CN103857208A - Machining method for circuit board drilling - Google Patents
Machining method for circuit board drilling Download PDFInfo
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- CN103857208A CN103857208A CN201210519567.0A CN201210519567A CN103857208A CN 103857208 A CN103857208 A CN 103857208A CN 201210519567 A CN201210519567 A CN 201210519567A CN 103857208 A CN103857208 A CN 103857208A
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Abstract
The invention relates to the field of circuit board processing, and provides a machining method for circuit board drilling. The method aims to solve the problem that due to wiring of a ball grid array (BGA) PCB with the diameter of 0.6 mm, the yield of a circuit board is difficult to guarantee. The machining method for circuit board drilling includes the following steps that primary bonding is carried out on L2 to Ln-1 layers of circuit boards; mechanical through holes with the diameter of 0.2 mm are drilled; copper electroplating is carried out on the through holes; the through holes are filled with resin; copper is electroplated and covers the through holes filled with the resin; the L1 layer of circuit board and the Ln layer of circuit board cover the L2-Ln-1 layers of the circuit boards for secondary bonding; laser blind holes with the diameter of 4 mil are drilled; copper electroplating is carried out on the blind holes. The invention further provides a circuit board formed through the method. By means of combination of the electroless copper technology processing method and HDI, drilling in the BGA PCB is achieved, so that conducting and wiring functions are achieved, good use performance of products is guaranteed, and the defective rate of the products is lowered.
Description
Technical field
The invention belongs to circuit board manufacture field, relate in particular to a kind of processing method of circuit boring.
Background technology
Along with the development of printed circuit board industry, circuit board is more and more towards the future development that becomes more meticulous, and is arranged at circuit in circuit board more and more thinner, and spacing is more and more less.Even in the board design of circuit board (Ball Grid Array PCB the is called for short BGA) cabling of the ball grid array structure of 0.6mm.Adopt traditional diamond-making technique to this class BGA circuit board hole, the processing such as figure processing, difficulty of processing is large, and is difficult to ensure the yield of BGA circuit board, therefore, this becomes the difficult problem that industry need to solve.
Summary of the invention
The object of the embodiment of the present invention is to provide a kind of processing method of circuit boring, is intended to circuit board (Ball Grid Array PCB, the be called for short BGA) cabling of the ball grid array structure that solves 0.6mm and is difficult to ensure the problem of circuit board yield.
The embodiment of the present invention is achieved in that a kind of processing method of circuit boring, and for the processing of ball grid array structure circuit board, this processing method comprises the following steps: L2 ~ Ln-1 layer circuit board is carried out to pressing for the first time; Drill diameter is the mechanical through hole of 0.2mm; To described through hole sink copper electroplate; Resin is clogged to described through hole; Filling up the above-mentioned the electroplates in hole covering copper of resin; Outer L1 and Ln layer circuit board are covered on L2 ~ Ln-1 layer circuit board and carry out pressing for the second time; Drill diameter is the laser blind hole of 4mil; And to described blind hole sink copper electroplate.
Preferably, the circuit board that described circuit board is ball grid array structure, this circuit board is of a size of 0.6mm.
Preferably, described pressing processing procedure for the first time comprises internal layer oxidation processes, lamination processing procedure, pressing processing procedure and last handling process.
Preferably, the scene temperature of lamination processing procedure is controlled at 20 ± 2 DEG C, and relative humidity is 50% ± 5%, and the circuit board composition that completes lamination processing will complete pressing in 1 hour.
Preferably, lamination processing method is without tip pressing-plate method, has tip trepanning superposition method or pressure chamber formula superposition method.
Preferably, described heavy copper electroplating processes method comprises that the dirty processing of brill, electroless copper plating are processed and the processing of thickening copper.
Preferably, described laser blind hole PROCESS FOR TREATMENT is carbon dioxide laser blind hole manufacture craft or ultraviolet laser blind hole manufacture craft.
Preferably, the radius of institute's drilling blind hole is 2mil, and the distance between two blind hole centers is 0.6mm, and the ring width of described blind hole is 5mil, and the spacing between the outward flange of described blind hole and the outward flange of described wire is 3.5mil.
Preferably, described blind hole and described through hole mutual conduction, to realize the conducting of described circuit board L1 layer to Ln layer.
The present invention also provides a kind of circuit board, and described circuit board is the circuit board that adopts the processing method in foregoing circuit twist drill hole to form.
