CN106455368A - Production method for first-order HDI (high density interconnector) resin plug hole circuit board - Google Patents
Production method for first-order HDI (high density interconnector) resin plug hole circuit board Download PDFInfo
- Publication number
- CN106455368A CN106455368A CN201611056479.6A CN201611056479A CN106455368A CN 106455368 A CN106455368 A CN 106455368A CN 201611056479 A CN201611056479 A CN 201611056479A CN 106455368 A CN106455368 A CN 106455368A
- Authority
- CN
- China
- Prior art keywords
- hole
- resin
- filling holes
- copper
- outer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
Abstract
The invention provides a production method for a first-order HDI (high density interconnector) resin plug hole circuit board. The production method comprises the following steps: laminating multiple layers of circuit boards to form an inner layer board; drilling through holes in the inner layer board; enabling the through holes to form resin plug holes; laminating an outer layer board on the surface of the inner layer board; drilling blind holes in the outer layer board, wherein the bottom of each blind hole is an end face of the corresponding resin plug hole. According to the production method for the circuit board, production flows of the first-order resin plug hole HDI are greatly reduced; meanwhile, the cost is reduced, and the production period is shortened.
Description
Technical field
The present invention relates to wiring board makes field, a kind of manufacture method of single order HDI filling holes with resin wiring board is referred in particular to.
Background technology
HDI is that the English of High Density Interconnector is write a Chinese character in simplified form, and high density interconnection HDI plate is typically using product
Layer method manufacture, the number of times of lamination is more, and the difficulty that plate makes is higher.Common HDI plate is substantially 1 lamination, high-order HDI
Using the laminating technique of 2 times or more, while taking the advanced PCB technology such as hole using folded hole, plating filling perforation, laser straight.High-order
HDI plate is mainly used in smart mobile phone, senior DV, IC support plate etc..And the system of existing single order filling holes with resin HDI plate
Standby flow process generally comprise sawing sheet → inner figure → internal layer AOI → internal layer etching → pressing (1) → drilling → sink copper → plate electricity →
Filling holes with resin (buried via hole) → abrasive belt grinding → outer graphics → etching (negative film) → outer layer AOI → pressing (2) → laser drill is (blind
Hole) → heavy copper → plate electricity → outer layer plated hole figure → filling perforation plating → abrasive belt grinding → brill outermost resin hole (outermost resin hole) →
Heavy copper → plate electricity → plated hole figure → plated hole → filling holes with resin → abrasive belt grinding → brill outer layer through hole (outer layer through hole) → heavy copper →
Plate electricity → outer graphics → graphic plating → etching → outer layer AOI → rear operation.Because pressing twice, while internal layer has buried via hole, outward
Layer is containing through hole, resin hole and blind hole, this preparation method, and overall flow is longer, so as to result in cost of manufacture higher, the cycle
Relatively long, therefore need to carry out process optimization to this.
Content of the invention
In order to solve above-mentioned technical problem, the invention discloses a kind of making of new single order HDI filling holes with resin wiring board
Method, comprises the following steps：Multilayer circuit board is pressed and forms an inner plating；Through hole is got out on inner plating；Make described logical
Hole forms filling holes with resin；Lamina rara externa is pressed on the surface of inner plating；Blind hole is got out on lamina rara externa, and the bottom of the blind hole is institute
State the end face of filling holes with resin.
Further, after the filling holes with resin is formed, it is additionally included on the end face of the filling holes with resin and forms a metallic copper
Layer.
Further, being additionally included in the blind hole of the lamina rara externa carries out filling perforation plating, filler metal in the blind hole
Copper.
Further, the metal copper layer of the filling holes with resin end face is obtained by heavy copper, plate galvanic process, before heavy process for copper,
Abrasive belt grinding is first carried out, the end face of filling holes with resin is carried out polishing, is roughened.
Further, before the filling holes with resin is formed, also include to carry out the through hole on the inner plating heavy copper, plate
Electricity, makes the hole wall of through hole cover a metal copper layer, each internal layer is connected, is turned on.
Further, copper is carried out sinking to through hole on inner plating, after plate electricity, to filling epoxy resin in through hole, form resin
Consent.
