CN108471670A - A kind of flush type power module structure and preparation method thereof - Google Patents
A kind of flush type power module structure and preparation method thereof Download PDFInfo
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- CN108471670A CN108471670A CN201810435815.0A CN201810435815A CN108471670A CN 108471670 A CN108471670 A CN 108471670A CN 201810435815 A CN201810435815 A CN 201810435815A CN 108471670 A CN108471670 A CN 108471670A
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- 238000002360 preparation method Methods 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 213
- 238000004804 winding Methods 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- 238000005553 drilling Methods 0.000 claims description 11
- 230000004907 flux Effects 0.000 claims description 6
- 239000006390 lc 2 Substances 0.000 claims description 6
- 238000002513 implantation Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 5
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 2
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
Abstract
The invention discloses a kind of flush type power module structures and preparation method thereof, including PCB upper substrates and PCB lower substrates, the upper surface of PCB upper substrates is bonded with power module chip, capacitance, the upper surface of PCB lower substrates offers slots under two to be spacedly distributed, each lower fluting has been implanted into magnetic core, PCB upper substrates are welded on the top of PCB lower substrates, extend or be flush to the upper surface of PCB lower substrates in the upper surface of magnetic core, the winding portion of magnetic core passes through blind hole and the upper surface with PCB upper substrates respectively, the lower surface of PCB lower substrates is conducted, electro-coppering is provided in blind hole.The present invention places in order to good by magnetic core, PCB upper substrates, PCB lower substrates form EE structures or EI structures, which increase blind holes for radiating, improve heat dissipation effect, entire production method, it is simple and effective, and flush type power module structure is small, low manufacture cost has a good application prospect.
Description
Technical field
The present invention relates to power module manufacture technology fields, and in particular to a kind of flush type power module structure and its making
Method.
Background technology
Magnetic core is the essential material of power module, is embedded to the critical process of magnetic core technique and power module making.
Currently, being the presence of following two modes on the market, have the following disadvantages：
(1) winding of power module is made in inside circuit board by magnetic core bonding way, in the region of layout magnetic core, circuit
Plate is slotted, and a kind of magnetic core is divided into magnetic core and lower magnetic core two parts, and two parts are all expressions outside circuit board, by viscous
Realization is connect to connect with power module；Another kind is the individual devices welding with magnetic core, and a part of the magnetic core as individual devices is led to
The mode for crossing welding is connect with power module, and which occupies the arrangement space of circuit board, and it is highly dense small-sized to be unfavorable for power module
Change design；
(2) entire magnetic core is wholly embedded into inside circuit board by magnetic core entirety embedded mode, and the winding of power module is by circuit
Plate is constituted, and the upper and lower surface layer of circuit board where magnetic core can all be laid out other components, such as resistance, capacitance.Which is according to burying
The disposing way for entering circuit board inner core is different, and can be divided into and horizontal bury magnetic and vertical bury magnetic.This method is due to entire magnetic
Core is embedded to inside circuit board, cannot directly be radiated by radiator, is unfavorable for magnetic core heat dissipation, so as to cause entire power module
Stability is bad.
Invention content
The purpose of the present invention is overcoming existing magnetic core entirety embedded mode, cannot directly be radiated by radiator, it is unfavorable
In magnetic core radiates the problem of.The flush type power module structure and preparation method thereof of the present invention, base on PCB is implanted in by magnetic core
Between plate, PCB lower substrates, placed magnetic core in order to good, PCB upper substrates, PCB lower substrates form EE structures or EI knots
Structure, which increase blind holes for radiating, and improves heat dissipation effect, entire production method is simple and effective, and flush type power module knot
Structure is small, and low manufacture cost has a good application prospect.
In order to achieve the above object, the technical solution adopted in the present invention is：
A kind of flush type power module structure, including PCB upper substrates and PCB lower substrates, the upper surface of the PCB upper substrates
It is bonded with power module chip, capacitance, the upper surface of the PCB lower substrates offers slots under two to be spacedly distributed, respectively
Lower fluting has been implanted into magnetic core, and the PCB upper substrates are welded on the top of PCB lower substrates, and the upper surface of the magnetic core is extended
Or it is flush to the upper surface of PCB lower substrates, the winding portion of the magnetic core passes through blind hole and the upper table with PCB upper substrates respectively
Face, PCB lower substrates lower surface be conducted, be provided with electro-coppering in the blind hole.