The present invention utilizes copper plating process processing method and high density interconnect technique processing method to mutually combine to have realized on circuit board and holes, by the first processing of the circuit board internal layer after lamination through hole, then in the outer laser drilling blind hole of circuit board, and through hole and blind hole are carried out to electro-coppering processing, reach conducting and realize wiring function with this, ensure good product serviceability, and reduced product fraction defective.Processing method of the present invention, is easy to processing, can avoid utilizing traditional diamond-making technique directly to drill through hole on circuit board and the circuit board damage that causes or be difficult to the problems such as processing.
Brief description of the drawings
Fig. 1 is the flow chart of holing on circuit board that the embodiment of the present invention provides.
Fig. 2 is the sectional view after boring on circuit board that the embodiment of the present invention provides.
Fig. 3 is the machining sketch chart at circuit board upward wiring that the embodiment of the present invention provides.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Please with reference to Fig. 1 to Fig. 3, the processing method of the circuit boring that the embodiment of the present invention provides, mainly to utilize copper plating process processing method and high density interconnect technique processing method (High DensityInterconnection is called for short HDI) to mutually combine to realize boring and cabling on circuit board 100.
In the present embodiment, the circuit board (Ball Grid ArrayPCB is called for short BGA) that circuit board 100 is ball grid array structure, this circuit board 100 is of a size of 0.6mm.
This processing method specifically comprises the following steps:
S101: L2 ~ Ln-1 layer circuit board is carried out to pressing for the first time, discrete multi-layer sheet is pressed into together with sticky piece to the multi-layer sheet of the needed number of plies and thickness.Pressing is, by means of B rank prepreg, each sandwich circuit is bonded to overall process.Bonding is by phase counterdiffusion, the infiltration between large molecule on each layer circuit board interface, and is interweaved and forms.
In the present embodiment, n is any even number between 4 ~ 32, for example, and 4,6,8 etc.
Pressing processing procedure for the first time comprises internal layer oxidation processes, lamination processing procedure, pressing processing procedure and last handling process.
Internal layer oxidation processes mainly comprises that alkali cleaning, pickling, microetch, preimpregnation, oxidation, reduction, anti-oxidant and rear cleaning such as dry up at the processing procedure, and this processing procedure can increase resin.
The scene temperature of lamination processing procedure is controlled at 20 ± 2 DEG C, and relative humidity is 50% ± 5%, and the circuit board composition that completes lamination processing will complete pressing in 1 hour.In the present embodiment, lamination processing method can be without tip pressing-plate method, have tip trepanning superposition method or pressure chamber formula superposition method.
Pressing processing procedure is that under the effect by high-temperature and high-pressure conditions, by each inner plating, prepreg and Copper Foil are bonded together, and make the production process of multilayer circuit board by pre-pipe position folded row's plate.The process conditions of pressing processing procedure are for providing prepreg from solid-state liquid state, the required temperature of polymerization reaction take place then of becoming; Provide liquid resin to flow and fill the needed pressure in circuit space; And provide and make volatile ingredient flow out the outer needed vacuum degree of plate.
Pressing process is for the first time that the multilayer circuit board after typesetting is folded is sent into vacuum hotpressing machine.Utilize the heat energy that provides of machinery, by the resin melting in resin sheet, so as to adhesive base plate and fill space.
S102: the mechanical through hole 20 that drill diameter is 0.2mm.Machine drilling is to utilize the mode of boring cutter high-speed cutting, forms the through hole 20 of up/down perforation on the circuit board after pressing for the first time.
In the present embodiment, when circuit board 100 to be processed is 6 laminate, machine drilling is that 2nd ~ 5 layer circuit boards are carried out to buried via hole processing.
S103: to through hole 20 sink copper electroplate.This step is the metalized to through hole 20, the inwall of through hole 20 cover one deck evenly, the metallic copper of heat shock resistance, to form electro-copperings 10 at through hole 20 inwalls.This metallization treating method comprises brill pollution discharge treatment method, electroless copper plating processing method and thickening copper processing method.This metallization treating method belongs to prior art, herein enumeration not.
S104: resin 30 is clogged to through hole 20.This step is utilized resin ink filling through hole 20 and is filled up.
S105: electroplating lid copper on the through hole 20 that fills up resin 30.Carry out whole plate electro-coppering processing to clogging the circuit board 100 of resin 30, to form electro-coppering 10 at circuit board surface, and enter next step after melanism or brown.
S106: outer L1 and Ln layer circuit board are covered on L2 ~ Ln-1 layer circuit board and carry out pressing for the second time.
S107: drill diameter is 4mil laser blind hole 40.
In the present embodiment, laser blind hole technique processing method can be carbon dioxide laser blind hole manufacture craft or ultraviolet laser blind hole manufacture craft.The method belongs to prior art, herein enumeration not.
