → CNC milling a groove → an inner layer circuit → inner layer etching → core embedding pressing → etching for reducing copper → X-RAY targeting → core embedding drilling → core embedding degumming → drilling a through hole → copper plating → outer layer circuit → L2 and L3 layer circuit → inner layer etching → browning → pressing total pressure → outer layer drilling → copper plating → outer layer circuit → half milling a hole → etching T surface → etching B surface → outer layer detection → solder resist printing.
The method further comprises the step of designing an isolating ring, namely a concentric circle in advance at the position of the metalized through hole, wherein the concentric circle adopts a drilling mode, and the magnetic core hole needs to be compensated by 0.4 mm in unilateral pre-enlargement according to the blind hole and the outer layer through hole file.
The method also comprises magnetic core lamination positioning, wherein the size of the magnetic core material is measured firstly, and the dimensional tolerance of the material is controlled within 0.05 mm in a subsequent precision machining mode; secondly, by presetting different sizes of the inner grooves, the magnetic cores are used for confirming which size design is optimally matched with the magnetic cores one by one; and finally, when the magnetic core is embedded, the magnetic core is accurately embedded into the printed board by adopting a vacuum pressing mode and an auxiliary silica gel pad and aluminum sheet laminating mode.
Cleaning is needed before the magnetic core is pressed, and the surface is coarsened to improve the lamination bonding force; meanwhile, a silica gel pad, an aluminum sheet and an epoxy plate are adopted for auxiliary pressing, so that lamination white spots are prevented.
Still include the magnetic core drilling, the drilling parameter is: drilling to the diameter of 1.66mm, the drilling speed of 30kr/min, the feed speed of 1.2m/min, the withdrawal speed of 1.5m/min, the drilling number: 1000 pieces.
The magnetic core concentric circle glue pressing device further comprises a magnetic core concentric circle glue pressing device, and vacuum glue pressing is adopted.
The method also comprises asymmetrical copper thickness distribution etching, wherein the top layer finished product copper thickness is 64.8mm, the bottom layer copper thickness is 137.2 mm, the difference is 64.8mm, two circuits cannot be synchronously etched, otherwise, the top layer circuit is etched to be thin, namely the top layer circuit is etched firstly, a dry film is used for protection after OK, and then the bottom layer circuit is etched.
The invention realizes the research and development production of the multilayer printed board with the embedded magnetic core by the lamination positioning technology of the embedded magnetic core, the concentric circle trepanning technology of the magnetic core material, the blind embedded hole vacuum resin hole plugging and the step-by-step etching technology of the asymmetric copper thickness; meanwhile, special requirements on resistance, inductance, magnetic core loss and the like are met. If the inductor (including the magnetic core) is buried in the printed board, the surface area of the printed board is greatly reduced, other components can be more reasonably distributed in the saved area, and a good solution is provided for high density and miniaturization of the power module.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.
Claims (10)
1. A method for manufacturing a multilayer printed circuit board of a power module with a buried magnetic core is characterized by comprising the following steps: the method comprises the steps of cutting a substrate → drilling a whole hole → CNC milling a groove → an inner layer circuit → inner layer etching → core embedding pressing → etching for reducing copper → X-RAY targeting → core embedding drilling → core embedding degumming → drilling a through hole → copper plating → outer layer circuit → L2 and L3 layer circuit → inner layer etching → browning → pressing total pressure → outer layer drilling → copper plating → outer layer circuit → half milling a hole → etching T surface → etching B surface → outer layer detection → solder resist printing.
2. The method as claimed in claim 1, further comprising pre-designing a spacer ring (concentric circle) at the position of the metalized through hole, wherein the concentric circle is drilled, and the magnetic core hole is compensated for by a single edge pre-enlarged by 0.4 mm according to the file of the blind hole and the outer layer through hole.
3. The method of claim 1, further comprising positioning the magnetic core in a lamination mode, wherein the dimension of the magnetic core material is measured and the dimensional tolerance of the material is controlled within 0.05 mm by subsequent precision machining.
4. The method of claim 3, wherein the different inner slot sizes are preset, and then the magnetic cores are used to confirm the best matching of the size design and the magnetic cores one by one.
