CN108617100B - Manufacturing process of thick copper foil circuit board - Google Patents
Manufacturing process of thick copper foil circuit board Download PDFInfo
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- CN108617100B CN108617100B CN201810437562.0A CN201810437562A CN108617100B CN 108617100 B CN108617100 B CN 108617100B CN 201810437562 A CN201810437562 A CN 201810437562A CN 108617100 B CN108617100 B CN 108617100B
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- copper foil
- dry film
- bonding sheet
- metal composite
- front surface
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Abstract
The invention discloses a manufacturing process of a thick copper foil circuit board, which selects 8.5 toThe front surface of the copper foil, the back surface of the copper foil, the first dry film and the second dry film are all provided with alignment marks; etching the front side and the back side of the copper foil relatively to obtain a circuit; filling the line gap with resin ink; the metal composite base material, the bonding sheet and the copper foil are sequentially stacked and pressed at high temperature. The alignment deviation of double-sided etching is guaranteed to be +/-0.075 mm, and the circuit pattern is accurate; the circuit board is anti-bending and does not crack; the power performance and the heat conduction and radiation performance are higher; the thermal conductivity is more than or equal to 3.0W/m.K, the breakdown voltage is more than or equal to 3.0KV, and the thermal resistance is as follows: 0.45 ℃/W-0.65 ℃/W, thermal shock resistance: 300 ℃/60s/6cycle, insulating layer bonding force: not less than 17N/mm2。
Description
Technical Field
The invention relates to a circuit board, in particular to a manufacturing process of a thick copper foil circuit board.
Background
With the continuous expansion of the application field of the circuit board, more and more products need to use a large-current substrate; such as power modules and automotive electronics. Some of them are the same as conventional PCBs, such as portable electronic products, network products, base station devices, etc.; and also different from the conventional PCB field, such as an automobile, an industrial control, a power supply module and the like.
The application field and the demand of the large-current substrate are rapidly expanded in recent years, so that a thick copper printed circuit board is needed to be arranged, and the circuit board is ensured to have larger current carrying capacity.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a manufacturing process of a thick copper foil circuit board, and the circuit board has higher current bearing performance.
The technical scheme adopted for solving the technical problem is as follows:
a manufacturing process of a thick copper foil circuit board comprises the following steps:
step a, selecting a copper foil with 8.5-11.5 oz, and arranging alignment marks on the front surface of the copper foil, the back surface of the copper foil, the first dry film and the second dry film;
b, correspondingly attaching the front surface of the copper foil and the first dry film according to the alignment marks, attaching the dry film on the reverse surface of the copper foil for protection, and exposing, developing and etching the front surface of the copper foil to etch a front surface circuit gap of the copper foil;
c, correspondingly attaching the back surface of the copper foil and the second dry film according to the alignment marks, attaching the dry film on the front surface of the copper foil for protection, exposing, developing and etching the back surface of the copper foil, communicating the front circuit gap and the back circuit gap on the copper foil, and completing etching on the copper foil to generate a circuit gap;
d, filling the gaps of the circuits with resin ink on a screen printing machine, polishing the surface layer of the copper foil by using an abrasive belt, removing the residual resin ink and performing surface treatment, and flattening the surface of the copper foil;
step e, after polishing the surface layer of the copper foil, supplementing moisture to the upper end face and the lower end face of the bonding sheet, sequentially stacking the metal composite substrate, the bonding sheet and the copper foil, pressing the copper foil, the bonding sheet and the metal composite substrate at a high temperature on a high-temperature pressing machine with a heating assembly, wherein the pressing temperature is 200-240 ℃, the pressure is 120-135 kg/cm2, the thickness of the bonding sheet is 0.35-0.65 mm, the mixed components of the metal composite substrate comprise carbon, boron and Sic fibers, and the thickness of the metal composite substrate is 1.8-2.2 mm;
the bonding sheet is made of PP materials.
According to another embodiment of the present invention, in the step d, after the line gap is filled with the thick resin ink, a drying process is further performed.
