CN116367439A - Manufacturing method of circuit board with built-in heat dissipation embedded copper block - Google Patents
Manufacturing method of circuit board with built-in heat dissipation embedded copper block Download PDFInfo
- Publication number
- CN116367439A CN116367439A CN202310522417.3A CN202310522417A CN116367439A CN 116367439 A CN116367439 A CN 116367439A CN 202310522417 A CN202310522417 A CN 202310522417A CN 116367439 A CN116367439 A CN 116367439A
- Authority
- CN
- China
- Prior art keywords
- copper
- copper block
- heat dissipation
- insulating resin
- filling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 82
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 80
- 239000010949 copper Substances 0.000 title claims abstract description 80
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 238000005530 etching Methods 0.000 claims abstract description 16
- 238000003801 milling Methods 0.000 claims abstract description 16
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000001569 carbon dioxide Substances 0.000 claims abstract description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 claims abstract description 4
- 239000003814 drug Substances 0.000 claims abstract description 3
- 239000007788 liquid Substances 0.000 claims abstract description 3
- 238000005553 drilling Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 20
- 230000000694 effects Effects 0.000 abstract description 6
- 230000011218 segmentation Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 11
- 239000004743 Polypropylene Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 239000002313 adhesive film Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000006087 Brown hydroboration reaction Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005429 filling process Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a manufacturing method of a circuit board with a built-in heat dissipation buried copper block, which comprises the following steps: pre-dividing copper blocks on a copper base by using a forming plate milling machine, wherein the reserved thickness of the copper blocks is 0.2mm; etching residual copper at the dividing position of the copper block; stripping the dry film by using strong alkaline liquid medicine; filling gaps between the segmented copper blocks with insulating resin; bonding the copper block and the insulating resin together; applying voltage between the two electrodes by using carbon dioxide mixed gas, releasing energy to burn the L1 layer and the dielectric layer to an aperture of 4-6 mil; and (3) carrying out copper filling treatment on the well-laser aperture to connect the L1 layer with the copper block. The method for manufacturing the copper block by segmentation is simple to operate, and has the advantages of large heat dissipation area and good heat dissipation effect.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a method for manufacturing a circuit board with a built-in heat dissipation buried copper block.
Background
Along with the development of the printed circuit board, the requirements on the performance of the heat dissipation element are higher and higher, such as higher and higher heat dissipation power, stronger heat conduction capability and higher reliability, and then the requirements on the heat dissipation of the terminal product are higher and higher, and part of the products start to introduce a novel heat dissipation mode PCB board copper block embedding technology so as to increase the heat dissipation area, shorten the heat transfer path and improve the heat dissipation efficiency. The copper-buried fast PCB technology has excellent heat dissipation performance, is particularly suitable for high-power and high-density electronic products, and can effectively improve the reliability and stability of the system.
However, the manufacturing process of this technology has the following disadvantages:
(1) The technology of embedding copper blocks in the inner layer of the PCB board adopts a groove milling technology in the current industry, and then embedding the copper blocks into the board for pressing and manufacturing, so that the method has higher precision requirement, and the embedded copper blocks have uneven risk, so that any burrs or bulges cannot be required during processing.
(2) The requirement on the precision of the slotting of the base plate and the PP is high, the base plate and the PP are manufactured by using a CCD forming machine, if the size is oversized, the copper block is buried, the pressing glue filling is insufficient due to oversized gaps, the copper block and the PCB are embedded, if the size is undersized, the copper block is buried difficultly, and the surface of the copper block is easily not flush with the copper surface of the outer layer and is scrapped.
(3) After the lamination is completed, PP glue overflows to the surface, and if the PP glue is not cleaned cleanly, residual copper/poor short circuit can be caused in the etching of the subsequent procedure.
Disclosure of Invention
The invention provides a manufacturing method of an etched copper block to solve at least one of the technical problems.
In order to solve the above problems, as one aspect of the present invention, there is provided a method for manufacturing a circuit board with a built-in heat dissipation copper block, comprising:
step 1, laminating a substrate:
bonding the copper block and the insulating resin together;
step 2, drilling:
processing a positioning through hole on the copper base plate formed in the step;
and 3, film sticking:
attaching a dry film on the plate surface;
step 4, exposure:
the dry films on the two sides of the plate are subjected to polymerization reaction by utilizing ultraviolet irradiation on an exposure machine;
step 5, depth control milling:
pre-dividing copper blocks on a copper base by using a forming plate milling machine, wherein the reserved thickness of the copper blocks is 0.2mm;
step 6, etching:
etching residual copper at the dividing position of the copper block;
step 7, removing the film:
stripping the dry film by using strong alkaline liquid medicine;
step 8, filling insulating resin:
filling gaps between the segmented copper blocks with insulating resin;
step 9, laminating:
bonding the copper block and the insulating resin together;
step 10, laser drilling:
applying voltage between the two electrodes by using carbon dioxide mixed gas, releasing energy to burn the L1 layer and the dielectric layer to an aperture of 4-6 mil;
step 11, hole filling:
and (3) carrying out copper filling treatment on the well-laser aperture by utilizing an electroplating hole filling principle, so that the L1 layer is connected with the copper block.
