CN211909298U

CN211909298U - Double-sided circuit board for LED lamp strip

Info

Publication number: CN211909298U
Application number: CN201922062170.3U
Authority: CN
Inventors: 赖思强
Original assignee: Jiangmen Dingfeng Lighting Electronic Science & Technology Co ltd
Current assignee: Jiangmen Dingfeng Lighting Electronic Science & Technology Co ltd
Priority date: 2019-11-25
Filing date: 2019-11-25
Publication date: 2020-11-10
Anticipated expiration: 2029-11-25

Abstract

The utility model provides a two-sided circuit board for LED lamp area, includes first circuit layer, second circuit layer and is located insulating layer between two circuit layers, on the first circuit layer, the position that needs the electricity to be connected at two circuit layers forms and pierces through the blind hole on first circuit layer. Because the utility model discloses position formation that needs the electricity to be connected at two circuit layers pierces through the blind hole on first circuit layer can be got rid of the insulating layer realization in this blind hole in the technology in follow-up manufacturing LED lamp area the electricity on first circuit layer and second circuit layer is connected. The utility model discloses realize the simple process that two circuit layer electricity are connected, leave out the inefficiency drilling technology, the electroplating process of high pollution and the palladium metal that the price is expensive have production efficiency height, pollute advantage such as little and low cost.

Description

Double-sided circuit board for LED lamp strip

Technical Field

The utility model relates to a circuit board especially relates to a double-sided circuit board for LED lamp area.

Background

Referring to fig. 1, a conventional double-sided circuit board for an LED strip includes a first circuit layer 011, a second circuit layer 012, and an insulating layer 02 between the first circuit layer 011 and the second circuit layer 012. A via hole 03 is drilled at a position where the first circuit layer 011 and the second circuit layer 012 need to be electrically connected, and then the inner wall of the via hole 03 is metallized. The metallization process comprises depositing a layer of palladium metal on the inner wall (including the insulating layer 02) of the via 03 by chemical means, and then electroplating a copper metal layer 032 on the palladium metal layer 031. The process of arranging the communication hole 03 in the prior art comprises a drilling process with low efficiency, an electroplating process with great environmental pollution and the use of expensive palladium metal, so the prior art has the defects of low production efficiency, great environmental pollution, high cost and the like.

Disclosure of Invention

In order to overcome the defects of the prior art, the utility model provides a double-sided circuit board for LED lamp strip with high production efficiency, small environmental pollution and low cost.

The utility model provides a technical means that its technical problem adopted is: the utility model provides a double-sided circuit board for LED lamp area, includes first circuit layer, second circuit layer and is located insulating layer between first circuit layer and the second circuit layer, on the first circuit layer, form in the position that first circuit layer and second circuit layer need the electricity to be connected and pierce through the blind hole of first circuit layer.

The utility model has the advantages that: because the utility model discloses position formation that needs the electricity to be connected at two circuit layers pierces through the blind hole on first circuit layer can be got rid of the insulating layer realization in this blind hole in the technology in follow-up manufacturing LED lamp area the electricity on first circuit layer and second circuit layer is connected. The utility model discloses realize the simple process that two circuit layer electricity are connected, leave out the inefficiency drilling technology, the electroplating process of high pollution and the palladium metal that the price is expensive have production efficiency height, pollute advantage such as little and low cost.

Drawings

FIG. 1 is a schematic cross-sectional view of a conventional double-sided circuit board;

FIG. 2 is a schematic structural view of the base material of the present invention;

fig. 3 is a schematic structural diagram of the circuit layer formed according to the present invention;

FIG. 4 is a schematic structural view of the present invention for removing the insulating layer in the blind hole;

FIG. 5 is a schematic structural view illustrating the filling of the blind holes with conductive material according to the present invention;

fig. 6 is a schematic structural view of the welding electronic component of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples.