A kind of flush type power module structure above-mentioned, the blind hole are laser drill or machine drilling.
The upper surface of PCB lower substrates is extended in a kind of flush type power module structure above-mentioned, the upper surface of the magnetic core
When, the lower surface of the PCB upper substrates is provided be spacedly distributed two upper flutings, the upper fluting be located at it is corresponding under open
The surface of slot, the PCB lower substrates constitute EE structures, upper surface of the upper fluting for placing magnetic core with PCB upper substrates
Extend the region of the upper surface of PCB lower substrates, it is described
A kind of flush type power module structure above-mentioned, the upper surface flush of the magnetic core is in the upper surface of PCB lower substrates
When, the lower surface of the PCB upper substrates is plane, and the PCB lower substrates constitute EI structures with PCB upper substrates.
Radiating copper sheet is arranged in the lower surface of a kind of flush type power module structure above-mentioned, the PCB lower substrates, described to dissipate
Hot copper sheet is connected with blind hole.
A kind of flush type power module structure above-mentioned, the magnetic core is by drawing in the lower fluting of abutted equipment implantation.
A kind of production method of flush type power module structure, includes the following steps,
Step (A1) selects magnetic core ring thickness, the winding portion circle of magnetic core to be implanted according to the requirement of power module structure
Number；
Step (B1) calculates separately PCB upper substrates according to the magnetic core ring thickness of the magnetic core (6) of selection, winding portion the number of turns
(1), the thickness of PCB lower substrates (2)；
(B11), by the magnetic core ring thickness of magnetic core (6), the magnetic flux μ and cross-sectional area A of magnetic core (6) is obtained, is calculated
Effective magnetic circuit length lc,
Wherein, L is winding portion the number of turns that inductance value, n required by power module structure are magnetic core (6)；
(B12), according to effective magnetic circuit length lc, the whole plate thickness H of PCB upper substrates and PCB lower substrates is calculated, it is as follows
Shown in formula,
H=(lc-2 (WOuter radius+d))/2
Wherein, WOuter radiusFor the outer radius of magnetic core ring, d is guard space,
And d<(the short side E-2W of PCB upper substrates and PCB lower substrate entiretyOuter radius)/2；
Step (C1) is slotted in the case where the upper surface of PCB lower substrates offers be spacedly distributed two, the depth of each lower fluting
Degree is magnetic core ring thickness, and the width of each lower fluting is bigger 0.2-0.5mm than the width of magnetic core；
Magnetic core is implanted to by drawing abutted equipment in corresponding lower fluting by step (D1)；
PCB upper substrates, are welded on the top of PCB lower substrates by step (E1), to PCB lower substrates and PCB upper substrate structures
At EI structures；
Step (F1) opens up blind hole by laser drill or machine drilling in PCB upper substrates and PCB lower substrates, and blind
Increase electro-coppering in hole, so that magnetic core is passed through blind hole and mutually led with the lower surface respectively with the upper surface of PCB upper substrates, PCB lower substrates
It is logical；
Step (G1), bonding power module chip, capacitance in the upper surface of PCB upper substrates, in the lower surface of PCB lower substrates
Increase radiating copper sheet, completes the making of power module structure, the radiating copper sheet is connected by blind hole with magnetic core.
The thickness of a kind of production method of flush type power module structure above-mentioned, (B12), the PCB upper substrates is PCB
2/3rds of lower substrate, according to the whole plate thickness H of PCB upper substrates and PCB lower substrates is obtained, respectively obtain PCB upper substrates and
The thickness of PCB lower substrates.