By adopting the technical scheme, the manufacturing process of the base plate and the PP slotting process is not needed, after the copper base plate is pressed, the copper block is segmented by using a depth control milling and etching method, the segmented positions are filled with insulating resin, the filling is completed, the pressing process is completed, and the laser and hole filling process is used for conducting and connecting the outer-layer components and the copper block, so that the heat dissipation effect is achieved. Therefore, the invention can solve the three technical problems without a substrate and a PP slotting process and a slotting process. The method for manufacturing the copper block by cutting through the deep milling and etching combined mode is simple to operate, and has the advantages of large heat dissipation area and good heat dissipation effect.
Drawings
Fig. 1 schematically shows a schematic structural diagram of step 1;
fig. 2 schematically shows a schematic structural diagram of step 2;
fig. 3 schematically shows a schematic structural diagram of step 3;
fig. 4 schematically shows a schematic structural diagram of step 4;
fig. 5 schematically shows a schematic structural diagram of step 5;
fig. 6 schematically shows a schematic structural diagram of step 6;
fig. 7 schematically shows a schematic structural diagram of step 7;
fig. 8 schematically shows a schematic structural diagram of step 8;
fig. 9 schematically shows a schematic structural diagram of step 9;
fig. 10 schematically shows a schematic structural diagram of step 10;
fig. 11 schematically shows a schematic structural diagram of step 11.
Detailed Description
The following describes embodiments of the invention in detail, but the invention may be practiced in a variety of different ways, as defined and covered by the claims.
The invention relates to the field of circuit board manufacturing, in particular to a manufacturing method of a copper circuit board by utilizing a large-area copper block heat dissipation technology, and a PCB is processed by adopting a method of deep milling and etching segmentation of copper blocks so as to solve at least one technical problem.
The specific flow of the invention is as follows: brown oxidation, press fit, positioning hole drilling, pretreatment/film pasting, exposure, deep milling, etching, film removing, resin filling, baking, grinding, brown oxidation, press fit, laser drilling, copper deposition, hole filling and normal flow.
The method comprises the following steps:
step 1, laminating a substrate
Under the action of certain temperature and pressure, the resin fluidity of the prepreg is utilized, and when the temperature reaches a certain degree, solidification occurs to bond the copper block and the insulating resin together; or such substrates may be purchased directly;
step 2, drilling:
processing a positioning through hole on the copper substrate piece by using a high-speed drilling machine;
step 3, film sticking
At a certain temperature and pressure, pasting a dry film on the board surface
Step 4, exposure
The dry films on the two sides of the plate are polymerized by irradiation of ultraviolet light on an exposure machine
Step 5, depth-controlling milling
The forming plate milling machine is used for pre-dividing copper blocks on a copper base, and the reserved thickness of the copper blocks is 0.2mm
Step 6, etching
Etching residual copper at the dividing position of the copper block
Step 7, removing the film
Stripping dry film using a strongly alkaline aqueous solution
Step 8 insulating resin filling
Filling gaps between the segmented copper blocks with insulating resin;
step 9, laminating
Under the action of certain temperature and pressure, the resin fluidity of the high heat conduction insulating adhesive film is utilized, and when the temperature reaches a certain degree, solidification occurs to bond the copper block and the insulating resin together.
Step 10, laser drilling
Applying voltage between two electrodes by using carbon dioxide mixed gas to release energy to burn L1 layer and dielectric layer to pore diameter of 4-6mil
Step 11, hole filling
And (3) carrying out copper filling treatment on the well-laser aperture by utilizing an electroplating hole filling principle, so that the L1 layer is connected with the copper block.
