CN219269149U

CN219269149U - Half-metallized slot structure

Info

Publication number: CN219269149U
Application number: CN202222553444.0U
Authority: CN
Inventors: 范红; 张震; 罗猛; 贺梓修; 贺南骏
Original assignee: Aoshikang Technology Co Ltd
Current assignee: Aoshikang Technology Co Ltd
Priority date: 2022-09-27
Filing date: 2022-09-27
Publication date: 2023-06-27
Anticipated expiration: 2032-09-27

Abstract

The utility model discloses a half-metallized slot structure, which comprises a PCB structure, wherein the PCB structure comprises a first core board containing conductor circuits and a second core board containing conductor circuits; the core board of the first conductor-containing circuit and the core board of the second conductor-containing circuit are bonded together through prepreg lamination, and the core board of the first conductor-containing circuit is positioned above the core board of the second conductor-containing circuit, wherein the copper layer at the top of the core board of the first conductor-containing circuit is L-layer, the copper layer at the bottom of the core board of the first conductor-containing circuit is L-layer, the copper layer at the top of the core board of the second conductor-containing circuit is L-layer, and the copper layer at the bottom of the core board of the second conductor-containing circuit is L-layer; the PCB structure is formed with a double T-shaped groove; the upper part of the double T-shaped groove is an NPTH groove hole, the lower part of the double T-shaped groove is a PTH groove hole, and the NPTH groove hole is positioned above the L layer; the inner wall of the PTH slot is a PTH metallized copper layer, and the PTH metallized copper layer conducts the L layer, the L layer and the L layer. The utility model is fit for installing components to realize high heat conduction, and the semi-metallized slotted hole and the inner layer electric stratum are conducted to form a double-step T-shaped slotted hole type PCB product.

Description

Half-metallized slot structure

Technical field:

the utility model belongs to the field of PCB manufacturing, and particularly relates to a half-metallized slot structure.

The background technology is as follows:

in order to prevent electromagnetic radiation and interference noise, copper block burying operation is performed during PCB manufacture, for example, patent CN 113660784A discloses a processing method and a testing method for built-in conductive adhesive of a PCB, and the method needs to be fastened and pasted with a T-shaped component in a manner of burying the conductive adhesive so as to lead the T-shaped component to be conducted with the copper surface of the PCB, but the conductive adhesive material is generally made of silver, copper paste and resin mixture, so that the conductive adhesive material is expensive and needs to be stored at a low temperature, and has poor heat resistance due to difference between the expansion coefficient after processing and copper in an inner layer, and poor local dimensional accuracy control due to the characteristics of poor viscosity, difficult positioning and alignment operation and the like. This results in the T-shaped components being degummed and contact failure in the later stage

In addition, the technology of embedding conductive adhesive has high material requirements and has great influence on processing design. And also need the mechanical accuse dark drilling, receive accuse dark equipment precision ability, generally the ability of + -50 um, must guarantee that can not bore through layer to critical dielectric layer (conductive adhesive layer) thickness is more than or equal to accuse dark degree 2 times, receive conductive ink (adhesive) semi-solid state processing degree of difficulty big, the higher probably needs the stack many times. The practical buried conductive adhesive has low efficiency and high cost.

Therefore, the company improves the prior art, forms a new semi-metallized slotted hole structure of the inner wall, is convenient for welding connection of devices to be installed, realizes conduction among different copper layers, and has good electromagnetic shielding effect.

The utility model comprises the following steps:

the utility model aims to provide a half-metallized slotted hole structure and a manufacturing method thereof, and the half-metallized slotted hole structure with a novel inner wall is formed, so that a device to be installed is convenient to weld and connect, conduction among different copper layers is realized, and a good electromagnetic shielding effect is achieved.