A kind of production method of flush type power module structure, includes the following steps,
Step (A2) selects magnetic core ring thickness, the winding portion circle of magnetic core to be implanted according to the requirement of power module structure
Number；
Step (B2), according to the magnetic core ring thickness of the magnetic core of selection, winding portion the number of turns, calculate separately PCB upper substrates,
The thickness of PCB lower substrates；
(B21), by the magnetic core ring thickness of magnetic core, the magnetic flux μ and cross-sectional area A of magnetic core is obtained, effective magnetic is calculated
Road length lc,
Wherein, L is winding portion the number of turns that inductance value, n required by power module structure are magnetic core；
(B22), according to effective magnetic circuit length lc, the whole plate thickness of PCB upper substrates (1) and PCB lower substrates (2) is calculated
H is shown below,
H=(lc-2 (WOuter radius+d))/2
Wherein, WOuter radiusFor the outer radius of magnetic core ring, d is guard space,
And d<(the short side E-2W of PCB upper substrates (1) and PCB lower substrates (2) entiretyOuter radius)/2；
Step (C2) is slotted in the case where the upper surface of PCB lower substrates offers be spacedly distributed two, the depth of each lower fluting
Degree is the 1/2 of magnetic core ring thickness, and the width of each lower fluting is bigger 0.2-0.5mm than the width of magnetic core；In the upper surface of PCB upper substrates
The upper fluting of two to be spacedly distributed is offered, the depth of each upper fluting is magnetic core ring thickness 1/2, and the width of each upper fluting compares magnetic
The big 0.2-0.5mm of width of core；
Magnetic core is implanted to by drawing abutted equipment in corresponding lower fluting by step (D2)；
PCB upper substrates, are welded on the top of PCB lower substrates by step (E2), and magnetic core extends the region insertion of lower fluting
Into the upper fluting of corresponding position, to which PCB lower substrates and PCB upper substrates constitute EE structures；
Step (F2) opens up blind hole by laser drill or machine drilling in PCB upper substrates and PCB lower substrates, and blind
Increase electro-coppering in hole, so that magnetic core is passed through blind hole and mutually led with the lower surface respectively with the upper surface of PCB upper substrates, PCB lower substrates
It is logical；
Step (G2), bonding power module chip, capacitance in the upper surface of PCB upper substrates, in the lower surface of PCB lower substrates
Increase radiating copper sheet, completes the making of power module structure, the radiating copper sheet is connected by blind hole with magnetic core.
The thickness of a kind of production method of flush type power module structure above-mentioned, (B22), the PCB upper substrates is PCB
2/3rds of lower substrate, according to the whole plate thickness H of PCB upper substrates and PCB lower substrates is obtained, respectively obtain PCB upper substrates and
The thickness of PCB lower substrates.
The beneficial effects of the invention are as follows：The flush type power module structure and preparation method thereof of the present invention, magnetic core is implanted into
Between PCB upper substrates, PCB lower substrates, placed magnetic core in order to good, PCB upper substrates, PCB lower substrates form EE structures
Or EI structures, which increase blind holes for radiating, and improves heat dissipation effect, entire production method is simple and effective, and flush type electricity
Source module structural volume is small, and low manufacture cost has a good application prospect.
Description of the drawings
Fig. 1 is the structural schematic diagram of flush type power module structure one embodiment of the present invention；
Fig. 2 is the structural schematic diagram of another embodiment of the flush type power module structure of the present invention.
The meaning marked in attached drawing is as follows：
1：PCB upper substrates；2：PCB lower substrates；201：Radiating copper sheet；3：Power module chip；4：Capacitance；5：Lower fluting；
6：Magnetic core；7：Blind hole；8：Upper fluting.
Specific implementation mode
Below in conjunction with Figure of description, the present invention is further illustrated.
As shown in Figure 1, the flush type power module structure of the present invention, including PCB upper substrates 1 and PCB lower substrates 2, it is described
The upper surface of PCB upper substrates 1 is bonded with power module chip 3, capacitance 4, and the upper surface of PCB lower substrates 2 offers to be divided at equal intervals
Slot 5 under two of cloth, each lower fluting 5 has been implanted into magnetic core 6, and the PCB upper substrates 1 are welded on the top of PCB lower substrates 2,
The upper surface of PCB lower substrates 2 is extended or be flush in the upper surface of the magnetic core 6, and the winding portion of the magnetic core 6 passes through blind
Hole 7 is conducted with the lower surface respectively with the upper surface of PCB upper substrates 1, PCB lower substrates 2, and plating is provided in the blind hole 7
Copper.