According to another embodiment of the present invention, further, in the step b, the front surface of the copper foil and the surface of the first dry film for connecting the front surface of the copper foil are subjected to impurity dust removal; and c, removing impurity and dust on the back surface of the copper foil and the surface of the second dry film, which is used for connecting the back surface of the copper foil.
According to another embodiment of the present invention, the copper foil has a thickness of 9.5 to 10.5oz, the bonding sheet has a thickness of 0.45 to 0.55mm, and the metal composite substrate has a thickness of 1.9 to 2.1 mm.
According to another embodiment of the present invention, further, in the step b, the copper foil is immersed in the etching solution with the front surface facing downward; in the step c, the copper foil is immersed in the etching solution with the reverse side facing downwards.
The manufacturing process of the thick copper foil circuit board has the following beneficial effects: the alignment deviation of double-sided etching is guaranteed to be +/-0.075 mm, the line form and position tolerance is small, and the line pattern is accurate; the circuit board has higher toughness and ductility, and the circuit board is resistant to bending and does not crack; the power performance and the heat conduction and radiation performance are higher; thermal conductivity is more than or equal to 3.0W/m.K, breakdown voltage is more than or equal to 3.0KV, and thermal resistance is as follows: 0.45 ℃/W-0.65 ℃/W, thermal shock resistance: 300 ℃/60s/6cycle, insulating layer bonding force: not less than 17N/mm2。
Drawings
FIG. 1 is a process flow diagram of the present invention.
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
As shown in fig. 1, a manufacturing process of a thick copper foil circuit board comprises the following steps:
step a, selecting a copper foil with 8.5-11.5 oz, and arranging alignment marks on the front surface of the copper foil, the back surface of the copper foil, the first dry film and the second dry film;
b, correspondingly attaching the front surface of the copper foil and the first dry film according to the alignment marks, attaching the dry film on the reverse surface of the copper foil for protection, and exposing, developing and etching the front surface of the copper foil to etch a front surface circuit gap of the copper foil;
c, correspondingly attaching the back surface of the copper foil and the second dry film according to the alignment marks, attaching the dry film on the front surface of the copper foil for protection, exposing, developing and etching the back surface of the copper foil, communicating the front circuit gap and the back circuit gap on the copper foil, and completing etching on the copper foil to generate a circuit gap;
d, filling the gaps of the circuits with resin ink on a screen printing machine, polishing the surface layer of the copper foil by using an abrasive belt, removing the residual resin ink and performing surface treatment, and flattening the surface of the copper foil;
step e, after polishing the surface layer of the copper foil, supplementing moisture to the upper end face and the lower end face of the bonding sheet, sequentially stacking the metal composite substrate, the bonding sheet and the copper foil, pressing the copper foil, the bonding sheet and the metal composite substrate at a high temperature on a high-temperature pressing machine with a heating assembly, wherein the pressing temperature is 200-240 ℃, the pressure is 120-135 kg/cm2, the thickness of the bonding sheet is 0.35-0.65 mm, the mixed components of the metal composite substrate comprise carbon, boron and Sic fibers, and the thickness of the metal composite substrate is 1.8-2.2 mm.
Adopting a front-back opposite etching mode, namely pasting a dry film on the front side, exposing, developing and etching, and etching the thick copper by half depth; the front side is then protected with a dry film, exposed and developed on the reverse side, and etched again to the remaining depth. The front surface of the copper foil, the back surface of the copper foil, the first dry film and the second dry film are provided with alignment marks; ensure the contraposition deviation of double-sided etching to be +/-0.075 mm.
And selecting the resin ink as the line insulation filler. The ink has good viscosity and fluidity, can flow and scrape on a screen printing machine, and can well fill line gaps; the resin ink can be well adhered to the copper foil after being dried. The resinous vehicle also provides the most basic and important adhesion between the ink and the substrate while acting as a dispersing wetting medium in the ink.