The key flow in the invention is described as follows:
pressing: copper substrate with 0.8mm and 1 sheet of high-heat-conductivity insulating PP (polypropylene) are purchased and sold for lamination, or the laminated substrate is directly purchased and sold
Drilling a positioning hole: positioning holes are drilled on the periphery of the plate to provide positioning for the subsequent processing
Sticking film: pasting a dry film on a copper substrate by using a dry film of 50 mu m;
exposure: carrying out plate finishing exposure on the plate with the film by using an ultraviolet exposure machine;
depth control milling: the depth control milling is carried out on the surface of the copper substrate by using a forming machine, copper base with the thickness of 0.2mm is reserved and is not milled, and the damage to the high-heat-conductivity insulating adhesive film caused by insufficient precision of the forming machine is avoided;
etching: etching the residual thickness of 0.2mm of the copper substrate to ensure that the bottom is completely etched and then removing the film;
removing the film: stripping dry film with sodium hydroxide solution
Filling insulating resin: filling insulating resin between the segmented copper blocks;
grinding: the raised resin was ground away to be flush with the copper base.
Pressing: after the resin filling is completed, 1 piece of high heat conduction insulating adhesive film and 1 layer of outer copper foil are added in a lamination mode to be pressed, and the manufacturing of the copper-buried part is completed until the process
Laser drilling: and drilling through the outer copper foil and the high-heat-conductivity insulating adhesive film by using a laser drilling machine, and controlling the aperture to be 4-6 mil.
Hole filling: and the laser holes are filled with holes, so that the outer layer of the laser holes can be conducted with the copper block, and the communicated part has better heat conduction and heat dissipation effects.
By adopting the technical scheme, the manufacturing process of the base plate and the PP slotting process is not needed, after the copper base plate is pressed, the copper block is segmented by using a depth control milling and etching method, the segmented positions are filled with insulating resin, the filling is completed, the pressing process is completed, and the laser and hole filling process is used for conducting and connecting the outer-layer components and the copper block, so that the heat dissipation effect is achieved. Therefore, the invention can solve the three technical problems without a substrate and a PP slotting process and a slotting process. The method for manufacturing the copper block by cutting through the deep milling and etching combined mode is simple to operate, and has the advantages of large heat dissipation area and good heat dissipation effect.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (1)
1. A manufacturing method of a circuit board with a built-in heat dissipation buried copper block is characterized by comprising the following steps:
step 1, laminating a substrate:
bonding the copper block and the insulating resin together;
step 2, drilling:
processing a positioning through hole on the copper base plate formed in the step;
and 3, film sticking:
attaching a dry film on the plate surface;
step 4, exposure:
the dry films on the two sides of the plate are subjected to polymerization reaction by utilizing ultraviolet irradiation on an exposure machine;
step 5, depth control milling:
pre-dividing copper blocks on a copper base by using a forming plate milling machine, wherein the reserved thickness of the copper blocks is 0.2mm;
step 6, etching:
etching residual copper at the dividing position of the copper block;
step 7, removing the film:
stripping the dry film by using strong alkaline liquid medicine;
step 8, filling insulating resin:
filling gaps between the segmented copper blocks with insulating resin;
step 9, laminating:
bonding the copper block and the insulating resin together;
step 10, laser drilling:
applying voltage between the two electrodes by using carbon dioxide mixed gas, releasing energy to burn the L1 layer and the dielectric layer to an aperture of 4-6 mil;
step 11, hole filling:
and (3) carrying out copper filling treatment on the well-laser aperture by utilizing an electroplating hole filling principle, so that the L1 layer is connected with the copper block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310522417.3A CN116367439A (en) | 2023-05-10 | 2023-05-10 | Manufacturing method of circuit board with built-in heat dissipation embedded copper block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310522417.3A CN116367439A (en) | 2023-05-10 | 2023-05-10 | Manufacturing method of circuit board with built-in heat dissipation embedded copper block |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116367439A true CN116367439A (en) | 2023-06-30 |
Family
ID=86922462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310522417.3A Pending CN116367439A (en) | 2023-05-10 | 2023-05-10 | Manufacturing method of circuit board with built-in heat dissipation embedded copper block |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116367439A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117241466A (en) * | 2023-11-13 | 2023-12-15 | 信丰迅捷兴电路科技有限公司 | Liquid cooling circuit board with embedded device and preparation method thereof |
-
2023
- 2023-05-10 CN CN202310522417.3A patent/CN116367439A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117241466A (en) * | 2023-11-13 | 2023-12-15 | 信丰迅捷兴电路科技有限公司 | Liquid cooling circuit board with embedded device and preparation method thereof |
| CN117241466B (en) * | 2023-11-13 | 2024-01-26 | 信丰迅捷兴电路科技有限公司 | Liquid cooling circuit board with embedded device and preparation method thereof |
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