Preferably, magnetic core 6 is by drawing under abutted equipment implantation in fluting 5.
Preferably, radiating copper sheet 201 is arranged in the lower surface of PCB lower substrates 2, and radiating copper sheet 201 is connected with blind hole 7, blind
Hole 7 be laser drill or machine drilling, it is easy to process, be provided with electro-coppering in blind hole 7, to make, be embedded to the magnetic core 6 of design,
It being capable of good heat dissipation effect.
Preferably, flush type power module structure one embodiment of the invention, as shown in Figure 1, the upper table of the magnetic core 6
When the upper surface of PCB lower substrates 2 is extended in face, the lower surface of the PCB upper substrates 1, which is provided on two to be spacedly distributed, opens
Slot 8, the upper fluting 8 are located at the surface of corresponding lower fluting 5, and the PCB lower substrates 2 constitute EE knots with PCB upper substrates 1
The benefit of structure, the EE structure designs can reduce pcb board drilling processing difficulty, and upper fluting 8 prolongs for placing the upper surface of magnetic core 6
The region of the upper surface of PCB lower substrates 2 is stretched out,
Another embodiment of the flush type power module structure of the present invention, as shown in Fig. 2, the upper surface of the magnetic core 6 is neat
It puts down when the upper surface of PCB lower substrates 2, the lower surfaces of the PCB upper substrates 1 is plane, base on the PCB lower substrates 2 and PCB
Plate 1 constitutes EI structures, the EI structure designs it is good, can simplify PCB manufacturing process, reduce module assembled difficulty.
The production method of the flush type power module structure of the present invention, one embodiment includes the following steps,
Step (A1) selects magnetic core ring thickness, the winding portion of magnetic core 6 to be implanted according to the requirement of power module structure
The number of turns, the step are the prior art；
Step (B1), according to the magnetic core ring thickness of the magnetic core 6 of selection, winding portion the number of turns, calculate separately PCB upper substrates 1,
The thickness of PCB lower substrates 2；
(B11), by the magnetic core ring thickness of magnetic core 6, the magnetic flux μ and cross-sectional area A of magnetic core 6 are obtained, is calculated effectively
Length of magnetic path lc,
Wherein, L is winding portion the number of turns that inductance value, n required by power module structure are magnetic core 6；
(B12), according to effective magnetic circuit length lc, the whole plate thickness H of PCB upper substrates 1 and PCB lower substrates 2 is calculated, such as
Shown in following formula,
H=(lc-2 (WOuter radius+d))/2
Wherein, WOuter radiusFor the outer radius of magnetic core ring, d is guard space,
And d<(the short side E-2W of 2 entirety of PCB upper substrates 1 and PCB lower substratesOuter radius)/2,
According to whole plate thickness H, the thickness of PCB upper substrates 1 is 2/3rds of PCB lower substrates 2, to respectively obtain PCB
The thickness of upper substrate 1 and PCB lower substrates 2；
Step (C1), slots 5 in the case where the upper surface of PCB lower substrates 2 offers be spacedly distributed two, each lower fluting 5
Depth be magnetic core ring thickness 0.2-0.5mm, the width of each lower fluting 5 is bigger 0.2-0.5mm than the width of magnetic core 6；
Magnetic core 6 is implanted to by drawing abutted equipment in corresponding lower fluting 5 by step (D1)；
PCB upper substrates 1, are welded on the top of PCB lower substrates 2 by step (E1), to PCB lower substrates 2 and PCB upper substrates
1 constitutes EI structures；
Step (F1) opens up blind hole by laser drill or machine drilling in PCB upper substrates 1 and PCB lower substrates 2, and
Increase electro-coppering in blind hole, make magnetic core 6 by blind hole 7 with respectively with the upper surface of PCB upper substrates 1, the following table of PCB lower substrates 2
Face is conducted；
Step (G1), bonding power module chip 3, capacitance 4 in the upper surface of PCB upper substrates 1, under PCB lower substrates 2
Surface increases radiating copper sheet 201, completes the making of power module structure, the radiating copper sheet 201 passes through blind hole 7 and 6 phase of magnetic core
Connection.