Referring to fig. 2, the present invention provides a method for manufacturing a double-sided circuit board for an LED lamp strip, wherein the selected substrate has a double-sided copper foil 10, and an insulating layer 2 is disposed between the two copper foils 10. A first circuit layer 11 is formed on one side of the copper foil 10 by chemical etching or mechanical cutting, and a second circuit layer 12 is formed on the other side of the copper foil 10. At the same time as the first circuit layer 11 is formed, blind holes 3 penetrating only the first circuit layer 11 are formed at positions where the first circuit layer 11 and the second circuit layer 12 need to be electrically connected. If the first circuit layer 11 is formed by chemical etching, the copper foil 10 that needs to be preserved is covered with an anti-corrosion layer, and the circuit gaps 111 that do not need to be preserved and the positions of the blind holes 3 are not covered with the anti-corrosion layer, so that when the first circuit layer 11 is etched, the blind holes 3 are etched at the same time, and the blind holes 3 only penetrate through the first circuit layer 11 and do not penetrate through the insulating layer 2. If the first circuit layer 11 is formed by mechanical cutting, a cutting die is simultaneously arranged at the position of the gap 111 and the blind hole 3 of the first circuit layer 11, and the blind hole 3 penetrating only the first circuit layer 11 and not the insulating layer 2 is cut out while the cutting die cuts out the circuit layer 11. When the circuit layer of the present invention is manufactured by chemical etching, the first circuit layer 11 and the second circuit layer 12 may be formed simultaneously in one step, or the first circuit layer 11 and the second circuit layer 12 may be formed in two steps.

The double-sided circuit board shown in fig. 3 is obtained through the above process, and the circuit board is provided with a first circuit layer 11 and a second circuit layer 12, wherein an insulating layer 2 is arranged between the first circuit layer 11 and the second circuit layer 12, and blind holes 3 which only penetrate through the first circuit layer 11 and do not penetrate through the insulating layer 2 are arranged at the positions where the first circuit layer 11 and the second circuit layer 12 are electrically connected.

The insulating layer 2 at the blind hole 3 can be removed by laser or other high-temperature objects before welding electronic components, so as to form the circuit board shown in fig. 4. The step can be completed in the circuit board manufacturing link and also can be completed in the electronic component 5 welding link.

Refer to fig. 5 and 6. The blind holes 3 are then filled with a conductive material 4, which conductive material 4 electrically connects the first circuit layer 11 and the second circuit layer 12. This step can be accomplished in the circuit board manufacturing link, also can accomplish at welding electronic components 5, the utility model discloses the preferred completion when welding electronic components 5. Before the electronic component 5 is welded, a screen plate is adopted to fill solder paste at the position where the electronic component 5 is required to be welded and the blind hole 3, then the electronic component 5 is placed, and the solder paste is solidified through heating. Thus, the process of soldering the electronic component 5 and electrically connecting the first circuit layer 11 and the second circuit layer 12 is completed at the same time, and the process is simple.

Because the utility model discloses when forming first circuit layer 11, form blind hole 3 in the position that needs are connected first circuit layer 11 and second circuit layer 12 electricity, the insulating layer that can get rid of in this blind hole 3 at the follow-up technology of making LED lamp area realizes first circuit layer 11 and second circuit layer 12's electricity to be connected. The utility model discloses realize the simple process that two circuit layer electricity are connected, leave out the inefficiency drilling technology, the electroplating process of high pollution and the palladium metal that the price is expensive have production efficiency height, pollute advantage such as little and low cost.

The above description of the specific embodiments is only a better embodiment of the present invention, and does not represent the limitation of the protection content of the present invention, and any technical solutions that can be obtained by normal reasoning of the ordinary technicians in the spirit of the present invention are the protection scope of the present invention.

Claims

1. The utility model provides a two-sided circuit board for LED lamp area, includes first circuit layer, second circuit layer and is located insulating layer between first circuit layer and the second circuit layer, its characterized in that: and blind holes penetrating through the first circuit layer are formed in the first circuit layer at positions where the first circuit layer and the second circuit layer need to be electrically connected.

2. A two-sided circuit board for a LED strip as claimed in claim 1, wherein: the blind hole penetrates the insulating layer.

3. A two-sided circuit board for a LED strip as claimed in claim 2, wherein: and the blind hole is filled with a conductive material which is electrically connected with the first circuit layer and the second circuit layer.

4. A two-sided circuit board for a LED strip as claimed in claim 3, wherein: the conductive material is solder paste.