5. The method for manufacturing the multilayer printed circuit board of the embedded magnetic core power supply module according to claim 4, wherein finally, the magnetic core is embedded into the printed circuit board accurately by adopting a vacuum pressing mode and an auxiliary silica gel pad and aluminum sheet laminating mode during embedding.
6. The method for manufacturing a multilayer printed circuit board of a power module with a buried magnetic core according to claim 5, wherein the magnetic core is cleaned and the surface is roughened before being pressed; and simultaneously, the silica gel pad, the aluminum sheet and the epoxy plate are adopted for auxiliary pressing.
7. The method for manufacturing the multilayer printed circuit board of the embedded magnetic core power module according to claim 1, further comprising drilling holes in the magnetic core, wherein the drilling parameters are as follows: drilling to the diameter of 1.66mm, the drilling speed of 30kr/min, the feed speed of 1.2m/min, the withdrawal speed of 1.5m/min, the drilling number: 1000 pieces.
8. The method for manufacturing a multilayer printed circuit board of a power module with a buried magnetic core according to claim 1, further comprising a step of pressing glue on concentric circles of the magnetic core by vacuum pressing.
9. The method of claim 1, further comprising etching the multilayer printed circuit board with asymmetric copper thickness distribution, wherein the top copper thickness of the final product is 64.8mm, the bottom copper thickness is 137.2 mm, the difference is 64.8mm, and the etching cannot be performed synchronously with the two-sided circuit.
10. The method of claim 9, wherein the top traces are etched to be thinner than the bottom traces by etching the top traces, OK and then protecting with a dry film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110132623.4A CN112788870A (en) | 2021-01-31 | 2021-01-31 | Method for manufacturing multilayer printed circuit board with embedded magnetic core power supply module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110132623.4A CN112788870A (en) | 2021-01-31 | 2021-01-31 | Method for manufacturing multilayer printed circuit board with embedded magnetic core power supply module |
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| CN112788870A true CN112788870A (en) | 2021-05-11 |
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| CN202110132623.4A Pending CN112788870A (en) | 2021-01-31 | 2021-01-31 | Method for manufacturing multilayer printed circuit board with embedded magnetic core power supply module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104039093A (en) * | 2014-06-25 | 2014-09-10 | 惠州市金百泽电路科技有限公司 | Manufacturing method for magnetic core-laminated type multi-layer printed-circuit board with electro-magnetic induction through blind holes |
| CN105530771A (en) * | 2016-02-02 | 2016-04-27 | 东莞翔国光电科技有限公司 | Process of manufacturing multilayer printed circuit board with embedded magnetic core |
| CN109496083A (en) * | 2018-11-16 | 2019-03-19 | 西安微电子技术研究所 | A kind of production method of buried inductance printed circuit board |
| CN111343800A (en) * | 2020-03-18 | 2020-06-26 | 四川英创力电子科技股份有限公司 | Processing technology for local electroplating of blind buried hole |
| CN112203425A (en) * | 2020-09-23 | 2021-01-08 | 惠州中京电子科技有限公司 | Manufacturing method of high-rise blind buried hole thick copper plate |
-
2021
- 2021-01-31 CN CN202110132623.4A patent/CN112788870A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104039093A (en) * | 2014-06-25 | 2014-09-10 | 惠州市金百泽电路科技有限公司 | Manufacturing method for magnetic core-laminated type multi-layer printed-circuit board with electro-magnetic induction through blind holes |
| CN105530771A (en) * | 2016-02-02 | 2016-04-27 | 东莞翔国光电科技有限公司 | Process of manufacturing multilayer printed circuit board with embedded magnetic core |
| CN109496083A (en) * | 2018-11-16 | 2019-03-19 | 西安微电子技术研究所 | A kind of production method of buried inductance printed circuit board |
| CN111343800A (en) * | 2020-03-18 | 2020-06-26 | 四川英创力电子科技股份有限公司 | Processing technology for local electroplating of blind buried hole |
| CN112203425A (en) * | 2020-09-23 | 2021-01-08 | 惠州中京电子科技有限公司 | Manufacturing method of high-rise blind buried hole thick copper plate |
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