The production method of the flush type power module structure of the present invention, second embodiment include the following steps,
Step (A2) selects magnetic core ring thickness, the winding portion of magnetic core 6 to be implanted according to the requirement of power module structure
The number of turns, the step are the prior art；
Step (B2), according to the magnetic core ring thickness of the magnetic core 6 of selection, winding portion the number of turns, calculate separately PCB upper substrates 1,
The thickness of PCB lower substrates 2；
(B21), by the magnetic core ring thickness of magnetic core 6, the magnetic flux μ and cross-sectional area A of magnetic core 6 are obtained, is calculated effectively
Length of magnetic path lc,
Wherein, L is winding portion the number of turns that inductance value, n required by power module structure are magnetic core (6)；
(B22), according to effective magnetic circuit length lc, the whole plate thickness H of PCB upper substrates 1 and PCB lower substrates 2 is calculated, such as
Shown in following formula,
H=(lc-2 (WOuter radius+d))/2
Wherein, WOuter radiusFor the outer radius of magnetic core ring, d is guard space,
And d<(the short side E-2W of 2 entirety of PCB upper substrates 1 and PCB lower substratesOuter radius)/2,
According to whole plate thickness H, the thickness of PCB upper substrates 1 is 2/3rds of PCB lower substrates 2, to respectively obtain PCB
The thickness of upper substrate 1 and PCB lower substrates 2；
Step (C2) is slotted in the case where the upper surface of PCB lower substrates offers be spacedly distributed two, the depth of each lower fluting
Degree is the 1/2 of magnetic core ring thickness, and the width of each lower fluting is bigger 0.2-0.5mm than the width of magnetic core；In the upper surface of PCB upper substrates
The upper fluting of two to be spacedly distributed is offered, the depth of each upper fluting is magnetic core ring thickness 1/2, and the width of each upper fluting compares magnetic
The big 0.2-0.5mm of width of core；
Magnetic core 6 is implanted to by drawing abutted equipment in corresponding lower fluting 5 by step (D2)；
PCB upper substrates 1, are welded on the top of PCB lower substrates 2 by step (E2), to PCB lower substrates 2 and PCB upper substrates
1 constitutes EI structures；
Step (F2) opens up blind hole by laser drill or machine drilling in PCB upper substrates 1 and PCB lower substrates 2, and
Increase electro-coppering in blind hole, make magnetic core 6 by blind hole 7 with respectively with the upper surface of PCB upper substrates 1, the following table of PCB lower substrates 2
Face is conducted；
Step (G2), bonding power module chip 3, capacitance 4 in the upper surface of PCB upper substrates 1, under PCB lower substrates 2
Surface increases radiating copper sheet 201, completes the making of power module structure, the radiating copper sheet 201 passes through blind hole 7 and 6 phase of magnetic core
Connection.
In conclusion the flush type power module structure and preparation method thereof of the present invention, base on PCB is implanted in by magnetic core
Between plate, PCB lower substrates, placed magnetic core in order to good, PCB upper substrates, PCB lower substrates form EE structures or EI knots
Structure, which increase blind holes for radiating, and improves heat dissipation effect, entire production method is simple and effective, and flush type power module knot
Structure is small, and low manufacture cost has a good application prospect.
The basic principles and main features and advantage of the present invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, and the above embodiments and description only describe the originals of the present invention
Reason, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes and improvements
It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle
It is fixed.
Claims (10)
1. a kind of flush type power module structure, it is characterised in that：It is described including PCB upper substrates (1) and PCB lower substrates (2)
The upper surface of PCB upper substrates (1) is bonded with power module chip (3), capacitance (4), and the upper surface of the PCB lower substrates (2) is opened
Equipped with slotting (5) under two to be spacedly distributed, each lower fluting (5) has been implanted into magnetic core (6), PCB upper substrates (1) welding
The upper surface of PCB lower substrates (2) is extended or be flush in the upper surface of top in PCB lower substrates (2), the magnetic core (6),
The winding portion of the magnetic core (6) by blind hole (7) with respectively under the upper surface of PCB upper substrates (1), PCB lower substrates (2)
Surface is conducted, and electro-coppering is provided in the blind hole (7).