Further, after the filling perforation electroplating technology of the outer layer board blind hole, also include outer layer through hole is bored, that is, run through lamina rara externa
Through hole with inner plating.
Further, after the brill outer layer through hole step, also include to carry out the outer layer through hole heavy copper, plate electricity.
Further, the manufacture method includes sawing sheet → making inner figure → internal layer AOI → internal layer etching → interior lamination
Close → bore internal layer through hole → copper → plate electricity → filling holes with resin → abrasive belt grinding → copper → plate electricity outer graphics → etching of sinking of sinking (negative
Piece) → outer layer AOI → outer layer pressing → laser drill (blind hole) → heavy copper → plate electricity → outer layer plated hole figure → filling perforation plating →
Abrasive belt grinding → brill outer layer through hole → heavy copper → plate electricity → outer graphics → graphic plating → etching → outer layer AOI → rear operation.
The manufacture method of the single order HDI filling holes with resin wiring board in the present invention program is for first making resin plug on inner plating
Hole, and copper, plate electricity is sunk to the end face of the filling holes with resin, metalized is carried out, and finally constitutes the buried via hole of multilayer circuit board.Connect
Again, blind hole is got out on lamina rara externa, and end face layers of copper of the bottom of the blind hole just for filling holes with resin, finally again the blind hole is entered
Row filling perforation is electroplated, and is the hole filler metal copper.The preparation method of this wiring board greatly reduces single order filling holes with resin HDI making
Flow process, while reduces cost and fabrication cycle.
Specific embodiment
By describing the technology contents of the present invention, structural features in detail, realizing purpose and effect, below in conjunction with embodiment
It is explained in detail.
The making of wiring board, how using sawing sheet as initial procedure.Then need nog plate, be exactly by the copper of script relative smooth
Face microetch becomes relative coarseness to be beneficial to the combination with institute's patch dry film.The cleaning solution for being used is that sulphuric acid adds hydrogen peroxide with micro-corrosion liquid.
Then photosensitive dry film is attached at copper-clad plate surface.Dry film is a kind of high molecular compound, and it is after ultraviolet irradiation
A kind of polyreaction can be produced and form a kind of stable material and plate face is attached to, so as to reach the work(for stopping plating and etching
Energy.Dry film is generally divided into three layers, and one layer is PE protecting film, and centre is photopolymer layer, and another is PET protective layer.PE layer and pet layer
It is all to shield, it is necessary to remove before press mold and before development, really worked is middle one layer of dry film, and it has
There are certain viscosity and good photonasty.
Then it is exposed, exposure is used up and the film is irradiated, and should expose as early as possible, because photosensitive dry film after patch dry film
There is certain shelf-life.Exposure uses exposure machine, can launch high intensity UV light (ultraviolet light) inside exposure machine, irradiates and is covered with egative film
With the substrate of dry film, by image transfer, the image after exposure on egative film will be inverted and is transferred on dry film.Before exposure machine exposure
Evacuation is wanted, this is to cause refraction in order to avoid bubble.While dust granule also can cause refraction, this inevitably results in and is transferred to
Layout distortion on dry film.More seriously dust granule can be bonded in plate face and stop that illumination causes impurity breaking or short
Road.
Copper-clad plate after the completion of exposure is developed through standing, and used in development section, sodium carbonate liquor is used as body lotion
Developed.Development mechanism be in light-sensitive surface the active group of unexposed portion and dilute alkaline soln react generate solable matter and
It is dissolved down, and the dry film of exposed portion is not dissolved.Development operation is carried out typically in developing machine, controls the temperature of developer solution
Degree, transfer rate, the photographic parameter such as spray pressure, the development effect that can obtain.Correct developing time is by showing a little
(not having the dry film for exposing to be shown the point that falls from printed board) shows, to determine, a little preferably must be held in the section total length that develops one
In constant percentage.