The copper foil with the thickness of 8.5-11.5 oz is selected to manufacture a circuit and is used as a conductor for bearing an electronic component, the performance of the conductor is enough to bear the high current load of more than 500 amperes, and the conductor has the best extension performance and is very suitable for being applied to the aspect of building modeling; belongs to a non-combustible material and can prevent fire; the copper plate forms a strong, non-toxic passivation layer even in extremely corrosive atmospheric environments. The mixed components of the metal composite base material comprise carbon, boron and Sic fibers, the metal matrix occupies a very high volume fraction, the specific good thermal conductivity and electrical conductivity of metal are kept, the temperature gradient can be rapidly and effectively reduced, and the reliability of an integrated circuit is improved; as the reinforcements such as carbon, boron, Sic fiber and the like generally have high modulus and low expansion coefficient, the metal composite substrate has higher bending resistance and no cracking performance.
The high-ductility copper foil, the metal composite base material and the bonding sheet are selected, so that the circuit board has high toughness and ductility, and the circuit board is resistant to bending and does not crack; has higher power performance and heat conduction and radiation performance. Thermal conductivity is more than or equal to 3.0W/m.K, breakdown voltage is more than or equal to 3.0KV, and thermal resistance is as follows: 0.45 ℃/W-0.65 ℃/W, thermal shock resistance: 300 ℃/60s/6cycle, insulating layer bonding force: not less than 17N/mm2。
The bonding sheet is made of PP materials. Polypropylene, PP for short, is a semi-crystalline thermoplastic; has high impact resistance, strong mechanical property, strong bonding force in a non-curing state, resistance to corrosion of various organic solvents and acid and alkali, and excellent moisture absorption resistance and solubility resistance.
And d, drying the circuit gap after the resin ink is filled into the circuit gap to be thick, wherein the resin ink is dried to be thick to well fill the circuit gap to form an insulation gap between circuits, the circuit insulation requirements are met on the electrical characteristics, and the working safety of the circuit board is ensured. After the resin printing ink is dried, the surface treatment of the copper foil is convenient, and the residual resin printing ink on the surface of the copper foil is removed.
In the step b, impurity and dust removal is carried out on the front surface of the copper foil and the surface of the first dry film, which is used for connecting the front surface of the copper foil; and c, removing impurity and dust on the back surface of the copper foil and the surface of the second dry film, which is used for connecting the back surface of the copper foil. The method has the advantages that after the dry film is attached to the copper foil, wrinkles or bulges are avoided, accurate transfer of the circuit pattern is guaranteed, deflection does not occur, the form and position tolerance of the circuit pattern is small, the thickness of the circuit in the formed circuit pattern is uniform, and the copper foil can obtain a good circuit after etching.
And d, before lamination, removing dust impurities on the surfaces of the metal composite base material, the bonding sheet and the copper foil, so that the high strength of the lamination connection of the metal composite base material, the bonding sheet and the copper foil is ensured, and the circuit board is resistant to bending and does not crack.
The thickness of the copper foil is 9.5-10.5 oz, the thickness of the bonding sheet is 0.45-0.55 mm, and the thickness of the metal composite base material is 1.9-2.1 mm. The thick copper foil circuit board has good comprehensive performance, larger current bearing performance and better heat dissipation performance, and the bonding sheet can well bond the copper foils with the two thicknesses and the metal composite base material.
In the step b, the front surface of the copper foil faces downwards when the copper foil is immersed in the etching solution; in the step c, the copper foil is immersed in the etching solution with the reverse side facing downwards. In the etching process, one surface of the circuit gap to be etched faces downwards, so that the problem that the solution accumulation occurs in the circuit gap to weaken the etching reaction is avoided. Preferably, the stirrer is arranged in the etching solution, so that the solution etched in the line gap is quickly separated from the line gap, and meanwhile, the etching solution in the line gap is quickly updated, and the etching reaction rate of the circuit board is accelerated.
The above embodiments are only for illustrating the technical solutions of the present invention and are not limited thereto, and any modification or equivalent replacement without departing from the spirit and scope of the present invention should be covered within the technical solutions of the present invention.