2. a kind of flush type power module structure according to claim 1, it is characterised in that：The blind hole (7) is laser
Drilling or machine drilling.
3. a kind of flush type power module structure according to claim 1, it is characterised in that：The upper table of the magnetic core (6)
When the upper surface of PCB lower substrates (2) is extended in face, the lower surface of the PCB upper substrates (1) is provided with two to be spacedly distributed
Upper fluting (8), the upper fluting (8) are located at the surface of corresponding lower fluting (5), the PCB lower substrates (2) and base on PCB
Plate (1) constitutes EE structures, and the upper table of PCB lower substrates (2) is extended in the upper surface that the upper fluting (8) is used to place magnetic core (6)
The region in face.
4. a kind of flush type power module structure according to claim 1, it is characterised in that：The upper table of the magnetic core (6)
When face is flush to the upper surface of PCB lower substrates (2), the lower surface of the PCB upper substrates (1) is plane, the PCB lower substrates
(2) EI structures are constituted with PCB upper substrates (1).
5. a kind of flush type power module structure according to claim 1, it is characterised in that：The PCB lower substrates (2)
Radiating copper sheet (201) is arranged in lower surface, and the radiating copper sheet (201) is connected with blind hole (7).
6. a kind of flush type power module structure according to claim 1, it is characterised in that：The magnetic core (6) passes through suction
It takes in the lower fluting (5) of abutted equipment implantation.
7. a kind of production method of flush type power module structure, it is characterised in that：Include the following steps,
Step (A1) selects magnetic core ring thickness, the winding portion circle of magnetic core to be implanted (6) according to the requirement of power module structure
Number；
Step (B1), according to the magnetic core ring thickness of the magnetic core (6) of selection, winding portion the number of turns, calculate separately PCB upper substrates (1),
The thickness of PCB lower substrates (2)；
(B11), by the magnetic core ring thickness of magnetic core (6), the magnetic flux μ and cross-sectional area A of magnetic core (6) are obtained, is calculated effectively
Length of magnetic path lc,
Wherein, L is winding portion the number of turns that inductance value, n required by power module structure are magnetic core (6)；
(B12), according to effective magnetic circuit length lc, the whole plate thickness H of PCB upper substrates (1) and PCB lower substrates (2) is calculated, such as
Shown in following formula,
H=(lc-2 (WOuter radius+d))/2
Wherein, WOuter radiusFor the outer radius of magnetic core ring, d is guard space,
And d ＜ (the short side E-2W of PCB upper substrates (1) and PCB lower substrates (2) entiretyOuter radius)/2；
Step (C1) is slotted (5) in the case where the upper surface of PCB lower substrates (2) offers be spacedly distributed two, each lower fluting
(5) depth is magnetic core ring thickness, and the width of each lower fluting (5) is bigger 2-4mm than the width of magnetic core (6)；
Magnetic core (6) is implanted to by drawing abutted equipment in corresponding lower fluting (5) by step (D1)；
PCB upper substrates (1) are welded on the top of PCB lower substrates (2) by step (E1), to PCB lower substrates (2) and base on PCB
Plate (1) constitutes EI structures；
Step (F1) opens up blind hole by laser drill or machine drilling in PCB upper substrates (1) and PCB lower substrates (2), and
Increase electro-coppering in blind hole, make magnetic core (6) by blind hole (7) with respectively with the upper surface of PCB upper substrates (1), PCB lower substrates
(2) lower surface is conducted；
Step (G1), in the upper surface of PCB upper substrates (1) bonding power module chip (3), capacitance (4), in PCB lower substrates (2)
Lower surface increase radiating copper sheet (201), complete the making of power module structure, the radiating copper sheet (201) passes through blind hole (7)
It is connected with magnetic core (6).