The dry film for being changed by ultraviolet light is dissolved and rinses out by sodium carbonate liquor.Secondly, development
Plank afterwards will be through pure water rinsing to prevent from bringing developer solution into etching groove before etching section is entered.The body lotion of etching groove is
CuCl2、HCl、H2O2.Etching solution will not be covered by dry film and exposed copper corrosion falls.Copper-clad plate has gone out etching groove, covers
Dry film on plank there is no longer use, so finally spraying plank stripping with hot NaOH solution, the dry film of hardening be dissolved away.
Then carry out AOI again to check automatically, the full name of AOI (Automatic Optic Inspection) is automated optical
Detection.Upon automatic detection, machine passes through photographic head automatically scanning PCB, gathers the conjunction in image, the solder joint of test and data base
The parameter of lattice is compared, and through image procossing, checks defect on PCB, and by display or Automatic Logos, defect is shown
Show/mark, repair for maintainer.
Then the etching before pressing to inner layer circuit board, increases the roughness on layers of copper surface, is conducive to each interlayer
Pipe sensitive adhesion.Pressing is with PP, individual internal substrate to be made intermediary to be combined into multi-layer sheet along with Copper Foil.The work of this set is by pressing
Conjunction machine is completed.Can be evacuated inside modern pressing machine, affect interlayer to tie to prevent from bubble occur in the PP for melting
With joint efforts, being uniformly distributed for molten resin is concurrently facilitated.
Then to the drilled through hole of inner plating after pressing, copper, plate electricity are then carried out sinking to institute's holes drilled through.Electroless copper plating is being given birth to
In product, the thin copper of last layer is deposited on whole through hole wall surface using chemical reaction, through this step, the hole wall of script no copper
Inside copper there has also been, so being also PTH (Plating Through Hole) flow process.After the deposition quality of chemical copper is directly affected
The continuous of conductor connection between plating copper mass and internal layer.The direct current heavy current for setting current intensity is connected to by plating section
On wiring board, it is immersed in the groove for filling electroplate liquid.Through just having sufficiently thick copper on hole wall after a while.Copper is covered due to all
Area all can plated last layer copper, so this is a kind of electric plating of whole board method.Different internal layers are linked together by the copper on hole wall
Bridge, so copper-plated quality directly affects the continuous of wiring board.
Then to the hole potting resin, filling holes with resin is formed.Using resin, via is clogged, then carry out in hole end surface
Copper facing, reduces hole and pitch of holes, reduces the area of plate, solves the problems, such as wire and wiring, improves wiring density.Filling holes with resin this
Plant the contradiction between the thickness of dielectric layers control of technological balance pressing and the design of internal layer buried via hole filler.If internal layer buried via hole does not have
Filled up by resin, when thermal shock is crossed, plank occurs the problem of plate bursting and directly scraps.If not adopting filling holes with resin, need
Want multiple PP to be pressed to meet the demand of filler, but thickness of dielectric layers between layers can be led because of the increase of PP piece
Cause thickness partially thick.The application inner layer resin consent of inner layer resin consent is widely applied in the product of HDI, to meet HDI
The design requirement of product film dielectric layer demand.Internal layer is had to the blind buried via hole product of buried via hole design, because the middle medium for combining
Design is partially thin, is often also required to increase the flow process of inner layer resin consent.Part blind hole product is pressed because the thickness of blind hole layer is larger
Close filler blind hole can not be filled up, it is also desirable to carry out filling holes with resin and fill up blind hole, it is to avoid in follow-up process, blind hole hole occurs no
The problem of copper.
Then, needing a layers of copper is covered with the end face of the filling holes with resin for being formed, equally first carries out abrasive belt grinding, not only
Unnecessary resin on filling holes with resin end face is ground off, while also the roughness of end face resin surface can be increased, not only contributes to layers of copper
In the attachment of resin surface, while also add the adhesion strength between layers of copper and resin bed.
The making of inner plating outermost layer pattern can be then carried out, is then etched, AOI optics automatic detection etc. is walked
Suddenly, then again lamina rara externa is pressed with inner plating, forms single order multilayer circuit board.And bored using laser on lamina rara externa
Hole, the blind hole needed for being formed.Meanwhile, the end face layers of copper of filling holes with resin in the bottom exactly inner plating of the blind hole.While also to this
Blind hole carries out heavy copper, plate electricity, is that the blind hole inwall encloses a layers of copper.Then outer layer plated hole figure, filling perforation plating are carried out.Be
In the blind hole for being formed, by way of plating, full metallic copper will be filled in blind hole.