Claims (6)
1. A manufacturing process of a thick copper foil circuit board is characterized by comprising the following steps:
step a, selecting a copper foil with 8.5-11.5 oz, and arranging alignment marks on the front surface of the copper foil, the back surface of the copper foil, the first dry film and the second dry film;
b, correspondingly attaching the front surface of the copper foil and the first dry film according to the alignment marks, attaching the dry film on the reverse surface of the copper foil for protection, and exposing, developing and etching the front surface of the copper foil to etch a front surface circuit gap of the copper foil;
c, correspondingly attaching the back surface of the copper foil and the second dry film according to the alignment marks, attaching the dry film on the front surface of the copper foil for protection, exposing, developing and etching the back surface of the copper foil, communicating the front circuit gap and the back circuit gap on the copper foil, and completing etching on the copper foil to generate a circuit gap;
d, filling the gaps of the circuits with resin ink on a screen printing machine, polishing the surface layer of the copper foil by using an abrasive belt, removing the residual resin ink and performing surface treatment, and flattening the surface of the copper foil;
step e, after polishing the surface layer of the copper foil, supplementing moisture to the upper end face and the lower end face of the bonding sheet, sequentially stacking the metal composite substrate, the bonding sheet and the copper foil, pressing the copper foil, the bonding sheet and the metal composite substrate at a high temperature on a high-temperature pressing machine with a heating assembly, wherein the pressing temperature is 200-240 ℃, the pressure is 120-135 kg/cm2, the thickness of the bonding sheet is 0.35-0.65 mm, the mixed components of the metal composite substrate comprise carbon, boron and Sic fibers, and the thickness of the metal composite substrate is 1.8-2.2 mm;
the bonding sheet is made of PP materials.
2. The process of claim 1, wherein in step d, the gap-filling resin ink is dried after the gap-filling resin ink is thick.
3. The process of claim 1, wherein in step b, the surface of the copper foil and the surface of the first dry film for connecting the front surface of the copper foil are cleaned of impurities and dust; and c, removing impurity and dust on the back surface of the copper foil and the surface of the second dry film, which is used for connecting the back surface of the copper foil.
4. The process of claim 1, wherein in step d, the surfaces of the metal composite substrate, the bonding sheet and the copper foil are cleaned of dust impurities before pressing.
5. The manufacturing process of the thick copper foil circuit board according to claim 1, wherein the copper foil is 9.5-10.5 oz thick, the bonding sheet is 0.45-0.55 mm thick, and the metal composite substrate is 1.9-2.1 mm thick.
6. The process of claim 1, wherein in step b, the copper foil is immersed in the etching solution with the front surface facing downward; in the step c, the copper foil is immersed in the etching solution with the reverse side facing downwards.
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| CN201810437562.0A CN108617100B (en) | 2018-05-09 | 2018-05-09 | Manufacturing process of thick copper foil circuit board |
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| CN201810437562.0A CN108617100B (en) | 2018-05-09 | 2018-05-09 | Manufacturing process of thick copper foil circuit board |
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| CN108617100B true CN108617100B (en) | 2020-06-30 |
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| CN111405773A (en) * | 2020-03-19 | 2020-07-10 | 盐城维信电子有限公司 | Circuit board and manufacturing method thereof |
| CN113613401A (en) * | 2021-08-02 | 2021-11-05 | 宁波甬强科技有限公司 | Method for manufacturing aluminum substrate circuit board |
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| CN102291946A (en) * | 2011-07-27 | 2011-12-21 | 深南电路有限公司 | Method for manufacturing thick copper circuit board |
| CN105208796B (en) * | 2015-09-14 | 2018-08-03 | 上海美维电子有限公司 | The production method and super thick copper circuit board of super thick copper circuit board |
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| CN102573336A (en) * | 2010-12-30 | 2012-07-11 | 北大方正集团有限公司 | Manufacturing method of multilayer circuit board and laminated structure for multilayer circuit board |
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