8. a kind of production method of flush type power module structure according to claim 7, it is characterised in that：(B12), institute
The thickness for stating PCB upper substrates (1) is 2/3rds of PCB lower substrates (2), according to obtaining PCB upper substrates (1) and PCB lower substrates
(2) whole plate thickness H, respectively obtains the thickness of PCB upper substrates (1) and PCB lower substrates (2).
9. a kind of production method of flush type power module structure, it is characterised in that：Include the following steps,
Step (A2) selects magnetic core ring thickness, the winding portion circle of magnetic core to be implanted (6) according to the requirement of power module structure
Number；
Step (B2), according to the magnetic core ring thickness of the magnetic core (6) of selection, winding portion the number of turns, calculate separately PCB upper substrates (1),
The thickness of PCB lower substrates (2)；
(B21), by the magnetic core ring thickness of magnetic core (6), the magnetic flux μ and cross-sectional area A of magnetic core (6) are obtained, is calculated effectively
Length of magnetic path lc,
Wherein, L is winding portion the number of turns that inductance value, n required by power module structure are magnetic core (6)；
(B22), according to effective magnetic circuit length lc, the whole plate thickness H of PCB upper substrates (1) and PCB lower substrates (2) is calculated, such as
Shown in following formula,
H=(lc-2 (WOuter radius+d))/2
Wherein, WOuter radiusFor the outer radius of magnetic core ring, d is guard space,
And d ＜ (the short side E-2W of PCB upper substrates (1) and PCB lower substrates (2) entiretyOuter radius)/2；
Step (C2) is slotted (5) in the case where the upper surface of PCB lower substrates (2) offers be spacedly distributed two, each lower fluting
(5) depth is the 1/2 of magnetic core ring thickness, and the width of each lower fluting (5) is bigger 0.2-0.5mm than the width of magnetic core (6)；In PCB
The upper surface of upper substrate (1) offers the upper fluting (8) of two to be spacedly distributed, and the depth of each upper fluting (8) is that magnetic core ring is thick
The width of degree 1/2, each upper fluting (8) is bigger 0.2-0.5mm than the width of magnetic core (6)；
Magnetic core (6) is implanted to by drawing abutted equipment in corresponding lower fluting (5) by step (D2)；
PCB upper substrates (1), are welded on the top of PCB lower substrates (2) by step (E2), and magnetic core (6) extends lower fluting (5)
Region is embedded into the upper fluting (8) of corresponding position, to which PCB lower substrates (2) and PCB upper substrates (1) constitute EE structures；
Step (F2) opens up blind hole by laser drill or machine drilling in PCB upper substrates (1) and PCB lower substrates (2), and
Increase electro-coppering in blind hole, make magnetic core (6) by blind hole (7) with respectively with the upper surface of PCB upper substrates (1), PCB lower substrates
(2) lower surface is conducted；
Step (G2), in the upper surface of PCB upper substrates (1) bonding power module chip (3), capacitance (4), in PCB lower substrates (2)
Lower surface increase radiating copper sheet (201), complete the making of power module structure, the radiating copper sheet (201) passes through blind hole (7)
It is connected with magnetic core (6).
10. a kind of production method of flush type power module structure according to claim 8, it is characterised in that：(B22),
The thickness of the PCB upper substrates (1) is 2/3rds of PCB lower substrates (2), according to obtaining base under PCB upper substrates (1) and PCB
The whole plate thickness H of plate (2), respectively obtains the thickness of PCB upper substrates (1) and PCB lower substrates (2).
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| CN201810435815.0A CN108471670A (en) | 2018-05-09 | 2018-05-09 | A kind of flush type power module structure and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810435815.0A CN108471670A (en) | 2018-05-09 | 2018-05-09 | A kind of flush type power module structure and preparation method thereof |
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| CN108471670A true CN108471670A (en) | 2018-08-31 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021203327A1 (en) * | 2020-04-08 | 2021-10-14 | 深南电路股份有限公司 | Embedded circuit board and fabrication method therefor |
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| WO2021203327A1 (en) * | 2020-04-08 | 2021-10-14 | 深南电路股份有限公司 | Embedded circuit board and fabrication method therefor |
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