Then, abrasive belt grinding is carried out, and drilled outer layer through hole, i.e., through the through hole of whole single order wiring board.Equally,
Need to carry out the hole heavy copper and plate electricity, turned on interlayer circuit.Then outer graphics are made and carries out graphic plating.?
After flat board plating, plate is needed through graphic plating after dry film exposure imaging.The purpose of graphic plating is to increase circuit
With in the hole copper thickness (mainly hole copper thickness), it is ensured that its electric conductivity and other physical properties.According to different clients difference plate
Performance requirement, the thick also difference of hole wall copper.In general, flat board electrodeposited coating only ensures to protect thin heavy layers of copper i.e.
Can.On the basis of total copper thickness is ensured, if figure is evenly distributed, the thick graph layer of comparison can be saved copper ball and consume and etch
Cost, improves etching speed, reduces etching difficulty., whereas if linewidth requirements are not tight, and figure skewness circuit is isolated,
Flat layer thickness can be then improved, reduces graphic plating thickness degree.
It is the etchant flow for advancing to the multilayer circuit board after graphic plating, unnecessary metallic copper on lamina rara externa is removed,
Then AOI detection and some follow-up process of outer layer, the single order HDI filling holes with resin wiring board needed for being just obtained are carried out again.
The manufacture method of the single order HDI filling holes with resin wiring board in the present invention program is for first making resin plug on inner plating
Hole, and copper, plate electricity is sunk to the end face of the filling holes with resin, metalized is carried out, and finally constitutes the buried via hole of multilayer circuit board.Connect
Again, blind hole is got out on lamina rara externa, and end face layers of copper of the bottom of the blind hole just for filling holes with resin, finally again the blind hole is entered
Row filling perforation is electroplated, and is the hole filler metal copper.The preparation method of this wiring board greatly reduces single order filling holes with resin HDI making
Flow process, while reduces cost and fabrication cycle.
Herein, up, down, left, right, before and after only represents its relative position and does not indicate that its absolute position.The foregoing is only
Embodiments of the invention, not thereby limit the scope of the claims of the present invention, what every utilization present specification was made etc.
Effect structure or equivalent flow conversion, or other related technical fields are directly or indirectly used in, all include in the present invention in the same manner
Scope of patent protection within.
Claims (9)
1. a kind of manufacture method of single order HDI filling holes with resin wiring board, comprises the following steps：Multilayer circuit board is pressed and is formed
One inner plating；Through hole is got out on inner plating；The through hole is made to form filling holes with resin；Lamina rara externa is pressed on the surface of inner plating；
Blind hole is got out on lamina rara externa, and the bottom of the blind hole is the end face of the filling holes with resin.
2. the manufacture method of single order HDI filling holes with resin wiring board as claimed in claim 1, it is characterised in that：Described being formed
After filling holes with resin, it is additionally included on the end face of the filling holes with resin and forms a metal copper layer.
3. the manufacture method of single order HDI filling holes with resin wiring board as claimed in claim 2, it is characterised in that：It is additionally included in institute
Stating in the blind hole of lamina rara externa carries out filling perforation plating, filler metal copper in the blind hole.
4. the manufacture method of single order HDI filling holes with resin wiring board as claimed in claim 3, it is characterised in that：The resin plug
The metal copper layer of hole end surface is obtained by heavy copper, plate galvanic process, before heavy process for copper, first carries out abrasive belt grinding, to filling holes with resin
End face is carried out polishing, is roughened.
5. the manufacture method of single order HDI filling holes with resin wiring board as claimed in claim 4, it is characterised in that：Described being formed
Before filling holes with resin, also include to carry out the through hole on the inner plating heavy copper, plate electricity, make the hole wall of through hole cover a metallic copper
Layer, each internal layer is connected, is turned on.
6. the manufacture method of single order HDI filling holes with resin wiring board as claimed in claim 5, it is characterised in that：To on inner plating
Through hole carries out sinking copper, after plate electricity, to filling epoxy resin in through hole, forms filling holes with resin.