Please refer to Fig. 3, in order to arrange wire 200 between two blind holes 40, the width of this wire 200 is D, to two blind holes 40 and and wire 200 between position relationship arrange: blind hole 40 radiuses are R, distance between every two blind hole 40 centers is L, the ring width 50 of blind hole 40 is T, and the spacing between the outward flange of blind hole 40 and the outward flange of wire 200 is W.
In the present embodiment, in order to arrange that width D is the wire 200 of 3mi l, the radius R that needs drilling blind hole 40 is 2mil, distance L between two blind hole 40 centers is 0.6mm, the ring width 50T of blind hole 40 is 5mil, spacing W between the outward flange of the outward flange of blind hole 40 and wire 200 is 3.5mil, has reduced thus difficulty of processing, thereby has ensured the processing yield of circuit board 100.
In the present embodiment, the penetration rate of laser drilling blind hole 40 is 120/minute.
S108: to blind hole 40 sink copper electroplate.Blind hole 40 is sunk copper electroplate before, need carry out abatement processes to blind hole 40, so as not in blind hole 40, leave boring after produce cinder.
In the present embodiment, the heavy copper electroplating technology processing procedure of blind hole 40 is identical with the heavy copper electroplating technology processing method of through hole 20, forms electro-coppering 10 in blind hole 40 inwalls.
Because desired BGA circuit board size is little, utilize traditional handicraft processing method to be difficult to realize boring and wiring function, but, the present invention utilizes copper plating process processing method and HDI to mutually combine to have realized on BGA circuit board and holes, by the first processing of the circuit board internal layer after lamination through hole, then in the outer laser drilling blind hole 40 of circuit board, and through hole 20 and blind hole 40 are carried out to electro-coppering processing, reach conducting and realize wiring function with this, ensure good product serviceability, and reduced product fraction defective.Processing method of the present invention, is easy to processing, can avoid utilizing traditional diamond-making technique directly to drill through hole on circuit board and the circuit board damage that causes or be difficult to the problems such as processing.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. a processing method for circuit boring, for the processing of ball grid array structure circuit board, is characterized in that, comprises the following steps:
L2 ~ Ln-1 layer circuit board is carried out to pressing for the first time;
Drill diameter is the mechanical through hole of 0.2mm;
To described through hole sink copper electroplate;
Resin is clogged to described through hole;
Filling up the above-mentioned the electroplates in hole covering copper of resin;
Outer L1 and Ln layer circuit board are covered on L2 ~ Ln-1 layer circuit board and carry out pressing for the second time;
Drill diameter is the laser blind hole of 4mil; And
To described blind hole sink copper electroplate.
2. the processing method of circuit boring as claimed in claim 1, is characterized in that, the circuit board that described circuit board is ball grid array structure, and this circuit board is of a size of 0.6mm.
3. the processing method of circuit boring as claimed in claim 1, is characterized in that, described pressing processing procedure for the first time comprises internal layer oxidation processes, lamination processing procedure, pressing processing procedure and last handling process.
4. the processing method of circuit boring as claimed in claim 3, is characterized in that, the scene temperature of lamination processing procedure is controlled at 20 ± 2 DEG C, and relative humidity is 50% ± 5%, and the circuit board composition that completes lamination processing will complete pressing in 1 hour.
5. the processing method of circuit boring as claimed in claim 3, is characterized in that, lamination processing method is without tip pressing-plate method, has tip trepanning superposition method or pressure chamber formula superposition method.
6. the processing method of circuit boring as claimed in claim 1, is characterized in that, described heavy copper electroplating processes method comprises bores dirty processing, electroless copper plating processing and the processing of thickening copper.
7. the processing method of circuit boring as claimed in claim 1, is characterized in that, described laser blind hole PROCESS FOR TREATMENT is carbon dioxide laser blind hole manufacture craft or ultraviolet laser blind hole manufacture craft.
8. the processing method of circuit boring as claimed in any of claims 1 to 7 in one of claims, it is characterized in that, the radius of institute's drilling blind hole is 2mil, distance between two blind hole centers is 0.6mm, the ring width of described blind hole is 5mil, and the spacing between the outward flange of described blind hole and the outward flange of described wire is 3.5mil.
9. the processing method of circuit boring as claimed in claim 1, is characterized in that, described blind hole and described through hole mutual conduction, to realize the conducting of described circuit board L1 layer to Ln layer.