In order to solve the problems, the technical scheme of the utility model is as follows:

a semi-metallized slot structure comprises a PCB structure, a first core board 111 containing conductor lines and a second core board 112 containing conductor lines; the first core board 111 containing the conductor lines and the second core board 112 containing the conductor lines are bonded together through the prepreg 120 in a pressing mode, and the first core board 111 containing the conductor lines is located above the second core board 112 containing the conductor lines, wherein a copper layer at the top of the first core board 111 containing the conductor lines is an L1 layer, a copper layer at the bottom of the core board 111 containing the conductor lines is an L2 layer, a copper layer at the top of the second core board 112 containing the conductor lines is an L3 layer, and a copper layer at the bottom of the core board is an L4 layer; the PCB structure is formed with a double T-shaped groove; the upper part of the double T-shaped groove is an NPTH groove hole 320, and the lower part is a PTH groove hole 310, wherein the NPTH groove hole 320 is positioned above the L2 layer; the inner wall of the PTH slot 310 is a PTH copper metallization layer 311, and the PTH copper metallization layer 311 conducts the L2 layer, the L3 layer and the L4 layer.

Further improved, the double T-shaped groove is welded and fixed with a double T-shaped device, and the length and width contours of the double T-shaped groove are equal to or smaller than 0.1mm larger than those of the installed double T-shaped device.

Further improved, the horizontal surface of the double-T-shaped groove at the prepreg 120 is a rough surface.

Further improves the roughness Rz of the rough surface to be more than or equal to 25um.

The manufacturing method of the half-metallized slotted hole structure comprises the following steps:

step one, sequentially carrying out material cutting, inner layer circuit, pressing and through hole drilling; after the lamination, the two core boards containing the conductor lines are bonded together through the prepreg 120;

step two, routing a PTH groove;

thirdly, performing primary depth control milling on the PTH groove to form a primary depth control milling groove hole, wherein the primary depth control milling groove hole and the groove hole of the PTH groove are concentrically arranged, and the diameter of the primary depth control milling groove hole is larger than that of the groove hole of the PTH groove, so that a T-shaped groove hole is formed; the depth of the primary depth-control gong slot reaches the middle part of the prepreg 120;

electroplating PTH;

step five, sequentially carrying out outer layer circuit-solder resist-character;

step six, secondary depth control gong, gong and removing the metal layer at the upper part of the side wall of the gong hole of the first depth control gong to form a non-conductive hole;

and step seven, sequentially carrying out surface treatment, routing, electrical measurement and FQC-FQA to obtain the PCB with the semi-metallized slot structure.

Further improved, the two conductor-containing lines are a first conductor-containing core board 111 and a second conductor-containing core board 112, respectively; the first core board 111 containing the conductor circuit and the second core board 112 containing the conductor circuit are bonded together through the prepreg 120 in a pressing mode, and the first core board 111 containing the conductor circuit is located above the second core board 112 containing the conductor circuit, wherein the copper layer at the top of the core board 111 containing the conductor circuit is provided with an L1 layer, the copper layer at the bottom is provided with an L2 layer, the copper layer at the top of the core board 112 containing the conductor circuit is provided with an L3 layer, the copper layer at the bottom is provided with an L4 layer, and in the third step, the first depth control gong passes through the L2 layer and cannot drill through the L3 layer.

Further improvement, in the third step, when the first time of deep gong control is carried out, a flat ground gong groove is formed, the serrated depth of the bottom of the groove cutter is more than 25um, and the gong bottom roughness Rz is more than or equal to 25um.

In the sixth step, when the secondary depth control gong is performed, the depth of the depth control gong is between the L1 layer and the L2 layer, and if the thickness between the L1 layer and the L2 layer is h1mm, the depth of the depth control gong is h1-0.1mm.

In the sixth step, when the secondary deep gong is controlled, the size of the deep gong is 0.1mm larger than the length and width contours of the installed double-T-shaped device or the single side of the double-T-shaped device.

Further improvements provide reduced transition zones at corner locations of the mounted double-T device.

The utility model has the advantages that:

the utility model has semi-metallized stepped slot holes, and provides good heat transfer distribution and shielding effect for double T-shaped devices with high heat conduction efficiency.

Description of the drawings:

FIG. 1 is a schematic view of a gong PTH slot;

FIG. 2 is a schematic view of a first depth control gong;

FIG. 3 is a schematic illustration of slot hole wall metallization;

FIG. 4 is a schematic view of a secondary stepped depth gong;

FIG. 5 is a schematic diagram of the finished product;

FIG. 6 is a schematic diagram of a dual T-shaped device mounted to a half-metallized slot structure.