7. the manufacture method of single order HDI filling holes with resin wiring board as claimed in claim 6, it is characterised in that：The lamina rara externa
After the filling perforation electroplating technology of blind hole, also include to bore outer layer through hole, i.e., through lamina rara externa and the through hole of inner plating.
8. the manufacture method of single order HDI filling holes with resin wiring board as claimed in claim 7, it is characterised in that：The brill outer layer
After through hole step, also include to carry out the outer layer through hole heavy copper, plate electricity.
9. the manufacture method of single order HDI filling holes with resin wiring board as claimed in claim 8, it is characterised in that：Including sawing sheet →
Make inner figure → internal layer AOI → internal layer etching → internal layer press → bore internal layer through hole → heavy copper → plate electricity → filling holes with resin →
Abrasive belt grinding → electric outer graphics → etching (the negative film) → outer layer AOI → outer layer pressing → laser drill (blind hole) of the copper → plate that sinks →
Heavy copper → plate electricity → outer layer plated hole figure → filling perforation plating → abrasive belt grinding → brill outer layer through hole → heavy copper → plate electricity → outer layer figure
Shape → graphic plating → etching → outer layer AOI → rear operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611056479.6A CN106455368A (en) | 2016-11-25 | 2016-11-25 | Production method for first-order HDI (high density interconnector) resin plug hole circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611056479.6A CN106455368A (en) | 2016-11-25 | 2016-11-25 | Production method for first-order HDI (high density interconnector) resin plug hole circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106455368A true CN106455368A (en) | 2017-02-22 |
Family
ID=58218500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611056479.6A Pending CN106455368A (en) | 2016-11-25 | 2016-11-25 | Production method for first-order HDI (high density interconnector) resin plug hole circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN106455368A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109152225A (en) * | 2018-10-18 | 2019-01-04 | 莆田市涵江区依吨多层电路有限公司 | A kind of buried via hole method for plugging of holes on high density interconnected printed circuit board |
| CN109982509A (en) * | 2017-12-28 | 2019-07-05 | 北大方正集团有限公司 | The production method and pcb board for having the pcb board of stepped groove |
| CN110213890A (en) * | 2019-04-17 | 2019-09-06 | 奥士康科技股份有限公司 | A kind of filling holes with resin method for 5G circuit board fabrication |
| CN111654978A (en) * | 2020-06-30 | 2020-09-11 | 景旺电子科技(珠海)有限公司 | Circuit board manufacturing method |
| CN112739016A (en) * | 2020-12-10 | 2021-04-30 | 惠州市特创电子科技股份有限公司 | Stacked hole circuit board and preparation method thereof |
| CN113873764A (en) * | 2021-09-26 | 2021-12-31 | 江门崇达电路技术有限公司 | Method for manufacturing resin jack panel with precise line |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109982509A (en) * | 2017-12-28 | 2019-07-05 | 北大方正集团有限公司 | The production method and pcb board for having the pcb board of stepped groove |
| CN109152225A (en) * | 2018-10-18 | 2019-01-04 | 莆田市涵江区依吨多层电路有限公司 | A kind of buried via hole method for plugging of holes on high density interconnected printed circuit board |
| CN110213890A (en) * | 2019-04-17 | 2019-09-06 | 奥士康科技股份有限公司 | A kind of filling holes with resin method for 5G circuit board fabrication |
| CN111654978A (en) * | 2020-06-30 | 2020-09-11 | 景旺电子科技(珠海)有限公司 | Circuit board manufacturing method |
| CN112739016A (en) * | 2020-12-10 | 2021-04-30 | 惠州市特创电子科技股份有限公司 | Stacked hole circuit board and preparation method thereof |
| CN112739016B (en) * | 2020-12-10 | 2023-03-14 | 惠州市特创电子科技股份有限公司 | Stacked hole circuit board and preparation method thereof |
| CN113873764A (en) * | 2021-09-26 | 2021-12-31 | 江门崇达电路技术有限公司 | Method for manufacturing resin jack panel with precise line |
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Application publication date: 20170222 |