10. a circuit board that adopts the processing method of the circuit boring described in any one in claim 1 to 9 to form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210519567.0A CN103857208A (en) | 2012-12-06 | 2012-12-06 | Machining method for circuit board drilling |
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| CN201210519567.0A CN103857208A (en) | 2012-12-06 | 2012-12-06 | Machining method for circuit board drilling |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106102352A (en) * | 2016-07-04 | 2016-11-09 | 广州兴森快捷电路科技有限公司 | A kind of method solving non-symmetrical line slab warping |
| CN106455368A (en) * | 2016-11-25 | 2017-02-22 | 深圳崇达多层线路板有限公司 | Production method for first-order HDI (high density interconnector) resin plug hole circuit board |
| CN108617100A (en) * | 2018-05-09 | 2018-10-02 | 珠海精路电子有限公司 | A kind of manufacture craft of thickness copper foil circuit board |
| CN112739016A (en) * | 2020-12-10 | 2021-04-30 | 惠州市特创电子科技股份有限公司 | Stacked hole circuit board and preparation method thereof |
| WO2021097614A1 (en) * | 2019-11-18 | 2021-05-27 | 苏州新光维医疗科技有限公司 | Integrated miniature welding plate structure and manufacturing process therefor |
| CN114173477A (en) * | 2020-09-10 | 2022-03-11 | 深南电路股份有限公司 | Circuit board drilling method and device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1348330A (en) * | 2001-10-19 | 2002-05-08 | 全懋精密科技股份有限公司 | Manufacture of thin core board for multiple-layer circuit board |
| US20060049913A1 (en) * | 2004-09-01 | 2006-03-09 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board including embedded resistor and method of fabricating the same |
| CN101296583A (en) * | 2008-04-24 | 2008-10-29 | 苏州市惠利华电子有限公司 | Method for processing printed circuit board |
| CN101977486A (en) * | 2010-10-29 | 2011-02-16 | 东莞红板多层线路板有限公司 | Method for manufacturing via stubs of circuit board |
| CN102159040A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for drilling hole on four-layered circuit board |
| CN102523704A (en) * | 2011-12-15 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Production method of multi-stage HDI plate |
-
2012
- 2012-12-06 CN CN201210519567.0A patent/CN103857208A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1348330A (en) * | 2001-10-19 | 2002-05-08 | 全懋精密科技股份有限公司 | Manufacture of thin core board for multiple-layer circuit board |
| US20060049913A1 (en) * | 2004-09-01 | 2006-03-09 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board including embedded resistor and method of fabricating the same |
| CN101296583A (en) * | 2008-04-24 | 2008-10-29 | 苏州市惠利华电子有限公司 | Method for processing printed circuit board |
| CN101977486A (en) * | 2010-10-29 | 2011-02-16 | 东莞红板多层线路板有限公司 | Method for manufacturing via stubs of circuit board |
| CN102159040A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for drilling hole on four-layered circuit board |
| CN102523704A (en) * | 2011-12-15 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Production method of multi-stage HDI plate |
Non-Patent Citations (1)
| Title |
|---|
| 聂荣 等: "《实例解析PCB设计技巧-基于Protel DXP》", 31 March 2006, 机械工业出版社 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106102352A (en) * | 2016-07-04 | 2016-11-09 | 广州兴森快捷电路科技有限公司 | A kind of method solving non-symmetrical line slab warping |
| CN106102352B (en) * | 2016-07-04 | 2019-10-15 | 广州兴森快捷电路科技有限公司 | A method of solving non-symmetrical line slab warping |
| CN106455368A (en) * | 2016-11-25 | 2017-02-22 | 深圳崇达多层线路板有限公司 | Production method for first-order HDI (high density interconnector) resin plug hole circuit board |
| CN108617100A (en) * | 2018-05-09 | 2018-10-02 | 珠海精路电子有限公司 | A kind of manufacture craft of thickness copper foil circuit board |
| CN108617100B (en) * | 2018-05-09 | 2020-06-30 | 珠海精路电子有限公司 | Manufacturing process of thick copper foil circuit board |
| WO2021097614A1 (en) * | 2019-11-18 | 2021-05-27 | 苏州新光维医疗科技有限公司 | Integrated miniature welding plate structure and manufacturing process therefor |
| GB2604516A (en) * | 2019-11-18 | 2022-09-07 | Scivita Med Tech Co Ltd | Integrated miniature welding plate structure and manufacturing process therefor |
| CN114173477A (en) * | 2020-09-10 | 2022-03-11 | 深南电路股份有限公司 | Circuit board drilling method and device |
| CN112739016A (en) * | 2020-12-10 | 2021-04-30 | 惠州市特创电子科技股份有限公司 | Stacked hole circuit board and preparation method thereof |
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Application publication date: 20140611 |