Wherein 111-a first core board containing conductor lines; 112-a second core board containing conductor lines; 113-an area to be mechanically controlled; 120-prepreg; 310-PTH slots; 311-PTH metallized copper layer; 320-NPTH slots; a first T-type structure of a 400-double T-type device; a second T-type structure of the 401-dual T-type device; PTH is metallized and NPTH is non-metallized.

The specific embodiment is as follows:

the working flow in the prior art is as follows: cutting, inner layer circuit, slotted hole, copper block embedding, conductive adhesive sleeving, pressing, PTH electroplating, outer layer circuit, solder resist, character, depth control gong, laser gong, surface treatment, gong, electric measurement, FQC and FQA. The need to embed conductive glue and pre-cut slots results in inconvenient lamination operations.

The method of the utility model is as follows:

cutting, inner layer circuit, pressing, drilling, routing PTH groove, first depth control routing, PTH electroplating, outer layer circuit, solder resist, character, second depth control routing, surface treatment, routing, electric measurement, FQC, FQA.

Further, the method comprises the following steps:

1. gong PTH slots need to run through the entire board.

2. The depth is controlled for the first time, the depth of a board is controlled, the L2 layer is required to be drilled through by drilling, and the L3 layer is not damaged and can not be drilled through; the external dimension of the depth-control gong is equal to the length and the width of the device or the single side is 0.1mm smaller.

3. And selecting a flat ground gong groove, wherein the serrated depth of the bottom of the groove cutter is more than 25um, so that the gong bottom roughness Rz is more than or equal to 25um, and the adhesion of subsequent copper deposition is ensured.

4. And then copper deposition electroplating is carried out to realize metallization of the through slot and the one-time deep-milling slot, and the through slot is conducted with the copper layer (L2 layer and L3 layer) of the inner electric layer.

5. After the outer layer pattern and the resistance welding are manufactured, secondary mechanical depth control gong is carried out, wherein the depth of the depth control gong is smaller than the thickness (h 1) between the L1 layer and the L2 layer, and is generally set to be h1-0.1mm.

6. Further described, the secondary mechanical depth-controlling gong is longer in size, equal in wide profile or 0.1mm in single side.

7. The device is synchronously arranged, a reduced transition belt is added at the corner position of the T-shaped big-small end, and the mounting firmness at the position of the double-T-shaped slotted hole is ensured.

Therefore, the conductive adhesive does not need to be embedded into the conductive adhesive and the pre-opened slot holes, and the problem of inconvenient pressing operation does not occur. In addition, the PTH section of the step groove in the final finished product and the inner copper layer (L2 layer and L3 layer) form a whole, so that the shielding function can be realized.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims

1. The semi-metallized slot structure is characterized by comprising a PCB structure, wherein the PCB structure comprises a first core board (111) containing conductor circuits and a second core board (112) containing conductor circuits; the first core board (111) containing the conductor lines and the second core board (112) containing the conductor lines are bonded together through prepreg (120) in a pressing mode, the first core board (111) containing the conductor lines is located above the second core board (112) containing the conductor lines, wherein a copper layer at the top of the first core board (111) containing the conductor lines is an L1 layer, a copper layer at the bottom of the core board (111) containing the conductor lines is an L2 layer, a copper layer at the top of the second core board (112) containing the conductor lines is an L3 layer, and a copper layer at the bottom of the core board (112) containing the conductor lines is an L4 layer; the PCB structure is formed with a double T-shaped groove; the upper part of the double T-shaped groove is an NPTH groove hole (320), and the lower part of the double T-shaped groove is a PTH groove hole (310), wherein the NPTH groove hole (320) is positioned above the L2 layer; the inner wall of the PTH slot (310) is a PTH metallized copper layer (311), and the PTH metallized copper layer (311) conducts the L2 layer, the L3 layer and the L4 layer.

2. The half-metallized slot structure of claim 1, wherein a double-T-shaped device is welded and fixed in the double-T-shaped slot, and the double-T-shaped slot is equal to or less than 0.1mm larger than the length and width profiles of the installed double-T-shaped device.

3. The half-metallized slot structure of claim 1, wherein the horizontal surface of said double T-slot at the prepreg (120) is roughened.

4. A half-metallized slot structure as claimed in claim 3, wherein said roughened surface has a roughness Rz greater than or equal to 25um.